JP2020202324A - Robot hand - Google Patents

Robot hand Download PDF

Info

Publication number
JP2020202324A
JP2020202324A JP2019109423A JP2019109423A JP2020202324A JP 2020202324 A JP2020202324 A JP 2020202324A JP 2019109423 A JP2019109423 A JP 2019109423A JP 2019109423 A JP2019109423 A JP 2019109423A JP 2020202324 A JP2020202324 A JP 2020202324A
Authority
JP
Japan
Prior art keywords
wafer
robot hand
base
suction
suction cup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019109423A
Other languages
Japanese (ja)
Other versions
JP7396815B2 (en
Inventor
豪 大波
Takeshi Onami
豪 大波
秀輝 小清水
Hideki Koshimizu
秀輝 小清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2019109423A priority Critical patent/JP7396815B2/en
Priority to KR1020200063071A priority patent/KR20200142454A/en
Priority to CN202010493080.4A priority patent/CN112077830A/en
Priority to TW109119422A priority patent/TWI836093B/en
Publication of JP2020202324A publication Critical patent/JP2020202324A/en
Application granted granted Critical
Publication of JP7396815B2 publication Critical patent/JP7396815B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

To provide a robot hand included in a robot transferring a wafer, which properly sucks and holds the center of a recess of the wafer and transfers the wafer, the wafer being curved to be recessed toward the center.SOLUTION: A robot hand 6 which is attached to a robot 1 and sucks and holds the center Wf of a recess of a wafer W that is curved to be recessed toward the center includes: a long flat plate base 60; a sucker 61 that is arranged on the base 60 and sucks and holds the center Wf of a recess of the wafer W; and a communication path 62 which communicates the suction surface 610d of the sucker 61 that sucks and holds the wafer W with a suction source 69. In the robot hand 6, the sucker 61 is raised with respect to one side 60a of the base 60 that mounts the sucker 61 thereon so that the outer peripheral part of the wafer W is not brought into contact with the one face 60a when the suction surface 610d sucks and holds the wafer W.SELECTED DRAWING: Figure 2

Description

本発明は、ロボットに取り付け、中凹み状に湾曲したウェーハの凹み中央を吸引保持するロボットハンドに関する。 The present invention relates to a robot hand that is attached to a robot and sucks and holds the center of a recess of a wafer curved in a central recess.

半導体ウェーハ等の被加工物を研削する研削装置上や切削する切削装置上等、又は上記装置間においては、中凹み状に湾曲したウェーハの外周縁を保持するロボットハンド（例えば、特許文献１参照）や、中凹み状に湾曲したウェーハの外周部分を離間する２つの吸引部でウェーハを吸引保持するロボットハンド（例えば、特許文献２参照）で、中凹み状に湾曲したウェーハを搬送している。 A robot hand that holds the outer peripheral edge of a wafer curved in a hollow shape on a grinding device that grinds a workpiece such as a semiconductor wafer, on a cutting device that cuts, or between the above devices (see, for example, Patent Document 1). ) Or a robot hand (see, for example, Patent Document 2) that sucks and holds the wafer with two suction portions that separate the outer peripheral portion of the wafer that is curved in the shape of a center recess, and conveys the wafer that is curved in the shape of a center recess. ..

特開２０１４−０００６５４号公報Japanese Unexamined Patent Publication No. 2014-000654 特開２０１７−０４５７８４号公報Japanese Unexamined Patent Publication No. 2017-045784

例えば、研削装置等の加工装置上において、ウェーハはウェーハカセットに棚状に収容されていて、ロボットのロボットハンドがウェーハを一枚保持しカセットから搬出して上下反転させて仮置きテーブルに搬送している。したがって、ロボットは、ウェーハを上下反転させるために、ロボットハンドでウェーハの中心を吸引保持したい。また、加工後のウェーハをスピン洗浄した後、スピンナテーブル上のウェーハを保持するときにウェーハの中央を吸引保持したいという要望がある。 For example, on a processing device such as a grinding device, wafers are housed in a wafer cassette in a shelf shape, and a robot hand of a robot holds one wafer, carries it out of the cassette, turns it upside down, and conveys it to a temporary storage table. ing. Therefore, the robot wants to suck and hold the center of the wafer with the robot hand in order to turn the wafer upside down. Further, after spin-cleaning the processed wafer, there is a desire to suck and hold the center of the wafer when holding the wafer on the spinner table.

しかし、中凹み状に湾曲したウェーハの凹み中央を吸引保持しようとすると、ウェーハの反り上がった外周部分がロボットハンドの基台に接触し、ウェーハが中凹み状に湾曲した状態ではロボットハンドがウェーハを適切に吸引保持する事ができないという問題がある。 However, when trying to suck and hold the center of the recess of the wafer curved in the shape of a center recess, the warped outer peripheral portion of the wafer comes into contact with the base of the robot hand, and the robot hand moves the wafer in a state where the wafer is curved in the shape of a center recess. There is a problem that it cannot be properly sucked and held.

よって、ウェーハを搬送するロボットに装着されるロボットハンドにおいては、反って中凹み状に湾曲しているウェーハの凹み中央をロボットハンドで適切に吸引保持して搬送するという課題がある。 Therefore, in the robot hand mounted on the robot that conveys the wafer, there is a problem that the center of the recess of the wafer that is curved in the shape of a central recess is appropriately sucked and held by the robot hand and conveyed.

上記課題を解決するための本発明は、ロボットに取り付け、中凹み状に湾曲したウェーハの凹み中央を吸引保持するロボットハンドであって、長尺平板状の基台と、該基台に配設されウェーハの凹み中央を吸引保持する吸盤と、ウェーハを吸引保持する該吸盤の吸着面を吸引源に連通させる連通路と、を備え、該吸着面でウェーハを吸引保持した際に、ウェーハの外周部分が該吸盤が装着された該基台の一面に接触しないように該吸盤を該一面に対して嵩上げしているロボットハンドである。 The present invention for solving the above problems is a robot hand that is attached to a robot and sucks and holds the center of a recess of a wafer curved in a central recess, and is arranged on a long flat plate-shaped base and the base. A suction cup that sucks and holds the center of the recess of the wafer and a communication passage that connects the suction surface of the suction cup that sucks and holds the wafer to the suction source are provided, and when the wafer is sucked and held by the suction surface, the outer periphery of the wafer is provided. It is a robot hand in which the suction cup is raised with respect to one surface so that the portion does not come into contact with one surface of the base on which the suction cup is mounted.

ロボットに取り付け、中凹み状に湾曲したウェーハの凹み中央を吸引保持する本発明に係るロボットハンドは、長尺平板状の基台と、基台に配設されウェーハの凹み中央を吸引保持する吸盤と、ウェーハを吸引保持する吸盤の吸着面を吸引源に連通させる連通路と、を備え、吸着面でウェーハを吸引保持した際に、ウェーハの外周部分が吸盤が装着された基台の一面に接触しないように吸盤を一面に対して嵩上げしていることで、中凹み状のウェーハの反り上がった外周部分が基台に接触すること無くロボットハンドが適切にウェーハの凹み中央を吸引保持できるようになる。そして、例えば、ウェーハの凹み中央をロボットハンドで吸引保持してウェーハカセットから取り出し、ウェーハを上下反転させて加工装置の仮置きテーブル等に搬送することが可能となる。 The robot hand according to the present invention, which is attached to a robot and sucks and holds the center of the recess of a wafer curved in a central recess, has a long flat plate-shaped base and a suction cup arranged on the base and sucks and holds the center of the recess of the wafer. And a communication passage that communicates the suction surface of the suction cup that sucks and holds the wafer to the suction source, and when the wafer is sucked and held by the suction surface, the outer peripheral part of the wafer becomes one surface of the base on which the suction cup is mounted. By raising the suction cup to one side so that it does not come into contact, the robot hand can properly suck and hold the center of the recess of the wafer without the warped outer peripheral part of the hollowed-out wafer coming into contact with the base. become. Then, for example, the center of the recess of the wafer can be sucked and held by a robot hand, taken out from the wafer cassette, and the wafer can be turned upside down and transported to a temporary storage table or the like of a processing apparatus.

ウェーハが収容されたカセット及びロボットハンドを備えるロボットの一例を示す斜視図である。It is a perspective view which shows an example of the robot which includes a cassette containing a wafer and a robot hand. 中凹み状に湾曲したウェーハの凹み中央をロボットハンドで吸引保持している状態を説明する側面図である。It is a side view explaining the state which sucked and held the center of the recess of the wafer curved in the shape of a center recess by a robot hand. ロボットハンドの基台の先端側の一面にＯリング、嵩上げブロック、及び吸着パッドを取り付ける状態を説明する斜視図である。It is a perspective view explaining the state which attaches the O-ring, the raising block, and the suction pad to one surface on the tip end side of the base of a robot hand. カセットに収容され中凹み状に湾曲したウェーハの凹み中央をロボットハンドで吸引保持している状態を説明する断面図である。It is sectional drawing explaining the state which sucked and held the center of the dent of the wafer housed in a cassette and curved in the shape of a dent by a robot hand.

図１に示すロボット１は、例えばカセット４に収容される中凹み状に湾曲したウェーハＷをカセット４から搬出したり、カセット４に搬入したりするためのロボットであり、本発明に係るロボットハンド６を備えており、例えば、図示しない研削装置上に配設されるものである。 The robot 1 shown in FIG. 1 is, for example, a robot for carrying out a wafer W housed in a cassette 4 and curved in a concave shape from the cassette 4 and carrying it into the cassette 4, and is a robot hand according to the present invention. 6 is provided, for example, it is arranged on a grinding device (not shown).

図１に示すカセット４は、例えば、底板４ａと、天板４ｂと、後壁４ｃと、２枚の側壁４ｄと、前方側（＋Ｙ方向側）の開口４ｅとを有しており、開口４ｅからウェーハＷを搬出入できる構成となっている。カセット４の内部には、複数の棚部４０が上下方向に所定の間隔をあけて形成されており、棚部４０においてウェーハＷを一枚ずつ収容することが可能となっている。なお、カセット４の構成は本例に限定されるものではない。 The cassette 4 shown in FIG. 1 has, for example, a bottom plate 4a, a top plate 4b, a rear wall 4c, two side walls 4d, and an opening 4e on the front side (+ Y direction side). The wafer W can be carried in and out from. A plurality of shelves 40 are formed inside the cassette 4 at predetermined intervals in the vertical direction, and the shelves 40 can accommodate one wafer W at a time. The configuration of the cassette 4 is not limited to this example.

図１、２に示す平面視円形状のウェーハＷは、ウェーハＷの中心から外周縁Ｗｃに向かって徐々に反っていくことで、中凹み状に湾曲している。即ち、この中凹み状の湾曲とは、カセット４の棚部４０にウェーハＷを表面Ｗａを下側に向けて載置した際に、ウェーハＷの表面Ｗａがその中央側の領域から外周側の領域に向かって徐々に低くなっていくような湾曲である。そして、カセット４の棚部４０に、ウェーハＷの外周縁Ｗｃが接触して棚部４０にウェーハＷが載置されている。例えば、ウェーハＷの裏面Ｗｂには図２に示す保護テープＴが貼着されている。 The circular wafer W shown in FIGS. 1 and 2 is curved in a centrally recessed shape by gradually warping from the center of the wafer W toward the outer peripheral edge Wc. That is, this hollowed-out curve means that when the wafer W is placed on the shelf 40 of the cassette 4 with the surface Wa facing downward, the surface Wa of the wafer W is located on the outer peripheral side from the central region thereof. It is a curve that gradually decreases toward the region. Then, the outer peripheral edge Wc of the wafer W comes into contact with the shelf 40 of the cassette 4, and the wafer W is placed on the shelf 40. For example, the protective tape T shown in FIG. 2 is attached to the back surface Wb of the wafer W.

図２に示す中凹み状に湾曲したウェーハＷの底である凹み中央Ｗｆと外周縁Ｗｃとの高さ差は、例えば、約５ｍｍとなっているが、５ｍｍより小さくてもよいし、該高さ差が約６ｍｍ〜約１０ｍｍあってもよい。
また、中凹み状に湾曲したウェーハＷの一例としては、表面Ｗａが樹脂封止されたウェーハ等がある。 The height difference between the center Wf of the recess and the outer peripheral edge Wc, which is the bottom of the wafer W curved in the shape of a center recess shown in FIG. 2, is, for example, about 5 mm, but may be smaller than 5 mm, or the height may be smaller than 5 mm. The difference may be about 6 mm to about 10 mm.
Further, as an example of the wafer W curved in a hollow shape, there is a wafer whose surface Wa is resin-sealed.

図１に示すようにロボット１は、多関節ロボットであり、ロボットハンド６を所定の位置に移動させる駆動部３を備えている。駆動部３は、例えば、長尺板状の第１のアーム３０と、長尺板状の第２のアーム３１と、Ｚ軸方向に延在するロボットハンド連結部３２と、ロボットハンド６を水平方向に旋回させるロボットハンド旋回手段３４と、第１のアーム連結部３３と、昇降機構３５とを備えている。 As shown in FIG. 1, the robot 1 is an articulated robot and includes a drive unit 3 for moving the robot hand 6 to a predetermined position. The drive unit 3 horizontally holds, for example, a long plate-shaped first arm 30, a long plate-shaped second arm 31, a robot hand connecting portion 32 extending in the Z-axis direction, and a robot hand 6. It includes a robot hand turning means 34 that turns in a direction, a first arm connecting portion 33, and an elevating mechanism 35.

ロボットハンド連結部３２には、第１のアーム３０の一端の上面が連結されている。第１のアーム３０のもう一端の下面には、第１のアーム連結部３３を介して、第２のアーム３１の一端の上面が連結されている。第２のアーム３１のもう一端の下面は、昇降機構３５の柱３５０の上端に連結されている。昇降機構３５は、例えば、ロボットハンド旋回手段３４内に収容された図示しないモータ等の昇降駆動源を備え、ロボットハンド旋回手段３４に対して柱３５０を昇降させてロボットハンド６の高さ位置を調整できる。そして、ロボットハンド旋回手段３４は、モータ等の図示しない旋回駆動源を備え旋回駆動源が生み出す回転力により回転し、昇降機構３５を旋回軸を軸として旋回させることで、ロボットハンド６を水平に旋回させている。 The upper surface of one end of the first arm 30 is connected to the robot hand connecting portion 32. The upper surface of one end of the second arm 31 is connected to the lower surface of the other end of the first arm 30 via the first arm connecting portion 33. The lower surface of the other end of the second arm 31 is connected to the upper end of the pillar 350 of the elevating mechanism 35. The elevating mechanism 35 includes, for example, an elevating drive source such as a motor (not shown) housed in the robot hand turning means 34, and raises and lowers the pillar 350 with respect to the robot hand turning means 34 to raise and lower the height position of the robot hand 6. Can be adjusted. Then, the robot hand swivel means 34 is provided with a swivel drive source (not shown) such as a motor, and rotates by the rotational force generated by the swivel drive source, and the elevating mechanism 35 is swiveled around the swivel axis to make the robot hand 6 horizontal. It is turning.

ロボットハンド連結部３２の上端側には、図１においては鉛直方向（Ｚ軸方向）に直交するＸ軸方向の軸心を有するスピンドル７０を回転可能に支持するハウジング７１が固定されている。例えばハウジング７１の内部には、スピンドル７０を回転駆動する図示しないモータが収容されている。 In FIG. 1, a housing 71 that rotatably supports a spindle 70 having an axis in the X-axis direction orthogonal to the vertical direction (Z-axis direction) is fixed to the upper end side of the robot hand connecting portion 32. For example, a motor (not shown) that rotationally drives the spindle 70 is housed inside the housing 71.

スピンドル７０の先端側はハウジング７１から−Ｘ方向に突出しており、この先端側に、ロボットハンド６の根元側が装着されるホルダ７３が配設されている。図示しないモータがスピンドル７０を回転させることに伴って、スピンドル７０にホルダ７３を介して接続されているロボットハンド６が回転して、ロボットハンド６の一面６０ａとロボットハンド６の一面６０ａの反対面６０ｂとを上下に反転させることができる。 The tip end side of the spindle 70 projects from the housing 71 in the −X direction, and a holder 73 on which the root side of the robot hand 6 is mounted is arranged on the tip end side. As the motor (not shown) rotates the spindle 70, the robot hand 6 connected to the spindle 70 via the holder 73 rotates, and the opposite surface between the one side 60a of the robot hand 6 and the one side 60a of the robot hand 6 60b can be turned upside down.

図１、２に示すロボット１に取り付け、中凹み状に湾曲したウェーハＷの凹み面（表面Ｗａ）の中央Ｗｆを吸引保持する本発明に係るロボットハンド６は、長尺平板状の基台６０と、基台６０に配設されウェーハＷの凹み面の中央Ｗｆを吸引保持する吸盤６１と、ウェーハＷを吸引保持する吸盤６１の吸着面６１０ｄを吸引源６９に連通させる連通路６２（図２のみ図示）と、を少なくとも備えている。 The robot hand 6 according to the present invention, which is attached to the robot 1 shown in FIGS. 1 and 2 and sucks and holds the center Wf of the recessed surface (surface Wa) of the wafer W curved in a central recess, is a long flat plate-shaped base 60. A suction cup 61 that is arranged on the base 60 and sucks and holds the center Wf of the recessed surface of the wafer W and a suction surface 610d of the suction cup 61 that sucks and holds the wafer W are communicated with the suction source 69 (FIG. 2). (Only shown), and at least.

基台６０は、例えば、ＳＵＳ、アルミまたはアルミナセラミックス等からなり、その先端側から図１に示すカセット４の内部に進入していく。基台６０の一面６０ａ（図１、２においては下面）の先端側の領域は、吸盤６１を装着する面となる。また、基台６０の一面６０ａは、根元側の一部を除いて平坦面となっている。 The base 60 is made of, for example, SUS, aluminum, alumina ceramics, or the like, and enters the inside of the cassette 4 shown in FIG. 1 from the tip side thereof. The region on the tip end side of one surface 60a (lower surface in FIGS. 1 and 2) of the base 60 is a surface on which the suction cup 61 is mounted. Further, one surface 60a of the base 60 is a flat surface except for a part on the root side.

基台６０の一面６０ａの根元側の領域は、例えば、略矩形状に基台６０を厚み方向（Ｚ軸方向）に切り欠いて切り欠き部６００が形成されていてもよい。該切り欠き部６００は、直径が比較的大きい中凹み状に湾曲したウェーハＷをロボットハンド６が吸引保持する場合に、ウェーハＷの反り上がった外周縁Ｗｃが入り込むことで、基台６０とウェーハＷとの接触を防ぐ役割を果す。また、切り欠き部６００を形成することで、カセット４内にロボットハンド６を進入させウェーハＷの凹み中央Ｗｆに吸盤６１を接触させるための上昇移動量を少なくできる。なお、後述する嵩上げブロック６６の枚数を増やすことで、ウェーハＷの凹み中央Ｗｆと外周縁Ｗｃとの高さ差に対応して吸盤６１の高さを調整する事ができるので、基台６０は切り欠き部６００を備えない構成となっていてもよい。 The region on the root side of one surface 60a of the base 60 may be formed by cutting the base 60 in the thickness direction (Z-axis direction) in a substantially rectangular shape, for example, to form a cutout portion 600. When the robot hand 6 sucks and holds the wafer W curved in a concave shape having a relatively large diameter, the cutout portion 600 is formed by the warped outer peripheral edge Wc of the wafer W entering the base 60 and the wafer. It plays a role of preventing contact with W. Further, by forming the notch portion 600, the amount of ascending movement for allowing the robot hand 6 to enter the cassette 4 and bringing the suction cup 61 into contact with the recessed center Wf of the wafer W can be reduced. By increasing the number of raising blocks 66, which will be described later, the height of the suction cup 61 can be adjusted according to the height difference between the recessed center Wf of the wafer W and the outer peripheral edge Wc. The configuration may not include the notch portion 600.

図２、３に示すように、例えば、基台６０の一面６０ａの先端側の領域には、基台６０の長手方向に所定の間隔を空けて複数（例えば２つ）の雌ねじ穴６０１が、厚み方向（Ｚ軸方向）に向かって形成されている。なお、雌ねじ穴６０１はさらに複数基台６０に形成されていてもよい。 As shown in FIGS. 2 and 3, for example, in the region on the tip end side of one surface 60a of the base 60, a plurality of (for example, two) female screw holes 601 are provided at predetermined intervals in the longitudinal direction of the base 60. It is formed in the thickness direction (Z-axis direction). The female screw holes 601 may be further formed in a plurality of bases 60.

例えば、基台６０の一面６０ａの先端側の領域の２つの雌ねじ穴６０１の間には、連通路６２を構成する吸引路６０３の一端が開口しており、吸引路６０３は、例えば、基台６０の内部を長手方向に延在している。
例えば、基台６０の一面６０ａの吸引路６０３の開口の周囲には、円環状のＯリング収容溝６０５が形成されている。 For example, one end of the suction path 603 forming the communication passage 62 is opened between the two female screw holes 601 in the region on the tip end side of one surface 60a of the base 60, and the suction path 603 is, for example, the base. The inside of 60 extends in the longitudinal direction.
For example, an annular O-ring accommodating groove 605 is formed around the opening of the suction path 603 on one side 60a of the base 60.

図２、３に示す吸盤６１は、例えば、変形可能なゴム等の弾性材を平面視円形状に形成したものであり、円形板状の吸盤基部６１０と、吸盤基部６１０の外周領域から徐々に拡径するように立設されたツバ状の変形部６１１とを備えている。吸盤６１において、図３に示す吸盤基部６１０の上端面（図２においては下端面）はウェーハＷを吸着する吸着面６１０ｄとなる。 The suction cup 61 shown in FIGS. 2 and 3 is formed by, for example, an elastic material such as deformable rubber formed in a circular shape in a plan view, and gradually starts from a circular plate-shaped suction cup base 610 and an outer peripheral region of the suction cup base 610. It is provided with a brim-shaped deformed portion 611 erected so as to expand the diameter. In the suction cup 61, the upper end surface (lower end surface in FIG. 2) of the suction cup base 610 shown in FIG. 3 is a suction surface 610d that attracts the wafer W.

吸盤基部６１０には、基台６０の一面６０ａに形成された雌ねじ穴６０１に対応する２つの吸盤馬鹿穴６１０ａと、基台６０の一面６０ａに形成された吸引路６０３の開口に対応する１つの吸盤吸引孔６１０ｂとがそれぞれ厚み方向（Ｚ軸方向）に貫通形成されている。なお、吸盤馬鹿穴６１０ａは、雌ねじ穴であってもよい。その際、基台６０の雌ねじ穴６０１は貫通穴で、基台６０側から固定雄ネジを貫通させ吸盤６１の雌ねじ穴に螺合させ吸盤６１との間に嵩上げブロック６６を挟んだ状態で吸盤６１を基台６０に連結させ一体化させる。 The suction cup base 610 has two suction cup stupid holes 610a corresponding to the female screw holes 601 formed on one surface 60a of the base 60 and one corresponding to the opening of the suction path 603 formed on one surface 60a of the base 60. Sucker suction holes 610b are formed through each in the thickness direction (Z-axis direction). The suction cup stupid hole 610a may be a female screw hole. At that time, the female screw hole 601 of the base 60 is a through hole, and the fixed male screw is penetrated from the base 60 side and screwed into the female screw hole of the suction cup 61, and the suction cup is sandwiched between the suction cup 61 and the raised block 66. 61 is connected to the base 60 and integrated.

本発明に係るロボットハンド６は、図２に示すように、吸着面６１０ｄでウェーハＷを吸引保持した際に、ウェーハＷの外周縁Ｗｃを含む外周部分が吸盤６１が装着された基台６０の一面６０ａに接触しないように吸盤６１を一面６０ａに対して嵩上げしている。即ち、例えば、ロボットハンド６は、吸盤６１と基台６０との間に、ウェーハＷの湾曲具合（反り具合）に応じて図２、３に示す嵩上げブロック６６を一枚又は複数枚挟んだ構成となっている。 As shown in FIG. 2, the robot hand 6 according to the present invention has a base 60 on which a suction cup 61 is mounted on an outer peripheral portion including the outer peripheral edge Wc of the wafer W when the wafer W is sucked and held by the suction surface 610d. The suction cup 61 is raised with respect to the one surface 60a so as not to come into contact with the one surface 60a. That is, for example, the robot hand 6 has one or a plurality of raised blocks 66 shown in FIGS. 2 and 3 sandwiched between the suction cup 61 and the base 60 according to the degree of curvature (warp) of the wafer W. It has become.

図２、３に示す例えば３枚が重なった状態の嵩上げブロック６６は、例えば、吸盤６１の吸盤基部６１０と略同径の円形平板状となっており、吸盤６１と基台６０との間に挟む枚数によって吸盤６１の基台６０の一面６０ａに対する嵩上げ高さを調整可能となっている。即ち、嵩上げブロック６６は、吸引保持したいウェーハＷの湾曲具合によってその数が調整される。
例えば剛性を有する素材からなる嵩上げブロック６６には、基台６０の一面６０ａに形成された雌ねじ穴６０１に対応する２つのブロック馬鹿穴６６０と、基台６０の一面６０ａに形成された吸引路６０３の開口に対応する１つのブロック吸引孔６６１とがそれぞれ厚み方向（Ｚ軸方向）に貫通形成されている。なお、ブロック馬鹿穴６６０は、雌ねじ穴であってもよい。
例えば、嵩上げブロック６６のブロック吸引孔６６１の周囲には、円環状のＯリング収容溝６６４が形成されている。 The raised block 66 shown in FIGS. 2 and 3, for example, in a state where three sheets are overlapped, has a circular flat plate shape having substantially the same diameter as the suction cup base portion 610 of the suction cup 61, and is between the suction cup 61 and the base 60. The height of the suction cup 61 with respect to one surface 60a of the base 60 can be adjusted by the number of sandwiched sheets. That is, the number of the raising blocks 66 is adjusted according to the degree of curvature of the wafer W to be suction-held.
For example, in the raised block 66 made of a rigid material, two block stupid holes 660 corresponding to the female screw holes 601 formed on one surface 60a of the base 60 and a suction path 603 formed on one surface 60a of the base 60. One block suction hole 661 corresponding to the opening of is formed through in the thickness direction (Z-axis direction). The block idiot hole 660 may be a female screw hole.
For example, an annular O-ring accommodating groove 664 is formed around the block suction hole 661 of the raised block 66.

図２に示すようにロボットハンド６を中凹み状に湾曲したウェーハＷの凹み中央Ｗｆを吸引保持可能な状態に組み立てるには、図３に示すように、基台６０側から順に、基台６０に形成された２つの雌ねじ穴６０１と、所定枚数（図３においては３枚）の各嵩上げブロック６６に形成された２つのブロック馬鹿穴６６０と、吸盤６１に形成された吸盤馬鹿穴６１０ａとが重なるように位置合わせする。 As shown in FIG. 2, in order to assemble the robot hand 6 so that the recessed center Wf of the wafer W curved in the shape of a central recess can be sucked and held, as shown in FIG. 3, the base 60 is sequentially assembled from the base 60 side. Two female screw holes 601 formed in the above, two block idiot holes 660 formed in each of a predetermined number of raised blocks 66 (three in FIG. 3), and a suction cup idiot hole 610a formed in the suction cup 61. Align so that they overlap.

さらに、基台６０のＯリング収容溝６０５にゴム等からなり円環状のＯリング６７を入れ込み、嵩上げブロック６６のＯリング収容溝６６４にＯリング６７を入れ込む。さらに、吸盤６１に形成された吸盤馬鹿穴６１０ａから図３に示す固定雄ねじ６８を挿入し嵩上げブロック６６のブロック馬鹿穴６６０を通してから、基台６０の雌ねじ穴６０１に螺合することにより、基台６０、嵩上げブロック６６、及び吸盤６１を一体化させることができる。即ち、吸盤６１が基台６０の一面に対して嵩上げされた状態で装着された状態になる。なお、固定雄ねじ６８のねじ頭が、吸盤６１の吸盤基部６１０に埋め込まれた状態になり、吸着面６１０ｄから突き出ていない状態になる。 Further, an annular O-ring 67 made of rubber or the like is inserted into the O-ring accommodating groove 605 of the base 60, and the O-ring 67 is inserted into the O-ring accommodating groove 664 of the raising block 66. Further, the fixing male screw 68 shown in FIG. 3 is inserted from the suction cup stupid hole 610a formed in the suction cup 61, passed through the block stupid hole 660 of the raising block 66, and then screwed into the female screw hole 601 of the base 60 to form the base. The 60, the raising block 66, and the suction cup 61 can be integrated. That is, the suction cup 61 is mounted in a raised state with respect to one surface of the base 60. The screw head of the fixed male screw 68 is embedded in the suction cup base 610 of the suction cup 61, and does not protrude from the suction surface 610d.

また、吸盤６１の吸盤吸引孔６１０ｂ、嵩上げブロック６６のブロック吸引孔６６１、及び基台６０の吸引路６０３が連通して構成される連通路６２（図２参照）が形成される。吸引路６０３の他端は、基台６０を装着するホルダ７３内に形成されたホルダ吸引路７３０に連通している。例えば、図２に示すホルダ７３のホルダ吸引路７３０には、ロボットハンド６の旋回移動を妨げないように可撓性を備える樹脂チューブ６９０が、図示しない継手等を介して連通している。そして、樹脂チューブ６９０のもう一端側には、真空発生装置、又はエジェクター機構等の吸引源６９に接続されている。そのため、吸引源６９が作動することで生み出される吸引力が連通路６２を通り、吸盤６１の吸着面６１０ｄに伝達される。 Further, a communication passage 62 (see FIG. 2) is formed in which the suction cup suction hole 610b of the suction cup 61, the block suction hole 661 of the raising block 66, and the suction path 603 of the base 60 are communicated with each other. The other end of the suction path 603 communicates with the holder suction path 730 formed in the holder 73 on which the base 60 is mounted. For example, a resin tube 690 having flexibility so as not to hinder the turning movement of the robot hand 6 communicates with the holder suction path 730 of the holder 73 shown in FIG. 2 via a joint (not shown) or the like. Then, the other end side of the resin tube 690 is connected to a suction source 69 such as a vacuum generator or an ejector mechanism. Therefore, the suction force generated by the operation of the suction source 69 passes through the communication passage 62 and is transmitted to the suction surface 610d of the suction cup 61.

また、基台６０のＯリング収容溝６０５に入れ込まれたＯリング６７は、嵩上げブロック６６によって押圧されてＯリング収容溝６０５内で変形し、また、嵩上げブロック６６のＯリング収容溝６６４に入れ込まれたＯリング６７は、他の嵩上げブロック６６又は吸盤６１によって押圧されてＯリング収容溝６６４内で変形する。その結果、各Ｏリング６７によって、吸盤６１から基台６０内までの連通路６２の密閉性が向上する。 Further, the O-ring 67 inserted into the O-ring accommodating groove 605 of the base 60 is pressed by the raising block 66 and deformed in the O-ring accommodating groove 605, and also becomes the O-ring accommodating groove 664 of the raising block 66. The inserted O-ring 67 is pressed by another raising block 66 or a suction cup 61 and deforms in the O-ring accommodating groove 664. As a result, each O-ring 67 improves the airtightness of the communication passage 62 from the suction cup 61 to the inside of the base 60.

以下に、図１に示すロボット１によりカセット４に裏面Ｗｂが上側を向いた状態で収容されているウェーハＷを搬出する場合の、ロボットハンド６の動作について説明する。なお、ロボット１のロボットハンド６により吸引保持されるウェーハＷは、カセット４に収容された状態になっていなくてもよい。
まず、図１に示すロボット１が昇降機構３５によってＺ軸方向に移動されて、ロボットハンド６とカセット４内の狙いのウェーハＷとのＺ軸方向における位置合わせが行われる。また、図示しないモータがスピンドル７０を回転させ、ロボットハンド６の吸盤６１が上側を向いた状態にセットされる。 The operation of the robot hand 6 will be described below when the robot 1 shown in FIG. 1 carries out the wafer W housed in the cassette 4 with the back surface Wb facing upward. The wafer W sucked and held by the robot hand 6 of the robot 1 does not have to be housed in the cassette 4.
First, the robot 1 shown in FIG. 1 is moved in the Z-axis direction by the elevating mechanism 35, and the robot hand 6 and the target wafer W in the cassette 4 are aligned in the Z-axis direction. Further, a motor (not shown) rotates the spindle 70, and the suction cup 61 of the robot hand 6 is set so as to face upward.

また、駆動部３がロボットハンド６を旋回させて、ロボットハンド６が開口４ｅからカセット４の内部の所定の位置まで進入していく。すなわち、図２、４に示すように、吸盤６１が、棚部４０（図２には不図示）上に裏面Ｗｂを上側を向けて載置されているウェーハＷの表面Ｗａの凹み中央Ｗｆの下方に位置するようにロボットハンド６が位置づけられる。 Further, the drive unit 3 turns the robot hand 6, and the robot hand 6 enters from the opening 4e to a predetermined position inside the cassette 4. That is, as shown in FIGS. 2 and 4, the suction cup 61 is placed on the shelf portion 40 (not shown in FIG. 2) on the recessed center Wf of the front surface Wa of the wafer W on which the back surface Wb is placed with the back surface Wb facing upward. The robot hand 6 is positioned so as to be located below.

次いで、図２、４に示すロボットハンド６が上昇して、ウェーハＷの表面Ｗａの凹み中央Ｗｆに吸盤６１を接触させる。吸盤６１の変形部６１１はウェーハＷの凹み中央Ｗｆの小さな湾曲に沿って変形することで、凹み中央Ｗｆとの接触面積が最大化され、吸盤６１の吸盤基部６１０の吸着面６１０ｄが凹み中央Ｗｆに接触する。なお、変形部６１１の傾斜している内側面のみがウェーハＷの凹み中央Ｗｆに接触した状態となってもよい。 Next, the robot hand 6 shown in FIGS. 2 and 4 is raised to bring the suction cup 61 into contact with the recessed center Wf of the surface Wa of the wafer W. The deformed portion 611 of the suction cup 61 is deformed along a small curve of the recessed center Wf of the wafer W to maximize the contact area with the recessed center Wf, and the suction surface 610d of the suction cup base 610 of the suction cup 61 is recessed at the center Wf. Contact. In addition, only the inclined inner side surface of the deformed portion 611 may be in contact with the recessed center Wf of the wafer W.

吸引源６９が作動して生み出された吸引力が、連通路６２を通り吸盤６１の吸着面６１０ｄまで伝達され、吸盤６１がウェーハＷの凹み中央Ｗｆを吸着することで、ロボットハンド６によりウェーハＷが吸引保持される。ここで、ウェーハＷの外周縁Ｗｃを含む外周部分が吸盤６１を装着する基台６０の一面６０ａに接触しないように、例えば３枚の嵩上げブロック６６によって吸盤６１を一面６０ａに対して嵩上げしていることで、中凹み状のウェーハＷの反り上がった外周部分が基台６０に接触すること無くなり、ロボットハンド６がウェーハＷの凹み中央Ｗｆを吸引保持できる。 The suction force generated by the operation of the suction source 69 is transmitted to the suction surface 610d of the suction cup 61 through the communication passage 62, and the suction cup 61 sucks the recessed center Wf of the wafer W, so that the wafer W is sucked by the robot hand 6. Is sucked and held. Here, the suction cup 61 is raised with respect to the one surface 60a by, for example, three raising blocks 66 so that the outer peripheral portion including the outer peripheral edge Wc of the wafer W does not come into contact with the one surface 60a of the base 60 on which the suction cup 61 is mounted. As a result, the curved outer peripheral portion of the recessed wafer W does not come into contact with the base 60, and the robot hand 6 can suck and hold the recessed center Wf of the wafer W.

図１に示す昇降機構３５でロボットハンド６を上昇させ、ロボットハンド６に吸引保持されるウェーハＷの外周縁Ｗｃが棚部４０上から離間された高さで昇降機構３５を停止させ、ウェーハＷを吸引保持したロボットハンド６が図１に示す駆動部３の第１のアーム３０によって＋Ｙ方向に移動し、ウェーハＷがロボットハンド６によりカセット４から搬出される。そして、例えば、ウェーハＷの表面Ｗａの凹み中央Ｗｆをロボットハンド６で適切に吸引保持した状態で、スピンドル７０を回転させウェーハＷを上下反転させて、表面Ｗａを上側に向けた状態で図示しない加工装置の仮置きテーブル等に搬送する。
なお、仮置きテーブルに搬送されたウェーハＷを位置決めさせ、研削装置等の加工装置のチャックテーブルに搬送手段で搬送させ、加工手段でウェーハＷを加工させる。そのため、搬送手段は、ウェーハＷの表面Ｗａの凹み中央Ｗｆを吸引保持してチャックテーブルに搬送させる。また、チャックテーブルでは、ウェーハＷの湾曲を平坦化させ、チャックテーブルの保持面を吸引源に連通させウェーハＷを倣わせて保持させる。
なお、例えば研削され湾曲していない平坦化されたウェーハＷを、本ロボットハンド６で保持させカセット４に湾曲していないウェーハＷを収容させてもよい。 The robot hand 6 is raised by the elevating mechanism 35 shown in FIG. 1, and the elevating mechanism 35 is stopped at a height at which the outer peripheral edge Wc of the wafer W attracted and held by the robot hand 6 is separated from the shelf 40, and the wafer W is stopped. The robot hand 6 that sucks and holds the wafer is moved in the + Y direction by the first arm 30 of the drive unit 3 shown in FIG. 1, and the wafer W is carried out from the cassette 4 by the robot hand 6. Then, for example, in a state where the recessed center Wf of the surface Wa of the wafer W is appropriately sucked and held by the robot hand 6, the spindle 70 is rotated to invert the wafer W upside down, and the surface Wa is not shown in the upward state. Transport to a temporary table or the like of the processing equipment.
The wafer W transported to the temporary table is positioned, transported to the chuck table of a processing device such as a grinding device by a transport means, and the wafer W is machined by the processing means. Therefore, the conveying means sucks and holds the recessed center Wf of the surface Wa of the wafer W and conveys it to the chuck table. Further, in the chuck table, the curvature of the wafer W is flattened, and the holding surface of the chuck table is communicated with the suction source to imitate and hold the wafer W.
For example, the flattened wafer W that has been ground and is not curved may be held by the robot hand 6 and the non-curved wafer W may be accommodated in the cassette 4.

本発明に係るロボットハンド６は上記実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。また、添付図面に図示されているロボット１やカセット４の各構成の形状等についても、これに限定されず、本発明に係るロボットハンド６の効果を発揮できる範囲内で適宜変更可能である。 Needless to say, the robot hand 6 according to the present invention is not limited to the above-described embodiment, and may be implemented in various different forms within the scope of its technical idea. Further, the shape and the like of each configuration of the robot 1 and the cassette 4 shown in the attached drawings are not limited to this, and can be appropriately changed within a range in which the effect of the robot hand 6 according to the present invention can be exhibited.

Ｗ：中凹み状に湾曲したウェーハ Ｗａ：ウェーハの表面 Ｗｂ：ウェーハの裏面 Ｗｃ：ウェーハの外周縁 Ｗｆ：ウェーハの凹み中央 Ｔ：保護テープ
４：カセット ４０：棚部
１：ロボット
３：駆動部 ３０：第１のアーム ３１：第２のアーム ３２：ロボットハンド連結部
３３：第１のアーム連結部 ３４：ロボットハンド旋回手段 ３５：昇降機構
７０：スピンドル ７１：ハウジング ７３：ホルダ ７３０：ホルダ吸引路
６：ロボットハンド
６０：基台 ６０ａ：基台の一面 ６００：切り欠き部 ６０１：雌ねじ穴 ６０３：吸引路 ６０５：Ｏリング収容溝
６１：吸盤 ６１０：吸盤基部 ６１０ａ：吸盤馬鹿穴 ６１０ｂ：吸盤吸引孔 ６１０ｄ：吸着面 ６１１：変形部
６２：連通路
６６：嵩上げブロック ６６０：ブロック馬鹿穴 ６６１：ブロック吸引孔 ６６４：Ｏリング収容溝
６９：吸引源 ６９０：樹脂チューブ W: Wafer curved in a hollow shape Wa: Wafer front surface Wb: Wafer back surface Wc: Wafer outer peripheral edge Wf: Wafer dent center T: Protective tape 4: Cassette 40: Shelf 1: Robot 3: Drive unit 30 : 1st arm 31: 2nd arm 32: Robot hand connecting part
33: First arm connecting part 34: Robot hand swivel means 35: Elevating mechanism 70: Spindle 71: Housing 73: Holder 730: Holder suction path 6: Robot hand 60: Base 60a: One side of base 600: Notch Part 601: Female screw hole 603: Suction path 605: O-ring accommodating groove 61: Sucker 610: Sucker base 610a: Sucker stupid hole 610b: Sucker suction hole 610d: Suction surface 611: Deformed part
62: Communication passage 66: Raised block 660: Block stupid hole 661: Block suction hole 664: O-ring accommodating groove 69: Suction source 690: Resin tube

Claims (1)

ロボットに取り付け、中凹み状に湾曲したウェーハの凹み中央を吸引保持するロボットハンドであって、
長尺平板状の基台と、該基台に配設されウェーハの凹み中央を吸引保持する吸盤と、ウェーハを吸引保持する該吸盤の吸着面を吸引源に連通させる連通路と、を備え、
該吸着面でウェーハを吸引保持した際に、ウェーハの外周部分が該吸盤が装着された該基台の一面に接触しないように該吸盤を該一面に対して嵩上げしているロボットハンド。 A robot hand that is attached to a robot and sucks and holds the center of the recess of a wafer that is curved like a hollow.
It is provided with a long flat plate-shaped base, a suction cup arranged on the base for sucking and holding the center of the recess of the wafer, and a communication passage for communicating the suction surface of the suction cup for sucking and holding the wafer to the suction source.
A robot hand that raises the suction cup with respect to one surface of the base on which the suction cup is mounted so that the outer peripheral portion of the wafer does not come into contact with one surface of the base on which the suction cup is mounted when the wafer is sucked and held by the suction surface.
JP2019109423A 2019-06-12 2019-06-12 robot hand Active JP7396815B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019109423A JP7396815B2 (en) 2019-06-12 2019-06-12 robot hand
KR1020200063071A KR20200142454A (en) 2019-06-12 2020-05-26 Robot hand
CN202010493080.4A CN112077830A (en) 2019-06-12 2020-06-03 Robot arm
TW109119422A TWI836093B (en) 2019-06-12 2020-06-10 Robot arm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019109423A JP7396815B2 (en) 2019-06-12 2019-06-12 robot hand

Publications (2)

Publication Number Publication Date
JP2020202324A true JP2020202324A (en) 2020-12-17
JP7396815B2 JP7396815B2 (en) 2023-12-12

Family

ID=73735001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019109423A Active JP7396815B2 (en) 2019-06-12 2019-06-12 robot hand

Country Status (3)

Country Link
JP (1) JP7396815B2 (en)
KR (1) KR20200142454A (en)
CN (1) CN112077830A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230087386A (en) 2021-12-09 2023-06-16 가부시기가이샤 디스코 Robot hand

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077068A (en) * 1993-06-18 1995-01-10 Hitachi Electron Eng Co Ltd Structure of wafer placing stage and chuck hand
JPH08236597A (en) * 1995-02-27 1996-09-13 Hitachi Ltd Transfer device
JP2001319960A (en) * 2000-05-10 2001-11-16 Seiko Epson Corp Transfer device, substrate transfer method and manufacturing method of electrooptical device
JP2003077988A (en) * 2001-09-06 2003-03-14 Nitto Denko Corp Semiconductor wafer mounting method and cassette used therefor
JP2007324169A (en) * 2006-05-30 2007-12-13 Nikon Corp Carrying arm, substrate carrier, and substrate inspection apparatus
JP2018006595A (en) * 2016-07-04 2018-01-11 株式会社ディスコ Processing apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200303593A (en) * 2002-02-19 2003-09-01 Olympus Optical Co Substrate sucking apparatus
JP2004055833A (en) * 2002-07-19 2004-02-19 Fujitsu Ltd Device for absorbing thin-plate like member
JP5989416B2 (en) 2012-06-20 2016-09-07 株式会社ディスコ Robot hand
US9355882B2 (en) 2013-12-04 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Transfer module for bowed wafers
JP2015204420A (en) * 2014-04-15 2015-11-16 株式会社ディスコ Conveying device for tabular object, and cutting device
JP6581436B2 (en) 2015-08-25 2019-09-25 株式会社ディスコ Robot hand
JP6853646B2 (en) * 2016-10-04 2021-03-31 株式会社ディスコ Robot hand and transfer robot

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077068A (en) * 1993-06-18 1995-01-10 Hitachi Electron Eng Co Ltd Structure of wafer placing stage and chuck hand
JPH08236597A (en) * 1995-02-27 1996-09-13 Hitachi Ltd Transfer device
JP2001319960A (en) * 2000-05-10 2001-11-16 Seiko Epson Corp Transfer device, substrate transfer method and manufacturing method of electrooptical device
JP2003077988A (en) * 2001-09-06 2003-03-14 Nitto Denko Corp Semiconductor wafer mounting method and cassette used therefor
JP2007324169A (en) * 2006-05-30 2007-12-13 Nikon Corp Carrying arm, substrate carrier, and substrate inspection apparatus
JP2018006595A (en) * 2016-07-04 2018-01-11 株式会社ディスコ Processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230087386A (en) 2021-12-09 2023-06-16 가부시기가이샤 디스코 Robot hand

Also Published As

Publication number Publication date
JP7396815B2 (en) 2023-12-12
CN112077830A (en) 2020-12-15
KR20200142454A (en) 2020-12-22
TW202045325A (en) 2020-12-16

Similar Documents

Publication Publication Date Title
JP5543813B2 (en) Work transfer method and work transfer device
JP6705668B2 (en) Die bonding apparatus and semiconductor device manufacturing method
KR102465718B1 (en) Method for picking up individually divided chips from chip storage tray
CN108346585B (en) Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
TWI681481B (en) Array device and method
JP4256132B2 (en) Plate-shaped material transfer device
JP2019153761A5 (en)
JP2020202324A (en) Robot hand
JP6581436B2 (en) Robot hand
JP6202962B2 (en) Cutting equipment
JP2002270674A (en) Carry-out device
JP7303635B2 (en) Work holding method and work processing method
JP4119170B2 (en) Chuck table
TW202226445A (en) Tape mounter
TWI836093B (en) Robot arm
JP7408244B2 (en) Chuck table, table base, and chuck table fixing mechanism
JP7386026B2 (en) Substrate processing method and substrate processing apparatus
JPH07183334A (en) Flip chip bonder
WO2021100185A1 (en) Component mounting system, component feeder, and component mounting method
JP5060273B2 (en) Electronic component peeling device
JP6907384B1 (en) Pickup device
JP2003303874A (en) Carrying apparatus for semiconductor wafer
JP2023085799A (en) robot hand
JP2021132181A (en) Processing apparatus
KR20210128336A (en) Wafer producing apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220428

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20230210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230420

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230801

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230803

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231130

R150 Certificate of patent or registration of utility model

Ref document number: 7396815

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150