CN108142001A - 主轴 - Google Patents
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- Publication number
- CN108142001A CN108142001A CN201580084030.8A CN201580084030A CN108142001A CN 108142001 A CN108142001 A CN 108142001A CN 201580084030 A CN201580084030 A CN 201580084030A CN 108142001 A CN108142001 A CN 108142001A
- Authority
- CN
- China
- Prior art keywords
- contact surface
- upper body
- sub
- main shaft
- screw rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims description 4
- 230000003993 interaction Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 101100410399 Arabidopsis thaliana PUMP2 gene Proteins 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 101100031730 Arabidopsis thaliana PUMP1 gene Proteins 0.000 description 3
- 101100130645 Homo sapiens MMP7 gene Proteins 0.000 description 3
- 102100030417 Matrilysin Human genes 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150147466A KR20170047058A (ko) | 2015-10-22 | 2015-10-22 | 스핀들 |
KR10-2015-0147466 | 2015-10-22 | ||
PCT/KR2015/012493 WO2017069325A1 (ko) | 2015-10-22 | 2015-11-19 | 스핀들 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108142001A true CN108142001A (zh) | 2018-06-08 |
CN108142001B CN108142001B (zh) | 2020-07-21 |
Family
ID=58557555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580084030.8A Expired - Fee Related CN108142001B (zh) | 2015-10-22 | 2015-11-19 | 主轴 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20170047058A (zh) |
CN (1) | CN108142001B (zh) |
WO (1) | WO2017069325A1 (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6041996A (en) * | 1996-11-22 | 2000-03-28 | Matsushita Electric Industrial Co., Ltd. | Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part |
JP2001293678A (ja) * | 2000-04-17 | 2001-10-23 | Ando Electric Co Ltd | 電子部品搬送装置 |
CN102387698A (zh) * | 2010-09-01 | 2012-03-21 | 雅马哈发动机株式会社 | 元件安装装置 |
CN103582406A (zh) * | 2012-08-10 | 2014-02-12 | 雅马哈发动机株式会社 | 元件搬送用头部、元件吸附用吸嘴及元件安装装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2841334B2 (ja) * | 1990-07-30 | 1998-12-24 | トーソク株式会社 | フリップチップボンディング装置 |
JP3336048B2 (ja) * | 1992-11-27 | 2002-10-21 | 京セラ株式会社 | 半導体素子の実装方法 |
JP3303705B2 (ja) * | 1997-01-22 | 2002-07-22 | 松下電器産業株式会社 | バンプ付電子部品の熱圧着装置 |
JP3400299B2 (ja) * | 1997-06-26 | 2003-04-28 | 株式会社新川 | ボンディング装置用ツール保持構造 |
JP3919684B2 (ja) * | 2003-03-13 | 2007-05-30 | 松下電器産業株式会社 | 倣い装置およびそれを用いた接合装置 |
-
2015
- 2015-10-22 KR KR1020150147466A patent/KR20170047058A/ko not_active Application Discontinuation
- 2015-11-19 WO PCT/KR2015/012493 patent/WO2017069325A1/ko active Application Filing
- 2015-11-19 CN CN201580084030.8A patent/CN108142001B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6041996A (en) * | 1996-11-22 | 2000-03-28 | Matsushita Electric Industrial Co., Ltd. | Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part |
JP2001293678A (ja) * | 2000-04-17 | 2001-10-23 | Ando Electric Co Ltd | 電子部品搬送装置 |
CN102387698A (zh) * | 2010-09-01 | 2012-03-21 | 雅马哈发动机株式会社 | 元件安装装置 |
CN103582406A (zh) * | 2012-08-10 | 2014-02-12 | 雅马哈发动机株式会社 | 元件搬送用头部、元件吸附用吸嘴及元件安装装置 |
Also Published As
Publication number | Publication date |
---|---|
CN108142001B (zh) | 2020-07-21 |
WO2017069325A1 (ko) | 2017-04-27 |
KR20170047058A (ko) | 2017-05-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 1204 Changyuan Road, Chengshan District, Kyung Sung Nam Road, South Korea Applicant after: HANWHA AEROSPACE Co.,Ltd. Address before: 1204 Changyuan Road, Chengshan District, Kyung Sung Nam Road, South Korea Applicant before: HANWHA TECHWIN Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190415 Address after: Gyeongnam Changwon City, South Korea Applicant after: Hanwha Precision Machinery Co.,Ltd. Address before: 1204 Changyuan Road, Chengshan District, Kyung Sung Nam Road, South Korea Applicant before: HANWHA AEROSPACE Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200721 Termination date: 20211119 |