CN205508884U - Good LED packaging structure of colour temperature uniform heat dissipation nature - Google Patents
Good LED packaging structure of colour temperature uniform heat dissipation nature Download PDFInfo
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- CN205508884U CN205508884U CN201620353331.8U CN201620353331U CN205508884U CN 205508884 U CN205508884 U CN 205508884U CN 201620353331 U CN201620353331 U CN 201620353331U CN 205508884 U CN205508884 U CN 205508884U
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Abstract
The utility model discloses a good LED packaging structure of colour temperature uniform heat dissipation nature, including the LED chip, be provided with the heat dissipation channel that is used for strengthening the thermal diffusivity, be used for the transmission than the euphotic layer of highlight line with be used for the transmission than the printing opacity portion of low light level line, it has phosphor powder all to fill in euphotic layer and the printing opacity portion, the thickness of printing opacity portion is greater than euphotic thickness. The utility model discloses a set up the heat -sinking capability that heat dissipation channel has strengthened LED packaging structure greatly, the utility model discloses to pass through away through the euphotic layer that thickness is thin than the highlight line, and will pass through away through the printing opacity portion that thickness is thick than low light level line for the colour temperature of the transmitted light of LED chip wholly seems more even.
Description
Technical field
This utility model relates to a kind of LED encapsulation structure, the LED encapsulation structure that a kind of colour temperature Homogeneouslly-radiating is good.
Background technology
The basic structure of traditional LED lamp is one piece of electroluminescent chip of semiconductor material; with on elargol or latex solidified to support; then chip and circuit board are connected with silver wire or gold thread; then surrounding epoxy sealing; play the effect of protection internal core; shell is finally installed, so the anti-seismic performance of LED lamp is good.Utilization field relates to daily household electrical appliances and the machinery production aspects such as mobile phone, desk lamp, household electrical appliances.But generally there is the problem that colour temperature is uneven and thermal diffusivity is bad in conventional LED package structure.
Utility model content
For solving the problems referred to above, the purpose of this utility model is the LED encapsulation structure providing a kind of colour temperature Homogeneouslly-radiating good.
The invention for solving the technical problem be the technical scheme is that the LED encapsulation structure that a kind of colour temperature Homogeneouslly-radiating is good, including LED chip, be provided with the heat dissipation channel for strengthening thermal diffusivity, for transmission compared with the photic zone of high light line and for transmission compared with the transmittance section of decreased light, all being filled with fluorescent material in described photic zone and transmittance section, the thickness of described transmittance section is more than euphotic thickness.
Further, described heat dissipation channel includes that micro-heat dissipation channel, described micro-heat dissipation channel are provided with at two and are arranged at the both sides of heat dissipation channel with being respectively symmetrically.Micro-heat dissipation channel that this utility model is arranged, can strengthen heat-sinking capability of the present utility model further；Micro-heat dissipation channel is symmetrically disposed on the both sides of heat dissipation channel by this utility model, so that this utility model heat radiation is uniformly, the temperature difference that effectively prevent encapsulating structure various piece is too high.
Further, being provided with installation inner chamber, described LED chip is arranged in installation inner chamber.LED chip is arranged in installation inner chamber by this utility model, and the beneficially protection of LED chip extends the service life of product.
Further, being provided with the reflecting layer of light utilization for increasing LED chip, described reflecting layer is arranged at the lower section installing inner chamber.The light of general LED chip is all to penetrate to surrounding, and cannot be effectively utilized to the light installing bottom surface injection of LED chip, therefore this utility model is provided with reflecting layer in the lower section of LED chip, so can be effectively improved the light utilization of LED chip.
Further, being provided with the protective layer for protecting reflecting layer, described reflecting layer is arranged at the inside of protective layer.This utility model is provided with protective layer, and within reflecting layer is arranged at protective layer, so can effectively prevent the silver in reflecting layer from curing, improve the service life in reflecting layer.
Further, described photic zone thickness from top to bottom gradually thickeies.Owing to the light of LED chip both sides is more weak, so can be designed so that more weak light passes through thicker fluorescent material, so that the colour temperature of light is more uniform.
The beneficial effects of the utility model are: the good LED encapsulation structure of a kind of colour temperature Homogeneouslly-radiating that this utility model uses, this utility model has been greatly reinforced the heat-sinking capability of LED encapsulation structure by arranging heat dissipation channel；Relatively high light line is gone out by this utility model by the photic zone transmission of thinner thickness, and relatively decreased light is gone out by the transmittance section transmission that thickness is thicker so that the colour temperature entirety of the transmission light of LED chip seems that ratio is more uniform.
Accompanying drawing explanation
The utility model is described in further detail with example below in conjunction with the accompanying drawings.
Fig. 1 is structure chart of the present utility model.
Detailed description of the invention
Fig. 1 is structure chart of the present utility model, as shown in Figure 1, the LED encapsulation structure that a kind of colour temperature Homogeneouslly-radiating is good, including LED chip 1, be provided with the heat dissipation channel 2 for strengthening thermal diffusivity, for transmission compared with the photic zone 3 of high light line and for transmission compared with the transmittance section 4 of decreased light, all being filled with fluorescent material in described photic zone 3 and transmittance section 4, the thickness of described transmittance section 4 is more than the thickness of photic zone 3.Heat dissipation channel 2 of the present utility model includes that micro-heat dissipation channel 5, described micro-heat dissipation channel 5 are provided with at two and are arranged at the both sides of heat dissipation channel 2 with being respectively symmetrically.Micro-heat dissipation channel 5 that this utility model is arranged, can strengthen heat-sinking capability of the present utility model further；Micro-heat dissipation channel 5 is symmetrically disposed on the both sides of heat dissipation channel 2 by this utility model, so that this utility model heat radiation is uniformly, the temperature difference that effectively prevent encapsulating structure various piece is too high.
This utility model is provided with installation inner chamber 6, and described LED chip 1 is arranged in installation inner chamber 6.LED chip 1 is arranged in installation inner chamber 6 by this utility model, and the beneficially protection of LED chip 1 extends the service life of product.This utility model is provided with the reflecting layer 7 of the light utilization for increasing LED chip 1, and described reflecting layer 7 is arranged at the lower section installing inner chamber 6.The light of general LED chip 1 is all to penetrate to surrounding, and cannot be effectively utilized to the light installing bottom surface injection of LED chip 1, therefore this utility model is provided with reflecting layer 7 in the lower section of LED chip 1, so can be effectively improved the light utilization of LED chip 1.This utility model is provided with the protective layer 8 for protecting reflecting layer 7, and described reflecting layer 7 is arranged at the inside of protective layer 8.This utility model is provided with protective layer 8, and within reflecting layer 7 is arranged at protective layer 8, so can effectively prevent the silver in reflecting layer 7 from curing, improve the service life in reflecting layer 7.Photic zone 3 of the present utility model thickness from top to bottom gradually thickeies.Owing to the light of LED chip 1 both sides is more weak, so can be designed so that more weak light passes through thicker fluorescent material, so that the colour temperature of light is more uniform.
The above, preferred embodiment the most of the present utility model, this utility model is not limited to above-mentioned embodiment, as long as it reaches technique effect of the present utility model with identical means, all should belong to protection domain of the present utility model.
Claims (6)
1. the LED encapsulation structure that a colour temperature Homogeneouslly-radiating is good, including LED chip (1), it is characterized in that: be provided with the heat dissipation channel (2) for strengthening thermal diffusivity, compared with the photic zone (3) of high light line and be used for the transmission transmittance section (4) compared with decreased light for transmission, all being filled with fluorescent material in described photic zone (3) and transmittance section (4), the thickness of described transmittance section (4) is more than the thickness of photic zone (3).
The LED encapsulation structure that a kind of colour temperature Homogeneouslly-radiating the most according to claim 1 is good, it is characterized in that: described heat dissipation channel (2) includes that micro-heat dissipation channel (5), described micro-heat dissipation channel (5) are provided with at two and are arranged at the both sides of heat dissipation channel (2) with being respectively symmetrically.
The LED encapsulation structure that a kind of colour temperature Homogeneouslly-radiating the most according to claim 1 is good, it is characterised in that: being provided with installation inner chamber (6), described LED chip (1) is arranged in installation inner chamber (6).
The LED encapsulation structure that a kind of colour temperature Homogeneouslly-radiating the most according to claim 3 is good, it is characterized in that: be provided with the reflecting layer (7) of light utilization for increasing LED chip (1), described reflecting layer (7) are arranged at the lower section installing inner chamber (6).
The LED encapsulation structure that a kind of colour temperature Homogeneouslly-radiating the most according to claim 4 is good, it is characterised in that: being provided with the protective layer (8) for protecting reflecting layer (7), described reflecting layer (7) are arranged at the inside of protective layer (8).
The LED encapsulation structure that a kind of colour temperature Homogeneouslly-radiating the most according to claim 1 is good, it is characterised in that: described photic zone (3) thickness from top to bottom gradually thickeies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620353331.8U CN205508884U (en) | 2016-04-22 | 2016-04-22 | Good LED packaging structure of colour temperature uniform heat dissipation nature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620353331.8U CN205508884U (en) | 2016-04-22 | 2016-04-22 | Good LED packaging structure of colour temperature uniform heat dissipation nature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205508884U true CN205508884U (en) | 2016-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620353331.8U Active CN205508884U (en) | 2016-04-22 | 2016-04-22 | Good LED packaging structure of colour temperature uniform heat dissipation nature |
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| Country | Link |
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| CN (1) | CN205508884U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810806A (en) * | 2016-04-22 | 2016-07-27 | 江门市迪司利光电股份有限公司 | LED packaging structure having uniform colour temperature and good heat dissipation |
| CN107514572A (en) * | 2017-07-26 | 2017-12-26 | 江门吉华光电精密有限公司 | A kind of good washing machine cavity lamp of thermal diffusivity |
-
2016
- 2016-04-22 CN CN201620353331.8U patent/CN205508884U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810806A (en) * | 2016-04-22 | 2016-07-27 | 江门市迪司利光电股份有限公司 | LED packaging structure having uniform colour temperature and good heat dissipation |
| CN107514572A (en) * | 2017-07-26 | 2017-12-26 | 江门吉华光电精密有限公司 | A kind of good washing machine cavity lamp of thermal diffusivity |
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