CN108151901B - 温度测量电路和方法以及微型计算机单元 - Google Patents
温度测量电路和方法以及微型计算机单元 Download PDFInfo
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- CN108151901B CN108151901B CN201711096414.9A CN201711096414A CN108151901B CN 108151901 B CN108151901 B CN 108151901B CN 201711096414 A CN201711096414 A CN 201711096414A CN 108151901 B CN108151901 B CN 108151901B
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- temperature
- temperature sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
- G01K15/007—Testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-235730 | 2016-12-05 | ||
| JP2016235730A JP6678094B2 (ja) | 2016-12-05 | 2016-12-05 | 温度計測回路、方法、及びマイクロコンピュータユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108151901A CN108151901A (zh) | 2018-06-12 |
| CN108151901B true CN108151901B (zh) | 2021-10-29 |
Family
ID=62240040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711096414.9A Active CN108151901B (zh) | 2016-12-05 | 2017-11-09 | 温度测量电路和方法以及微型计算机单元 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10670478B2 (https=) |
| JP (1) | JP6678094B2 (https=) |
| CN (1) | CN108151901B (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6598592B2 (ja) * | 2015-08-28 | 2019-10-30 | ルネサスエレクトロニクス株式会社 | 半導体集積回路および電子制御ユニット |
| JP7055084B2 (ja) * | 2018-09-20 | 2022-04-15 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の制御方法 |
| US10664027B2 (en) * | 2018-10-09 | 2020-05-26 | Intel Corporation | Methods, systems and apparatus for dynamic temperature aware functional safety |
| JP7134160B2 (ja) * | 2019-12-18 | 2022-09-09 | 本田技研工業株式会社 | ガス制御装置及びガス制御方法 |
| GB201919297D0 (en) * | 2019-12-24 | 2020-02-05 | Aronson Bill | Temperature sensing physical unclonable function (puf) authenication system |
| KR102804069B1 (ko) | 2019-12-27 | 2025-05-09 | 삼성전자주식회사 | 빌트-인 셀프 테스트 회로 및 이를 포함하는 온도 측정 회로 |
| CN111787428B (zh) * | 2020-06-24 | 2022-03-08 | Oppo广东移动通信有限公司 | 用户终端设备 |
| DE112022003987T5 (de) * | 2021-08-16 | 2024-06-06 | Rohm Co., Ltd. | Halbleitervorrichtung und fahrzeuggerät |
| US20230366754A1 (en) * | 2022-05-11 | 2023-11-16 | Cirrus Logic International Semiconductor Ltd. | Single-point temperature calibration of resistance-based temperature measurements |
| EP4296639B1 (en) * | 2022-06-20 | 2025-01-29 | Carrier Corporation | Temperature sensor testing |
| CN115183899B (zh) * | 2022-08-24 | 2025-08-08 | 威海威高瑞影医疗科技有限公司 | 一种体温检测方法、装置、介质及体温检测仪 |
| CN117824870A (zh) * | 2022-09-27 | 2024-04-05 | 华为技术有限公司 | 检测电路及其控制方法、车载终端设备 |
| CN118706292B (zh) * | 2024-08-30 | 2025-01-21 | 中国计量大学 | 基于柔性温度传感器的动力系统温度原位校准装置及方法 |
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| EP1262755A1 (en) * | 2001-05-31 | 2002-12-04 | STMicroelectronics, Inc. | Temperature sensing circuit and calibration method |
| KR20040087152A (ko) * | 2003-04-04 | 2004-10-13 | 삼성전자주식회사 | 반도체 온도 검출기, 이를 구비하여 셀프 리프레쉬 전류를감소시키는 반도체 메모리 장치, 및 그 셀프 리프레쉬 방법 |
| JP2005106766A (ja) * | 2003-10-02 | 2005-04-21 | Sumitomo Electric Ind Ltd | 被加熱物品の表面温度測定方法、これを用いた加熱方法、及び光ファイバプリフォームの製造方法 |
| KR100668739B1 (ko) * | 2004-04-13 | 2007-01-26 | 주식회사 하이닉스반도체 | 오실레이터 회로 |
| CN102025368A (zh) * | 2009-09-19 | 2011-04-20 | 无锡爱睿芯电子有限公司 | 温度感应振荡器和其生产方法、以及温度频率校正系统 |
| CN102466523A (zh) * | 2010-10-28 | 2012-05-23 | 精工电子有限公司 | 温度检测装置 |
| CN202442811U (zh) * | 2011-12-21 | 2012-09-19 | 无锡华润矽科微电子有限公司 | 电子温度测量电路结构 |
| JP2014098614A (ja) * | 2012-11-14 | 2014-05-29 | Renesas Electronics Corp | 温度センサおよび半導体装置 |
| CN204115913U (zh) * | 2014-09-19 | 2015-01-21 | 国家电网公司 | 一种智能型铂电阻温度测量校验仪 |
| CN104596662A (zh) * | 2014-12-08 | 2015-05-06 | 深圳市芯海科技有限公司 | 优化线性度的片上数字温度传感器 |
| CN105628243A (zh) * | 2015-12-30 | 2016-06-01 | 清华大学深圳研究生院 | 一种电阻型温度传感芯片 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07111381B2 (ja) | 1987-08-11 | 1995-11-29 | アンリツ株式会社 | ディジタル温度計 |
| JP2652961B2 (ja) * | 1989-03-28 | 1997-09-10 | 日本電気株式会社 | 電子部品の保護機構 |
| JP2975259B2 (ja) * | 1994-05-27 | 1999-11-10 | 核燃料サイクル開発機構 | 原子炉燃料の破損検出法 |
| JPH11118619A (ja) * | 1997-10-08 | 1999-04-30 | Koito Ind Ltd | サーミスタ故障検出方法 |
| US6853259B2 (en) * | 2001-08-15 | 2005-02-08 | Gallitzin Allegheny Llc | Ring oscillator dynamic adjustments for auto calibration |
| US7044633B2 (en) * | 2003-01-09 | 2006-05-16 | International Business Machines Corporation | Method to calibrate a chip with multiple temperature sensitive ring oscillators by calibrating only TSRO |
| US7168853B2 (en) * | 2003-01-10 | 2007-01-30 | International Business Machines Corporation | Digital measuring system and method for integrated circuit chip operating parameters |
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| CN101216356A (zh) * | 2007-01-04 | 2008-07-09 | 海尔集团公司 | 一种温度传感器的故障检测方法及装置 |
| GB201102070D0 (en) * | 2011-02-07 | 2011-03-23 | Nordic Semiconductor Asa | Semiconductor temperature sensors |
| JP5738141B2 (ja) * | 2011-09-20 | 2015-06-17 | ルネサスエレクトロニクス株式会社 | 半導体装置及び温度センサシステム |
| KR101885857B1 (ko) * | 2012-01-04 | 2018-08-06 | 삼성전자주식회사 | 온도 관리 회로, 이를 포함하는 시스템 온 칩 및 온도 관리 방법 |
| JP2013178118A (ja) * | 2012-02-28 | 2013-09-09 | Honda Motor Co Ltd | 温度検出器 |
| US9658118B2 (en) * | 2012-11-16 | 2017-05-23 | Linear Technology Corporation | Precision temperature measurement devices, sensors, and methods |
| JP6186646B2 (ja) * | 2013-03-29 | 2017-08-30 | 株式会社ケーヒン | 電圧検出装置 |
| CN105486422A (zh) * | 2014-09-16 | 2016-04-13 | 哈尔滨恒誉名翔科技有限公司 | 基于msp430f149高精度测温装置及其测量方法 |
| EP3340467B1 (en) * | 2016-12-22 | 2022-10-05 | NXP USA, Inc. | Digitally controlled oscillator with temperature compensation |
| KR102749169B1 (ko) * | 2017-01-10 | 2025-01-06 | 삼성전자주식회사 | 온도 보상 발진 제어기 및 그것을 포함하는 온도 보상 수정 발진기 |
-
2016
- 2016-12-05 JP JP2016235730A patent/JP6678094B2/ja active Active
-
2017
- 2017-10-26 US US15/795,112 patent/US10670478B2/en active Active
- 2017-11-09 CN CN201711096414.9A patent/CN108151901B/zh active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1262755A1 (en) * | 2001-05-31 | 2002-12-04 | STMicroelectronics, Inc. | Temperature sensing circuit and calibration method |
| KR20040087152A (ko) * | 2003-04-04 | 2004-10-13 | 삼성전자주식회사 | 반도체 온도 검출기, 이를 구비하여 셀프 리프레쉬 전류를감소시키는 반도체 메모리 장치, 및 그 셀프 리프레쉬 방법 |
| JP2005106766A (ja) * | 2003-10-02 | 2005-04-21 | Sumitomo Electric Ind Ltd | 被加熱物品の表面温度測定方法、これを用いた加熱方法、及び光ファイバプリフォームの製造方法 |
| KR100668739B1 (ko) * | 2004-04-13 | 2007-01-26 | 주식회사 하이닉스반도체 | 오실레이터 회로 |
| CN102025368A (zh) * | 2009-09-19 | 2011-04-20 | 无锡爱睿芯电子有限公司 | 温度感应振荡器和其生产方法、以及温度频率校正系统 |
| CN102466523A (zh) * | 2010-10-28 | 2012-05-23 | 精工电子有限公司 | 温度检测装置 |
| CN202442811U (zh) * | 2011-12-21 | 2012-09-19 | 无锡华润矽科微电子有限公司 | 电子温度测量电路结构 |
| JP2014098614A (ja) * | 2012-11-14 | 2014-05-29 | Renesas Electronics Corp | 温度センサおよび半導体装置 |
| CN204115913U (zh) * | 2014-09-19 | 2015-01-21 | 国家电网公司 | 一种智能型铂电阻温度测量校验仪 |
| CN104596662A (zh) * | 2014-12-08 | 2015-05-06 | 深圳市芯海科技有限公司 | 优化线性度的片上数字温度传感器 |
| CN105628243A (zh) * | 2015-12-30 | 2016-06-01 | 清华大学深圳研究生院 | 一种电阻型温度传感芯片 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US10670478B2 (en) | 2020-06-02 |
| JP2018091741A (ja) | 2018-06-14 |
| CN108151901A (zh) | 2018-06-12 |
| US20180156675A1 (en) | 2018-06-07 |
| JP6678094B2 (ja) | 2020-04-08 |
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