CN201964364U

CN201964364U - Soaking heat dissipation structure of light-emitting diode (LED) integrated module

Info

Publication number: CN201964364U
Application number: CN2010205700248U
Authority: CN
Inventors: 朱大龙; 朱纪南
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-10-11
Filing date: 2010-10-11
Publication date: 2011-09-07
Anticipated expiration: 2020-10-11

Abstract

The utility model relates to a soaking heat dissipation structure of a light-emitting diode (LED) integrated module, wherein a concave liquid cavity 1 is made from heat conduction and dissipation materials, an LED integrated module 2 is assembled at the bottom side of the inner side of the cavity, a clear heat dissipation liquid 3 is filled in the concave liquid cavity 1, the whole LED integrated module 2 is soaked in the clear heat dissipation liquid 3, and a transparent cover 4 is installed at the front side of the LED integrated module 2. The concave liquid cavity 1 is connected with the transparent cover 4 in a sealing way. The clear heat dissipation liquid 3 conducts the heat of the outer surface of the soaked LED integrated module 2 to the liquid cavity 1, the heat of the liquid cavity 1 is dissipated through a radiator which is connected with the outer surface of the liquid cavity 1, the soaking heat dissipation effect of the LED integrated module is good, the luminous decay is reduced, and the service life is prolonged.

Description

The LED integration module soaks the structure of heat radiation

Technical field

The utility model relates to the radiator structure of LED integration module, and especially the LED integration module soaks the structure of heat conduction and heat radiation.

Background technology

The LED heat radiation that Chinese patent grant number: CN201448618U tells about, be to contact with liquid at the LED lamp plate back side to dispel the heat, its main drawback has: radiator liquid is not soaked whole LED, can not dispel the heat the appearance of LED lamp is comprehensive, especially the heat of sealing can not leave rapidly, and radiating effect is undesirable.Above the led chip is fluorescent material, sealing, and what cause that LED light declines mainly is that fluorescent material, sealing are subjected to the high heat of led chip and ageing failure, particularly the chip height of integrated LED module is concentrated, temperature is higher, and fluorescent material, sealing enjoy the easier aging light decay of high heat especially.

Summary of the invention

There is not whole the immersion to dispel the heat in order to overcome existing LED integration module, the unfavorable drawback of radiating effect, the utility model provides a kind of the whole method of soaking heat radiation of LED integration module can effectively be left the heat of LED lamp integral body, reduces light decay.

The technical method that its technical problem that solves the utility model adopts is as follows:

Materials processing concavity cavity with good heat conductivity is contained in box chamber inner bottom surface with the LED integration module, fills transparent radiator liquid in the box chamber, allows radiator liquid soak the whole LED integration module, and the LED shadow surface is a box chamber transparency cover, and outside, box chamber is connected with radiator.The heat of LED integration module appearance is transmitted to the box chamber by heat-conducting liquid, and the heat in box chamber leaves heat passing on the radiator.

The beneficial effects of the utility model are: the LED integration module can effectively leave by the heat that it is whole by the heat radiation of liquid complete immersion, reduces light decay and increases the service life.

Description of drawings

Below in conjunction with drawings and Examples the utility model is further specified.

Fig. 1 is the structural representation that the utility model LED integration module soaks heat radiation;

Sequence number explanation among Fig. 1: 1. fluid chamber, 2.LED integration module, 3. transparent cooling fluid, 4. transparency cover.

The specific embodiment

Do concavity fluid chamber 1 with the material with heat conduction and heat radiation, LED integration module 2 is contained in the chamber inner bottom surface, fill transparent cooling fluid 3 in the fluid chamber 1, allow transparent cooling fluid 3 soak whole LED integration module 2, transparency cover 4 is installed in LED integration module 2 fronts.Fluid chamber 1 is to be tightly connected with transparency cover 4.The heat of the appearance of the LED integration module 2 that transparent cooling fluid 3 will soak passes to fluid chamber 1, and the heat of fluid chamber 1 is left heat by the radiator that is connected with its outside.

Claims

1. a LED integration module soaks the structure of dispelling the heat, form by fluid chamber (1), LED integration module (2), transparent cooling fluid (3), transparency cover (4), it is characterized in that: do concavity fluid chamber (1) with material with heat conduction and heat radiation, LED integration module (2) is contained in the chamber inner bottom surface of fluid chamber (1), fill transparent cooling fluid (3) in the fluid chamber (1), allow transparent cooling fluid (3) soak whole LED integration module (2), transparency cover (4) is installed in LED integration module (2) front, and fluid chamber (1) is to be tightly connected with transparency cover (4).

2. LED integration module according to claim 1 soaks the structure of heat radiation, and it is characterized in that: the heat of the appearance of the LED integration module (2) that transparent cooling fluid (3) will soak passes to fluid chamber (1).

3. LED integration module according to claim 1 soaks the structure of heat radiation, it is characterized in that: the heat of fluid chamber (1) is left heat by the radiator that is connected with its outside.