CN108183084B - Vacuum suction nozzle component - Google Patents
Vacuum suction nozzle component Download PDFInfo
- Publication number
- CN108183084B CN108183084B CN201711457674.4A CN201711457674A CN108183084B CN 108183084 B CN108183084 B CN 108183084B CN 201711457674 A CN201711457674 A CN 201711457674A CN 108183084 B CN108183084 B CN 108183084B
- Authority
- CN
- China
- Prior art keywords
- chip
- contact
- vacuum
- force generator
- sucking force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of vacuum suction nozzle components comprising Non-contact vacuum sucking force generator is used to generate suction, in the case where not contact object, to pick up and place the object；And position-limit mechanism, it is connect with the Non-contact vacuum sucking force generator, when the Non-contact vacuum sucking force generator generates suction to pick up the object, the edge by contacting the object limits the position of the object.The vacuum suction nozzle component can pick up in the case where the upper surface of not contact chip and chip placement, and can when picking up fixed chip position in order to the respective chip placement region that is aligned in pallet, it is possibly realized so that relying solely on operator and backfilling chip by hand, this does not need the exceptional space for having for pickup on chip not only, chip will not be damaged, placement alignment precision is also increased simultaneously, cost and flow processing time is saved, reduces the quantity of operator.
Description
Technical field
The present invention relates to vacuum slot fields, more particularly, to pick up the vacuum slot that object is transported with placing objects
Component.
Background technique
In electronic industry, needed in such as chip package and test process same to the multiple chips being placed on pallet
Shi Jinhang operation.For example, needing to move from pallet if finding that some chip on pallet has flaw by Manual Visual Inspection
It is backfilling into the corresponding position in pallet except the chip, and by intact chip, in order to follow-up process and standardization.
On the one hand, removing tool chip defective by hand is possible, but since chip is increasingly frivolous and is miniaturized,
By operator directly with hand backfill intact chip may contact chip upper surface, chip easy to damage, also, in operator
Member may be inaccurate when chip to be backfilling into the position on pallet by hand, and then further damages chip, therefore be not allow
's.
On the other hand, it is also contemplated that backfilling chip by hand using standard vacuum suction nozzle, but existing standard vacuum is inhaled
Mouth also needs the upper surface of contact chip, and can be contacted by vacuum slot on current chip to pick up the space of chip very
It is limited.Also, it is backfilled by hand even with standard vacuum suction nozzle, there are still the problems that inaccuracy may be placed when backfill.Separately
Outside, no matter using according to above-mentioned back-filling way in terms of which, certain power can all be applied in chip surface, and this may cause
The warpage of chip.
In another aspect, the corresponding position that intact chip is backfilling on pallet by chip mounter also can be used.But consider
To the price of chip mounter, does so and will increase cost；It is backfilled further, since needing to operate chip mounter, which increases places
The time is managed, and needs additional operator.
Summary of the invention
The present invention provides a kind of vacuum suction nozzle component and its manufacturing method and a kind of pickup and place tool, can be
Not in the case where the upper surface of contact chip pick up and chip placement, and can pick up when fixed chip position in order to
The respective chip placement region being aligned in pallet, is possibly realized so that relying solely on operator and backfilling chip by hand, this
The exceptional space for having for pickup on chip is not needed not only, will not damage chip, while also improving placement alignment precision,
Cost and flow processing time are saved, the quantity of operator is reduced.
According to one embodiment of present invention, a kind of vacuum suction nozzle component is provided comprising Non-contact vacuum suction
Generating device is used to generate suction, in the case where not contact object, to pick up and place the object；And position restrainer
Structure is connect with the Non-contact vacuum sucking force generator, generates suction in the Non-contact vacuum sucking force generator
When power is to pick up the object, the edge by contacting the object limits the position of the object.
Still another embodiment in accordance with the present invention provides a kind of pickup and place tool, including tracheae, be used to convey plus
The gas of pressure；Gas flow controller is connected with the tracheae, for controlling the gas of the pressurization provided from the tracheae
Amount；Vacuum suction nozzle component according to an embodiment of the invention has in the Non-contact vacuum sucking force generator
The stomata of upper setting；And connector, between the gas flow controller and the vacuum suction nozzle component, for connecting
Tracheae and the stomata are stated, to supply the gas of the pressurization to the Non-contact vacuum sucking force generator by the tracheae
Body.
According to each embodiment of aforementioned present invention, on the one hand, vacuum suction nozzle component of the invention includes contactless
Pull of vacuum generating device is generated in the suction that can pick up the object in the case where contact object.With regard to chip
Speech, does not need the upper surface of contact chip, therefore, there is no need to the exceptional space for having for picking up chip on chip, Bu Huiyin
The power for acting on chip surface makes chip generate warpage.On the other hand, vacuum suction nozzle component of the invention further comprises limit
Mechanism is limited pair when Non-contact vacuum sucking force generator gets up acquiring object by the edge of contact object
The position of elephant.In the case where only contacting position of the edge of the object such as chip to limit object, core can not only be prevented
The displacement of piece, convenient for alignment pallet on will chip placement position, while will not contact chip surface, avoid in chip
Circuit damage.Furthermore it due to using position-limit mechanism to increase the alignment precision of chip placement, also avoids putting due to chip
Set the chip damage that inaccuracy may cause.
Detailed description of the invention
Fig. 1 is a kind of internal structure chart of Non-contact vacuum sucking force generator；
Fig. 2 is the perspective view that air-flow forms swirling eddy in the internal flow of Non-contact vacuum sucking force generator；
Fig. 3 is the schematic diagram that object is picked up by Non-contact vacuum sucking force generator；
Fig. 4 shows the position-limit mechanism in vacuum suction nozzle component according to an embodiment of the invention；
Fig. 5 shows vacuum suction nozzle component according to an embodiment of the invention；
Fig. 6 shows the pickup including vacuum suction nozzle component and place tool according to one embodiment of present invention；And
Fig. 7 shows the manufacturing method process of vacuum suction nozzle component according to an embodiment of the invention.
Various aspects and features of the invention are described referring to above-mentioned attached drawing.Generally use the same or similar drawing reference numeral
To indicate same or similar component.Above-mentioned attached drawing is only schematical, and not restrictive.It is of the invention not departing from
In the case where purport, the size, shape of all parts, label or appearance can change in above-mentioned attached drawing, without quilt
It is restricted to be merely illustrative as shown by book attached drawing.
Specific embodiment
Illustrate each embodiment, feature and effect of the invention referring especially to chip below.Although using chip as
Object illustrates various aspects of the invention, it should be understood that this is not as the limitation to technical solution of the present invention.As long as energy
Enough suction is enough provided, the vacuum suction nozzle component of the embodiment of the present invention and pickup and place tool, which can be used in picking up, appoints
The object of what type, the object for especially needing to pick up in electronic industry and/or optical industry, this is including but not limited to various
Integrated circuit, chip, circuit board, semiconductor and liquid crystal display panel, and corresponding effect can be obtained in corresponding field.
Fig. 1 is a kind of internal structure chart of Non-contact vacuum sucking force generator 10.Fig. 2 shows air-flows non-contact
10 internal flow of formula pull of vacuum generating device is to form the perspective view of swirling eddy.Non-contact vacuum sucking force generator 10
With main body, stomata 11 is set in main body, stomata 11 is opposite with formed in the body interior two by inlet channel
Channel 12,13 connect, as gas-pressurized F, such as oil-free air, filled via stomata 11 into Non-contact vacuum suction
After setting 10 inside, this two passes 12 and 13 guides gas F along their quickly flowings respectively, is sent out by Non-contact vacuum suction
The gas vent of generating apparatus 10 is blown out along two opposite directions, generates swirling eddy in the lower section of gas vent, so as to
Negative pressure is generated on object to be picked up and forms suction.
Fig. 3 more clearly shows the schematic diagram that object is picked up by Non-contact vacuum sucking force generator 10.Wherein
Object 14 can be chip.Chip 14 is placed on pallet 15, when gas-pressurized F flows into Non-contact vacuum by stomata 11
It after sucking force generator 10, is guided quickly to flow along two opposite channels 12 and 13, to generate in gas vent
Swirling eddy, and then negative pressure is generated in the top of chip 14, make it possible to generate the suction for picking up chip 14, by the arrow in Fig. 3
Head A shows the direction for generating negative pressure.
According to the General Principle for non-contactly picking up object, in Non-contact vacuum sucking force generator 10 with non-contact side
After formula picks up chip, with the rising of chip 14, when (i.e. chip 14 is floating for the pressure difference of the upper and lower surface of chip 14
Power) when reaching balance with the gravity of chip 14, chip 14 is maintained at the spy of 10 lower section of Non-contact vacuum sucking force generator
Place is set in positioning.Non-contact vacuum sucking force generator can be not contact chip 14 the case where, by chip 14 from pallet as a result,
It is picked up on 15.As long as keeping the supply of gas-pressurized, it will be able to transport chip in this way to new placement region.When
When needing chip placement 14, it is thus only necessary to stop or reduce supply pressurized gas F.Pull of vacuum generating device 10 usually mentions
For the suction between 5psi to 20psi, to pick up chip.
Non-contact vacuum sucking force generator 10 shown in Fig. 1-3 is based on bernoulli principle in not contact chip itself
In the case where pick up chip 14.However, this is not unique implementation.It is also contemplated that being inhaled using Cyclonic Non-contact vacuum
Power generating device.Wherein, the gas of pressurization is introduced tangentially into flux chamber, in intracavitary circumnutation of running business into strong one, due to centrifugal force
Effect, and negative pressure is generated thereunder, and then generates the suction for object.
With standard vacuum suction nozzle by sucker contact chip surface and by air in discharge air bag, produce via sucker
The raw negative pressure acted directly on chip is compared to pick up chip, and the vacuum suction nozzle component of the embodiment of the present invention has used above-mentioned
Non-contact vacuum sucking force generator acts on the negative pressure of chip by generation swirling eddy generation to pick up core
Piece, when the buoyancy of chip and gravity reach balance, chip can be tieed up in the case where not contacting pull of vacuum generating device
Hold the specific location below pull of vacuum generating device.Due to not needing contact chip surface, do not need on chip
With the exceptional space for picking up chip, chip will not be caused to damage.
The vacuum suction nozzle component of the embodiment of the present invention further includes and above-mentioned Non-contact vacuum sucking force generator 10 1
The position-limit mechanism used is acted, which connect with pull of vacuum generating device 10.It is filled in Non-contact vacuum suction
When setting 10 generation suction to pick up chip, which can limit the skyborne position of chip by the edge of contact chip
It sets, more particularly along the lateral position of chip surface.Specifically, it is picked up when using Non-contact vacuum sucking force generator 10
When chip, in addition to the gravity of pressure difference (i.e. the buoyancy of chip 14) and chip 14 of the upper and lower surface of chip 14 described above,
Chip 14 will also be acted on the power of chip by position-limit mechanism, when the buoyancy of chip, gravity and position-limit mechanism and chip edge
When power caused by contacting mutually balances, chip is maintained at position-limit mechanism, to limit the movement of chip.In general,
In the vacuum suction nozzle component of the embodiment of the present invention, the buoyancy for acting on chip of the generation of Non-contact vacuum sucking force generator 10
Not less than the gravity of chip itself.
The size of position-limit mechanism and chip matches.When picking up other objects in addition to the chip, position-limit mechanism also with
The size of the object matches.As long as being matched with object size, and when Non-contact vacuum sucking force generator picks up object
The position that object can be limited by the edge of contact object, then position-limit mechanism can be shaped to any shape.In a reality
Apply in example, position-limit mechanism can be around Non-contact vacuum sucking force generator gas vent setting a plurality of limit plate or
Person's gag lever post, a plurality of limit plate or gag lever post can be centered around the gas outlet and generate the direction of negative pressure along same
Angle extends outwardly setting.In this way, from one end far from the gas vent to one end close to the gas vent, in difference
At position, a plurality of limit plate or gag lever post can limit the same shape of multiple and different sizes jointly, thus when non-contact
Formula pull of vacuum generating device generate suction when, can by the edge of contact object at different locations limit different size but
Any of object with same shape.
In a further embodiment, a plurality of limit plate or gag lever post can around generate the direction of negative pressure circumferentially or
The rectangular setting of person can limit the position of different size of round or rectangular object in this way.Also, it is contemplated that relative to pick up
The shape and/or size of the object taken are arranged the shape, size and set-up mode of position-limit mechanism.
For chip, by the only edge of contact chip when picking up chip, limited without contact chip surface
The position of chip, this has picked up chip in the case where not needing the additional pickup space on chip surface, has limited chip
Displacement, in chip placement, convenient on operator's manual-alignment pallet will chip placement placement region.
Fig. 4 shows the position-limit mechanism 20 in vacuum suction nozzle component according to an embodiment of the invention.In the limit
In mechanism 20, uses second surface 28 described further below as stop surface, core is limited by the edge of contact chip
The position of piece.Position-limit mechanism 20 in Fig. 4 specifically includes hollow fixed frame 21 and for connecing fixed frame 21 with non-
Multiple attachment devices 22 that touch pull of vacuum generating device 10 links together.Although showing four attachment devices in Fig. 4
22, but this is not limiting, and any other quantity is also feasible.Attachment device 22 is prolonged from an end face of fixed frame 21
It stretches, first end is connect with fixed frame 21, and second end is connect with Non-contact vacuum sucking force generator 10.21 He of fixed frame
One or more of attachment devices 22 limit a space Ss jointly, when one or more of attachment devices 22 with it is contactless
When pull of vacuum generating device 10 connects, Non-contact vacuum sucking force generator 10 can generate suction in the space S, from
And it will for example pick up into the space S chip.
When operator need the chip having picked up is placed into specific region when, for example be backfilling into it is specific on pallet
When region, which can match with the specific region, consequently facilitating operator is aligned.Preferably, this is fixed
The inside of frame 21 is provided with positioning region 23, can be shaped as pattern as shown in Figure 4.Alternatively, can also be in fixed frame
On 21 on the bottom surface of the EDGE CONTACT of the specific region be arranged positioning region 23.The specific region of positioning region 23 and chip placement
The positioning region of edge matches, so as to which fixed frame 21 is fixed to the specific region.In this way, operator once will
Fixed frame 21 is fixed to alignment specific region, is achieved that the chip of pickup and the autoregistration of placement region.As long as by cutting
Supply that is disconnected or reducing gas-pressurized, due to gravity, it will be able to so that having picked up and being maintained in space S
Chip falls on the specific region, without artificial vision is directed at chip and the specific region.
In one embodiment, pickup and placement can be controlled by selecting the thickness D of used fixed frame 21
The height of chip.In general, fixed frame 21 picks up and has the thickness less than 3 millimeters on placement direction.It is blocked up to be possible to damage
Hurt chip.
Attachment device 22 in Fig. 4 is specifically shaped to four clamping parts.It is expected that the quantity of the clamping part can be less than
Four or be more than four.Each clamping part is provided with into space S first outstanding in the first end close to fixed frame 21
Divide 24, each first part 24 has first surface 27 and second surface 28.It is inhaled when by each component of Fig. 4 and Non-contact vacuum
When power generating device 10 assembles, which can be supported on first surface 27.When Fig. 4 institute
The fixed mechanism 20 and Non-contact vacuum sucking force generator 10 shown, which fits together, constitutes 30 (such as Fig. 5 of vacuum suction nozzle component
It is shown) when, second surface 28 has the certain angle relative to the direction for generating negative pressure, fills in Non-contact vacuum suction
Set the position that the chip is limited when 10 generation suction pick up chip.In this embodiment, the second surface 28 of first part 24
With the function of being restricted chip position.
Fig. 5 shows the schematic diagram of vacuum suction nozzle component 30 according to an embodiment of the invention.Wherein, contactless true
Empty sucking force generator 10 is connect with position-limit mechanism 20 as shown in Figure 4.As seen from Figure 5, Non-contact vacuum suction fills
It sets 10 to be supported on the first surface 27 of each first part 24, and in addition to first part 24, each clamping part 22 is also set
Be equipped with opposite with first part 24 one end setting second part 26 and connect the of first part 24 and second part 26
Three parts 25, second part 26 and first part 24 are used for Non-contact vacuum sucking force generator 10 in 26 He of second part
Clamping between the first surface 27 of first part 24.Part III 25 has clamping surface, when Non-contact vacuum suction occurs
Device 10 between second part 26 and the first surface of first part 24 27 when clamping, the surface of Part III 25 with it is non-contact
The surface of formula pull of vacuum generating device 10 engages.In one embodiment, which is capable of providing in the horizontal direction
The upper power for clamping Non-contact vacuum sucking force generator 10.If the clamping surface of Part III 25 and Non-contact vacuum are inhaled
Frictional force between the surface of power generating device 10 is sufficiently large, can omit the first part 24 for playing a supportive role.Alternatively,
It can the only clamping Non-contact vacuum sucking force generator between second part 26 and the first surface of first part 24 27
10, chucking power is provided without the use of clamping surface.
In one embodiment, the clamping part 22 including second part 26 can be configured, realizes that the clamping part 22 connects with non-
Touch pull of vacuum generating device 10 is detachably connected, in turn, can be realized position-limit mechanism (especially stop surface 28) with
Non-contact vacuum sucking force generator 10 is detachably connected.Thereby, it is possible to configure different Non-contact vacuums according to application
The combination of sucking force generator and position-limit mechanism.In one embodiment, directly position-limit mechanism 20 and Non-contact vacuum are inhaled
Power generating device 10 forms one, that is, is fixedly connected and feasible, such as by the two by way of 3D printing or punch die
Monolithic molding.
As shown in figure 5, when Non-contact vacuum sucking force generator 10 generates suction and picks up chip, due to first part
Tilted to space S from the fixed frame 21 and size and shape with chip of 24 multiple second surfaces 28 matches,
Second surface 28 is capable of the edge of contact chip, so that chip is maintained at each second surface 28, limits the movement of chip.
It illustrate only the position-limit mechanism that fixed frame 21 is combined according to one embodiment in Fig. 4.In other implementations
In example, fixed frame 21 can be omitted, and only retains the clamping part 22 connecting with Non-contact vacuum sucking force generator 10,
To only realize limit function, and ignore the function of alignment chip placement region.
In a further embodiment, attachment device 22 can be configured to be different from clamping part shown in Figure 4 and 5, and only
The connection being provided in only between fixed frame 21 and Non-contact vacuum sucking force generator 10, to only realize that alignment is placed
The function in region.As such, it is desirable to other separate configurations position-limit mechanism, for example, position-limit mechanism can be configured to from fixed frame 21
Extend close to the end face of Non-contact vacuum sucking force generator 10 into space S raised.Alternatively, can be from contactless true
The gas vent of empty sucking force generator 10 is individually extended limit plate and/or bar into space S.
The used Non-contact vacuum sucking force generator, limit of the embodiment of the present invention are described above by reference to attached drawing
Mechanism and by the two assembling or the vacuum suction nozzle component to be formed that is fixed together.This is only the preferred embodiment of the present invention,
Rather than to the concrete restriction of vacuum suction nozzle component of the invention.It picks up chip on not contact chip surface and can limit
Under the premise of the position of the chip of pickup, the construction of Non-contact vacuum sucking force generator and position-limit mechanism can be modified, is assembled
And fixed form, without departing from the scope of the present invention.
Non-contact vacuum sucking force generator provides can pick up and chip placement in the case where not contact chip
Means, because without having additional pickup space on chip, avoiding the damage of circuit caused by due to contact chip surface
And chip warpage.Position-limit mechanism makes it possible to limit the position of chip while picking up chip, thus in the transport of chip
In the process, the movement of chip can be limited, and convenient for alignment chip placement region.Due to vacuum suction nozzle component packet of the invention
Above-mentioned two component part has been included, such vacuum suction nozzle component is used by operator in the pickup and placement process of chip
It carries out accurately backfill to be possibly realized, it is no longer necessary to use chip mounter.
In one embodiment, vacuum suction nozzle component of the invention needs in conjunction with the tracheae of the gas for supplying pressurization
It uses.Fig. 6 show can by operator it is manually operated it is a kind of pickup and place tool 40, tracheae 41 is shown,
It is used to convey the gas-pressurized such as oil-free air；Gas flow controller 42 is connected with tracheae 41, mentions for controlling from tracheae 41
The amount of the gas-pressurized of confession；Vacuum suction nozzle component 30 and the connection between gas flow controller 42 and vacuum suction nozzle component 30
First 43.The gas that connector 43 will be arranged on the Non-contact vacuum sucking force generator 10 in tracheae 41 and vacuum suction nozzle component 30
Hole 11 (Fig. 6 is not shown) connection, to pass through tracheae 41 to 10 supply pressurized gas of Non-contact vacuum sucking force generator.Air-flow
It include handle 44 on controller 42.Operator can be controlled by operation handle 44 is supplied to Non-contact vacuum suction to occur
The amount of the gas-pressurized of device 10.When needing to pick up chip, the gas flow of supply can be increased, and works as and needs chip placement
When, it can cut off or reduce supply gas.
Fig. 7 shows the method 700 of manufacture vacuum suction nozzle component according to an embodiment of the invention.Method 700 is wrapped
It including and 701 Non-contact vacuum sucking force generators is provided, the Non-contact vacuum sucking force generator is used to generate suction, with
In the case where not contact object, the object is picked up and placed；702 position-limit mechanisms are provided, the position-limit mechanism is described non-
When contact pull of vacuum generating device generates suction to pick up the object, by contacting described in the edge limitation of the object
The position of object；And the position-limit mechanism is connect 703 with the Non-contact vacuum sucking force generator.
As previously described, it can be and be detachably connected between Non-contact vacuum sucking force generator and position-limit mechanism
Or be fixedly connected.Therefore, non-accordingly by operator's artificial selection in addition to machine assembles above-mentioned vacuum suction nozzle component
Contact pull of vacuum generating device and position-limit mechanism, and it is also possible that the two, which is manually assembled,.
The above-mentioned specific embodiment about system and method for the invention is only schematical, and not restrictive.This
Between a little embodiments can any combination, to achieve the object of the present invention.Protection scope of the present invention is by the attached claims
Book defines.
One word of " comprising " in description and claims is not excluded for the presence of other element or steps.It says in the description
The function of each element that is bright or recording in the claims can also be split or combine, by corresponding multiple element or list
One element is realized." first " and " second " in description and claims is used only for indicating title, is not offered as any
Specific sequence.
Claims (9)
1. a kind of vacuum suction nozzle component (30), comprising:
Non-contact vacuum sucking force generator (10), is used to generate suction, to pick up in the case where not contact object (14)
Take and place the object (14)；And
Position-limit mechanism (20) is connect, in the Non-contact vacuum with the Non-contact vacuum sucking force generator (10)
When sucking force generator (10) generates suction to pick up the object (14), the edge by contacting the object (14) limits institute
State the position of object (14), wherein the position-limit mechanism (20) further include:
Hollow fixed frame (21)；And
One or more attachment devices (22) are used to occur the fixed frame (21) and the Non-contact vacuum suction
Device (10) connection；
Wherein, each attachment device (22) extends from an end face of the fixed frame (21), and non-connects with described
Touch pull of vacuum generating device (10) connection, the fixed frame (21) and one or more of attachment devices (22) are common
A space (S) is limited, it is described when the attachment device (22) is connect with the Non-contact vacuum sucking force generator (10)
Non-contact vacuum sucking force generator (10) can generate suction in the space (S).
2. vacuum suction nozzle component (30) according to claim 1, wherein the position-limit mechanism (20) includes from the fixation
The limit that one end close to the Non-contact vacuum sucking force generator (10) of frame (21) extends into the space (S)
Protrusion.
3. vacuum suction nozzle component (30) according to claim 1 or 2, wherein one or more of attachment devices (22)
It is multiple clamping parts (22), one end of each clamping part (22) is provided with first part (24), the first part
(24) there is the first surface (27) for being used to support the Non-contact vacuum sucking force generator (10) and for described non-
Contact pull of vacuum generating device (10) generates suction to pick up the position for limiting the object (14) when the object (14)
Second surface (28).
4. vacuum suction nozzle component (30) according to claim 1, wherein the position-limit mechanism (20) with it is described contactless
Pull of vacuum generating device (10) is detachably connected.
5. vacuum suction nozzle component (30) according to claim 1, wherein the position-limit mechanism (20) further include:
At the fixed frame (21) inside or the end of one end far from the Non-contact vacuum sucking force generator (10)
The one or more positioning regions (23) being arranged on face.
6. vacuum suction nozzle component (30) according to claim 3, wherein each clamping part (22) further include with institute
State the second part (26) of the opposite one end setting of first part (24), the second part (26) and the first part (24)
For by the Non-contact vacuum sucking force generator (10) in the second part (26) and the first part (24)
Clamping between first surface (27).
7. vacuum suction nozzle component (30) according to claim 6, wherein the clamping part (22) further includes being arranged described
Part III (25) between first part (24) and the second part (26), when the Non-contact vacuum suction fills
(10) are set between the second part (26) and the first surface (27) of the first part (24) when clamping, the third portion
The surface of (25) is divided to engage with the surface of the Non-contact vacuum sucking force generator (10).
8. a kind of pickup and place tool (40), comprising:
Tracheae (41) is used to convey gas-pressurized (F)；
Gas flow controller (42) is connected with the tracheae (41), for controlling the pressurization provided from the tracheae (41)
The amount of gas (F)；
According to claim 1, vacuum suction nozzle component described in any one of -7 (30) have and inhale in the Non-contact vacuum
The stomata (11) being arranged on power generating device (10)；And
Connector (43), between the gas flow controller (42) and the vacuum suction nozzle component (43), for connecting
Tracheae (41) and the stomata (11) are stated, to pass through the tracheae (41) Xiang Suoshu Non-contact vacuum sucking force generator (10)
Supply the gas-pressurized (F).
9. pickup according to claim 8 and place tool (40), wherein
The gas-pressurized (F) includes oil-free air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711457674.4A CN108183084B (en) | 2017-12-28 | 2017-12-28 | Vacuum suction nozzle component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711457674.4A CN108183084B (en) | 2017-12-28 | 2017-12-28 | Vacuum suction nozzle component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108183084A CN108183084A (en) | 2018-06-19 |
| CN108183084B true CN108183084B (en) | 2019-03-22 |
Family
ID=62548107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711457674.4A Active CN108183084B (en) | 2017-12-28 | 2017-12-28 | Vacuum suction nozzle component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108183084B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114552022B (en) * | 2021-09-02 | 2023-09-05 | 万向一二三股份公司 | Manufacturing device and manufacturing method of solid battery |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006289559A (en) * | 2005-04-12 | 2006-10-26 | Fluoro Mechanic Kk | Hand-held vacuum tweezers |
| DE102008045257A1 (en) * | 2008-09-01 | 2010-03-04 | Rena Gmbh | Apparatus and method for handling substrates |
| CN102687262A (en) * | 2009-12-23 | 2012-09-19 | Memc电子材料有限公司 | Semiconductor wafer transport system |
| CN203165871U (en) * | 2013-01-31 | 2013-08-28 | 上海星纳电子科技有限公司 | Contactless wafer feeding device |
| CN106548966A (en) * | 2015-09-17 | 2017-03-29 | 英属开曼群岛商精曜有限公司 | The permutation method of wafer |
-
2017
- 2017-12-28 CN CN201711457674.4A patent/CN108183084B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006289559A (en) * | 2005-04-12 | 2006-10-26 | Fluoro Mechanic Kk | Hand-held vacuum tweezers |
| DE102008045257A1 (en) * | 2008-09-01 | 2010-03-04 | Rena Gmbh | Apparatus and method for handling substrates |
| CN102687262A (en) * | 2009-12-23 | 2012-09-19 | Memc电子材料有限公司 | Semiconductor wafer transport system |
| CN203165871U (en) * | 2013-01-31 | 2013-08-28 | 上海星纳电子科技有限公司 | Contactless wafer feeding device |
| CN106548966A (en) * | 2015-09-17 | 2017-03-29 | 英属开曼群岛商精曜有限公司 | The permutation method of wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108183084A (en) | 2018-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101250478B1 (en) | Grinding device, grinding method, and manufacturing method of thin-plate like member | |
| CN105792628B (en) | The autoloader of integrated matching electrical measurement machine equipment | |
| JP5344145B2 (en) | Method for aligning electronic component and substrate in bonding apparatus | |
| JP4777722B2 (en) | Brittle material cleaving device | |
| KR102465718B1 (en) | Method for picking up individually divided chips from chip storage tray | |
| JP7102305B2 (en) | Manufacturing method of die bonding equipment and semiconductor equipment | |
| JP2008124198A (en) | Handler teaching method and handler | |
| CN108183084B (en) | Vacuum suction nozzle component | |
| KR101531583B1 (en) | Transfer jig and method of manufacturing board | |
| JP5447565B2 (en) | Handler teaching method and handler | |
| KR20090109871A (en) | Device for processing printed circuit board | |
| CN104241143B (en) | Cutting apparatus | |
| TW202112511A (en) | Picker and hand including the same | |
| JP5838301B2 (en) | Suction nozzle and component mounting device | |
| JP5688987B2 (en) | Cutting equipment | |
| JP4683129B2 (en) | Handler teaching method and handler | |
| CN208279030U (en) | Positioning fitting loading and unloading equipment | |
| TW201130601A (en) | Grinding device and grinding method, and method of manufacturing thin plate-like member | |
| TW201430360A (en) | Electronic component operating device and detection equipment using the same | |
| JP5766420B2 (en) | Die bonding apparatus and bonding method | |
| CN108987291B (en) | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | |
| JP2020202324A (en) | Robot hand | |
| JP4390365B2 (en) | Bonding method and apparatus | |
| CN217045044U (en) | Marking equipment is got ready to drawing fork of circuit board | |
| JP2678664B2 (en) | Handling device and handling method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |