JP2011101048A - Method of teaching handler, and handler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of teaching a handler and a handler, which are capable of accurately acquiring the height of a grip member that comes into contact with the upper surface of a semiconductor chip with a simple structure even if the back pressure of gas jetting from the grip member when the grip member is brought close to the upper surface of the semiconductor chip does not rise up to predetermined pressure. <P>SOLUTION: When a suction pad is moved down toward an IC chip disposed in a testing socket, the suction pad is moved down while jetting the gas from a tip thereof. Then the flow rate of the gas jetting from the tip of the suction pad is detected by a flow sensor, and the lowering position of the suction pad when the flow rate detected by the flow sensor decreases to a predetermined value is registered, in a storage, as the height at which the suction pad comes into contact with the upper surface of the IC chip. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a teaching method for a handler and a handler.

  A semiconductor device is inspected by an IC inspection apparatus before shipping. The IC inspection apparatus is also called an IC handler, and the IC handler is provided with a measurement robot. The measuring robot holds a semiconductor device (semiconductor chip) by vacuum suction with a suction pad and attaches it to a tester socket. At this time, the semiconductor chip is mounted on the inspection socket while being pressed with a predetermined force. When the inspection by the tester is completed, the measurement robot vacuum-sucks the semiconductor chip attached to the inspection socket, removes it from the inspection socket, and places it on the collection tray according to the inspection result.

  By the way, since the semiconductor chip is attached to the inspection socket while pressing the semiconductor chip with a predetermined force with the suction pad, when the semiconductor chip attached to the inspection socket is removed by vacuum suction, the suction pad is removed from the upper surface of the semiconductor chip. Adsorbs to a lower position. In this case, the thrust of the lowering mechanism is applied to the semiconductor chip via the suction pad, and a large load may be applied to the semiconductor chip to cause damage. On the other hand, if the suction height of the semiconductor chip is slightly high, the semiconductor chip is sucked up by the air flow of vacuum suction, and the suction pad cannot accurately pick up the semiconductor chip, resulting in a position shift. However, there was a problem that the suction pad was sucked.

In IC handlers (measuring robots), the operator sets the suction height position visually in the teaching work that is performed in advance, but there is a limit to the visual inspection, and it is not possible to teach the highly accurate height position. There has been a demand for a method of teaching an optimum height position without applying a load to the chip by a simple method.
Therefore, a method has been proposed in which a force sensor is provided at the tip of the gripping part and teaching is performed without visual inspection (Patent Document 1). In addition, a method has been proposed in which a position detection sensor for detecting a target is provided on the grip portion side to perform teaching without using visual observation (Patent Document 2). Furthermore, a method has been proposed in which a transmission type sensor is provided in the gripping part and teaching is performed without visual inspection (Patent Document 3).

  However, in Patent Document 1, the force sensor is expensive, and has a large size and interferes with a workpiece, so that it must actually be detachable, which is very inconvenient. Further, in Patent Document 2 and Patent Document 3, the sensor interferes with the inspection socket. In particular, in a non-lead type semiconductor chip such as BGA or CSP, the socket has a pocket shape. When seated (attached), the state cannot be detected from the side unless some contrivance is made.

In each of these patent documents, since a jig for teaching is newly added to the gripping part, the structure of the gripping part becomes complicated, and the position adjustment of the jig for teaching is very troublesome. Moreover, the cost is increased by adding a new jig.
Therefore, as a teaching method for a handler that can accurately determine the height position at which the gripping member contacts the upper surface of the semiconductor chip with a simple configuration, gas is injected from the lower end of the gripping member without gripping the semiconductor chip. The gripping member is moved toward the upper surface of the semiconductor chip previously arranged at the chip placement position, and the pressing means when the back pressure of the gas injected from the gripping member becomes a preset high pressure A method has been proposed in which the position is a height position at which the gripping member comes into contact with the semiconductor chip (Patent Document 4).

JP-A-9-76183 JP 2004-288787 A JP 2004-193333 A JP 2008-124198 A

  However, in the method disclosed in Patent Document 4, when a vacuum pump compatible unit having an air release port is used as a vacuum supply valve that applies a negative pressure to the inside of the gripping member (suction pad) when the semiconductor chip is sucked, gas supply is performed. Since the gas supplied from the means to the gripping member escapes to the atmosphere release port side of the vacuum pump compatible unit, the back pressure of the gas injected from the tip of the gripping member is not reduced even if the tip of the gripping member is brought close to the upper surface of the semiconductor chip. There was a problem that the pressure did not rise to a preset pressure.

  The present invention has been made to solve the above problems, and its purpose is to increase the back pressure of gas ejected from the tip of the gripping member to a predetermined pressure when the gripping member is brought close to the upper surface of the semiconductor chip. An object of the present invention is to provide a handler teaching method and a handler that can determine the height position at which the gripping member comes into contact with the upper surface of the semiconductor chip with a simple configuration without high accuracy.

  The teaching method of a handler according to one aspect of the present invention includes a pressing unit including an operating body that moves up and down, a gripping member that is connected to a lower end portion of the operating body and grips a semiconductor chip, and a movement that moves the pressing unit up and down. Means for arranging a semiconductor chip held by the holding member at a chip arrangement position, or in a teaching method of a handler for holding the semiconductor chip arranged at the chip arrangement position by the holding member. In a state where the gripping member is not gripped, the gripping member is moved toward the upper surface of the semiconductor chip previously disposed at the chip placement position while gas is ejected from the lower end of the gripping member, and the flow rate of the gas ejected from the gripping member is set in advance. The position of the pressing means when lowered to a set flow rate is a height position at which the gripping member comes into contact with the semiconductor chip, That.

  According to the teaching method of the handler of one aspect of the present invention, the gripping member is moved toward the upper surface of the semiconductor chip disposed at the chip placement position while gas is ejected from the lower end of the gripping member, and the tip of the gripping member is the semiconductor. When moving to the position of the upper surface of the chip, the gas ejected from the tip of the gripping member is blocked by the semiconductor chip, so that the flow rate of the gas ejected from the tip of the gripping member is reduced. Accordingly, since the height position where the gripping member comes into contact with the semiconductor chip can be detected before the semiconductor chip is directly pressed, the gripping member is placed on the upper surface of the semiconductor chip without applying a large load to the semiconductor chip. Even when the back pressure of the gas ejected from the tip of the gripping member does not rise to a predetermined pressure when it is close to, the height position at which the gripping member contacts the upper surface of the semiconductor chip is obtained with a simple configuration with high accuracy. be able to.

  A handler teaching method according to another aspect of the present invention includes a pressing unit including an operating body elastically supported upward by an elastic member, a gripping member connected to a lower end portion of the operating body, and gripping a semiconductor chip. , A moving means for moving the pressing means up and down, a gas supplied to the pressing means, and an operating body elastically supported by the elastic member between the predetermined uppermost position and lowermost position, And an operating body driving unit that moves up and down with respect to the pressing unit, and the semiconductor chip held by the holding member is arranged at the chip arrangement position, or the semiconductor chip arranged at the chip arrangement position is held by the holding member. In a handler teaching method, a semiconductor chip in which the gripping member is preliminarily disposed at a chip disposition position while gas is ejected from the lower end of the gripping member without gripping the semiconductor chip. The position of the pressing means when the flow rate of the gas ejected from the gripping member is lowered to a preset flow rate is defined as the height position at which the gripping member contacts the semiconductor chip. It is characterized by that.

According to the teaching method of the handler of another aspect of the present invention, while the gas is injected from the lower end of the gripping member, the gripping member is moved toward the upper surface of the semiconductor chip placed at the chip placement position, When the tip moves to the position of the upper surface of the semiconductor chip, the gas ejected from the tip of the gripping member is blocked by the semiconductor chip, thereby reducing the flow rate of the gas ejected from the tip of the gripping member. Accordingly, since the height position where the gripping member comes into contact with the semiconductor chip can be detected before the semiconductor chip is directly pressed, the gripping member is placed on the upper surface of the semiconductor chip without applying a large load to the semiconductor chip. Even when the back pressure of the gas ejected from the tip of the gripping member does not rise to a predetermined pressure when it is close to, the height position at which the gripping member contacts the upper surface of the semiconductor chip is obtained with a simple configuration with high accuracy. be able to.
Furthermore, even if the tip of the gripping member moves further than the position of the upper surface of the semiconductor chip for some reason, the gripping member (operating body) moves relative to the pressing means, so there is no possibility of damaging the semiconductor chip.

  A handler according to an aspect of the present invention includes a pressing unit including an operating body movable in the vertical direction, a gripping member that is connected to a lower end portion of the operating body and grips a semiconductor chip, and a movement that moves the pressing unit up and down. A relative position detecting means for detecting a relative position between the gripping member and the pressing means, a vertical movement position detecting means for detecting a vertical movement position of the pressing means, and a detection signal from the vertical movement position detecting means And a vertical movement position calculation means for calculating the movement position of the pressing means, and the semiconductor chip held by the holding member is arranged at the chip arrangement position, or the semiconductor chip arranged at the chip arrangement position is In the handler gripped by the gripping member, gas supply means for injecting gas from the tip of the gripping member, supplied from the gas supply means, and from the tip of the gripping member The flow rate detection means for detecting whether or not the flow rate of the gas to be sprayed has decreased to a predetermined reference flow rate, the gas supply means and the moving means are driven, and the gas is injected from the tip of the gripping member, The drive control means for moving the gripping member toward the semiconductor chip previously arranged at the chip placement position, and the flow rate detection means that the flow rate of the gas injected from the tip of the gripping member has reached the reference flow rate. And a registration means for registering the movement position calculated by the vertical movement position calculation means in the storage means as a height position at which the gripping member contacts the semiconductor chip when detected.

According to the handler of one aspect of the present invention, when the tip of the gripping member moves toward the upper surface of the semiconductor chip placed at the chip placement position, the gas sprayed from the tip of the gripping member is placed at the chip placement position. It is blocked by the semiconductor chip. When the gas injection is blocked, the flow rate of the gas injected from the tip of the gripping member is reduced to the reference flow rate, and the flow rate detecting means detects the decrease. The registration means registers the movement position calculated by the vertical movement position calculation means at that time in the storage means as a height position at which the gripping member comes into contact with the semiconductor chip.
Therefore, the gripping member does not give a large load to the semiconductor chip, and even if the back pressure of the gas ejected from the tip of the gripping member does not rise to a predetermined pressure when the gripping member is brought close to the upper surface of the semiconductor chip. Can be obtained with high accuracy and with a simple configuration.

  A handler according to another aspect of the present invention includes a pressing unit including an operating body elastically supported upward by an elastic member, a gripping member that is connected to a lower end portion of the operating body and grips a semiconductor chip, A moving means for moving the pressing means up and down, a gas supplied to the pressing means, and an operating body elastically supported by the elastic member between the predetermined uppermost position and the lowermost position. An actuating body drive means that moves up and down with respect to the position, a relative position detection means that detects a relative position between the gripping member and the pressing means, a vertical movement position detection means that detects a vertical movement position of the pressing means, And a vertical movement position calculation means for calculating the movement position of the pressing means based on a detection signal from the vertical movement position detection means, and the semiconductor chip held by the holding member is arranged at the chip arrangement position, or the chip Arrangement In a handler that grips the semiconductor chip arranged on the device with the gripping member, gas supply means for injecting gas from the tip of the gripping member, and gas supplied from the gas supply means and jetted from the tip of the gripping member The flow rate detection means for detecting whether or not the flow rate of the gas flow has been reduced to a predetermined reference flow rate, and the actuation body drive means, the gas supply means, and the movement means are driven and controlled to determine the actuation body in advance. A drive control means arranged between the uppermost position and the lowermost position, and moving the gripping member toward a semiconductor chip preliminarily disposed at the chip placement position while injecting gas from the tip of the gripping member; When the pressure detection means detects that the flow rate of the gas injected from the tip of the gripping member has reached the reference flow rate, the vertical movement position calculation means is performed. Was the movement position, wherein the gripping member is provided with a registration means for registering in the storage means as a height position in contact with the semiconductor chip.

  According to the handler of another aspect of the present invention, when the tip of the gripping member moves toward the upper surface of the semiconductor chip placed at the chip placement position, the gas injected from the tip of the gripping member is changed to the chip placement position. The semiconductor chip arranged in the block is blocked. When the gas injection is blocked, the flow rate of the gas ejected from the tip of the gripping member is reduced to the reference flow rate, and the flow rate detecting means detects the decrease. The registration means registers the movement position calculated by the vertical movement position calculation means at that time in the storage means as a height position at which the gripping member comes into contact with the semiconductor chip.

Therefore, the gripping member does not give a large load to the semiconductor chip, and even if the back pressure of the gas ejected from the tip of the gripping member does not rise to a predetermined pressure when the gripping member is brought close to the upper surface of the semiconductor chip. Can be obtained with high accuracy and with a simple configuration.
Furthermore, even if the tip of the gripping part moves further than the position of the upper surface of the semiconductor chip for some reason, the gripping member (operating body) moves relative to the pressing means, so there is no possibility of damaging the semiconductor chip.

It is a top view of an IC handler. It is a whole perspective view for demonstrating the measurement robot with which the IC handler was equipped. It is sectional drawing for demonstrating the press apparatus provided in the measurement robot. It is a pneumatic circuit diagram of air of a measurement robot. It is a circuit diagram which shows the electrical structure of a measurement robot. It is a flowchart figure which shows operation | movement of a control apparatus. It is a figure which shows the state in which the suction pad is contacting the upper surface of IC chip. It is a figure which shows other embodiment of this invention.

Hereinafter, a first embodiment in which the present invention is embodied in an IC handler will be described with reference to FIGS.
FIG. 1 is a plan view showing the configuration of the IC handler 10. The IC handler 10 includes a base 101, a safety cover 102, a high temperature chamber 103, a supply robot 104, a recovery robot 105, a first slide table 106, a second slide table 107, and a plurality of conveyors C1 to C6.

The base 101 has the elements mounted on the upper surface thereof. The safety cover 102 surrounds a large area of the base 101, and the supply robot 104, the recovery robot 105, the first slide table 106 and the second slide table 107 are accommodated therein.
The plurality of conveyors C <b> 1 to C <b> 6 are provided on the base 101 so that one end side thereof is located outside the safety cover 102 and the other end portion is located inside the safety cover 102. Each of the conveyors C1 to C6 conveys the tray 108 containing a plurality of IC chips T as semiconductor chips from the outside of the safety cover 102 into the safety cover 102, and conversely, moves the tray 108 into the safety cover 102. From the safety cover 102 to the outside.

  The supply robot 104 includes an X-axis frame FX and a first Y-axis frame FY1. The collection robot 105 includes the X-axis frame FX and the second Y-axis frame FY2. The X-axis frame FX is disposed in the X direction. The first Y-axis frame FY1 and the second Y-axis frame FY2 are arranged to be parallel to each other along the Y direction, and are supported so as to be movable in the X direction with respect to the X-axis frame FX. . The first Y-axis frame FY1 and the second Y-axis frame FY2 are reciprocated in the X direction along the X-axis frame FX by respective motors (not shown) provided on the X-axis frame FX.

  A supply-side robot hand unit 110 is supported on the lower side of the first Y-axis frame FY1 so as to be movable in the Y direction. The supply-side robot hand unit 110 is reciprocated in the Y direction along the first Y-axis frame FY1 by respective motors (not shown) provided on the first Y-axis frame FY1. Then, the supply-side robot hand unit 110 supplies, for example, the tray 108 containing the IC chip T before the inspection of the conveyor C1 to the first slide table 106, for example.

  A collection-side robot hand unit 111 is supported below the second Y-axis frame FY2 so as to be movable in the Y direction. The collection-side robot hand unit 111 reciprocates in the Y direction along the second Y-axis frame FY2 by respective motors (not shown) provided on the second Y-axis frame FY2. Then, the supply-side robot hand unit 110 supplies, for example, the inspected IC chip supplied to the second slide table 107 to, for example, the tray 108 of the conveyor C8.

  A measurement robot 11 is provided in the high temperature chamber 103. For example, the measurement robot 11 attaches the IC chip T before inspection supplied to the first slide table 106 to the inspection socket 50. The IC chip T mounted in the inspection socket 50 is subjected to electrical inspection. Further, the measurement robot 11 supplies the IC chip T after completion of the inspection mounted on the inspection socket 50 to the second slide table 107, for example.

FIG. 2 is a perspective view of a main part of the measurement robot 11, and the measurement robot 11 includes a contact arm 20. The contact arm 20 is provided so as to be reciprocally movable in the X and Y directions with respect to the robot body by an X-axis motor MX and a Y-axis motor MY (both of which are shown in FIG. 5) respectively provided on the robot body of the measuring robot 11. It has been.
A Z-axis motor MZ as a moving means is fixed to the contact arm 20. The Z-axis motor MZ is composed of a servo motor, and includes an encoder SE1. The rotation speed, rotation position, and rotation direction of the Z-axis motor MZ are detected by a detection signal from the encoder SE1.

  A ball screw 21 extending in the Z direction (vertical direction) is rotatably supported by a pair of upper and lower bearings 22 at a position adjacent to the Z-axis motor MZ in the contact arm 20. A driven pulley 23 is fixed to a portion of the ball screw 21 that protrudes from the bearing 22. The driven pulley 23 is drivingly connected to a driving pulley 25 fixed to the rotating shaft of the Z-axis motor MZ via a connecting belt 24. Therefore, when the Z-axis motor MZ rotates forward and backward, the ball screw 21 rotates forward and backward via the drive pulley 25, the connecting belt 24, and the driven pulley 23.

  In the contact arm 20, a guide rail 26 extending in the Z direction (vertical direction) is fixed between the Z-axis motor MZ and the ball screw 21. The guide rail 26 is provided with a carriage 27 that is movable along the guide rail 26, and the carriage 27 is provided with a connecting member 28. The connecting member 28 is provided with a screwing portion 28a in which a female screw into which the ball screw 21 is screwed is formed. Therefore, when the Z-axis motor MZ (ball screw 21) rotates in the forward and reverse directions, the connecting member 28 (carriage 27) screwed with the ball screw 21 can move along the guide rail 26, so Reciprocates in the direction (up and down direction).

A mounting plate 29 is connected and fixed to the connecting member 28. The mounting plate 29 extends in the anti-X direction (forward) from the connecting member 28, and a pair of front and rear compliance units CU are provided on the lower surface thereof.
The compliance unit CU includes a plurality of (two in FIG. 2) pressing devices 30. The pressing device 30 grips (sucks and holds) an IC chip T (see FIG. 3) as a semiconductor chip and presses it onto a test socket 50 (see FIG. 3) provided on the tester head 12. The lower surface of the plate 29 is fixed. In the present embodiment, by providing the two pressing devices 30, two IC chips T are held and conveyed at a time. The compliance unit CU is detachably connected to the mounting plate 29, and can be appropriately replaced according to the number and arrangement of the IC chips T to be inspected.

Next, the pressing device 30 as pressing means will be described with reference to FIG.
In FIG. 3, the pressing device 30 includes an air cylinder SL fixed to the connection base 31 and a device chuck DC connected to the tip of the air cylinder SL.
In the air cylinder SL, the base end portion of the cylinder tube 32 is fixed to the connection base 31. The cylinder tube 32 includes a bottomed cylindrical tube main body 32a and a front plate 32b that closes the opening of the tube main body 32a, and a piston 33 as an operating body in a cylinder chamber formed by the tube main body 32a and the front plate 32b. Are arranged so as to be movable in the Z direction (vertical direction). Therefore, the cylinder chamber is partitioned by the piston 33 into the first chamber a on the upper side and the second chamber b on the lower side.

The piston 33 is lifted upward by a spring SP as an elastic member, which will be described later, and the position of the piston 33 on the first chamber a side is in contact with the bottom surface of the tube main body 32a shown in FIG. It is located at the top end position).
An air introduction port 34 is formed at the end of the tube body 32a on the first chamber a side, and the first connection port P1 is attached to the air introduction port 34. The first connection port P1 is connected to an electropneumatic regulator 61 (see FIG. 4) via an air supply pipe R1 (see FIG. 4). When air is supplied from the electropneumatic regulator 61 to the first chamber a, the piston 33 causes the spring SP of the device chuck DC from the uppermost position where it abuts against the bottom surface of the tube main body 32a due to the pressure of the air. It moves downward against the elastic force.

Incidentally, the stroke amount of the piston 33 is the distance to the position (lowermost position) where the lower surface of the piston 33 contacts the inner surface of the front plate 32b when the piston 33 is at the uppermost position shown by the solid line in FIG. That is, it coincides with the vertical interval of the second chamber b shown in FIG.
The device chuck DC includes a connection block 41, and a connection protrusion 41a formed on the upper surface thereof is connected and fixed to the piston 33 and a screw N through a through hole formed in the front plate 32b. Therefore, the connection block 41 (device chuck DC) moves in the vertical direction together with the piston 33.

  A spring SP is connected between the connection block 41 and the connection base 31. That is, the connection block 41 is elastically suspended from the connection base 31 via the spring SP. In this embodiment, the spring SP pushes up the piston 33 via the connecting block 41 so that the piston 33 is positioned at the uppermost end position. When air is supplied to the first chamber a, the pressure causes the piston 33 to move downward against the elastic force of the spring SP, eventually reaching the lowest end position and hitting the front plate 32b. The downward movement is restricted.

The connection block 41 is recessed at the lower surface center position, and a vacuum guide path 42 is formed by forming a through hole from the recessed position toward the outer surface. A second connection port P <b> 2 is attached to the vacuum guide path 42 on the outer surface of the connection block 41.
An intermediate block 43 is connected and fixed below the connecting block 41, and a guide block 44 is connected and fixed below the intermediate block 43. In the central position of the intermediate block 43 and the guide block 44, accommodation holes that communicate with the vacuum guide path 42 formed in the connection block 41 are formed to penetrate, respectively, and suction tubes 45 are disposed in these accommodation holes.

  A suction pad 46 having a suction port 46 a for sucking the IC chip T is connected and fixed to the tip of the suction tube 45. Then, by bringing the inside of the suction tube 45 to a negative pressure state, the suction pad 46 sucks and holds the IC chip T as shown in FIG. On the other hand, by releasing the negative pressure in the suction tube 45, the suction pad 46 places the IC chip T held by suction in, for example, the inspection socket 50 provided in the tester head 12.

A detected piece 47 is fixed to the outer surface of the connecting block 41 with a bolt 48. The detected piece 47 is detected by a relative position detection sensor SE2 composed of a photocoupler as a relative position detecting means fixed to the connection base 31 at its tip end portion. More specifically, the relative position detection sensor SE2 moves the detection piece 47 that moves up and down with the movement of the piston 33 (device chuck DC) in the vertical direction, that is, between the piston 33 (device chuck DC) and the cylinder tube 32. Detect relative position.
In the present embodiment, the detection signal of the relative position detection sensor SE2 is “off” when the piston 33 passes the intermediate position between the uppermost end position and the lowermost position from the uppermost position side to the lowermost position side. The signal is switched from the “ON” signal to the “OFF” signal when the signal is switched from the “ON” signal to the “ON” signal.

As shown in FIG. 3, the tester head 12 is provided with an inspection socket 50. The inspection socket 50 is provided with as many spring pins 52 having contact portions 51 at the upper end as the number of terminals of the IC chip T. The spring pin 52 moves up and down with a predetermined stroke with respect to the inspection socket 50. When the IC chip T is pushed down, each terminal of the IC chip T comes into contact with the corresponding contact portion 51 from above and the spring pin 52 is pushed down.
As a result, each terminal of the IC chip T and the contact portion 51 of the inspection socket 50 are in electrical contact, and electrical inspection is performed in that state. After the inspection is completed, the inspected IC chip T is picked up from the inspection socket 50 by the device chuck DC, and is conveyed to a storage unit (not shown) according to the inspection result.

Next, the pneumatic circuit of the measuring robot 11 configured as described above will be described with reference to FIG.
In FIG. 4, an electropneumatic regulator 61 as an operating body driving means is connected to a first connection port P1 via an air supply pipe R1, supplies air to the first chamber a of the cylinder tube 32, and the first The pressure of air in the chamber a is adjusted. The piston 33 moves up and down with respect to the cylinder tube 32 against the elastic force of the spring SP by the pressure of the air in the first chamber a.

The vacuum generator corresponding unit 62 that applies a negative pressure to the inside of the suction pad 46 when sucking the IC chip T has two vacuum generators 621 and 622 connected in series, and these vacuum generators 621 and 622 are connected to each other. Among them, the vacuum generator 621 on the downstream side is supplied with pressurized gas such as compressed air from the positive pressure circuit 63 as gas supply means via the electromagnetic valve B1.
The vacuum generator 621 of the vacuum generator corresponding unit 62 has a suction port 621a, and a second connection port P2 is connected to the suction port 621 through an intake pipe R2 and a filter F. On the other hand, the vacuum generator 622 of the vacuum generator corresponding unit 62 has a suction port 622a, and a second connection port P2 is connected to the suction port 622a via an intake pipe R2, a filter F, and a check valve B3. Yes.

  The positive pressure circuit 63 as the gas supply means is connected to the second connection port P2 via the gas supply pipe R3, the electromagnetic valve B2, and the intake pipe R2. The positive pressure circuit 63 includes a discharge pump and generates a positive pressure source. The positive pressure circuit 63 is configured to eject a gas such as compressed air from the suction pad 46 by bringing the inside of the vacuum guide path 42 communicating with the second connection port P2 into a positive pressure state.

  The pipe R2 between the second connection port P2 and the electromagnetic valve B2 is provided with a flow rate sensor 65 as flow rate detection means for detecting the flow rate of gas (for example, compressed air) discharged from the suction port 46a of the suction pad 46. ing. In the present embodiment, when the positive pressure circuit 63 causes the suction pipe 45 to be in a positive pressure state and a gas such as compressed air is ejected from the suction pad 46, the suction port 46a of the suction pad 46 gradually moves. The flow rate of the gas discharged from the suction port 46a when it is closed gradually decreases.

Next, the electrical configuration of the measuring robot 11 will be described with reference to FIG.
In FIG. 5, a control device 70 as a drive control means, a working body movement control means, and a pressing means movement control means has a CPU 70A, a ROM 70B, and a RAM 70C. The control device 70 attaches the IC chip T before the inspection to the inspection socket 50 according to the stored various data and various control programs, and removes the IC chip T after the inspection from the inspection socket 50 by suction. Then, the processing of teaching the height position where the pressing device 30 (the suction pad 46) comes into contact with the IC chip T mounted on the inspection socket 50 is executed.

An input / output device 71 having various operation switches and a display is connected to the control device 70. The input / output device 71 displays the processing status of various processes executed by the measurement robot 11. The input / output device 71 inputs a signal instructing the start of execution of each process, initial value data for executing each process, and the like to the control device 70.
An electropneumatic regulator drive circuit 72 is connected to the control device 70. The control device 70 outputs a drive control signal to the electropneumatic regulator drive circuit 72. The electropneumatic regulator drive circuit 72 drives the electropneumatic regulator 61 in response to the drive control signal from the control device 70, supplies air to the first chamber a of the cylinder tube 32, and air in the first chamber a. Adjust the pressure.

An electromagnetic valve drive circuit 73 is connected to the control device 70. The control device 70 outputs a drive control signal to the electromagnetic valve drive circuit 73. In response to the drive control signal from the control device 70, the electromagnetic valve drive circuit 73 switches and controls the electromagnetic valve B1 and the switching electromagnetic valve B2.
For example, when adsorbing the IC chip T, the control device 70 controls to open the electromagnetic valve B1 and close the electromagnetic valve B2. That is, the vacuum generators 621 and 622 apply a negative pressure to the suction pipe 45 so that the suction pad 46 can hold the IC chip T by suction. In the teaching operation for determining the height position of the pressing device 30 (suction pad 46) when the suction pad 46 contacts the upper surface of the IC chip T on which the inspection socket 50 is mounted, the control device 70 is the electromagnetic valve B2. And the electromagnetic valve B1 is controlled to be closed. In other words, the inside of the suction pipe 45 is brought into a positive pressure state by the positive pressure circuit 63 and the pressurized gas is injected from the suction pad 46.

An X-axis motor drive circuit 75 is connected to the control device 70. The control device 70 outputs a drive control signal to the X-axis motor drive circuit 75. The X-axis motor drive circuit 75 rotates the X-axis motor MX forward and backward in response to a drive control signal from the control device 70 to reciprocate the contact arm 20 relative to the robot body in the X direction. ing.
A Y-axis motor drive circuit 76 is connected to the control device 70. The control device 70 outputs a drive control signal to the Y-axis motor drive circuit 76. The Y-axis motor drive circuit 76 rotates the Y-axis motor MY forward and backward in response to a drive control signal from the control device 70 to reciprocate the contact arm 20 relative to the robot body in the Y direction. ing.

A Z-axis motor drive circuit 77 is connected to the control device 70. The control device 70 outputs a drive control signal to the Z-axis motor drive circuit 77. The Z-axis motor drive circuit 77 rotates the Z-axis motor MZ forward and backward in response to a drive control signal from the control device 70 to move the pressing device 30 up and down with respect to the contact arm 20 (robot body).
An encoder SE1 is connected to the control device 70. The control device 70 receives the detection signal from the encoder SE1 and calculates the relative position of the pressing device 30 (suction pad 46) with respect to the contact arm 20. More specifically, the control device 70 determines the pressing device 30 (suction pad 46) when the suction surface of the suction pad 46 comes into contact with the upper surface of the IC chip T attached to the inspection socket 50 based on the calculated relative position. Is calculated and registered in the RAM 70C.

  A relative position detection sensor SE2 is connected to the control device 70. The control device 70 receives an ON / OFF detection signal from the relative position detection sensor SE2 and detects the relative position between the piston 33 (device chuck DC) and the cylinder tube 32. More specifically, the control device 70 determines whether the piston 33 has passed the intermediate position between the uppermost end position and the lowermost position from the uppermost position side to the lowermost position side, based on the detection signal. Is passed from the lowermost position to the uppermost position.

  A flow sensor 65 is connected to the control device 70. The control device 70 receives a signal from the flow rate sensor 65 and detects the flow rate of the pressurized gas discharged from the suction port 46a of the suction pad 46 when the suction pad 46 is lowered. Specifically, when the flow rate of the gas injected from the lower end of the suction pad 46 is reduced to a predetermined reference flow rate based on the detection signal, the control device 70 makes the suction port 46a of the suction pad 46 contact the IC chip T. It has come to be judged that it was blocked.

Next, the teaching processing operation for obtaining the height position when the suction pad 46 comes into contact with the upper surface of the IC chip T mounted on the inspection socket 50 of the measuring robot 11 configured as described above is shown in FIG. The operation will be described according to a flowchart showing the operation of the device 70.
Now, the IC chip T is mounted in the inspection socket 50 in advance on the inspection socket 50. At this time, the electromagnetic valve B1 and the electromagnetic valve B2 are all closed. The piston 33 is disposed at the uppermost position.

From this state, a teaching start signal is output from the input / output device 71 in order to teach the height position when the suction pad 46 contacts the upper surface of the IC chip T to the inspection socket 50.
First, the control device 70 drives and controls the X-axis motor MX, the Y-axis motor MY, and the Z-axis motor MZ, and the pressing device 30, that is, the suction pad 46 is mounted on the inspection socket 50 to be taught. Guide to a predetermined position directly above the chip T (step S1-1).
When the suction pad 46 is guided to a predetermined position directly above the IC chip T, the control device 70 controls the electropneumatic regulator 61 to supply air to the first chamber a of the cylinder tube 32 to cause the piston 33 to move. It is moved downward (step S1-2).

  At this time, the control device 70 supplies air to the first chamber a of the cylinder tube 32 until the detection signal of the relative position detection sensor SE2 switches from the “off” signal to the “on” signal (step S1-3). . When the detection signal of the relative position detection sensor SE2 is switched from the “off” signal to the “on” signal (YES in step S1-3), the control device 70 controls the electropneumatic regulator 61 to control the first of the cylinder tube 32. The supply of air to the first chamber a is stopped (step S1-4). That is, the control device 70 stops the piston 33 at an intermediate position between the uppermost end position and the lowermost position.

  Next, the control device 70 opens the electromagnetic valve B2, connects the positive pressure circuit 63 and the second connection port P2, and sets the inside of the suction pipe 45 to a positive pressure to inject air from the suction pad 46 (step S1- 5). Subsequently, the control device 70 drives and controls the Z-axis motor MZ to move the pressing device 30 (suction pad 46) downward toward the IC chip T mounted on the inspection socket 50 located directly below ( Step S1-6).

During this downward movement, the control device 70 calculates the height position of the pressing device (suction pad 46) at that time based on the detection signal from the encoder SE1.
The control device 70 takes in a signal output from the flow sensor 65 when the pressing device 30 (suction pad 46) is moved downward while jetting air from the suction pad 46, and the tip of the suction pad 46 (suction port). The flow rate of the gas ejected from 46a) is detected (step S1-7).

  Then, as shown in FIG. 7, the suction pad 46 eventually comes into contact with the upper surface of the IC chip T. When the suction pad 46 comes into contact with the upper surface of the IC chip T, the suction port 46a of the suction pad 46 is closed. When the suction pad 46 approaches the upper surface of the IC chip T, the flow rate of the gas discharged from the suction port 46a gradually decreases, and when the flow rate of the gas discharged from the suction port 46a decreases to a predetermined reference amount, the control device 70 It is determined that the suction pad 46 is in contact with the upper surface of the IC chip T (steps S1-8, S1-9). The control device 70 stores the calculated height position of the pressing device (suction pad 46) in the RAM 70C based on the detection signal from the encoder SE1 up to that time, and stores the height position in the input / output device 71. The data is output and displayed on the display (step S1-9).

Subsequently, when the suction height position of the suction pad 46 in one inspection socket 50 is registered, the control device 70 closes the electromagnetic valve B2 and stops the injection of gas from the suction pad 46 (step S1- 10). Subsequently, the control device 70 reversely rotates the Z-axis motor MZ and moves the pressing device (suction pad 46) up to a predetermined upper position (step S1-11).
Then, when the control device 70 moves the pressing device 30 upward to a predetermined upper position, the teaching of the suction height position of the suction pad 46 in one inspection socket 50 is finished.

Next, effects of the embodiment configured as described above will be described below.
(1) According to the above-described embodiment, the suction pad 46 is moved downward toward the upper surface of the IC chip T previously disposed in the inspection socket 50 while jetting gas from the suction pad 46. When the suction pad 46 comes into contact with the upper surface of the IC chip T, the gas jetted from the suction pad 46 is blocked by the IC chip T, so that the gas discharged from the suction port 46a of the suction pad 46 is The flow rate sensor 65 detects a decrease in the flow rate. Therefore, by determining whether or not the gas flow rate detected by the flow rate sensor 65 has decreased to a predetermined reference flow rate, it can be detected that the suction pad 46 is in contact with the upper surface of the IC chip T. The control device 70 can detect the position. In addition, the suction pad 46 can be moved to the IC chip T by a simple method of detecting the flow rate of the gas discharged from the suction port 46a of the suction pad 46 with the flow sensor 65 while jetting the gas from the suction pad 46. Can be detected with high accuracy.
Further, when the suction pad 46 is brought close to the upper surface of the IC chip T, the height position where the suction pad 46 comes into contact with the upper surface of the IC chip T can be easily set even if the back pressure of the gas ejected from the suction pad 46 does not increase. Can be obtained with high accuracy in a simple configuration,

  (2) According to the above embodiment, the flow rate sensor 65 detects the flow rate of the gas ejected from the suction pad 46 while being moved downward while jetting the gas from the suction pad 46. That is, the existing suction pad 46 and the pipe R2 (suction pipe 45) are used. In other words, by switching between the electromagnetic valve B1 and the electromagnetic valve B2, the suction pad 46 can be used for teaching processing operation in addition to the original suction of the IC chip T. Therefore, it is not necessary to newly provide the pressing device 30 with a special jig used for teaching, and the height position can be detected with a very simple configuration and high accuracy.

  (3) According to the above-described embodiment, when the suction height position for sucking the IC chip T is detected, the piston 33 is disposed in an intermediate position with respect to the cylinder tube 32. Therefore, even if the suction pad 46 moves further downward than the position of the upper surface of the IC chip T for some reason, the piston 33 moves upward with respect to the cylinder tube 32. There is no risk of damage.

In addition, you may change the said embodiment as follows.
In the above embodiment, when the pressing device 30 is moved downward, air is supplied from the electropneumatic regulator 61 to move the piston 33 to an intermediate position between the uppermost position and the lowermost position. The position is not limited, and any position between the uppermost position and the lowermost position is possible.
In the above embodiment, the height position of the upper surface of the IC chip T arranged in the inspection socket 50 is obtained, but the present invention is not limited to this, and the pocket of the supply tray in which the IC chip before inspection is accommodated. It may be applied to the detection of the height position of the upper surface of the IC chip in the above, or to the detection of the height position of the upper surface of the IC chip in the pocket of the collection tray in which the IC chip after inspection is accommodated.

Further, it can be applied to the detection of the height position of the upper surface of the IC chip in the pocket of the hot plate provided in the IC handler, or can be kept on standby before being placed in the inspection socket 50, or the collection tray. It may be applied to the detection of the height position of the upper surface of the IC chip in a pocket for waiting before being conveyed.
In the above embodiment, the spring SP is coupled between the coupling block 41 of the device chuck DC and the coupling base 31 to elastically support the piston 33 (device chuck DC). Alternatively, an elastic member may be disposed between the lower surface of the piston 33 and the front plate 32b of the cylinder tube 32 to elastically support the piston 33 (device chuck DC). Of course, in addition to the spring SP of the above embodiment, an elastic member may be disposed between the lower surface of the piston 33 and the front plate 32b of the cylinder tube 32.

In particular, in the above-described embodiment, the present invention may be applied to an IC handler including a measurement robot that does not elastically support the piston 33 (device chuck DC) with the spring SP.
In each of the above embodiments, the suction pad 46 has a lip shape as shown in FIGS. As long as the IC chip T is flat, the shape of the suction pad 46 may be a resin or metal suction pad provided with a projection corresponding to the outer size of the IC chip. That is, when the upper surface of the IC chip T is contacted, only the protrusion comes into contact first, thereby increasing the pressure in the first embodiment, or in the second embodiment as a suction pad shape that causes the piston 33 to start upward movement. Also good.

-In above-mentioned embodiment, although device chuck DC (adsorption pad 46) was moved up and down with air cylinder SL, it is not limited to this. For example, the device chuck DC (suction pad 46) may be moved up and down with a diaphragm or a bellows.
In the above embodiment, the measurement robot 11 provided in the IC handler is embodied. However, the present invention is not limited to this. For example, the IC chip is transported from the first arrangement position to the second arrangement position. The present invention may be applied to other transfer devices.
In the above embodiment, the vacuum generator-compatible unit is used, but a vacuum pump-compatible unit 64 (see FIG. 8) having an air release port AP may be used. In FIG. 8, 641 is a vacuum supply pilot valve, 642 is a vacuum supply valve, 642 is a vacuum breaking pilot valve, 66 is a vacuum source, and AF is a valve filter.

  DESCRIPTION OF SYMBOLS 10 ... IC handler, 11 ... Measuring robot, 30 ... Pressing device, 32 ... Cylinder tube, 32 ... Cylinder tube, 32a ... Tube main body, 33 ... Piston, 46 ... Adsorption pad, 47 ... Detection piece, 50 ... Inspection socket, 61 ... Electro-pneumatic regulator, 62 ... Vacuum generator compatible unit, 63 ... Positive pressure circuit, 65 ... Flow sensor, 70 ... Control device, 70A ... CPU, 70B ... ROM, 70C ... RAM, DC ... Device chuck, B1, B2 ... Electromagnetic valve, MZ ... Z-axis motor, SE1 ... Encoder, SE2 ... Relative position detection sensor, SL ... Air cylinder, SP ... Spring, T ... IC chip.

Claims (4)

A pressing means comprising an operating body that moves up and down;
A holding member connected to the lower end of the operating body and holding the semiconductor chip;
Moving means for moving the pressing means up and down;
In the teaching method of the handler for holding the semiconductor chip held by the holding member at the chip arrangement position, or holding the semiconductor chip arranged at the chip arrangement position by the holding member,
Gas that is ejected from the gripping member by moving the gripping member toward the top surface of the semiconductor chip previously disposed at the chip placement position while ejecting gas from the lower end of the gripping member without gripping the semiconductor chip A method of teaching a handler, characterized in that the position of the pressing means when the flow rate decreases to a preset flow rate is a height position at which the gripping member contacts the semiconductor chip. A pressing means comprising an operating body elastically supported upward by an elastic member;
A holding member connected to the lower end of the operating body and holding the semiconductor chip;
Moving means for moving the pressing means up and down;
Actuator driving means for supplying gas to the pressing means and causing the operating body elastically supported by the elastic member to move up and down relative to the pressing means between a predetermined uppermost position and lowermost position. In the teaching method of the handler that holds the semiconductor chip held by the holding member at the chip arrangement position, or holds the semiconductor chip arranged at the chip arrangement position by the holding member,
Gas that is ejected from the gripping member by moving the gripping member toward the top surface of the semiconductor chip that is previously disposed at the chip placement position while ejecting gas from the lower end of the gripping member without gripping the semiconductor chip A method of teaching a handler, characterized in that the position of the pressing means when the flow rate decreases to a preset flow rate is a height position at which the gripping member contacts the semiconductor chip. A pressing means comprising an operating body movable in the vertical direction;
A holding member connected to the lower end of the operating body and holding the semiconductor chip;
Moving means for moving the pressing means up and down;
A relative position detecting means for detecting a relative position between the gripping member and the pressing means;
A vertical movement position detecting means for detecting a vertical movement position of the pressing means;
A vertical movement position calculation means for calculating the movement position of the pressing means based on a detection signal from the vertical movement position detection means, and a semiconductor chip held by the holding member is arranged at a chip arrangement position, or a chip In the handler that grips the semiconductor chip placed at the placement position with the gripping member,
Gas supply means for injecting gas from the tip of the gripping member;
A flow rate detection means for detecting whether or not the flow rate of the gas supplied from the gas supply means and ejected from the tip of the gripping member has decreased to a predetermined reference flow rate;
Drive control means for driving the gas supply means and the moving means to move the gripping member toward a semiconductor chip previously disposed at a chip placement position, while jetting gas from the tip of the gripping member;
When the flow rate detecting means detects that the flow rate of the gas injected from the tip of the gripping member has reached the reference flow rate, the gripping member is the semiconductor position calculated by the vertical movement position calculating means. Registration means for registering in the storage means as the height position in contact with the chip;
A handler characterized by providing A pressing means including an operating body elastically supported upward by an elastic member;
A holding member connected to the lower end of the operating body and holding the semiconductor chip;
Moving means for moving the pressing means up and down;
Actuator driving means for supplying gas to the pressing means and causing the operating body elastically supported by the elastic member to move up and down relative to the pressing means between a predetermined uppermost position and lowermost position. When,
A relative position detecting means for detecting a relative position between the gripping member and the pressing means;
A vertical movement position detecting means for detecting a vertical movement position of the pressing means;
Based on a detection signal from the vertical movement position detection means, a vertical movement position calculation means for calculating the movement position of the pressing means;
In a handler that holds a semiconductor chip held by the holding member at a chip arrangement position, or holds a semiconductor chip arranged at a chip arrangement position by the holding member,
Gas supply means for injecting gas from the tip of the gripping member;
A flow rate detection means for detecting whether or not the flow rate of the gas supplied from the gas supply means and ejected from the tip of the gripping member has decreased to a predetermined reference flow rate;
The operating body driving means, the gas supply means, and the moving means are driven and controlled to dispose the operating body between a predetermined uppermost position and a lowermost position, and gas from the tip of the gripping member. Driving control means for moving the gripping member toward the semiconductor chip previously arranged at the chip arrangement position,
When the pressure detecting means detects that the flow rate of the gas injected from the tip of the gripping member has reached the reference flow rate, the gripping member is the semiconductor position calculated by the vertical movement position calculating means. Registration means for registering in the storage means as the height position in contact with the chip;
A handler characterized by providing

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