CN205508877U - LED packaging structure that big thermal diffusivity of illumination zone is good - Google Patents
LED packaging structure that big thermal diffusivity of illumination zone is good Download PDFInfo
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- CN205508877U CN205508877U CN201620354749.0U CN201620354749U CN205508877U CN 205508877 U CN205508877 U CN 205508877U CN 201620354749 U CN201620354749 U CN 201620354749U CN 205508877 U CN205508877 U CN 205508877U
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Abstract
The utility model discloses a LED packaging structure that big thermal diffusivity of illumination zone is good, including the LED chip, be provided with the heat dissipation channel who is used for increasing the hemisphere transparent surface of illumination zone and is used for strengthening heat dispersion. The utility model discloses a with transparent surface LED's the illumination zone that has designed into hemisphere greatly increased, the utility model discloses an add heat dissipation channel, improved packaging structure's heat dispersion greatly.
Description
Technical field
This utility model relates to a kind of LED encapsulation structure, the LED encapsulation structure that the big thermal diffusivity of a kind of illumination zone is good.
Background technology
The basic structure of traditional LED lamp is one piece of electroluminescent chip of semiconductor material; with on elargol or latex solidified to support; then chip and circuit board are connected with silver wire or gold thread; then surrounding epoxy sealing; play the effect of protection internal core; shell is finally installed, so the anti-seismic performance of LED lamp is good.Utilization field relates to daily household electrical appliances and the machinery production aspects such as mobile phone, desk lamp, household electrical appliances.But it is less generally to there is illumination zone in traditional LED encapsulation structure, and thermal diffusivity does not reaches the problems such as requirement.
Utility model content
For solving the problems referred to above, the purpose of this utility model is the LED encapsulation structure providing the big thermal diffusivity of a kind of illumination zone good.
The invention for solving the technical problem be the technical scheme is that the LED encapsulation structure that the big thermal diffusivity of a kind of illumination zone is good, including LED chip, is provided with the hemispherical transparent surface for increasing illumination zone and for strengthening the heat dissipation channel of heat dispersion.
Further, the horizontal micro-heat radiation road for strengthening heat dispersion further it is provided with.This utility model is provided with horizontal micro-heat radiation road, so further enhances the heat-sinking capability of encapsulating structure.
Further, described horizontal micro-heat radiation road is provided with two and is symmetrically disposed on the both sides of heat dissipation channel.Horizontal micro-heat radiation road is symmetrically disposed on the both sides of heat dissipation channel by this utility model, so can avoid each several part excessive temperature differentials of encapsulating structure at improving heat radiation efficiency simultaneously.
Further, the longitudinal direction micro-heat radiation road for strengthening heat dispersion further it is provided with.This utility model is provided with longitudinally micro-heat radiation road, so can further strengthen the heat-sinking capability of encapsulating structure
Further, described longitudinal direction micro-heat radiation road is provided with two and is symmetrically disposed on the both sides of heat dissipation channel.Longitudinally micro-heat radiation road is symmetrically disposed on the both sides of heat dissipation channel by this utility model, so can avoid each several part excessive temperature differentials of encapsulating structure at improving heat radiation efficiency simultaneously.
The beneficial effects of the utility model are: the good LED encapsulation structure of the big thermal diffusivity of a kind of illumination zone that this utility model uses, this utility model considerably increases the illumination zone of LED by transparent surface is designed to hemispherical；This utility model, by setting up heat dissipation channel, substantially increases the heat dispersion of encapsulating structure.
Accompanying drawing explanation
The utility model is described in further detail with example below in conjunction with the accompanying drawings.
Fig. 1 is this utility model structure chart.
Detailed description of the invention
Fig. 1 is this utility model structure chart, as it is shown in figure 1, the LED encapsulation structure that the big thermal diffusivity of a kind of illumination zone is good, including LED chip 1, is provided with the hemispherical transparent surface 2 for increasing illumination zone and for strengthening the heat dissipation channel 3 of heat dispersion.This utility model is provided with the horizontal micro-heat radiation road 4 for strengthening heat dispersion further.This utility model is provided with horizontal micro-heat radiation road 4, so further enhances the heat-sinking capability of encapsulating structure.Horizontal micro-heat radiation road 4 of the present utility model is provided with two and is symmetrically disposed on the both sides of heat dissipation channel 3.Horizontal micro-heat radiation road 4 is symmetrically disposed on the both sides of heat dissipation channel 3 by this utility model, so can avoid each several part excessive temperature differentials of encapsulating structure at improving heat radiation efficiency simultaneously.This utility model is provided with the longitudinal direction micro-heat radiation road 5 for strengthening heat dispersion further.This utility model is provided with longitudinally micro-heat radiation road 5, so can further strengthen the heat-sinking capability of encapsulating structure.Longitudinal direction of the present utility model micro-heat radiation road 5 is provided with two and is symmetrically disposed on the both sides of heat dissipation channel 3.Longitudinally micro-heat radiation road 5 is symmetrically disposed on the both sides of heat dissipation channel 3 by this utility model, so can avoid each several part excessive temperature differentials of encapsulating structure at improving heat radiation efficiency simultaneously.
This utility model has made the radiator structure of an omnibearing stereo by the encapsulating structure that is combined in heat dissipation channel 3, horizontal micro-heat radiation road 4 and longitudinal micro-heat radiation road 5 three, not only it is effectively increased the heat dispersion of LED encapsulation structure, and it is more uniform to dispel the heat, it is to avoid excessive temperature differentials.
The above, preferred embodiment the most of the present utility model, this utility model is not limited to above-mentioned embodiment, as long as it reaches technique effect of the present utility model with identical means, all should belong to protection domain of the present utility model.
Claims (5)
1. the LED encapsulation structure that the big thermal diffusivity of illumination zone is good, including LED chip (1), it is characterised in that: it is provided with the hemispherical transparent surface (2) for increasing illumination zone and for strengthening the heat dissipation channel (3) of heat dispersion.
The LED encapsulation structure that the big thermal diffusivity of a kind of illumination zone the most according to claim 1 is good, it is characterised in that: it is provided with the horizontal micro-heat radiation road (4) for strengthening heat dispersion further.
The LED encapsulation structure that the big thermal diffusivity of a kind of illumination zone the most according to claim 2 is good, it is characterised in that: described horizontal micro-heat radiation road (4) is provided with two and is symmetrically disposed on the both sides of heat dissipation channel (3).
4. according to the LED encapsulation structure that the arbitrary described big thermal diffusivity of a kind of illumination zone of claims 1 to 3 is good, it is characterised in that: it is provided with longitudinal direction micro-heat radiation road (5) for strengthening heat dispersion further.
The LED encapsulation structure that the big thermal diffusivity of a kind of illumination zone the most according to claim 4 is good, it is characterised in that: described longitudinal direction micro-heat radiation road (5) is provided with two and is symmetrically disposed on the both sides of heat dissipation channel (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620354749.0U CN205508877U (en) | 2016-04-22 | 2016-04-22 | LED packaging structure that big thermal diffusivity of illumination zone is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620354749.0U CN205508877U (en) | 2016-04-22 | 2016-04-22 | LED packaging structure that big thermal diffusivity of illumination zone is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205508877U true CN205508877U (en) | 2016-08-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620354749.0U Active CN205508877U (en) | 2016-04-22 | 2016-04-22 | LED packaging structure that big thermal diffusivity of illumination zone is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205508877U (en) |
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2016
- 2016-04-22 CN CN201620354749.0U patent/CN205508877U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |