CN208014732U - A kind of small-sized deep ultraviolet LED inorganic encapsulated structures - Google Patents
A kind of small-sized deep ultraviolet LED inorganic encapsulated structures Download PDFInfo
- Publication number
- CN208014732U CN208014732U CN201820359234.9U CN201820359234U CN208014732U CN 208014732 U CN208014732 U CN 208014732U CN 201820359234 U CN201820359234 U CN 201820359234U CN 208014732 U CN208014732 U CN 208014732U
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- Prior art keywords
- hole
- groove
- small
- mounting base
- deep ultraviolet
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- 239000011521 glass Substances 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 238000009434 installation Methods 0.000 claims abstract description 16
- 238000004020 luminiscence type Methods 0.000 claims abstract description 14
- 239000011230 binding agent Substances 0.000 claims abstract description 6
- 239000011148 porous material Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 description 2
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 2
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Disinfection, Sterilisation Or Deodorisation Of Air (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model is related to LED device technical fields, more particularly to a kind of small-sized deep ultraviolet LED inorganic encapsulated structures, including package floor, mounting base, packaged glass lid and installation glass cover, the surface of package floor is provided with the first groove, and mounting base is provided on the surface of the package floor in the first groove；The second groove is provided on the surface of mounting base, the madial wall of second groove is connected with the second through-hole is respectively arranged on lateral wall with the inner cavity of first through hole and first through hole with the inner cavity of the second through-hole, packaged glass lid is fixed on by inorganic binder in the first groove and the second groove with installation glass cover, packaged glass plate is made with installation glass plate of unorganic glass, improves the anti-ultraviolet property of the utility model entirety；First metal heat sink can also be fixed LED luminescence chips while heat loss through conduction with the second metal heat sink, enhance the anti-seismic performance of the utility model entirety.
Description
Technical field
The utility model is related to LED device technical fields, and in particular to a kind of small-sized deep ultraviolet LED inorganic encapsulated structures.
Background technology
The research of UV LED is gradually paid attention to by industry, is more considered as LED another new after white light
Continent, foreground be very optimistic, while being reported in the coming years according to the industry development of yole, UV LED industry
Will with the speed of annual compound growth rate 46% develop, unquestionable UV LED by be LED industry revolution next time.
Ultraviolet LED refers generally to centre of luminescence wavelength in 400nm LED below, but sometimes by emission wavelength be more than 380nm when
Referred to as near ultraviolet LED, and referred to as deep ultraviolet LED when shorter than 300nm, because the bactericidal effect of short wavelength light is high, therefore ultraviolet LED
It is relatively broad to be usually used in purposes, the purposes such as the sterilization and deodorization of refrigerator and household electrical appliances etc..
At this stage, the packaged type of ultraviolet LED mainly continues to use the packaged type of white light LEDs, but white-light LED encapsulation is current
The all different degrees of organic material for using resin one kind of almost all of packaged type is packaged, may be because of ultraviolet
Light radiation leads to colloid yellow, reduces light emitting diode service life.
Utility model content
In view of the deficiencies of the prior art, it the utility model discloses a kind of small-sized deep ultraviolet LED inorganic encapsulated structures, is used for
The organic material for solving to use resin one kind is packaged, and colloid yellow may be caused because of ultraviolet radiation, reduces hair
The problems such as optical diode service life；The utility model is achieved by the following technical programs：
A kind of small-sized deep ultraviolet LED inorganic encapsulated structures, including package floor, mounting base, packaged glass lid and installation
The surface of glass cover, the package floor is provided with the first groove, and is equably provided on the madial wall of first groove
The inner cavity of one through-hole, first groove is communicated with the outside by the first through hole, the envelope in first groove
It fills and is provided with mounting base on the surface of bottom plate；
It is provided with the second groove on the surface of the mounting base, distinguishes on the madial wall and lateral wall of second groove
It is provided with the second through-hole with the inner cavity of the first through hole and the first through hole with the inner cavity of second through-hole to be connected, institute
The inner cavity for stating the second groove is connected by second through-hole with the inner cavity of first groove, the institute in second groove
It states and LED luminescence chips is installed on the surface of mounting base, on the surface of the mounting base below the LED luminescence chips
It is provided with wiring through-hole and the wiring through-hole extends to the bottom of the package floor；
It is provided with the first card slot on surface on the outside of the package floor, is provided on the surface on the outside of the mounting base
Second card slot；
It is embedded with the first metal heat sink in the first through hole, the second metal heat sink, institute are embedded in second through-hole
Packaged glass lid is stated to be fixed in first groove and described second by inorganic binder respectively with the installation glass cover
In groove.
Preferably, first groove and second groove are rectangular configuration.
Preferably, the pore size of the first through hole is 0.90 to 0.12mm.
Preferably, the pore size of second through-hole is 0.50 to 0.80mm.
Preferably, described first be connected on the first groove madial wall is run through in one end of first metal heat sink
In through-hole, the other end, which runs through, to be connected in the first through hole on the second groove lateral wall.
Preferably, one end of second metal heat sink is fixedly connected in second through-hole, and the other end is connected to institute
State the surface of LED luminescence chips.
Preferably, the packaged glass lid is made with the installation glass cover of inorganic glass materials.
The beneficial effects of the utility model are：
Packaged glass lid is fixed on by inorganic binder in the first groove and the second groove with installation glass cover, is encapsulated
Glass plate is made with installation glass plate of unorganic glass, improves the anti-ultraviolet property of the utility model entirety；First gold medal
Belong to heat sink LED luminescence chips can also to be fixed while heat loss through conduction with the second metal heat sink, enhances this practicality
Novel whole anti-seismic performance.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is the stereogram of the utility model；
Fig. 2 is the sectional view of the utility model mounting base；
Fig. 3 is the sectional view of the utility model mounting base；
Fig. 4 is the sectional view of the utility model package floor；
Fig. 5 is the structural schematic diagram of the utility model packaged glass lid；
Fig. 6 is the structural schematic diagram of the utility model installation glass cover.
In figure：1, package floor；2, mounting base；3, packaged glass lid；4, glass cover is installed；5, the first groove；6,
One through-hole；7, the second groove；8, the second through-hole；9, LED luminescence chips；10, wiring through-hole；11, the first card slot；12, the second card
Slot；13, the first metal heat sink；14, the second metal heat sink.
Specific implementation mode
It is new below in conjunction with this practicality to keep the purpose, technical scheme and advantage of the utility model embodiment clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained without creative efforts belong to
The range of the utility model protection.
A kind of small-sized deep ultraviolet LED inorganic encapsulated structures, including package floor 1, mounting base 2, packaged glass lid 3 and peace
The surface of glaze lid 4, package floor 1 is provided with the first groove 5, and first is equably provided on the madial wall of the first groove 5
The inner cavity of through-hole 6, the first groove 5 is communicated with the outside by first through hole 6, on the surface of the package floor 1 in the first groove 5
It is provided with mounting base 2；
It is provided with the second groove 7 on the surface of mounting base 2, is respectively set on the madial wall and lateral wall of the second groove 7
There is the second through-hole 8 to be connected with the inner cavity of first through hole 6 and first through hole 6 with the inner cavity of the second through-hole 8, the second groove 7 it is interior
Chamber is connected by the second through-hole 8 with the inner cavity of the first groove 5, is equipped on the surface of the mounting base 2 in the second groove 7
LED luminescence chips 9 are provided with wiring through-hole 10 and wiring through-hole 10 on the surface of the mounting base 2 of the lower section of LED luminescence chips 9
Extend to the bottom of package floor 1；
It is provided with the first card slot 11 on the surface in 1 outside of package floor, second is provided on the surface in 2 outside of mounting base
Card slot 12；
It is embedded with the first metal heat sink 13 in first through hole 6, the second metal heat sink 14 is embedded in the second through-hole 8, encapsulates
Glass cover 3 is fixed on by inorganic binder in the first groove 5 and in the second groove 7 respectively with installation glass cover 4.
First groove 5 and the second groove 7 are rectangular configuration, and the pore size of first through hole 6 is 0.90 to 0.12mm, the
The pore size of two through-holes 8 is 0.50 to 0.80mm, and one end of the first metal heat sink 13, which is run through, is connected to 5 madial wall of the first groove
On first through hole 6 in, the other end is through being connected in the first through hole 6 on 7 lateral wall of the second groove, the second metal heat sink 14
One end be fixedly connected in the second through-hole 8, the other end is connected to the surface of LED luminescence chips 9, packaged glass lid 3 and installation
Glass cover 4 is made of inorganic glass materials.
When in use, packaged glass lid 3 is fixed on the first groove 5 and the with installation glass cover 4 by inorganic binder
In two grooves 7, packaged glass plate is made with installation glass plate of unorganic glass, improves the uvioresistant of the utility model entirety
Linear energy.
First metal heat sink 13 and the second metal heat sink 14 while heat loss through conduction can also to LED luminescence chips 9 into
Row is fixed, and the anti-seismic performance of the utility model entirety is enhanced.
Above example is only to illustrate the technical solution of the utility model, rather than its limitations；Although with reference to aforementioned reality
Example is applied the utility model is described in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and model of various embodiments of the utility model technical solution that it does not separate the essence of the corresponding technical solution
It encloses.
Claims (7)
1. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures, including package floor, mounting base, packaged glass lid and installation glass
Glass lid, it is characterised in that：The surface of the package floor is provided with the first groove, on the madial wall of first groove equably
It is provided with first through hole, the inner cavity of first groove is communicated with the outside by the first through hole, in first groove
The package floor surface on be provided with mounting base；
It is provided with the second groove on the surface of the mounting base, is respectively set on the madial wall and lateral wall of second groove
There is the second through-hole to be connected with the inner cavity of the first through hole and the first through hole with the inner cavity of second through-hole, described
The inner cavity of two grooves is connected by second through-hole with the inner cavity of first groove, the peace in second groove
It fills and LED luminescence chips is installed on the surface of bottom plate, be arranged on the surface of the mounting base below the LED luminescence chips
There is wiring through-hole and the wiring through-hole extends to the bottom of the package floor；
It is provided with the first card slot on surface on the outside of the package floor, second is provided on the surface on the outside of the mounting base
Card slot；
It is embedded with the first metal heat sink in the first through hole, the second metal heat sink, the envelope are embedded in second through-hole
Glaze lid is fixed in first groove and second groove by inorganic binder respectively with the installation glass cover
It is interior.
2. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：Described first is recessed
Slot and second groove are rectangular configuration.
3. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：Described first is logical
The pore size in hole is 0.90 to 0.12mm.
4. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：Described second is logical
The pore size in hole is 0.50 to 0.80mm.
5. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：First gold medal
The one end for belonging to heat sink, which is run through, to be connected in the first through hole on the first groove madial wall, and the other end, which runs through, is connected to institute
It states in the first through hole on the second groove lateral wall.
6. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：Second gold medal
The one end for belonging to heat sink is fixedly connected in second through-hole, and the other end is connected to the surface of the LED luminescence chips.
7. a kind of small-sized deep ultraviolet LED inorganic encapsulated structures according to claim 1, it is characterised in that：The encapsulation glass
Glass lid is made with the installation glass cover of inorganic glass materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820359234.9U CN208014732U (en) | 2018-03-16 | 2018-03-16 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820359234.9U CN208014732U (en) | 2018-03-16 | 2018-03-16 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208014732U true CN208014732U (en) | 2018-10-26 |
Family
ID=63889096
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820359234.9U Expired - Fee Related CN208014732U (en) | 2018-03-16 | 2018-03-16 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208014732U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336212A (en) * | 2018-03-16 | 2018-07-27 | 江苏鸿利国泽光电科技有限公司 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
-
2018
- 2018-03-16 CN CN201820359234.9U patent/CN208014732U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336212A (en) * | 2018-03-16 | 2018-07-27 | 江苏鸿利国泽光电科技有限公司 | A kind of small-sized deep ultraviolet LED inorganic encapsulated structures |
| CN108336212B (en) * | 2018-03-16 | 2024-09-13 | 林上煜 | Inorganic packaging structure of small-size dark ultraviolet LED |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181026 |