CN108183084A - Vacuum suction nozzle component - Google Patents
Vacuum suction nozzle component Download PDFInfo
- Publication number
- CN108183084A CN108183084A CN201711457674.4A CN201711457674A CN108183084A CN 108183084 A CN108183084 A CN 108183084A CN 201711457674 A CN201711457674 A CN 201711457674A CN 108183084 A CN108183084 A CN 108183084A
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- Prior art keywords
- chip
- contact
- vacuum
- force generator
- sucking force
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of vacuum suction nozzle components, including Non-contact vacuum sucking force generator, are used to generate suction, in the case of not contact object, to pick up and place the object；And position-limit mechanism, it is connect with the Non-contact vacuum sucking force generator, when the Non-contact vacuum sucking force generator generates suction to pick up the object, the position of the object is limited by the edge for contacting the object.The vacuum suction nozzle component can be picked up in the case of the upper surface of not contact chip and chip placement, and can in pickup fixed chip position in order to being directed at the respective chip placement region in pallet, it is possibly realized so that relying solely on operating personnel and backfilling chip by hand, this does not need to the exceptional space for having for pickup on chip not only, chip will not be damaged, placement alignment precision is also increased simultaneously, cost and flow processing time is saved, reduces the quantity of operating personnel.
Description
Technical field
The present invention relates to vacuum slot fields, more particularly, to pick up with placing objects to transport the vacuum slot of object
Component.
Background technology
In electronic industry, needed in such as chip package and test process same to the multiple chips being placed on pallet
Shi Jinhang is operated.If for example, finding that some chip on pallet has flaw by Manual Visual Inspection, need to move from pallet
Except the chip, and intact chip is backfilling into the corresponding position in pallet, in order to follow-up process and standardization.
On the one hand, removing tool chip defective by hand is possible, but since chip is increasingly frivolous and is miniaturized,
By operating personnel directly with hand backfill intact chip may contact chip upper surface, fragile chip, also, in operator
Member may be inaccurate when chip to be backfilling into the position on pallet by hand, and then further damages chip, therefore be not allow
's.
On the other hand, it is also contemplated that backfilling chip by hand using standard vacuum suction nozzle, but existing standard vacuum is inhaled
Mouth also needs the upper surface of contact chip, and can contact space to pick up chip on current chip by vacuum slot very
It is limited.Also, even with standard vacuum suction nozzle by hand backfill, there are still backfill when may place inaccuracy the problem of.Separately
Outside, no matter use according to above-mentioned back-filling way in terms of which, can all apply certain power in chip surface, and this may be caused
The warpage of chip.
In another aspect, it can also use chip mounter that intact chip is backfilling into the corresponding position on pallet.But consider
To the price of chip mounter, cost can be increased by doing so；Further, since operation chip mounter is needed to be backfilled, which increases places
The time is managed, and needs additional operating personnel.
Invention content
The present invention provides a kind of vacuum suction nozzle component and its manufacturing method and a kind of pickup and place tool, can be
Not in the case of the upper surface of contact chip pickup and chip placement, and can pickup when fixed chip position in order to
The respective chip placement region being aligned in pallet, is possibly realized so that relying solely on operating personnel and backfilling chip by hand, this
The exceptional space for having for pickup on chip is not needed to not only, will not damage chip, while also improve placement alignment precision,
Cost and flow processing time are saved, reduces the quantity of operating personnel.
According to one embodiment of present invention, a kind of vacuum suction nozzle component is provided, including Non-contact vacuum suction
Generating means is used to generate suction, in the case of not contact object, to pick up and place the object；And position restrainer
Structure is connect with the Non-contact vacuum sucking force generator, and suction is generated in the Non-contact vacuum sucking force generator
When power is to pick up the object, the position of the object is limited by the edge for contacting the object.
According to still a further embodiment, a kind of pickup and place tool are provided, including tracheae, conveying is used for and adds
The gas of pressure；Gas flow controller is connected with the tracheae, for controlling the gas of the pressurization provided from the tracheae
Amount；Vacuum suction nozzle component according to an embodiment of the invention has in the Non-contact vacuum sucking force generator
The stomata of upper setting；And connector, between the gas flow controller and the vacuum suction nozzle component, for connecting
Tracheae and the stomata are stated, to supply the gas of the pressurization to the Non-contact vacuum sucking force generator by the tracheae
Body.
According to each embodiment of the invention described above, on the one hand, vacuum suction nozzle component of the invention includes contactless
Pull of vacuum generating means is generated in the suction that the object can be picked up not in the case of contact object.With regard to chip
Speech does not need to the upper surface of contact chip, therefore, there is no need to the exceptional space for having for picking up chip on chip, Bu Huiyin
The power for acting on chip surface causes chip to generate warpage.On the other hand, vacuum suction nozzle component of the invention further comprises limiting
Mechanism when Non-contact vacuum sucking force generator gets up acquiring object, is limited pair by the edge of contact object
The position of elephant.In the case of position of the edge of the only object of contact such as chip to limit object, core can not only be prevented
The displacement of piece, convenient for alignment pallet on will chip placement position, while will not contact chip surface, avoid in chip
Circuit damage.Furthermore the alignment precision of chip placement is increased due to the use of position-limit mechanism, also avoids putting due to chip
Chip caused by putting inaccurate possibility damages.
Description of the drawings
Fig. 1 is a kind of internal structure chart of Non-contact vacuum sucking force generator；
Fig. 2 be air-flow in the internal flow of Non-contact vacuum sucking force generator to form the stereogram of swirling eddy；
Fig. 3 is the schematic diagram by Non-contact vacuum sucking force generator pickup object；
Fig. 4 shows the position-limit mechanism in vacuum suction nozzle component according to an embodiment of the invention；
Fig. 5 shows vacuum suction nozzle component according to an embodiment of the invention；
Fig. 6 shows pickup and the place tool for including vacuum suction nozzle component according to one embodiment of present invention；And
Fig. 7 shows the manufacturing method flow of vacuum suction nozzle component according to an embodiment of the invention.
Various aspects and features of the invention are described with reference to above-mentioned attached drawing.The same or similar drawing reference numeral of generally use
To represent same or similar component.Above-mentioned attached drawing is only schematical, and not restrictive.Do not departing from the present invention's
In the case of purport, the size of all parts, shape, label or appearance can change in above-mentioned attached drawing, without quilt
It is restricted to be merely illustrative as shown by book attached drawing.
Specific embodiment
Illustrate each embodiment, feature and the effect of the present invention referring especially to chip below.Although using chip as
Object illustrates various aspects of the invention, it should be understood that this is not as the limitation to technical scheme of the present invention.As long as energy
Enough suction is enough provided, the vacuum suction nozzle component of the embodiment of the present invention and pickup and place tool can be used in pickup and appoint
The object of what type, especially needs the object picked up, this is including but not limited to various in electronic industry and/or optical industry
Integrated circuit, chip, circuit board, semiconductor and liquid crystal display panel, and corresponding effect can be obtained in corresponding field.
Fig. 1 is a kind of internal structure chart of Non-contact vacuum sucking force generator 10.Fig. 2 shows air-flow non-contact
10 internal flow of formula pull of vacuum generating means is to form the stereogram of swirling eddy.Non-contact vacuum sucking force generator 10
With main body, stomata 11 is set in main body, stomata 11 is opposite with formed in the body interior two by inlet channel
Channel 12,13 connect, as gas-pressurized F, such as oil-free air, filled via stomata 11 into Non-contact vacuum suction
After putting 10 inside, this two passes 12 and 13 guides gas F along their quick flowings respectively, is sent out by Non-contact vacuum suction
The gas vent of generating apparatus 10 is blown out along two opposite directions, and swirling eddy is generated in the lower section of gas vent, so as to
Negative pressure is generated on object to be picked up and forms suction.
Fig. 3 more clearly shows the schematic diagram that object is picked up by Non-contact vacuum sucking force generator 10.Wherein
Object 14 can be chip.Chip 14 is placed on pallet 15, when gas-pressurized F flows into Non-contact vacuum by stomata 11
After sucking force generator 10, it is guided quickly to flow along two opposite channels 12 and 13, so as to generate in gas vent
Swirling eddy, and then generate negative pressure in the top of chip 14, enabling the suction of pickup chip 14 is generated, by the arrow in Fig. 3
Head A shows the direction for generating negative pressure.
According to the General Principle for non-contactly picking up object, in Non-contact vacuum sucking force generator 10 with non-contact side
After formula picks up chip, with the rising of chip 14, when the pressure differential of the upper and lower surface of chip 14, (i.e. chip 14 is floating
Power) when reaching balance with the gravity of chip 14, chip 14 is maintained at the spy of 10 lower section of Non-contact vacuum sucking force generator
Place is put in positioning.Non-contact vacuum sucking force generator can be in the situation of not contact chip 14, by chip 14 from pallet as a result,
It is picked up on 15.As long as keep the supply of gas-pressurized, it will be able to transport chip in this way to new placement region.When
When needing chip placement 14, it is thus only necessary to stop or reduce supply pressurized gas F.Pull of vacuum generating means 10 usually carries
For the suction between 5psi to 20psi, to pick up chip.
The Non-contact vacuum sucking force generator 10 shown in Fig. 1-3 be based on bernoulli principle in not contact chip in itself
In the case of pick up chip 14.However, this is not unique realization method.It is also contemplated that it is inhaled using Cyclonic Non-contact vacuum
Power generating means.Wherein, the gas of pressurization is introduced tangentially into flux chamber, run business into strong one circumnutation in intracavitary, due to centrifugal force
Effect, and negative pressure is generated thereunder, and then generates the suction for object.
With standard vacuum suction nozzle by sucker contact chip surface and by discharging the air in air bag, being produced via sucker
The raw negative pressure acted directly on chip is compared to pick up chip, and the vacuum suction nozzle component of the embodiment of the present invention has used above-mentioned
Non-contact vacuum sucking force generator picks up core acting the negative pressure in chip by generating swirling eddy
Piece, when the buoyancy and gravity of chip reach balance, chip can be tieed up in the case where not contacting pull of vacuum generating means
Hold the specific location below pull of vacuum generating means.Due to not needing to contact chip surface, do not need on chip
With for picking up the exceptional space of chip, chip will not be caused to damage.
The vacuum suction nozzle component of the embodiment of the present invention further includes and above-mentioned Non-contact vacuum sucking force generator 10 1
The position-limit mechanism used is acted, which connect with pull of vacuum generating means 10.It is filled in Non-contact vacuum suction
When putting 10 generation suction to pick up chip, which can limit the skyborne position of chip by the edge of contact chip
It puts, more particularly along the lateral position of chip surface.Specifically, when Non-contact vacuum sucking force generator 10 is used to pick up
During chip, in addition to the pressure differential (i.e. the buoyancy of chip 14) of the upper and lower surface of chip 14 described above and the gravity of chip 14,
The power that chip 14 will also be acted on chip by position-limit mechanism, when the buoyancy of chip, gravity and position-limit mechanism and chip edge
When power mutually balances caused by contact, chip is maintained at position-limit mechanism, so as to limit the movement of chip.In general,
In the vacuum suction nozzle component of the embodiment of the present invention, the buoyancy for acting on chip of the generation of Non-contact vacuum sucking force generator 10
Not less than the gravity of chip itself.
The size of position-limit mechanism and chip matches.In pickup other objects in addition to the chip, position-limit mechanism also with
The size matching of the object.As long as it is matched with object size, and when Non-contact vacuum sucking force generator picks up object
The position of object can be limited by the edge of contact object, then position-limit mechanism can be shaped to any shape.In a reality
Apply in example, position-limit mechanism can be around Non-contact vacuum sucking force generator gas vent set a plurality of limiting plate or
Person's gag lever post, a plurality of limiting plate or gag lever post can be centered around the gas outlet and generate the direction of negative pressure along same
Angle extends outwardly setting.In this way, from one end far from the gas vent to one end close to the gas vent, in difference
At position, a plurality of limiting plate or gag lever post can limit the same shape of multiple and different sizes jointly, thus when non-contact
Formula pull of vacuum generating means generate suction when, can by the edge of contact object at different locations limit different size but
Any one in object with same shape.
In a further embodiment, a plurality of limiting plate or gag lever post can surround generate the direction of negative pressure circumferentially or
The rectangular setting of person can limit the position of different size of round or rectangular object in this way.Also, it is contemplated that relative to pick up
The shape and/or size of the object taken sets the shape of position-limit mechanism, size and set-up mode.
For chip, by the only edge of contact chip when picking up chip, limited without contact chip surface
The position of chip has picked up chip in the case of this additional pickup space on chip surface is not needed to, has limited chip
Displacement, in chip placement, on personnel's manual-alignment pallet easy to operation will chip placement placement region.
Fig. 4 shows the position-limit mechanism 20 in vacuum suction nozzle component according to an embodiment of the invention.In the limiting
In mechanism 20, using second surface 28 described further below as stop surface, core is limited by the edge of contact chip
The position of piece.Position-limit mechanism 20 in Fig. 4 specifically includes hollow fixed frame 21 and for fixed frame 21 to be connect with non-
Multiple attachment devices 22 that touch pull of vacuum generating means 10 links together.Although four attachment devices are shown in Fig. 4
22, but this is not limiting, and any other quantity is also feasible.Attachment device 22 is prolonged from an end face of fixed frame 21
It stretches, first end is connect with fixed frame 21, and second end is connect with Non-contact vacuum sucking force generator 10.21 He of fixed frame
One or more of attachment devices 22 jointly limit a space S, when one or more of attachment devices 22 with it is contactless
When pull of vacuum generating means 10 connects, Non-contact vacuum sucking force generator 10 can generate suction in the space S, from
And such as chip pickup is arrived in the space S.
When operating personnel need the chip having picked up is placed into specific region when, be for example backfilling into it is specific on pallet
During region, which can match with the specific region, consequently facilitating operating personnel are aligned.Preferably, this is fixed
The inside of frame 21 is provided with positioning region 23, can be shaped as pattern as shown in Figure 4.It alternatively, can also be in fixed frame
With setting positioning region 23 on the bottom surface of the EDGE CONTACT of the specific region on 21.Positioning region 23 and the specific region of chip placement
The positioning region of edge matches, so as to which fixed frame 21 is fixed to the specific region.In this way, operating personnel once will
Fixed frame 21 is fixed to alignment specific region, is achieved that the chip of pickup and the autoregistration of placement region.As long as by cutting
Supply that is disconnected or reducing gas-pressurized, due to gravity, it will be able to so that having picked up and being maintained in space S
Chip falls on the specific region, without artificial vision is directed at chip and the specific region.
In one embodiment, can pickup and placement be controlled by the thickness D of fixed frame used in selection 21
The height of chip.In general, fixed frame 21 has the thickness less than 3 millimeters in pickup and placement direction.It is blocked up it is possible that damage
Hinder chip.
Attachment device 22 in Fig. 4 is specifically shaped to four clamping parts.It is expected that the quantity of the clamping part can be less than
Four or more than four.Each clamping part is provided with first prominent into space S in the first end close to fixed frame 21
Divide 24, each first part 24 has first surface 27 and second surface 28.It is inhaled when by each component of Fig. 4 and Non-contact vacuum
When power generating means 10 assembles, which can be supported on first surface 27.When Fig. 4 institutes
The fixed mechanism 20 shown fits together with Non-contact vacuum sucking force generator 10 and forms 30 (such as Fig. 5 of vacuum suction nozzle component
It is shown) when, second surface 28 has the certain angle relative to the direction for generating negative pressure, is filled in Non-contact vacuum suction
The position of the chip is limited when putting 10 generation suction pickup chip.In this embodiment, the second surface 28 of first part 24
With the function of being restricted chip position.
Fig. 5 shows the schematic diagram of vacuum suction nozzle component 30 according to an embodiment of the invention.Wherein, it is contactless true
Empty sucking force generator 10 is connect with position-limit mechanism 20 as shown in Figure 4.As seen from Figure 5, Non-contact vacuum suction fills
It puts 10 to be supported on the first surface 27 of each first part 24, and in addition to first part 24, each clamping part 22 is also set
Be equipped with opposite with first part 24 one end setting second part 26 and connect the of first part 24 and second part 26
Three parts 25, second part 26 and first part 24 are used for Non-contact vacuum sucking force generator 10 in 26 He of second part
Clamping between the first surface 27 of first part 24.Part III 25 has clamping surface, when Non-contact vacuum suction occurs
Device 10 between second part 26 and the first surface of first part 24 27 during clamping, the surface of Part III 25 with it is non-contact
The surface engagement of formula pull of vacuum generating means 10.In one embodiment, which is capable of providing in the horizontal direction
The upper power for clamping Non-contact vacuum sucking force generator 10.If the clamping surface of Part III 25 is inhaled with Non-contact vacuum
Frictional force between the surface of power generating means 10 is sufficiently large, can omit the first part 24 for playing a supportive role.Alternatively,
It can the only clamping Non-contact vacuum sucking force generator between second part 26 and the first surface of first part 24 27
10, provide chucking power without the use of clamping surface.
In one embodiment, the clamping part 22 including second part 26 can be configured, realize that the clamping part 22 connects with non-
Touch pull of vacuum generating means 10 is detachably connected, and then, can realize position-limit mechanism (especially stop surface 28) with
Non-contact vacuum sucking force generator 10 is detachably connected.Thereby, it is possible to different Non-contact vacuums are configured according to application
The combination of sucking force generator and position-limit mechanism.In one embodiment, directly position-limit mechanism 20 and Non-contact vacuum are inhaled
Power generating means 10 forms one, that is, is fixedly connected and feasible, such as by the two by way of 3D printing or punch die
Monolithic molding.
As shown in figure 5, when Non-contact vacuum sucking force generator 10 generates suction pickup chip, due to first part
24 multiple second surfaces 28 are tilted to space S from the fixed frame 21 and size and shape with chip matches,
Second surface 28 is capable of the edge of contact chip, so as to which chip is maintained at each second surface 28, limits the movement of chip.
It illustrate only the position-limit mechanism that fixed frame 21 is combined according to one embodiment in Fig. 4.In other implementations
In example, fixed frame 21 can be omitted, and only retains the clamping part 22 being connect with Non-contact vacuum sucking force generator 10,
So as to only realize limit function, and ignore the function of alignment chip placement region.
In a further embodiment, attachment device 22 can be configured to be different from the clamping part shown in Figure 4 and 5, and only
The connection being provided in only between fixed frame 21 and Non-contact vacuum sucking force generator 10, so as to only realize that alignment is placed
The function in region.As such, it is desirable to other separate configurations position-limit mechanism, for example, position-limit mechanism can be configured to from fixed frame 21
Extend close to the end face of Non-contact vacuum sucking force generator 10 into space S raised.It alternatively, can be from contactless true
The gas vent of empty sucking force generator 10 is individually extended limiting plate and/or bar into space S.
The used Non-contact vacuum sucking force generator, limiting of the embodiment of the present invention are described above by reference to attached drawing
Mechanism and by the two assembling or the vacuum suction nozzle component to be formed that is fixed together.This is only the preferred embodiment of the present invention,
Rather than the concrete restriction of the vacuum suction nozzle component to the present invention.It picks up chip on not contact chip surface and can limit
Under the premise of the position of the chip of pickup, the construction of Non-contact vacuum sucking force generator and position-limit mechanism can be changed, is assembled
And fixed form, without departing from the scope of the present invention.
Non-contact vacuum sucking force generator provides can pick up and chip placement in the case of not contact chip
Means are damaged because without having additional pickup space on chip, avoiding circuit caused by due to contact chip surface
And chip warpage.Position-limit mechanism makes it possible to limit the position of chip while chip is picked up, so as in the transport of chip
In the process, the movement of chip can be limited, and convenient for alignment chip placement region.Due to the vacuum suction nozzle component packet of the present invention
Above-mentioned two component part has been included, such vacuum suction nozzle component is used by operating personnel in the pickup of chip and placement process
It carries out accurately backfill to be possibly realized, it is no longer necessary to use chip mounter.
In one embodiment, vacuum suction nozzle component of the invention needs to be combined with for supplying the tracheae of the gas of pressurization
It uses.Fig. 6, which is shown, tracheae 41 is shown by a kind of manually operated pickup of operating personnel and place tool 40,
It is used to convey the gas-pressurized such as oil-free air；Gas flow controller 42 is connected with tracheae 41, is carried for controlling from tracheae 41
The amount of the gas-pressurized of confession；Vacuum suction nozzle component 30 and the connection between gas flow controller 42 and vacuum suction nozzle component 30
First 43.The gas that connector 43 will be set on the Non-contact vacuum sucking force generator 10 in tracheae 41 and vacuum suction nozzle component 30
Hole 11 (Fig. 6 is not shown) connects, with by tracheae 41 to 10 supply pressurized gas of Non-contact vacuum sucking force generator.Air-flow
Include handle 44 on controller 42.Operating personnel can be controlled by operation handle 44 is supplied to Non-contact vacuum suction to occur
The amount of the gas-pressurized of device 10.When needing to pick up chip, the gas flow of supply can be increased, and working as needs chip placement
When, it can cut off or reduce supply gas.
Fig. 7 shows the method 700 of manufacture vacuum suction nozzle component according to an embodiment of the invention.Method 700 is wrapped
It including and 701 Non-contact vacuum sucking force generators is provided, the Non-contact vacuum sucking force generator is used to generate suction, with
In the case of not contact object, the object is picked up and placed；702 position-limit mechanisms are provided, the position-limit mechanism is described non-
When contact pull of vacuum generating means generates suction to pick up the object, by contacting described in the edge limitation of the object
The position of object；And the position-limit mechanism is connect 703 with the Non-contact vacuum sucking force generator.
As previously described, can be to be detachably connected between Non-contact vacuum sucking force generator and position-limit mechanism
Or be fixedly connected.Therefore, it is non-accordingly by operating personnel's artificial selection in addition to machine assembles above-mentioned vacuum suction nozzle component
Contact pull of vacuum generating means and position-limit mechanism, and it is also possible that the two, which is manually assembled,.
The specific embodiment of the above-mentioned system and method about the present invention is only schematical, and not restrictive.This
It can arbitrarily be combined between a little embodiments, to achieve the object of the present invention.Protection scope of the present invention is by appended claim
Book defines.
One word of " comprising " in description and claims is not excluded for the presence of other element or steps.It says in the description
The function of each element that is bright or recording in the claims can also be split or combine, by corresponding multiple element or list
One element is realized." first " and " second " in description and claims is used only for representing title, is not offered as any
Specific sequence.
Claims (10)
1. a kind of vacuum suction nozzle component (30), including：
Non-contact vacuum sucking force generator (10), is used to generate suction, in the case of not contact object (14), to pick up
Take and place the object (14)；And
Position-limit mechanism (20) is connect with the Non-contact vacuum sucking force generator (10), in the Non-contact vacuum
When sucking force generator (10) generates suction to pick up the object (14), institute is limited by the edge for contacting the object (14)
State the position of object (14).
2. vacuum suction nozzle component (30) according to claim 1, wherein, the position-limit mechanism (20) further includes：
Hollow fixed frame (21)；And
One or more attachment devices (22) are used to occur the fixed frame (21) and the Non-contact vacuum suction
Device (10) connects；
Wherein, each attachment device (22) extends from an end face of the fixed frame (21), and non-is connect with described
Touch pull of vacuum generating means (10) connects, and the fixed frame (21) and one or more of attachment devices (22) are common
A space (S) is limited, it is described when the attachment device (22) is connect with the Non-contact vacuum sucking force generator (10)
Non-contact vacuum sucking force generator (10) can generate suction in the space (S).
3. vacuum suction nozzle component (30) according to claim 2, wherein, the position-limit mechanism (20) is including from the fixation
The limiting that one end close to the Non-contact vacuum sucking force generator (10) of frame (21) extends into the space (S)
Protrusion.
4. the vacuum suction nozzle component (30) according to Claims 2 or 3, wherein, one or more of attachment devices (22)
It is multiple clamping parts (22), one end of each clamping part (22) is provided with first part (24), the first part
(24) have and be used to support the first surface (27) of the Non-contact vacuum sucking force generator (10) and for described non-
Contact pull of vacuum generating means (10) generates suction to pick up the position that the object (14) are limited during the object (14)
Second surface (28).
5. vacuum suction nozzle component (30) according to claim 1, wherein, the position-limit mechanism (20) with it is described contactless
Pull of vacuum generating means (10) is detachably connected.
6. vacuum suction nozzle component (30) according to claim 2, wherein, the position-limit mechanism (20) further includes：
At the fixed frame (21) inside or the end of one end of the separate Non-contact vacuum sucking force generator (10)
The one or more positioning regions (23) set on face.
7. vacuum suction nozzle component (30) according to claim 4, wherein, each clamping part (22) is additionally included in and institute
State the second part (26) of the opposite one end setting of first part (24), the second part (26) and the first part (24)
For by the Non-contact vacuum sucking force generator (10) in the second part (26) and the first part (24)
Clamping between first surface (27).
8. vacuum suction nozzle component (30) according to claim 7, wherein, the clamping part (22) further include be arranged on it is described
Part III (25) between first part (24) and the second part (26), when the Non-contact vacuum suction fills
(10) are put between the second part (26) and the first surface (27) of the first part (24) during clamping, the third portion
The surface of (25) is divided to be engaged with the surface of the Non-contact vacuum sucking force generator (10).
9. a kind of pickup and place tool (40), including：
Tracheae (41) is used to convey gas-pressurized (F)；
Gas flow controller (42) is connected with the tracheae (41), for controlling the pressurization provided from the tracheae (41)
The amount of gas (F)；
Vacuum suction nozzle component (30) according to any one of claim 1-8 has and is inhaled in the Non-contact vacuum
The stomata (11) set on power generating means (10)；And
Connector (43), between the gas flow controller (42) and the vacuum suction nozzle component (43), for connecting
State tracheae (41) and the stomata (11), with by the tracheae (41) to the Non-contact vacuum sucking force generator (10)
Supply the gas-pressurized (F).
10. pickup according to claim 9 and place tool (40), wherein,
The gas-pressurized (F) is including oil-free air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711457674.4A CN108183084B (en) | 2017-12-28 | 2017-12-28 | Vacuum suction nozzle component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711457674.4A CN108183084B (en) | 2017-12-28 | 2017-12-28 | Vacuum suction nozzle component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108183084A true CN108183084A (en) | 2018-06-19 |
| CN108183084B CN108183084B (en) | 2019-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711457674.4A Active CN108183084B (en) | 2017-12-28 | 2017-12-28 | Vacuum suction nozzle component |
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| CN (1) | CN108183084B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108183084B (en) | 2019-03-22 |
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