TW201814822A - Electronic component transfer device and test equipment applying same for adjusting and positioning an angular orientation of an electronic component transferred by a pick-and-place member to ensure a correct execution of testing operation - Google Patents

Abstract

An electronic component transfer device is provided with a moving part connected with a pick-and-place assembly. The pick-and-place assembly is provided with a carrier base connected to the moving part. The carrier base is pivoted to a pivoting base. The pivoting base is provided with a pick-and-place member for picking up and placing electronic components. In addition, a positioning structure is provided between the carrier base and the pivoting base for positioning the pivoting angle between the pivoting base and the pick-and-place member. A turning assembly is used to adjust the pivoting angle between the pivoting base and the pick-and-place member of the pick-and-place assembly. A sensing assembly is configured to sense the angular orientation of the electronic component transferred by the pick-and-place member of the pick-and-place assembly, and transmit the sensing signal to a controller for performing a comparison, so as to control the turning assembly to drive and pivot the pivoting base of the pick-and-place assembly and the pick-and-place member, thereby adjusting and positioning an angular orientation of an electronic component transferred by the pick-and-place member to ensure a correct execution of testing operation for the electronic component. As a result, the practical efficacy of improving test quality can be achieved.

Description

   Electronic component transfer device and test equipment for application thereof   

The invention provides an electronic component transfer device and a test device for adjusting the angular direction of a positioning electronic component to ensure the correct execution of the test operation of the electronic component to achieve the improvement of test quality.

At present, in order to ensure the quality of electronic components, after the production of electronic components is completed, operators will perform test operations on test equipment to eliminate defective electronic components; see Figures 1 and 2 to learn about electronic component testing equipment. A feeding device 11, a receiving device 12, a testing device 13, a conveying device 14, and a transfer device 15 are arranged on the machine 10; the feeding device 11 is used to receive at least one feeding tray 16, and The feeding tray 16 is provided with a plurality of rectangular receiving grooves 161 for receiving the electronic component A to be measured. The receiving device 12 is used to receive at least one receiving tray 17 and is provided on the receiving tray 17. There are a plurality of rectangular tanks 171 for accommodating the tested electronic component A. The test device 13 is provided with a test base 131 in the test area for performing the test operation of the electronic components. The conveying device 14 is provided in the test area. The test base 131 of the test device 13 is provided with a first feeding stage 141a and a first discharging stage 142a on one side, and a second feeding stage 141b and a second discharging stage 142b on the other side. Feed moving is arranged between the first and second loading stages 141a, 141b and the feeding device 11. Structure 143 for moving the electronic component A to be tested on the supply tray 16 to the first and second loading stages 141a and 141b, and the first and second loading stages 141a and 141b to move the measured unit The electronic component A is carried to the test area. A discharge moving mechanism 144 is arranged between the first and second discharge carriers 142a, 142b and the receiving device 12, for the first and second discharge carriers. The electronic components A tested on 142a and 142b are moved to the receiving tray 17 on the receiving device 12; the transfer device 15 is located on the test base 131 of the testing device 13 and the first feeding of the conveying device 14 A first pick-and-place mechanism 151 is arranged between the stage 141a and the first discharge stage 142a, for transferring the electronic component A to be tested on the first incoming stage 141a to the test base 131 of the test device 13 for execution During the test operation, the tested electronic component A is transferred to the first discharge stage 142a, the test base 131 of the test device 13 and the second feed stage 141b and the second discharge stage of the conveying device 14. A second pick-and-place mechanism 152 is arranged between the platforms 142b for transferring the electronic component A to be tested on the second loading stage 141b to the test base 131 of the testing device 13. Perform the test operation, and then transfer the tested electronic component A to the second discharge stage 142b, and the discharge moving mechanism 144 of the conveying device 14 loads the first and second discharge stages 142a and 142b. The tested electronic component A is moved to the receiving tray 17 on the receiving device 12 to complete the test operation of the electronic component A in an automated manner; when the electronic component A is transferred to the test base 131 of the test device 13 to perform the test operation The electronic components A must be placed in the test base 131 of the test device 13 at the same angular position, so that the contacts of the electronic component A are electrically connected to corresponding probes on the test base 131 of the test device 13 respectively. In order to correctly perform the test operation, in order to place each electronic component A into the test base 131 of the test device 13 at the same angular position, the marking mark on each electronic component A is generally used as a reference to The electronic component A is placed in each receiving groove 161 of the feeding tray 16 at the same angular position, and the rectangular receiving groove 161 is used to restrict each side of each electronic component A (as shown in FIG. 2). Place each electronic component A in the correct angular position The test base 131 of the device 13 performs the test operation; however, when each electronic component A is placed in each of the receptacles 161 of the supply tray 16, if the operator is negligent, the electronic components A cannot be oriented at the same angular position. When placed in the receiving grooves 161 of the feed tray 16, the transfer device 15 cannot determine whether the angular direction of the electronic component A being transferred is correct, that is, the electronic component A in the wrong angular direction is directly moved. The test seat 131 placed in the test device 13 cannot perform the test operation correctly, which affects the quality of the test operation. In addition, because there are many types of electronic components, and various electronic components have different shapes, as shown in FIG. 3 Since the electronic component B is circular, when each electronic component B is placed in each of the receiving grooves 161 of the supply tray 16, the receiving groove 161 of the supply tray 16 cannot limit the electronic component B, and is transported. In the process, the electronic component B is extremely easy to rotate the receiving groove 161 of the feeding tray 16, so that the electronic components B cannot be accommodated in the receiving grooves 161 of the feeding tray 16 at the same angular position, and then the test operation is performed. At this time, because the transfer device 15 cannot determine the transferred The angular position of the electronic component B direction, but can not correct electronic component B is transferred to the test socket 13 of the test apparatus 131 performs a test operation, thereby affecting the quality of the test.

Please refer to FIG. 4. In order to solve the above-mentioned shortcomings, that is, an operator has a moving rod that can be driven to move in the first, second, and third directions (X, Y, and Z directions) in the transfer device 20 of the electronic component testing equipment. 21, and the moving rod 21 is used to drive a pick-and-place device 22 for picking and placing the electronic component A, and a first direction adjusting structure 23 and a second direction adjusting structure 24 are provided between the moving rod 21 and the pick-and-place device 22. And angular position adjustment structure 25 to drive the pick-and-place device 22 for displacement adjustment and rotation adjustment in the first and second directions (XY directions), thereby adjusting the first and second-direction positions of the electronic component A on the pick-and-place device 22 And the angular direction, wherein the angular adjustment structure 25 is provided with a carrier 251 with movement displacement adjustment by the first direction adjustment structure 23 and the second direction adjustment structure 24, and the carrier 251 is provided with a first The motor 252 arranged in three directions (Z direction), and the pick-and-place device 22 is connected to the output shaft 2521 of the motor 252, and the pick-and-place device 22 can be driven by the output shaft 2521 of the motor 252 for rotation adjustment to adjust The angular direction of the electronic component A; see FIG. 5, when the loading device 20 is placed 22 After picking up the electronic component A, the first direction adjustment structure 23, the second direction adjustment structure 24, the angle adjustment structure 25, and the pick-and-place device 22 are moved to the test seat 26 of the test device by using the moving rod 21, and first The first-direction adjustment structure 23, the second-direction adjustment structure 24, and the angle-position adjustment structure 25 are used to drive the pick-and-place device 22 for displacement adjustment and rotation adjustment in the first and second directions (XY directions) to adjust the pick-and-place device 22 The first and second directions and angular directions of the electronic component A align the electrical contact A1 of the electronic component A with the probe 261 of the test base 26, and the picker 22 and the electronic are driven by the moving rod 21 The component A is displaced downward, so that the electrical contact 211 of the electronic component A contacts the probe 261 of the test base 26 to perform the test operation of the electronic component A; however, the rotation axis 2521 of the motor 252 of the angular adjustment structure 25 is subjected to Out of step will still cause deflection, that is, when the electrical contact A1 of the electronic component A is pressed against the probe 261 of the test base 26, the probe 261 of the test base 26 will contact the electrical contact A1 of the electronic component A Generates a reaction force that will cause the shaft 252 of the motor 252 1. The pick-and-place device 22 and the electronic component A are deflected, resulting in that the electrical contact A1 of the electronic component A and the probe 261 of the test base 26 cannot make effective electrical contact, thereby affecting the test quality.

In view of this, the inventor then used his many years of research and development and production experience in related industries, in-depth research on the current problems, and after long-term research and trial work, he finally developed a transfer device for electronic components and its application. The test equipment is to effectively improve the disadvantages of the prior art, which is the design purpose of the present invention.

An object of the present invention is to provide a transfer device for electronic components, which is connected with a moving component and is provided with a pick-and-place component, the pick-and-place component is provided with a bearing seat connected to the moving member, and is pivotally arranged on the bearing seat. There is a pivot base, and a pick-and-place device for picking and placing electronic components is provided on the pivot base, and a positioning structure is provided between the bearing base and the pivot base for positioning the pivot base and the pick-and-place device. An indexing component is used to adjust the pivoting angle of the pivot seat of the pick-and-place component and the pick-and-place device, and a sensing component is used to sense the electronics carried by the pick-and-place component's pick-and-place device. The angular position of the component, and the sensing signal is transmitted to the controller for comparison, so as to control the indexing component to drive the pivoting seat of the pick-and-place component and the pivot of the pick-and-place device, so as to adjust The angular direction of the electronic component can be adjusted to locate the angular direction of the electronic component carried by the pick-and-place device to ensure the correct execution of the test operation of the electronic component and achieve the practical purpose of improving the test quality.

The second object of the present invention is to provide a testing device using an electronic component transfer device. The test device is provided with a feeding device, a receiving device, a testing device, a conveying device, and a transferring device on the machine. The device is used to contain at least one electronic component to be tested, the receiving device is used to contain at least one completed electronic component, the test device is provided in the test area with a test base for performing electronic component testing operations, and the conveying device It is used to transfer the electronic components to be tested to the test area, and the tested electronic components are transferred to the receiving device from the test area. The transfer device is used to transfer the electronic components between the transfer device and the test base of the test device for loading. The electronic component under test is adjusted with the transfer device to adjust the angular direction of the electronic component under test, so that the electronic component under test is correctly placed in the test stand of the test device, so as to ensure the correct execution of the test operation and achieve the lift test. Quality is practical.

     Learning part:     

10‧‧‧machine

11‧‧‧feeding device

12‧‧‧ Receiving device

13‧‧‧test device

131‧‧‧Test Block

14‧‧‧ Conveying device

141a‧‧‧First loading stage

142a‧‧‧First discharge stage

141b‧‧‧Second loading stage

142b‧‧‧Second discharge stage

143‧‧‧Feed moving mechanism

144‧‧‧Discharging and moving mechanism

15‧‧‧ transfer device

151‧‧‧The first pick-and-place mechanism

152‧‧‧Second pick-and-place mechanism

16‧‧‧feed tray

161‧‧‧container

17‧‧‧ Receiving tray

171‧‧‧container

20‧‧‧ transfer device

21‧‧‧move

22‧‧‧Pickup

23‧‧‧ Structure adjustment in the first direction

24‧‧‧Second direction adjustment structure

25‧‧‧Corner adjustment structure

251‧‧‧carrying parts

252‧‧‧Motor

2521‧‧‧Output shaft

26‧‧‧Test Block

261‧‧‧ Probe

A‧‧‧Electronic components

A1‧‧‧electric contact

B‧‧‧Electronic components

     Part of the invention:     

30‧‧‧ transfer device

31‧‧‧moving parts

32‧‧‧Pick-and-place components

321‧‧‧bearing seat

3211‧‧‧Shaft hole

322‧‧‧Pivot Block

3221‧‧‧ Pivot

323‧‧‧Pickup

324‧‧‧Pressing piece

33‧‧‧ first direction adjustment structure

34‧‧‧Second direction adjustment structure

35‧‧‧ Indexing assembly

351‧‧‧Rotary drive unit

352‧‧‧index

3521‧‧‧Setting Department

3522‧‧‧Putting Department

36‧‧‧Awareness component

30a‧‧‧ transfer device

31a‧‧‧moving parts

32a‧‧‧Pick-and-place components

322a‧‧‧Pivot Block

323a‧‧‧Pick and Place

324a‧‧‧Pressing piece

33a‧‧‧First-direction adjustment structure

34a‧‧‧Second direction adjustment structure

35a‧‧‧ indexing assembly

351a‧‧‧Rotary drive unit

352a‧‧‧Indexer

3521a‧‧‧Set

3522a‧‧‧Putting Department

36a‧‧‧Awareness component

30b‧‧‧ transfer device

40‧‧‧machine

41‧‧‧feeding device

42‧‧‧Receiving device

43‧‧‧test device

431‧‧‧Test Block

44‧‧‧ Conveying device

441a‧‧‧First loading stage

442a‧‧‧First discharge stage

441b‧‧‧Second loading stage

442b‧‧‧Second discharge stage

443‧‧‧Feeding and moving agency

444‧‧‧Discharging and moving mechanism

50‧‧‧feed tray

501‧‧‧container

51‧‧‧Receiving tray

511‧‧‧container

B‧‧‧Electronic components

Figure 1: Schematic diagram of the configuration of the conventional electronic component testing equipment.

Fig. 2: Schematic diagram of the use of conventional electronic components housed in a tray.

Fig. 3: A schematic diagram showing the use of another type of electronic component housed in a tray.

Figure 4: Schematic diagram of the conventional pick-and-place mechanism.

Figure 5: Schematic diagram of the use of the conventional pick-and-place mechanism.

FIG. 6 is a schematic structural diagram of a transfer device according to the first embodiment of the present invention.

FIG. 7 is a schematic diagram of the application of the transfer device of the first embodiment of the present invention to a test device.

Fig. 8 is a schematic diagram of the operation of the first embodiment of the present invention applied to a test device (1).

FIG. 9 is a schematic diagram of the operation of the first embodiment of the present invention applied to a test device (2).

Fig. 10 is a schematic diagram of the operation of the first embodiment of the present invention applied to a test device (3).

FIG. 11 is a schematic diagram of the operation of the first embodiment of the present invention applied to a test device (four).

FIG. 12 is a schematic diagram (fifth) of the operation of the first embodiment of the present invention applied to a test device.

FIG. 13 is a schematic diagram of the operation of the first embodiment of the present invention applied to a test device (six).

FIG. 14 is a schematic view of the operation of the first embodiment of the present invention applied to a test device (seven).

FIG. 15 is a schematic diagram of the operation of the first embodiment of the present invention applied to a test device (eight).

FIG. 16: Schematic diagram of the operation of the first embodiment of the present invention applied to a test device (nine).

FIG. 17 is a schematic structural diagram of a transfer device according to a second embodiment of the present invention.

In order to make your reviewer better understand the present invention, a preferred embodiment will be given in conjunction with the drawings, which will be described in detail as follows: Please refer to FIG. 6 for the electronic component transfer device of the first embodiment of the present invention. 30 is provided with a moving part 31 which can be driven by a robotic arm for displacement in the first, second and third directions (X, Y, Z directions) for driving the pick-and-place assembly 32 for picking and placing electronic components. The pick-and-place assembly 32 is A supporting base 321 connected to the moving part 31 is provided for pivoting a pivot base 322, and a pick-and-place device 323 for picking and placing electronic components is connected to the pivot base 322, so that the pick-and-place device 323 can move with the pivot base 322. In this embodiment, the bearing base 321 is provided with a shaft hole 3211 and a bearing seat arranged in the third direction (Z direction). The pivot base 322 is Then, a pivot 3221 arranged in a third direction (Z direction) is provided for penetrating and extending in the shaft hole 3211 of the bearing seat 321 and the bearing seat, so that the pivot seat 322 and the pick-and-place device 323 The pivot 3221 can be pivoted at various angles as the axis; and a positioning structure is provided between the bearing base 321 and the pivot base 322 to For positioning the pivoting angle of the pivot base 322 and the pick-and-place device 323, the positioning structure is provided between the bearing base 321 and the pivot base 322 with a pressing member 324 which can be an airbag or a pressure cylinder for Controlling pressing against the pivot base 322, so that the pivot base 322 cannot be pivoted, so that the pivot angles of the pivot base 322 and the pick-and-place device 323 can be located; in this embodiment, the pressing member 324 It is an airbag, and when the pressure is input into the pressure member 324, the pressure member 324 is expanded to press against the pivot base 322, so that the pivot base 322 cannot be pivoted, and the pivot can be positioned. The pivoting angle of the seat 322 and the pick-and-place device 323, and when the pressure member 324 stops inputting air pressure, the pressure member 324 contracts and disengages against the pivot seat 322, so that the pivot seat 322 and the The pick-and-place device 323 can be pivoted; a first direction adjusting structure 33 and a second direction adjusting structure 34 are connected between the moving component 31 and the pick-and-place component 32, so as to drive the pick-and-place component 32 as the first The displacement adjustment in the first and second directions (XY directions) is not allowed because the first direction adjustment structure 33 and the second direction adjustment structure 34 are conventional techniques. To repeat; an indexing component 35 is used to drive the pivoting base 322, the picker 323, and the electronic components of the pick and place component 32 to pivot at an appropriate angle to adjust the angular position of the electronic component carried by the picker 323 Direction; in this embodiment, the indexing assembly 35 is a hollow motor, and an indexing base 352 driven by a rotation driving group 351 is provided on the indexing assembly 35, and the indexing base 35 is positioned on the indexing base 35. A sleeve portion 3521 is provided on the top surface for the pivot seat 322 of the pick-and-place component 32, and a penetration portion 3522 is provided on the bottom surface of the sleeve portion 3521 for the pick-and-place component 32. The pick-up assembly 323 and electronic components can be driven by the moving part 31 to displace the pick-and-place assembly 32, so that the pivot base 322 of the pick-and-place assembly 32 is placed in the sleeve portion 3521 of the index base 352. The rotation driving group 351 drives the indexing seat 352 to drive the pivoting seat 322, the picker 323, and the electronic component of the pick-and-place component 32 to pivot at an appropriate angle to adjust the angular direction of the electronic component; a sensing component 36 is A CCD imager for sensing the angular position of the electronic component carried by the picker 323 of the pick and place component 32 Position in the first and second directions, and transmit the sensing signal to the controller (not shown in the figure) for comparison. When the angular direction of the electronic component is abnormal, the controller controls the indexing component 35 to drive the taking The pivot base 322, the pick-and-place device 323, and the electronic component of the component 32 are pivoted at an appropriate angle to adjust the angular direction of the electronic component to be tested. When the first and second directions of the electronic component are abnormal, the first component is controlled. The one-direction adjustment structure 33 and the second-direction adjustment structure 34 drive the pick-and-place component 32 to perform displacement adjustment in the first and second directions (XY directions); in this embodiment, the indexing seat 352 of the indexing component 35 is worn. The placement portion 3522 communicates with the bottom, and the sensing component 36 can be disposed below the penetration portion 3522 of the indexing seat 352 of the indexing component 35, and the pivoting seat 322 of the pick-and-place component 32 is sleeved on the indexing portion. When the sleeve portion 352 of the seat 352 is inside, the sensing component 36 senses the angular position and the first and second directions of the electronic component.

Please refer to FIG. 7. When the transfer device of the electronic component of the present invention is applied to a test device, the test device is provided on the machine 40 with a feeding device 41, a receiving device 42, a testing device 43, a conveying device 44 and At least one transfer device; the feeding device 41 is used to receive at least one feeding tray 50, and a plurality of rectangular receiving grooves 501 are provided on the feeding tray 50 for receiving electronic components to be tested; The receiving device 42 is used for receiving at least one receiving tray 51, and a plurality of rectangular receiving grooves 511 are provided on the receiving tray 51 for receiving the tested electronic components; the testing device 43 is located in the test area A test stand 431 is provided therein for performing the test operation of the electronic components. The conveying device 44 is used to carry the electronic components to be tested on the feeding tray 50 of the feeding device 41 to the test area for test operations, and then complete the test operation. The measured electronic components are carried into the receiving tray 51 of the receiving device 42. In this embodiment, the conveying device 44 is arranged on the test base 431 side of the testing device 43 with a first feeding stage 441a And the first discharge stage 442a, and the second discharge stage 441b and the second discharge stage are arranged on the other side A feeding unit 443 is arranged between the first and second loading platforms 441a, 441b and the feeding device 41 to move the electronic components to be tested on the feeding tray 50 to the first And second input carriers 441a, 441b, and the first and second input carriers 441a, 441b carry the electronic components to be tested to the test area. The first and second output carriers 442a, 442b and A discharge moving mechanism 444 is arranged between the receiving devices 42 for moving the electronic components on the first and second discharging stages 442a and 442b to the receiving tray 51 on the receiving device 42. The transfer device is used to transfer the electronic component under test to the test area to the test stand 431 of the test device 43 to perform the test operation of the electronic component under test, and to complete the test of the electronic component. The components are transferred to the conveying device 44, and the tested electronic components are carried by the conveying device 44 into the receiving tray 51 on the receiving device 42; in this embodiment, the test stand 431 of the testing device 43 A first set of transfer devices 30a are arranged between the first feeding stage 441a and the first discharging stage 442a of the conveying device 44. Electronic components are transferred between the test base 431 of the test device 43 and the first loading stage 441a and the first discharge stage 442a of the transport device 44, and between the test base 431 of the test device 43 and the transport device 44 A second set of transfer devices 30b are arranged between the second loading stage 441b and the second discharging stage 442b, so that the test base 43 of the testing device 43 and the second loading stage 441b of the conveying device 44 The electronic components are transferred between the second discharge stage 442b and the second discharge stage 442b, and then the finished electronic components are moved to the receiving device 42 by the first discharge stage 442a and the second discharge stage 442b. In the upper receiving tray 51, the testing operation of electronic components is completed in an automated manner.

Please refer to FIGS. 8 and 9. When the test device of the present invention performs a test operation of an electronic component, a circular electronic component B is taken as an example, which first uses the feeding and moving mechanism 443 of the conveying device 44 to feed the material. The electronic component B to be tested on the tray 50 is moved to the first loading stage 441a, and the electronic component B to be tested is carried by the first loading stage 441a to the test of the testing device 43 in the test area. Side of seat 431; please refer to Figures 10 and 11, and then use the first set of transfer device 30a to transfer the electronic component B to be tested. First, it uses the moving part 31a to drive the pick-and-place assembly 32a, the first The one-direction adjustment structure 33a and the second-direction adjustment structure 34a, and the pick-and-place device 323a of the pick-and-place component 32a sucks the electronic component B to be tested on the first loading stage 441a, and sends the electronic component to be tested B is transferred above the indexing component 35a, and the pick-and-place component 32a is in the process of transferring the electronic component B to be tested, and it inputs air pressure in the pressure member 324a, so that the pressure member 324a expands and presses. The pivot base 322a is resisted, so that the pivot base 322a, the pick-and-place device 323a, and the electronic component B cannot be pivoted. Please refer to FIG. 12, and then use the moving member 31 a to drive the pick-and-place component 32 a, the first direction adjustment structure 33 a, and the second direction adjustment structure 34 a to perform a downward displacement in the third direction (Z direction), so that The pivot base 322a is sleeved in the sleeve portion 3521a of the index base 352a, the pick-and-place device 323a and the electronic component B to be tested are contained in the penetration portion 3522a, and the sensing component 36a senses it. The angular direction and the first and second directions of the electronic component B to be tested; see FIG. 13. The sensing component 36 a transmits the sensing signal to the controller (not shown in the figure) for comparison. When the angular direction of the electronic component B to be measured is abnormal, control is stopped to input the air pressure in the pressure member 324a of the pick-and-place component 32a, so that the pressure member 324a is contracted and released from pressing against the pivot seat 322a, so that The pivot base 322a, the pick-and-place device 323a and the electronic component B to be tested can be pivoted, and then the rotation driving group 351a of the index component 35a is driven to drive the index base 352a to drive the pivot base of the pick-and-place component 32a. 322a, the pick-and-place device 323a and the electronic component B to be tested are pivoted at an appropriate angle to adjust The angular direction of the electronic component B to be tested; please refer to FIG. 14. After adjusting the angular direction of the electronic component B to be tested, the air pressure is then input into the pressure member 324 a to expand the pressure member 324 a. Pressing against the pivot base 322a makes the pivot base 322a, the pick-and-place device 323a, and the electronic component B unable to pivot to position the angular direction of the electronic component B to be measured; see FIGS. 14 and 15, After the electronic component B to be tested is adjusted to the correct angular position, the electronic component B to be tested can be transferred to the test stand 431 of the test device 43 to perform the test operation; thereby, the transfer device is used The indexing assembly 35a of 30a pivots and adjusts the electronic component B to be tested to the correct angular position, and presses the pressing member 324a against the pivot base 322 to locate the angular direction of the electronic component B to be tested. , You can ensure the correct execution of the test operation, and achieve the practical benefits of improving the test quality; please refer to Figure 16, when the test operation is completed, the transfer device 30a transfers the tested electronic component B to the transport device 44 on the first discharge stage 442a and carried by the first discharge stage 442a Test area, and the electronic component B on the second discharging stage 442a is moved by the discharging moving mechanism 444 to the receiving tray 51 on the receiving device 42 to complete the testing operation of the electronic component B .

Please refer to FIG. 17. The difference between the electronic component transfer device according to the second embodiment of the present invention and the first embodiment is only the configuration of the indexing component 35 and the sensing component 36, which is based on the indexing component 35. The sensing component 36 is disposed at a side position, and the pick-and-place component 32, the first direction adjustment structure 33, the second direction adjustment structure 34, and the electronic component B to be tested are first transferred to the sensing component 36 by the moving component 31 To sense the angular direction and the first and second directions of the electronic component to be tested, and then the pick-and-place component 32, the first direction adjustment structure 33, the second direction adjustment structure 34, and the electronic component B to be tested First transfer to the indexing component 35 to adjust the angular position of the electronic component B to be tested; thereby, the indexing component 35 of the transfer device 30 is also used to adjust the electronic component to be tested to the correct angular position. Direction to ensure the correct execution of test operations and achieve the practical benefits of improving test quality.

Based on this, the present invention is a practical and progressive design. However, the same products and publications have not been disclosed. Therefore, the invention patent application requirements are met, and the application is filed according to law.

Claims (10)

    A transfer device for electronic components includes: a moving part: displacement in at least one direction; a pick-and-place component: a bearing seat connected to the moving member, and a pivot seat on the bearing seat pivot A pick-and-place device for picking and placing electronic components is provided on the pivot base, and a positioning structure is provided between the bearing base and the pivot base to position the pivot angle of the pivot base and the pick-up device; Sensing component: It senses the angular position of the electronic components carried by the pick-and-place device of the pick-and-place component and transmits the sensing signal to the controller. To support the pivot base of the pick-and-place component, and the controller controls the index base to drive the pivot base of the pick-and-place component to pivot to adjust the electronics carried by the pick-and-place component's picker The angular orientation of the component.         The electronic component transfer device according to item 1 of the scope of the patent application, wherein the moving part is driven by a mechanical arm to perform first, second and third direction displacement to drive the pick-and-place component.         The electronic device transfer device according to item 1 of the scope of the patent application, wherein the bearing seat of the pick-and-place component is provided with a shaft hole, and the pivot seat is provided with a pivot shaft for penetrating and extending the pivot device. A shaft hole in the bearing seat.         The electronic component transfer device according to item 1 of the scope of the patent application, wherein the positioning structure of the indexing assembly is provided with a pressing member between the bearing base and the pivot base to press against the pivot base. .         The electronic component transfer device according to item 4 of the scope of the patent application, wherein the pressure-controlling member of the indexing component is an air bag or a pressure cylinder.         According to the electronic component transfer device according to item 1 of the scope of the patent application, the top surface of the indexing base of the indexing component is provided with a sleeve portion for receiving the pivoting base of the picking and placing component.         The electronic component transfer device according to item 6 of the scope of the patent application, wherein a bottom portion of the indexing base of the indexing component is provided with a penetrating portion for receiving the pick-and-place device and the pick-and-place component. Electronic component.         The electronic component transfer device according to item 7 of the scope of the patent application, wherein the penetrating portion of the indexing seat of the indexing assembly is connected to the bottom, and the penetrating portion of the indexing seat is provided below the penetrating portion. Perceptual components.         The electronic component transfer device according to item 1 of the scope of patent application, wherein the sensing component is disposed at a side position of the indexing component.         A testing device includes: a machine; a feeding device: arranged on the machine for receiving at least one electronic component to be tested; a receiving device: arranged on the machine for Undertake at least one completed electronic component; test device: configured on the machine and a test stand in the test area for performing electronic component testing operations; conveyor device: configured on the machine For the electronic components to be tested on the feeding device to the testing area, and the electronic components that have been tested in the testing area to the receiving device; at least one according to item 1 of the scope of patent application Transfer device: It is used to transfer the electronic component to be tested to the test area to the test stand of the test device to perform the test operation, and transfer the tested electronic component to the transfer device.