JP5447565B2 - Handler teaching method and handler - Google Patents

Description

  The present invention relates to a teaching method for a handler and a handler.

  A semiconductor device is inspected by an IC inspection apparatus before shipping. The IC inspection apparatus is also called an IC handler, and the IC handler is provided with a measurement robot. The measuring robot holds a semiconductor device (semiconductor chip) by vacuum suction with a suction pad and attaches it to a tester socket. At this time, the semiconductor chip is mounted on the inspection socket while being pressed with a predetermined force. When the inspection by the tester is completed, the measurement robot vacuum-sucks the semiconductor chip attached to the inspection socket, removes it from the inspection socket, and places it on the collection tray according to the inspection result.

  By the way, since the semiconductor chip is attached to the inspection socket while pressing the semiconductor chip with a predetermined force with the suction pad, when the semiconductor chip attached to the inspection socket is removed by vacuum suction, the suction pad is removed from the upper surface of the semiconductor chip. Adsorbs to a lower position. In this case, the thrust of the lowering mechanism is applied to the semiconductor chip via the suction pad, and a large load may be applied to the semiconductor chip to cause damage. On the other hand, if the suction height of the semiconductor chip is slightly high, the semiconductor chip is sucked up by the air flow of vacuum suction, and the suction pad cannot accurately pick up the semiconductor chip, resulting in a position shift. However, there was a problem that the suction pad was sucked.

  In IC handlers (measuring robots), the operator sets the suction height position visually in the teaching work that is performed in advance, but there is a limit to the visual inspection, and it is not possible to teach the highly accurate height position. There has been a demand for a method of teaching an optimum height position without applying a load to the chip by a simple method.

  Therefore, a method has been proposed in which a force sensor is provided at the tip of the gripping part and teaching is performed without visual inspection (Patent Document 1). In addition, a method has been proposed in which a position detection sensor for detecting a target is provided on the grip portion side to perform teaching without using visual observation (Patent Document 2). Furthermore, a method has been proposed in which a transmission type sensor is provided in the gripping part and teaching is performed without visual inspection (Patent Document 3).

JP-A-9-76183 JP 2004-288787 A JP 2004-193333 A

  However, in Patent Document 1, the force sensor is expensive, has a large size, interferes with the workpiece, and actually has to be detachable, which is very inconvenient. Further, in Patent Document 2 and Patent Document 3, the sensor interferes with the inspection socket. In particular, in a non-lead type semiconductor chip such as BGA or CSP, the socket has a pocket shape. When seated (attached), the state cannot be detected from the side unless some contrivance is made.

  In each of these patent documents, since a jig for teaching is newly added to the gripping part, the structure of the gripping part becomes complicated, and the position adjustment of the jig for teaching is very troublesome. Moreover, the cost is increased by adding a new jig.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to teach a handler that can accurately determine the height position at which the gripping member contacts the upper surface of the semiconductor chip with a simple configuration. It is to provide a method and a handler.

According to the teaching method of the handler of the present invention, a pressing means including an operating body biased upward so as to be positioned at the uppermost end position by an elastic force of an elastic member , and a semiconductor chip connected to the operating body by a grip portion. a gripping member for gripping the, when the pressure of the gripping member inside the air rises to the reference pressure, a teaching method of the handler with a pressure detecting means for outputting an oN signal, and the said actuation member top After disposing the elastic member against the elastic force of the elastic member at an intermediate position between the upper end position and the lowermost position, moving the holding member toward the semiconductor chip while injecting air from the holding part, The position of the pressing means when the gripping member comes into contact with the semiconductor chip and the pressure detection means outputs an ON signal is the height position at which the gripping member comes into contact with the semiconductor chip. Register.

According to the teaching method of the handler of the present invention, while injecting the grip portion or al air, the gripping member is moved toward the half-conductor chip, the grip portion is moved to position the semiconductor chip, or gripper The air blowing out is blocked by the semiconductor chip. By air is blocked, back pressure of the air for jetting gripper or found increases. Accordingly, since the height position where the gripping member contacts the semiconductor chip can be detected before the semiconductor chip is directly pressed, teaching can be performed with a simple configuration without applying a large load to the semiconductor chip. .

  Furthermore, even if the tip of the gripping member moves further than the position of the upper surface of the semiconductor chip for some reason, the gripping member (operating body) moves relative to the pressing means, so there is no possibility of damaging the semiconductor chip.

The handler according to the present invention includes a pressing means including an operating body biased upward so as to be positioned at the uppermost end position by an elastic force of an elastic member , and is connected to the operating body and holds a semiconductor chip by a holding portion. Air is supplied to the gripping member, the moving means for moving the pressing means, and the pressing means, and the operating body is resisted against the elastic force of the elastic member at an intermediate position between the uppermost position and the lowermost position. Operating means driving means to be moved, pressing means position detecting means for detecting the position of the pressing means, air supply means for injecting air from the gripping part, and the pressure of the air inside the gripping member to a reference pressure A pressure detecting means for outputting an ON signal when lifted, a drive control means for moving the gripping member toward the semiconductor chip while jetting air from the gripping portion, and the gripping member Registration means for registering in the storage means the position of the pressing means when the pressure detection means outputs an ON signal in contact with the conductor chip as the height position at which the gripping member comes into contact with the semiconductor chip; It was.

According to the handler of the present invention, the gripping member is Moving towards the semi-conductor chip, air being gripper or al injection, it is closed on the semiconductor chip disposed in a chip placement position. When the air injection is blocked, the pressure of the air guided to the gripping portion rises to the reference pressure, and the rise is detected by the pressure detecting means and an ON signal is output . The registration unit registers the position of the pressing unit at that time in the storage unit as a height position at which the gripping member contacts the semiconductor chip.

Therefore, it is possible to detect the height position at which the holding member contacts the semiconductor chip with a simple configuration without applying a large load to the semiconductor chip.
Furthermore, even if the tip of the gripping part moves further than the position of the upper surface of the semiconductor chip for some reason, the gripping member (operating body) moves relative to the pressing means, so there is no possibility of damaging the semiconductor chip.

The top view of an IC handler. The whole perspective view for demonstrating the measuring robot with which the IC handler was equipped. Sectional drawing for demonstrating the press apparatus provided in the measurement robot. Air pneumatic circuit diagram of the measurement robot. The circuit diagram which shows the electric constitution of a measurement robot. The flowchart figure which shows operation | movement of a control apparatus. The figure which shows the state which the suction pad is contacting the upper surface of IC chip. The flowchart figure which shows operation | movement of the control apparatus explaining 2nd Embodiment.

(First embodiment)
Hereinafter, a first embodiment in which the present invention is embodied in an IC handler will be described with reference to FIGS.

  FIG. 1 is a plan view showing the configuration of the IC handler 10. The IC handler 10 includes a base 101, a safety cover 102, a high temperature chamber 103, a supply robot 104, a recovery robot 105, a first slide table 106, a second slide table 107, and a plurality of conveyors C1 to C6.

  The base 101 has the elements mounted on the upper surface thereof. The safety cover 102 surrounds a large area of the base 101, and the supply robot 104, the recovery robot 105, the first slide table 106 and the second slide table 107 are accommodated therein.

  The plurality of conveyors C <b> 1 to C <b> 6 are provided on the base 101 so that one end side thereof is located outside the safety cover 102 and the other end portion is located inside the safety cover 102. Each of the conveyors C1 to C6 conveys the tray 108 containing a plurality of IC chips T as semiconductor chips from the outside of the safety cover 102 into the safety cover 102, and conversely, moves the tray 108 into the safety cover 102. From the safety cover 102 to the outside.

  The supply robot 104 includes an X-axis frame FX and a first Y-axis frame FY1. The collection robot 105 includes the X-axis frame FX and the second Y-axis frame FY2. The X-axis frame FX is disposed in the X direction. The first Y-axis frame FY1 and the second Y-axis frame FY2 are arranged to be parallel to each other along the Y direction, and are supported so as to be movable in the X direction with respect to the X-axis frame FX. . The first Y-axis frame FY1 and the second Y-axis frame FY2 are reciprocated in the X direction along the X-axis frame FX by respective motors (not shown) provided on the X-axis frame FX.

  A supply-side robot hand unit 110 is supported on the lower side of the first Y-axis frame FY1 so as to be movable in the Y direction. The supply-side robot hand unit 110 is reciprocated in the Y direction along the first Y-axis frame FY1 by respective motors (not shown) provided on the first Y-axis frame FY1. Then, the supply-side robot hand unit 110 supplies, for example, the tray 108 containing the IC chip T before the inspection of the conveyor C1 to the first slide table 106, for example.

  A collection-side robot hand unit 111 is supported below the second Y-axis frame FY2 so as to be movable in the Y direction. The collection-side robot hand unit 111 reciprocates in the Y direction along the second Y-axis frame FY2 by respective motors (not shown) provided on the second Y-axis frame FY2. Then, the supply-side robot hand unit 110 supplies, for example, the inspected IC chip supplied to the second slide table 107 to, for example, the tray 108 of the conveyor C8.

  A measurement robot 11 is provided in the high temperature chamber 103. For example, the measurement robot 11 attaches the IC chip T before inspection supplied to the first slide table 106 to the inspection socket 50. The IC chip T mounted in the inspection socket 50 is subjected to electrical inspection. Further, the measurement robot 11 supplies the IC chip T after completion of the inspection mounted on the inspection socket 50 to the second slide table 107, for example.

  FIG. 2 is a perspective view of a main part of the measurement robot 11, and the measurement robot 11 includes a contact arm 20. The contact arm 20 is provided so as to be reciprocally movable in the X and Y directions with respect to the robot body by an X-axis motor MX and a Y-axis motor MY (both of which are shown in FIG. 5) respectively provided on the robot body of the measuring robot 11. It has been.

  A Z-axis motor MZ as a moving means is fixed to the contact arm 20. The Z-axis motor MZ is composed of a servo motor, and includes an encoder SE1. The rotation speed, rotation position, and rotation direction of the Z-axis motor MZ are detected by a detection signal from the encoder SE1.

  A ball screw 21 extending in the Z direction (vertical direction) is rotatably supported by a pair of upper and lower bearings 22 at a position adjacent to the Z-axis motor MZ in the contact arm 20. A driven pulley 23 is fixed to a portion of the ball screw 21 that protrudes from the bearing 22. The driven pulley 23 is drivingly connected to a driving pulley 25 fixed to the rotating shaft of the Z-axis motor MZ via a connecting belt 24. Therefore, when the Z-axis motor MZ rotates forward and backward, the ball screw 21 rotates forward and backward via the drive pulley 25, the connecting belt 24, and the driven pulley 23.

  In the contact arm 20, a guide rail 26 extending in the Z direction (vertical direction) is fixed between the Z-axis motor MZ and the ball screw 21. The guide rail 26 is provided with a carriage 27 that is movable along the guide rail 26, and the carriage 27 is provided with a connecting member 28. The connecting member 28 is provided with a screwing portion 28a in which a female screw into which the ball screw 21 is screwed is formed. Therefore, when the Z-axis motor MZ (ball screw 21) rotates in the forward and reverse directions, the connecting member 28 (carriage 27) screwed with the ball screw 21 can move along the guide rail 26, so Reciprocates in the direction (up and down direction).

  A mounting plate 29 is connected and fixed to the connecting member 28. The mounting plate 29 extends in the anti-X direction (forward) from the connecting member 28, and a pair of front and rear compliance units CU are provided on the lower surface thereof.

  The compliance unit CU includes a plurality of (two in FIG. 2) pressing devices 30. The pressing device 30 grips (sucks and holds) an IC chip T (see FIG. 3) as a semiconductor chip and presses it onto a test socket 50 (see FIG. 3) provided on the tester head 12. The lower surface of the plate 29 is fixed. In the present embodiment, by providing the two pressing devices 30, two IC chips T are held and conveyed at a time. The compliance unit CU is detachably connected to the mounting plate 29, and can be appropriately replaced according to the number and arrangement of the IC chips T to be inspected.

Next, the pressing device 30 as pressing means will be described with reference to FIG.
In FIG. 3, the pressing device 30 includes an air cylinder SL fixed to the connection base 31 and a device chuck DC connected to the tip of the air cylinder SL.

  In the air cylinder SL, the base end portion of the cylinder tube 32 is fixed to the connection base 31. The cylinder tube 32 includes a bottomed cylindrical tube main body 32a and a front plate 32b that closes the opening of the tube main body 32a, and a piston 33 as an operating body in a cylinder chamber formed by the tube main body 32a and the front plate 32b. Are arranged so as to be movable in the Z direction (vertical direction). Therefore, the cylinder chamber is partitioned by the piston 33 into the first chamber a on the upper side and the second chamber b on the lower side.

  The piston 33 is lifted upward by a spring SP as an elastic member, which will be described later, and the position of the piston 33 on the first chamber a side is in contact with the bottom surface of the tube main body 32a shown in FIG. It is located at the top end position).

  An air introduction port 34 is formed at the end of the tube body 32a on the first chamber a side, and the first connection port P1 is attached to the air introduction port 34. The first connection port P1 is connected to an electropneumatic regulator 61 (see FIG. 4) via an air supply pipe R1 (see FIG. 4). And then. When air is supplied from the electropneumatic regulator 61 to the first chamber a, the elastic force of the spring SP of the device chuck DC from the uppermost position where the piston 33 abuts against the bottom surface of the tube main body 32a due to the pressure of the air. It is designed to move downward against this.

  Incidentally, the stroke amount of the piston 33 is the distance to the position (lowermost position) where the lower surface of the piston 33 contacts the inner surface of the front plate 32b when the piston 33 is at the uppermost position shown by the solid line in FIG. That is, it coincides with the vertical interval of the second chamber b shown in FIG.

  The device chuck DC includes a connection block 41, and a connection protrusion 41a formed on the upper surface thereof is connected and fixed to the piston 33 and a screw N through a through hole formed in the front plate 32b. Therefore, the connection block 41 (device chuck DC) moves in the vertical direction together with the piston 33.

  A spring SP is connected between the connection block 41 and the connection base 31. That is, the connection block 41 is elastically suspended from the connection base 31 via the spring SP. In this embodiment, the spring SP pushes up the piston 33 via the connecting block 41 so that the piston 33 is positioned at the uppermost end position. When air is supplied to the first chamber a, the pressure causes the piston 33 to move downward against the elastic force of the spring SP, eventually reaching the lowest end position and hitting the front plate 32b. The downward movement is restricted.

  The connection block 41 is recessed at the lower surface center position, and a vacuum guide path 42 is formed by forming a through hole from the recessed position toward the outer surface. A second connection port P <b> 2 is attached to the vacuum guide path 42 on the outer surface of the connection block 41.

  An intermediate block 43 is connected and fixed below the connecting block 41, and a guide block 44 is connected and fixed below the intermediate block 43. In the central position of the intermediate block 43 and the guide block 44, accommodation holes that communicate with the vacuum guide path 42 formed in the connection block 41 are formed to penetrate, respectively, and suction tubes 45 are disposed in these accommodation holes.

  A suction pad 46 is connected and fixed to the tip of the suction tube 45. Then, by bringing the inside of the suction tube 45 to a negative pressure state, the suction pad 46 sucks and holds the IC chip T as shown in FIG. On the other hand, by releasing the negative pressure in the suction tube 45, the suction pad 46 places the IC chip T held by suction in, for example, the inspection socket 50 provided in the tester head 12.

  A detected piece 47 is fixed to the outer surface of the connecting block 41 with a bolt 48. The detected piece 47 is detected by a relative position detection sensor SE2 composed of a photocoupler as a relative position detecting means fixed to the connection base 31 at its tip end portion. More specifically, the relative position detection sensor SE2 moves the detection piece 47 that moves up and down with the movement of the piston 33 (device chuck DC) in the vertical direction, that is, between the piston 33 (device chuck DC) and the cylinder tube 32. Detect relative position.

  In the present embodiment, the detection signal of the relative position detection sensor SE2 is “off” when the piston 33 passes the intermediate position between the uppermost end position and the lowermost position from the uppermost position side to the lowermost position side. The signal is switched from the “ON” signal to the “OFF” signal when the signal is switched from the “ON” signal to the “ON” signal.

  As shown in FIG. 3, the tester head 12 is provided with an inspection socket 50. The inspection socket 50 is provided with spring pins 52 having contact portions 51 at the upper ends as many as the number of terminals Ta of the IC chip T. The spring pin 52 moves up and down with a predetermined stroke with respect to the inspection socket 50. When the IC chip T is pushed down, each terminal Ta of the IC chip T comes into contact with the corresponding contact portion 51 from above and the spring pin 52 is pushed down.

  As a result, each terminal Ta of the IC chip T and the contact portion 51 of the inspection socket 50 are in electrical contact, and electrical inspection is performed in that state. After the inspection is completed, the inspected IC chip T is picked up from the inspection socket 50 by the device chuck DC, and is conveyed to a storage unit (not shown) according to the inspection result.

Next, the pneumatic circuit of the measuring robot 11 configured as described above will be described with reference to FIG.
In FIG. 4, an electropneumatic regulator 61 as an operating body driving means is connected to a first connection port P1 via an air supply pipe R1, supplies air to the first chamber a of the cylinder tube 32, and the first The pressure of air in the chamber a is adjusted. The piston 33 moves up and down with respect to the cylinder tube 32 against the elastic force of the spring SP by the pressure of the air in the first chamber a.

  The vacuum circuit 62 as air suction means is connected to the second connection port P2 via the first switching electromagnetic valve B1 and the opening / closing electromagnetic valve B3. The vacuum circuit 62 includes a suction pump and generates a negative pressure source. The vacuum circuit 62 allows the suction pad 46 to suck and hold the IC chip T by bringing the inside of the suction pipe 45 to a negative pressure state via the first switching electromagnetic valve B1 and the open / close electromagnetic valve B3. .

  The positive pressure circuit 63 as the air supply means is connected to the second connection port P2 through the second switching electromagnetic valve B2 and the opening / closing electromagnetic valve B3. The positive pressure circuit 63 includes a discharge pump and generates a positive pressure source. The positive pressure circuit 63 is configured to inject air from the suction pad 46 by bringing the inside of the suction pipe 45 to a positive pressure state via the second switching electromagnetic valve B2 and the open / close electromagnetic valve B3. .

  A pressure detection sensor 65 as pressure detection means is provided in the pipe R2 between the second connection port P2 and the open / close electromagnetic valve B3. The pressure detection sensor 65 detects the pressure of air in the pipe R2 (suction pipe 45). In this embodiment, when the positive pressure circuit 63 causes the suction pipe 45 to be in a positive pressure state and air is ejected from the suction pad 46, the mouth of the suction pad 46 is gradually closed. The pressure of air in the pipe R2 (suction pipe 45) increases accordingly. The pressure detection sensor 65 outputs a detection signal that changes from an “off” signal to an “on” signal when the pressure rises to a predetermined reference pressure.

Next, the electrical configuration of the measuring robot 11 will be described with reference to FIG.
In FIG. 5, a control device 70 as a drive control means, a working body movement control means, and a pressing means movement control means has a CPU 70A, a ROM 70B, and a RAM 70C. The control device 70 attaches the IC chip T before the inspection to the inspection socket 50 according to the stored various data and various control programs, and removes the IC chip T after the inspection from the inspection socket 50 by suction. Then, the processing of teaching the height position where the pressing device 30 (the suction pad 46) comes into contact with the IC chip T mounted on the inspection socket 50 is executed.

  An input / output device 71 having various operation switches and a display is connected to the control device 70. The input / output device 71 displays the processing status of various processes executed by the measurement robot 11. The input / output device 71 inputs a signal instructing the start of execution of each process, initial value data for executing each process, and the like to the control device 70.

  An electropneumatic regulator drive circuit 72 is connected to the control device 70. The control device 70 outputs a drive control signal to the electropneumatic regulator drive circuit 72. The electropneumatic regulator drive circuit 72 drives the electropneumatic regulator 61 in response to the drive control signal from the control device 70, supplies air to the first chamber a of the cylinder tube 32, and air in the first chamber a. Adjust the pressure.

  An electromagnetic valve drive circuit 73 is connected to the control device 70. The control device 70 outputs a drive control signal to the electromagnetic valve drive circuit 73. In response to the drive control signal from the control device 70, the electromagnetic valve drive circuit 73 switches and controls the first switching electromagnetic valve B1, the second switching electromagnetic valve B2, and the open / close electromagnetic valve B3.

  For example, when adsorbing the IC chip T, the control device 70 controls to open the first switching electromagnetic valve B1 and the opening / closing electromagnetic valve B3 and to close the second switching electromagnetic valve B2. In other words, the suction circuit 45 is made to have a negative pressure in the vacuum circuit 62 so that the suction pad 46 can hold the IC chip T by suction. Further, the control device 70 performs the second switching in the teaching operation for obtaining the height position of the pressing device 30 (suction pad 46) when the suction pad 46 contacts the upper surface of the IC chip T on which the inspection socket 50 is mounted. Control is performed so that the electromagnetic valve B2 and the open / close electromagnetic valve B3 are opened and the first switching electromagnetic valve B1 is closed. That is, the positive pressure circuit 63 sets the inside of the suction pipe 45 to a positive pressure and jets air from the suction pad 46.

  An X-axis motor drive circuit 75 is connected to the control device 70. The control device 70 outputs a drive control signal to the X-axis motor drive circuit 75. The X-axis motor drive circuit 75 rotates the X-axis motor MX forward and backward in response to a drive control signal from the control device 70 to reciprocate the contact arm 20 relative to the robot body in the X direction. ing.

  A Y-axis motor drive circuit 76 is connected to the control device 70. The control device 70 outputs a drive control signal to the Y-axis motor drive circuit 76. The Y-axis motor drive circuit 76 rotates the Y-axis motor MY forward and backward in response to a drive control signal from the control device 70 to reciprocate the contact arm 20 relative to the robot body in the Y direction. ing.

  A Z-axis motor drive circuit 77 is connected to the control device 70. The control device 70 outputs a drive control signal to the Z-axis motor drive circuit 77. The Z-axis motor drive circuit 77 rotates the Z-axis motor MZ forward and backward in response to a drive control signal from the control device 70 to move the pressing device 30 up and down with respect to the contact arm 20 (robot body).

  The control device 70 is connected to the encoder SE1. The control device 70 receives the detection signal from the encoder SE1 and calculates the relative position of the pressing device 30 (suction pad 46) with respect to the contact arm 20. More specifically, the control device 70 determines the pressing device 30 (suction pad 46) when the suction surface of the suction pad 46 comes into contact with the upper surface of the IC chip T attached to the inspection socket 50 based on the calculated relative position. Is calculated and registered in the RAM 70C.

  The control device 70 is connected to a relative position detection sensor SE2. The control device 70 receives an ON / OFF detection signal from the relative position detection sensor SE2 and detects the relative position between the piston 33 (device chuck DC) and the cylinder tube 32. More specifically, the control device 70 determines whether the piston 33 has passed the intermediate position between the uppermost end position and the lowermost position from the uppermost position side to the lowermost position side, based on the detection signal. Is passed from the lowermost position to the uppermost position.

  The control device 70 is connected to a pressure detection sensor 65. The controller 70 receives an on / off detection signal from the pressure detection sensor 65 and detects the pressure of air in the pipe R2 (suction pipe 45). Specifically, the control device 70 closes the mouth of the suction pad 46 in contact with the IC chip T when the pressure of the air in the pipe R2 (suction pipe 45) rises to the reference pressure based on the detection signal. It comes to judge that it has come off.

  Next, the teaching processing operation for obtaining the height position when the suction pad 46 comes into contact with the upper surface of the IC chip T mounted on the inspection socket 50 of the measuring robot 11 configured as described above is shown in FIG. The operation will be described according to a flowchart showing the operation of the device 70.

  Now, the IC chip T is mounted in the inspection socket 50 in advance on the inspection socket 50. At this time, the first switching electromagnetic valve B1, the second switching electromagnetic valve B2, and the open / close electromagnetic valve B3 are all closed. The piston 33 is disposed at the uppermost position.

  From this state, a teaching start signal is output from the input / output device 71 in order to teach the height position when the suction pad 46 contacts the upper surface of the IC chip T to the inspection socket 50.

  First, the control device 70 drives and controls the X-axis motor MX, the Y-axis motor MY, and the Z-axis motor MZ, and the pressing device 30, that is, the suction pad 46 is mounted on the inspection socket 50 to be taught. Guide to a predetermined position directly above the chip T (step S1-1).

  When the suction pad 46 is guided to a predetermined position directly above the IC chip T, the control device 70 controls the electropneumatic regulator 61 to supply air to the first chamber a of the cylinder tube 32 to cause the piston 33 to move. It is moved downward (step S1-2).

  At this time, the control device 70 supplies air to the first chamber a of the cylinder tube 32 until the detection signal of the relative position detection sensor SE2 switches from the “off” signal to the “on” signal (step S1-3). . When the detection signal of the relative position detection sensor SE2 is switched from the “off” signal to the “on” signal (YES in step S1-3), the control device 70 controls the electropneumatic regulator 61 to control the first of the cylinder tube 32. The supply of air to the first chamber a is stopped (step S1-4). That is, the control device 70 stops the piston 33 at an intermediate position between the uppermost end position and the lowermost position.

  Next, the control device 70 opens the second switching electromagnetic valve B2 and the open / close electromagnetic valve B3, connects the positive pressure circuit 63 and the second connection port P2, and sets the inside of the suction pipe 45 to a positive pressure from the suction pad 46. Air is injected (step S1-5). Subsequently, the control device 70 drives and controls the Z-axis motor MZ to move the pressing device 30 (suction pad 46) downward toward the IC chip T mounted on the inspection socket 50 located directly below ( Step S1-6).

During this downward movement, the control device 70 calculates the height position of the pressing device (suction pad 46) at that time based on the detection signal from the encoder SE1.
The control device 70 determines whether or not the detection signal of the pressure detection sensor 65 is “ON” when the pressing device 30 (suction pad 46) is moved downward while jetting air from the suction pad 46, that is, suction. It is determined whether or not the pad 46 has reached the upper surface of the IC chip T (step S1-7).

  Then, as shown in FIG. 7, the suction pad 46 eventually comes into contact with the upper surface of the IC chip T. When the suction pad 46 comes into contact with the upper surface of the IC chip T, the mouth of the suction pad 46 is closed, the air injection is stopped, and the pressure of the air in the pipe R2 (suction pipe 45) rises to the reference pressure. The detection signal of the detection sensor 65 is turned on (YES in step S1-7).

  When the detection signal of the pressure detection sensor 65 is turned on, the control device 70 determines that the suction pad 46 is in contact with the IC chip T attached to the inspection socket 50 (step S1-8). Based on the detection signal from the encoder SE1, the control device 70 stores the calculated height position of the pressing device (suction pad 46) in the RAM 70C and outputs the height position to the input / output device 71. Is displayed on the display (step S1-9).

  Subsequently, when the suction height position of the suction pad 46 in one inspection socket 50 is registered, the control device 70 closes the second switching electromagnetic valve B2 and the open / close electromagnetic valve B3 and injects air from the suction pad 46. Is stopped (step S1-10). Subsequently, the control device 70 reversely rotates the Z-axis motor MZ and moves the pressing device (suction pad 46) up to a predetermined upper position (step S1-11).

  Then, when the control device 70 moves the pressing device 30 upward to a predetermined upper position, the teaching of the suction height position of the suction pad 46 in one inspection socket 50 is finished.

Next, effects of the embodiment configured as described above will be described below.
(1) According to the above-described embodiment, the suction pad 46 is moved downward toward the upper surface of the IC chip T previously arranged in the inspection socket 50 while air is jetted from the suction pad 46. When the suction pad 46 comes into contact with the upper surface of the IC chip T, the air jetted from the suction pad 46 is blocked by the IC chip T, whereby the pressure of the air in the pipe 64 (suction pipe 45). Is detected by the pressure detection sensor 65. Therefore, by detecting an increase in pressure of the pressure detection sensor 65, it can be detected that the suction pad 46 is in contact with the upper surface of the IC chip T, and the control device 70 can detect the height position at that time. In addition, the suction height position at which the suction pad 46 sucks the IC chip T can be accurately determined by simply moving the suction pad 46 while ejecting air and detecting the pressure by the pressure detection sensor 65. Can be detected.

  (2) According to the above embodiment, the pressure is detected by the pressure detection sensor 65 while the air is jetted from the suction pad 46 and moved downward. That is, the existing suction pad 46 and the pipe R2 (suction pipe 45) are used. In other words, by switching the first switching electromagnetic valve B1, the second switching electromagnetic valve B2, and the opening / closing electromagnetic valve B3, the suction pad 46 is used for teaching processing operation in addition to the original IC chip T suction. I was able to. Therefore, it is not necessary to newly provide the pressing device 30 with a special jig used for teaching, and the height position can be detected with a very simple configuration and high accuracy.

(3) According to the above-described embodiment, when the suction height position for sucking the IC chip T is detected, the piston 33 is disposed in an intermediate position with respect to the cylinder tube 32. Therefore, even if the suction pad 46 moves further downward than the position of the upper surface of the IC chip T for some reason, the piston 33 moves upward with respect to the cylinder tube 32. There is no risk of damage.
(Second Embodiment)
Next, a second embodiment embodying the present invention will be described. This embodiment is the same as the IC handler 10 of the first embodiment except that the teaching method is different from that of the first embodiment. The only difference from the first embodiment is the teaching processing operation of the control device 70. For convenience of explanation, the operation is performed according to the flowchart showing the processing operation of the control device 70 in the present embodiment shown in FIG. The other configuration is omitted.

  In the present embodiment, the suction height position at which the suction pad 46 sucks the IC chip T is detected without ejecting air from the suction pad 46. Therefore, in this embodiment, since the positive pressure circuit 63 is not used, it is possible to use an existing IC inspection apparatus that does not have the positive pressure circuit 63.

  Now, the IC chip T is mounted in the inspection socket 50 in advance on the inspection socket 50. At this time, the first switching electromagnetic valve B1, the second switching electromagnetic valve B2, and the open / close electromagnetic valve B3 are all closed. The piston 33 is disposed at the uppermost position.

  From this state, the start signal for teaching is output from the input / output device 71 in order to perform teaching for obtaining the height position when the suction pad 46 contacts the upper surface of the IC chip T to the inspection socket 50.

  First, the control device 70 drives and controls the X-axis motor MX, the Y-axis motor MY, and the Z-axis motor MZ, and the pressing device 30, that is, the suction pad 46 is mounted on the inspection socket 50 to be taught. Guide to a predetermined position directly above the chip T (step S2-1).

  When the suction pad 46 is guided to a predetermined position directly above the IC chip T, the control device 70 controls the electropneumatic regulator 61 to supply air to the first chamber a of the cylinder tube 32 to cause the piston 33 to move. It is moved downward (step S2-2).

  At this time, the control device 70 supplies air to the first chamber a of the cylinder tube 32 until the detection signal of the relative position detection sensor SE2 switches from the “off” signal to the “on” signal (step S2-3). . When the detection signal of the relative position detection sensor SE2 is switched from the “off” signal to the “on” signal (YES in step S2-3), the control device 70 controls the electropneumatic regulator 61 to control the first of the cylinder tube 32. The supply of air to the first chamber a is stopped (step S2-4). That is, the control device 70 stops the piston 33 at an intermediate position between the uppermost end position and the lowermost position.

  Next, the control device 70 drives and controls the Z-axis motor MZ to move the pressing device 30 (suction pad 46) downward toward the IC chip T attached to the inspection socket 50 located directly below ( Step S2-5). During this downward movement, the control device 70 calculates the height position of the pressing device (suction pad 46) at that time based on the detection signal from the encoder SE1.

  The control device 70 determines whether or not the detection signal from the relative position detection sensor SE2 is “OFF” when the pressing device 30 (suction pad 46) is moved downward, that is, the suction pad 46 is on the upper surface of the IC chip T. Is determined (step S2-6).

  Then, as shown in FIG. 7, the suction pad 46 eventually comes into contact with the upper surface of the IC chip T. When the suction pad 46 comes into contact with the upper surface of the IC chip T, the suction pad 46 (piston 33) is restricted from further downward movement. As a result, the piston 33 moves relative to the tube body 32a from the intermediate position to the uppermost position, and the detection signal of the relative position detection sensor SE2 changes from “on” to “off” (YES in step S2-6). ).

  When the detection signal of the relative position detection sensor SE2 is “OFF”, the control device 70 determines that the suction pad 46 is in contact with the IC chip T mounted on the inspection socket 50 (step S2-7). Based on the detection signal from the encoder SE1, the control device 70 stores the calculated height position of the pressing device (suction pad 46) in the RAM 70C and outputs the height position to the input / output device 71. Is displayed on the display (step S2-8).

  Subsequently, when the suction height position of the suction pad 46 in one inspection socket 50 is registered, the control device 70 moves the pressing device (suction pad 46) up to a predetermined upper position (step). S2-9).

  Then, when the control device 70 moves the pressing device 30 upward to a predetermined upper position, the teaching of the suction height position of the suction pad 46 in one inspection socket 50 is finished.

Next, effects of the embodiment configured as described above will be described below.
(1) According to the above embodiment, the piston 33 is held at an intermediate position between the uppermost position and the lowermost position in a state where the elastic force of the spring SP and the air pressure are balanced, and the suction pad 46 is moved downward toward the upper surface of the IC chip T of the socket 50 for inspection. When the suction pad 46 comes into contact with the upper surface of the IC chip T, the balance of the force is lost, and the piston 33 (suction pad 46) moves relative to the cylinder tube 32 upward (uppermost end position side). The relative position changes. Therefore, by detecting the change of the relative position detection sensor SE2, it is possible to detect that the suction pad 46 is in contact with the upper surface of the IC chip T, and the control device 70 can detect the height position at that time.

  In addition, the piston 33 is moved in a state where the elastic force of the spring SP and the air pressure are kept in balance, and the suction pad 46 is moved downward, and the change is detected by the relative position detection sensor SE2. The suction height position at which the suction pad 46 sucks the IC chip T can be detected with high accuracy.

  (2) According to the above embodiment, the piston 33 is moved in a state where the elastic force of the spring SP and the air pressure are kept in balance, and the suction pad 46 is moved downward, and the relative position detection sensor SE2 changes the relative position. Is detected. That is, the existing suction pad 46, electropneumatic regulator 61, etc. were used. Therefore, it is not necessary to newly provide a special jig used for teaching in the pressing device 30, and a highly accurate height position can be detected with a very simple configuration.

In addition, you may change the said embodiment as follows.
In each of the above embodiments, when the pressing device 30 is moved downward, air is supplied from the electropneumatic regulator 61 and the piston 33 is moved to an intermediate position between the uppermost position and the lowermost position. The position is not limited to any position and may be any position between the uppermost position and the lowermost position.
In each of the above embodiments, the height position of the upper surface of the IC chip T arranged in the inspection socket 50 is obtained. However, the present invention is not limited to this, and the supply tray in which the IC chip before inspection is accommodated It can be applied to the detection of the height position of the upper surface of the IC chip in the pocket of the IC, or to the detection of the height position of the upper surface of the IC chip in the pocket of the collection tray in which the IC chip after inspection is accommodated. Good.

Further, it can be applied to the detection of the height position of the upper surface of the IC chip in the pocket of the hot plate provided in the IC handler, or can be kept on standby before being placed in the inspection socket 50, or the collection tray. It may be applied to the detection of the height position of the upper surface of the IC chip in a pocket for waiting before being conveyed.
In the above embodiment, the spring SP is coupled between the coupling block 41 of the device chuck DC and the coupling base 31 to elastically support the piston 33 (device chuck DC). Alternatively, an elastic member may be disposed between the lower surface of the piston 33 and the front plate 32b of the cylinder tube 32 to elastically support the piston 33 (device chuck DC). Of course, in addition to the spring SP of the above embodiment, an elastic member may be disposed between the lower surface of the piston 33 and the front plate 32b of the cylinder tube 32.

In particular, in the first embodiment, the piston 33 (device chuck DC) may be applied to an IC handler including a measurement robot that is not elastically supported by the spring SP.
In each of the above embodiments, the suction pad 46 has a lip shape as shown in FIGS. As long as the IC chip T is flat, the shape of the suction pad 46 may be a resin or metal suction pad provided with a projection corresponding to the outer size of the IC chip. That is, when the upper surface of the IC chip T is contacted, only the protrusion comes into contact first, thereby increasing the pressure in the first embodiment, or in the second embodiment as a suction pad shape that causes the piston 33 to start upward movement. Also good.
-In above-mentioned embodiment, although device chuck DC (adsorption pad 46) was moved up and down with air cylinder SL, it is not limited to this. For example, the device chuck DC (suction pad 46) may be moved up and down with a diaphragm or a bellows.
In the above embodiment, the measurement robot 11 provided in the IC handler is embodied. However, the present invention is not limited to this. For example, the IC chip is transported from the first arrangement position to the second arrangement position. The present invention may be applied to other transfer devices.

  DESCRIPTION OF SYMBOLS 10 ... IC handler, 11 ... Measuring robot, 30 ... Pressing device, 32 ... Cylinder tube, 32 ... Cylinder tube, 32a ... Tube main body, 33 ... Piston, 46 ... Adsorption pad, 47 ... Detection piece, 50 ... Inspection socket, 61 ... Electro-pneumatic regulator, 62 ... Vacuum circuit 62, 63 ... Positive pressure circuit, 65 ... Pressure detection sensor, 70 ... Control device, 70A ... CPU, 70B ... ROM, 70C ... RAM, DC ... Device chuck, B1 ... First Switching solenoid valve, B2 ... second switching solenoid valve, B3 ... open / close solenoid valve, MZ ... Z-axis motor, SE1 ... encoder, SE2 ... relative position detection sensor, SL ... air cylinder, SP ... spring, T ... IC chip.

Claims (2)

A pressing means comprising an operating body biased upward so as to be positioned at the uppermost end position by the elastic force of the elastic member;
A gripping member connected to the operating body and gripping the semiconductor chip by a gripping portion;
A pressure detecting means for outputting an ON signal when the pressure of the air inside the gripping member rises to a reference pressure, and a teaching method for a handler comprising:
After disposing the operating body at an intermediate position between the uppermost position and the lowermost position against the elastic force of the elastic member,
While spraying air from the gripping part, the gripping member is moved toward the semiconductor chip,
The position of the pressing means when the gripping member comes into contact with the semiconductor chip and the pressure detecting means outputs an ON signal is registered as a height position at which the gripping member comes into contact with the semiconductor chip. Teaching method for handlers. A pressing means comprising an operating body biased upward so as to be positioned at the uppermost end position by the elastic force of the elastic member;
A gripping member connected to the operating body and gripping the semiconductor chip by a gripping portion;
Moving means for moving the pressing means;
Operating body driving means for supplying air to the pressing means and moving the operating body to an intermediate position between the uppermost position and the lowermost position against the elastic force of the elastic member;
A pressing means position detecting means for detecting the position of the pressing means;
Air supply means for injecting air from the gripping part;
Pressure detecting means for outputting an ON signal when the pressure of the air inside the gripping member rises to a reference pressure;
Drive control means for moving the gripping member toward the semiconductor chip while injecting air from the gripping portion;
Registration that registers the position of the pressing means when the gripping member comes into contact with the semiconductor chip and the pressure detection means outputs an ON signal in the storage means as a height position at which the gripping member comes into contact with the semiconductor chip Means,
A handler characterized by providing