CN102072474A - Soaking heat radiating method for LED (Light Emitting Diode) integrated module - Google Patents
Soaking heat radiating method for LED (Light Emitting Diode) integrated module Download PDFInfo
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- CN102072474A CN102072474A CN2010105156681A CN201010515668A CN102072474A CN 102072474 A CN102072474 A CN 102072474A CN 2010105156681 A CN2010105156681 A CN 2010105156681A CN 201010515668 A CN201010515668 A CN 201010515668A CN 102072474 A CN102072474 A CN 102072474A
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Abstract
The invention provides a soaking heat radiating method for an LED integrated module. A concave liquid cavity 1 is made of heat conducting and heating radiating materials, an LED integrated module 2 is arranged on the bottom surface in the cavity, transparent heating radiating liquid 3 is filled in the liquid cavity 1, the whole LED integrated module 2 is soaked by the transparent heating radiating liquid 3, and a transparent cover 4 is arranged on the front of the LED integrated module 2. The liquid cavity 1 is hermetically connected with the transparent cover 4. Heat on the surface of the soaked LED integrated module 2 is conducted to the liquid cavity 1 by the transparent heating radiating liquid 3, and the heat of the liquid cavity 1 is radiated by a heat radiator connected to the outer surface of the liquid cavity 1. The soaking heat radiating effect for the LED integrated module is great, lumens depreciation is reduced, and the service life is prolonged.
Description
Technical field
The present invention relates to the heat dissipating method of LED integration module, especially the LED integration module soaks the method for heat conduction and heat radiation.
Background technology
The LED heat radiation that Chinese patent grant number: CN201448618U tells about, be to contact with liquid at the LED lamp plate back side to dispel the heat, its main drawback has: radiator liquid is not soaked whole LED, can not dispel the heat the appearance of LED lamp is comprehensive, especially the heat of sealing can not leave rapidly, and radiating effect is undesirable.Above the led chip is fluorescent material, sealing, and what cause that LED light declines mainly is that fluorescent material, sealing are subjected to the high heat of led chip and ageing failure, particularly the chip height of integrated LED module is concentrated, temperature is higher, and fluorescent material, sealing enjoy the easier aging light decay of high heat especially.
Summary of the invention
Do not have whole the immersion to dispel the heat in order to overcome existing LED integration module, the unfavorable drawback of radiating effect the invention provides a kind of method with the whole immersion heat radiation of LED integration module, the heat of LED lamp integral body effectively can be left, and reduces light decay.
It is as follows that the present invention solves the technical method that its technical problem adopts:
Materials processing concavity cavity with good heat conductivity is contained in box chamber inner bottom surface with the LED integration module, fills transparent radiator liquid in the box chamber, allows radiator liquid soak the whole LED integration module, and the LED shadow surface is a box chamber transparency cover, and outside, box chamber is connected with radiator.The heat of LED integration module appearance is transmitted to the box chamber by heat-conducting liquid, and the heat in box chamber leaves heat passing on the radiator.
The invention has the beneficial effects as follows: the LED integration module can effectively leave by the heat that it is whole by the heat radiation of liquid complete immersion, reduces light decay and increases the service life.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the structural representation that LED integration module of the present invention soaks the method for heat radiation;
Sequence number explanation among Fig. 1: 1. fluid chamber, 2.LED integration module, 3. transparent cooling fluid, 4. transparency cover.
The specific embodiment
Do concavity fluid chamber 1 with the material with heat conduction and heat radiation, LED integration module 2 is contained in the chamber inner bottom surface, fill transparent cooling fluid 3 in the fluid chamber 1, allow transparent cooling fluid 3 soak whole LED integration module 2, transparency cover 4 is installed in LED integration module 2 fronts.Fluid chamber 1 is to be tightly connected with transparency cover 4.The heat of the appearance of the LED integration module 2 that transparent cooling fluid 3 will soak passes to fluid chamber 1, and the heat of fluid chamber 1 is left heat by the radiator that is connected with its outside.
Claims (3)
1. a LED integration module soaks the method for dispelling the heat, form by fluid chamber (1), LED integration module (2), transparent cooling fluid (3), transparency cover (4), it is characterized in that: do concavity fluid chamber (1) with material with heat conduction and heat radiation, LED integration module (2) is contained in the chamber inner bottom surface of fluid chamber (1), fill transparent cooling fluid (3) in the fluid chamber (1), allow transparent cooling fluid (3) soak whole LED integration module (2), transparency cover (4) is installed in LED integration module (2) front, and fluid chamber (1) is to be tightly connected with transparency cover (4).
2. LED integration module according to claim 1 soaks the method for heat radiation, and it is characterized in that: the heat of the appearance of the LED integration module (2) that transparent cooling fluid (3) will soak passes to fluid chamber (1).
3. LED integration module according to claim 1 soaks the method for heat radiation, it is characterized in that: the heat of fluid chamber (1) is left heat by the radiator that is connected with its outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105156681A CN102072474A (en) | 2010-10-11 | 2010-10-11 | Soaking heat radiating method for LED (Light Emitting Diode) integrated module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105156681A CN102072474A (en) | 2010-10-11 | 2010-10-11 | Soaking heat radiating method for LED (Light Emitting Diode) integrated module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102072474A true CN102072474A (en) | 2011-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105156681A Pending CN102072474A (en) | 2010-10-11 | 2010-10-11 | Soaking heat radiating method for LED (Light Emitting Diode) integrated module |
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| CN (1) | CN102072474A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN104696750A (en) * | 2015-03-03 | 2015-06-10 | 吉林蓝锐电子科技有限公司 | LED light source module and assembling method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101725858A (en) * | 2010-02-11 | 2010-06-09 | 陈炜旻 | LED lamp radiating with optically coupled cooling liquid |
| CN101825242A (en) * | 2010-05-31 | 2010-09-08 | 温辉 | Vacuum liquid cooling LED lamp |
| CN201964364U (en) * | 2010-10-11 | 2011-09-07 | 朱大龙 | Soaking heat dissipation structure of light-emitting diode (LED) integrated module |
-
2010
- 2010-10-11 CN CN2010105156681A patent/CN102072474A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101725858A (en) * | 2010-02-11 | 2010-06-09 | 陈炜旻 | LED lamp radiating with optically coupled cooling liquid |
| CN101825242A (en) * | 2010-05-31 | 2010-09-08 | 温辉 | Vacuum liquid cooling LED lamp |
| CN201964364U (en) * | 2010-10-11 | 2011-09-07 | 朱大龙 | Soaking heat dissipation structure of light-emitting diode (LED) integrated module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN104696750A (en) * | 2015-03-03 | 2015-06-10 | 吉林蓝锐电子科技有限公司 | LED light source module and assembling method thereof |
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| DD01 | Delivery of document by public notice |
Addressee: Zhu Dalong Document name: Notification of Passing Examination on Formalities |
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Application publication date: 20110525 |