CN203733849U - LED illuminating light source having sulfuration-proof function - Google Patents
LED illuminating light source having sulfuration-proof function Download PDFInfo
- Publication number
- CN203733849U CN203733849U CN201420118058.1U CN201420118058U CN203733849U CN 203733849 U CN203733849 U CN 203733849U CN 201420118058 U CN201420118058 U CN 201420118058U CN 203733849 U CN203733849 U CN 203733849U
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- CN
- China
- Prior art keywords
- lead frame
- cup
- insulating support
- colloidal silica
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- Led Device Packages (AREA)
Abstract
The utility model relates to the light emitting diode (LED) field. The utility model discloses an LED illuminating light source having a sulfuration-proof function. The LED illuminating light source comprises an LED wafer, electric conduction metal wires, an insulation support rack, a lead wire framework and solidified silica gels, wherein the lead wire framework comprises a bearing seat part and electrode lead pin parts, the bearing seat part is arranged at the middle of the lead wire framework, the electrode lead pin parts are arranged at two sides of the lead wire framework, the insulation support rack comprises a cup bottom part and a cup edge part which is arranged at an edge, the LED wafer is fixed on the bearing seat part of the lead wire framework and is electrically connected to the electrode lead pin parts at the two sides of the lead wire framework through the electric conduction metal wires, and the solidified silica gels comprise first silica gel bodies and a second silica gel body. In the annular container, each of the top faces within zones formed through combination and intersection of the insulation support rack and the lead wire framework is covered by a layer of the first silica gel body. In the annular container, each of the top faces of the first silica gel body and the other zones outside the first silica gel body are covered by a layer of the second silica gel body. The LED illuminating light source of the utility model is used for illumination and has sulfuration-proof effects.
Description
Technical field
The utility model relates to light-emitting diode (LED) field, relates in particular to surface-mount type light emitting diode construction, can belong to H01L33/48 group, specifically the improvement project to its anti-sulfuration function in IPC International Patent Classification (IPC).
Background technology
LED(Light Emitting Diode), light-emitting diode, is a kind of solid-state semiconductor device, it can directly be converted into luminous energy electricity.Light-emitting diode, as the good lighting source of a kind of characteristics of luminescence, has the features such as energy-saving and environmental protection, safety, long service life, by replacing traditional incandescent lamp and electricity-saving lamp, has had at present extensive use.Light-emitting diode, according to the difference of encapsulating structure, has diversity, and wherein one is surface-mount type light-emitting diode (TOP LED), has the advantage of little, the easy paster of volume, good heat dissipation, becomes most LED and encapsulates the product that producer promotes mainly.
Surface-mount type light-emitting diode is made up of the main material encapsulation such as lead frame, PPA, chip, spun gold, adhesive glue, silica gel.What surface-mount type LED encapsulation body exposed is lead frame, PPA and silica gel.Surface-mount type light-emitting diode is humidity sensitive device, moisture is entered by gap between different materials, mainly nonmetal from PPA() and lead frame (metal) between, under the effect of temperature, moisture can produce vapour pressure, in the time that this steam pressure is greater than the bonding force between material, will form the phenomenon of layering between material, and then affect ohmic contact, and there is silver coating oxidative phenomena on lead frame.Surface-mount type light-emitting diode after making moist, sulfuration after, can cause that colour temperature drift, light decay strengthen, unfailing performance reduces, and causes product photoelectric parameter to be degenerated and even loses efficacy, therefore the design that, how to strengthen air-tightness technique is the key that improves surface-mount type light-emitting diode product reliability design.
Utility model content
The LED lighting source of a kind of improved surface-mount type light emitting diode construction that the utility model proposes based on this object just, can improve the air-tightness of surface-mount type light emitting diode construction greatly, plays anti-sulfurization.
The technical solution of the utility model is:
A kind of LED lighting source with anti-sulfuration function, comprise LED wafer, conducting metal silk thread, insulating support, lead frame and curing silica gel composition, load bearing seat portion in the middle of lead frame comprises and the electrode pin portion on both sides, insulating support comprises the cup limit portion at cup bottom and edge, LED wafer is fixed on the load bearing seat portion of lead frame, and be electrically connected on respectively the electrode pin portion on lead frame both sides by conducting metal silk thread, the load bearing seat portion of the centre of lead frame and the electrode pin portion on both sides are by the cup bottom isolation of insulating support and the fixing base arrangement that forms of combining closely each other, the electrode pin portion of cup limit portion and the lead frame of insulating support combines closely and fixes and around the edge setting of this base arrangement, thereby the cup-like containers with a lower recess of this base arrangement formation.Wherein main improvement is: curing silica gel comprises the first colloidal silica and the second colloidal silica, in this cup-like containers, be positioned on the end face of regional extent of the combination boundary of electrode pin portion, the electrode pin portion of lead frame and the cup bottom of insulating support, the cup bottom of insulating support and the load bearing seat portion of lead frame of cup limit portion and the lead frame of insulating support and cover one deck the first colloidal silica, in this cup-like containers, on the end face of other regional extents outside the first colloidal silica and the first colloidal silica, cover one deck the second colloidal silica.
Further preferred, the height of the second colloidal silica is concordant with the height of the cup limit portion of insulating support.
Further preferred, the first colloidal silica is the silica gel of high phenyl content side chain, and the second colloidal silica is the silica gel of methyl group side chain.
Further preferred, insulating support is the stake body of PPA material, and conducting metal silk thread is spun gold.
LED lighting source of the present utility model is a kind of LED lighting source with anti-sulfuration function, its surface-mount type light emitting diode construction of this LED lighting source is different from the structure of only putting one deck fluorescence silica gel in existing surface-mount type light emitting diode construction, but adopt secondary gluing process to form, specifically: in this cup-like containers, be positioned at the cup limit portion of insulating support and the electrode pin portion of lead frame, the cup bottom of the electrode pin portion of lead frame and insulating support, on end face in the regional extent that the combination of the cup bottom of insulating support and the load bearing seat portion of lead frame is had a common boundary, cover one deck the first colloidal silica, in this cup-like containers, on the end face of other regional extents outside the first colloidal silica and the first colloidal silica, cover one deck the second colloidal silica, thereby can improve surface-mount type light emitting diode construction air-tightness, play anti-sulfurization.
Brief description of the drawings
Fig. 1 is the Facad structure schematic diagram of embodiment of the present utility model.
Fig. 2 is the side sectional structure schematic diagram of embodiment of the present utility model.
Embodiment
Now with embodiment, the utility model is further illustrated by reference to the accompanying drawings.
Consult shown in Fig. 1 and Fig. 2, the LED lighting source of embodiment of the present utility model is to comprise LED wafer 1, conducting metal silk thread 2, insulating support, lead frame and curing silica gel composition.Load bearing seat portion 31 in the middle of lead frame comprises and the electrode pin portion 32 on both sides.Insulating support comprises the cup limit portion 42 at cup bottom 41 and edge.LED wafer 1 is fixed on the load bearing seat portion 31 of lead frame, and is electrically connected respectively (adopt welded more) in the electrode pin portion 32 on lead frame both sides by conducting metal silk thread 2.The load bearing seat portion 31 of the centre of lead frame and the electrode pin portion 32 on both sides are cup bottom 41 isolation by insulating support, and combine closely each other and fix and a base arrangement 100 of formation.It is fixing and around the edge setting of this base arrangement 100 that cup limit portion 42 and the electrode pin portion 32 of lead frame of insulating support combines closely, thereby form the cup-like containers 200 of a lower recess with this base arrangement 100.Curing silica gel comprises the first colloidal silica 6 and the second colloidal silica 7.In this cup-like containers 200, be positioned on the end face of the regional extent that cup bottom 41 and the combination of the load bearing seat portion 31 of lead frame of the cup limit portion 42 of insulating support and the electrode pin portion 32 of the electrode pin portion 32 of lead frame, lead frame and the cup bottom 41 of insulating support, insulating support have a common boundary and cover one deck the first colloidal silica 6.In this cup-like containers 200, on the end face of other regional extents of 6 outside the first colloidal silica 6 and the first colloidal silica (comprising the subregion of the cup limit portion 42 of the insulating support that does not cover the first colloidal silica 6 and the load bearing seat portion 31 of lead frame), cover one deck the second colloidal silica 7.Wherein, the first colloidal silica 6 be for block water molecule in insulating support and the infiltration of lead frame intersection and the generation of diffusion, can prevent that this surface-mount type light-emitting diode from making moist, vulcanizing.The second colloidal silica 7 is conventional packaging silicon rubbers, is generally the packaging silicon rubber that is distributed with fluorescent material.
Preferably, insulating support (cup bottom 41 and cup limit portion 42) is the stake body of the PPA material of better performances, and conducting metal silk thread 2 is the good spun golds of electric conductivity and ductility.
Preferably, the height of the second colloidal silica 7 is concordant with the height of the cup limit portion 42 of insulating support, fills fully cup-like containers 200, to ensure the insulating support binding ability of silicon the second colloidal silica 7 and PPA.
Preferably, the first colloidal silica 6 is the silica gel of high phenyl content side chain, and the second colloidal silica 7 is the silica gel of methyl group side chain.This case inventor is known after studying with keen determination in a large number: silica gel material is material behavior, and polysiloxanes is main chain, and its side chain is divided into two classes, and a class side chain is methyl group, and another kind of side chain is high phenyl content group.The silica gel heat resistance of methyl branch is good, and long-term structural stability is strong, quite a lot of with the relative meeting of caking property of PPA, metal.And the relative compactness of the silica gel of high phenyl content side chain is strong, hardness is high, effectively infiltration and the diffusion of block water molecule.
Therefore, the LED lighting source of this embodiment of the present utility model (surface-mount type light emitting diode construction) adopts two kinds of silica gel to be cured by secondary gluing process.Solidify the first colloidal silica 6 of the high phenyl content side chain silica gel of one deck at the lead frame of metal and the intersection of nonmetallic insulating support (the cup limit portion 42 of insulating support and the electrode pin portion 32 of the electrode pin portion 32 of lead frame, lead frame and glass bottom 41 of insulating support, the cup bottom 41 of insulating support and the combination intersection of the load bearing seat portion 31 of lead frame) covering; Above the first colloidal silica 6 and do not cover the second colloid 7 that is perfused with again one deck in the regional extent of the first colloidal silica 6 and is mixed with the methyl branch silica gel of fluorescent material in cup-like containers 200.The silica gel of the high phenyl content side chain of the first colloidal silica 6 can stop steam, the air from coming in conjunction with gap, boundary between the lead frame of metal and nonmetallic insulating support, play anti-sulfurization, the silica gel of the methyl branch of the second colloid 7 is strengthened being combined with the insulating support of PPA, increase the performance reliably and with long-term of product, play the effect that the silica gel of two classes makes up mutually.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.
Claims (5)
1. one kind has the LED lighting source of anti-sulfuration function, comprise LED wafer, conducting metal silk thread, insulating support, lead frame and curing silica gel composition, load bearing seat portion in the middle of lead frame comprises and the electrode pin portion on both sides, insulating support comprises the cup limit portion at cup bottom and edge, LED wafer is fixed on the load bearing seat portion of lead frame, and be electrically connected on respectively the electrode pin portion on lead frame both sides by conducting metal silk thread, the load bearing seat portion of the centre of lead frame and the electrode pin portion on both sides are by the cup bottom isolation of insulating support and the fixing base arrangement that forms of combining closely each other, the electrode pin portion of cup limit portion and the lead frame of insulating support combines closely and fixes and around the edge setting of this base arrangement, thereby the cup-like containers with a lower recess of this base arrangement formation, it is characterized in that: curing silica gel comprises the first colloidal silica and the second colloidal silica, in this cup-like containers, be positioned at the cup limit portion of insulating support and the electrode pin portion of lead frame, the cup bottom of the electrode pin portion of lead frame and insulating support, on end face in the regional extent that the combination of the cup bottom of insulating support and the load bearing seat portion of lead frame is had a common boundary, cover one deck the first colloidal silica, in this cup-like containers, on the end face of other regional extents outside the first colloidal silica and the first colloidal silica, cover one deck the second colloidal silica.
2. the LED lighting source with anti-sulfuration function according to claim 1, is characterized in that: the height of the second colloidal silica is concordant with the height of the cup limit portion of insulating support.
3. the LED lighting source with anti-sulfuration function according to claim 2, is characterized in that: the first colloidal silica is the silica gel of high phenyl content side chain, the second colloidal silica is the silica gel of methyl group side chain.
4. according to the arbitrary described LED lighting source with anti-sulfuration function of claims 1 to 3, it is characterized in that: insulating support is the stake body of PPA material.
5. according to the arbitrary described LED lighting source with anti-sulfuration function of claims 1 to 3, it is characterized in that: conducting metal silk thread is spun gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420118058.1U CN203733849U (en) | 2014-03-17 | 2014-03-17 | LED illuminating light source having sulfuration-proof function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420118058.1U CN203733849U (en) | 2014-03-17 | 2014-03-17 | LED illuminating light source having sulfuration-proof function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733849U true CN203733849U (en) | 2014-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420118058.1U Expired - Fee Related CN203733849U (en) | 2014-03-17 | 2014-03-17 | LED illuminating light source having sulfuration-proof function |
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| Country | Link |
|---|---|
| CN (1) | CN203733849U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105679736A (en) * | 2014-12-05 | 2016-06-15 | 友立材料株式会社 | Lead frame and manufacturing method thereof |
-
2014
- 2014-03-17 CN CN201420118058.1U patent/CN203733849U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105679736A (en) * | 2014-12-05 | 2016-06-15 | 友立材料株式会社 | Lead frame and manufacturing method thereof |
| CN105679736B (en) * | 2014-12-05 | 2019-11-01 | 大口电材株式会社 | Lead frame and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20170317 |