CN108140634A - 对部件进行表面安装的方法 - Google Patents

对部件进行表面安装的方法 Download PDF

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Publication number
CN108140634A
CN108140634A CN201680049226.8A CN201680049226A CN108140634A CN 108140634 A CN108140634 A CN 108140634A CN 201680049226 A CN201680049226 A CN 201680049226A CN 108140634 A CN108140634 A CN 108140634A
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China
Prior art keywords
bearing substrate
electronic unit
electroconductive binder
flexible
flexible pcb
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Granted
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CN201680049226.8A
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English (en)
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CN108140634B (zh
Inventor
安东尼·迈尔斯
本杰明·马谢德
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ILIT TECHNOLOGIES Ltd
DST Innovations Ltd
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ILIT TECHNOLOGIES Ltd
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Priority to CN202111635815.3A priority Critical patent/CN114335261A/zh
Publication of CN108140634A publication Critical patent/CN108140634A/zh
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Publication of CN108140634B publication Critical patent/CN108140634B/zh
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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Abstract

一种将多个电子部件(103)连接到柔性电路板(107)的方法，包括：提供承载电子部件(103)的承载基板(105)，每个电子部件(103)具有涂覆有导电粘合剂(102)的至少一个电触点；以及将承载基板(105)施加到柔性电路板(106)，使得电子部件(103)经由导电粘合剂(102)粘附到柔性电路板(106)并与柔性电路板(106)电接触。电子部件(103)可以包括LED，并且可以在柔性电路板(106)上提供一个或多个光学层。

Description

对部件进行表面安装的方法
技术领域
本发明涉及一种对部件进行表面安装的方法，特别是但不限于用于在柔性基板上形成柔性电子器件。
背景技术
以下讨论不被视为承认相关的现有技术。
表面安装部件与电子电路的接合通常通过以下方式来实现：使用金属焊料在电极之间形成电连接，然后用聚合物“胶”来帮助将部件粘合到电路表面。然而，柔性电子电路和器件的应用的增加意味着更多的电子器件正在诸如聚合物片材和织物之类的柔性基板上形成，这与焊接所需的高温和焊接接头的刚性不兼容。例如，焊膏通常需要超过200℃的温度才能固化，这使得焊接与常见的柔性基板如聚对苯二甲酸乙二醇酯(PET)和聚氯乙烯(PVC)不兼容，它们的软化点分别为70℃和55℃左右。这种不合适意味着必须使用其他电子接合技术来形成具有集成的表面安装部件的柔性电子器件。
与通常为低温熔融金属合金的焊膏相比，填充有导电材料的聚合物粘结剂(导电粘结剂)基本上在低于150℃的温度下或者在室温下通过施加紫外光而固化。出于此原因，导电粘合剂已经开始用于形成柔性电子器件；它们通常也相对便宜和柔软，同时还提供良好的导电性和粘附性。导电粘合剂分为两大类：各向同性导电粘合剂(ICA)和各向异性导电粘合剂(ACA)。ICA能够在所有方向上导电，而ACA在被压紧在电极之间时仅在z轴上导电。导电粘合剂的另一个有用的能力是它们能够使用常见印刷技术(例如丝网印刷)以大面积或图案快速印刷，从而缩短加工时间。
对柔性电子产品的关注度增加目前受限于对新材料和加工技术的开发和可用性的需求，所述新材料和加工技术将允许柔性电路进而柔性器件以与其刚性对应物同样的方式工作、同样耐用并且经济地生产。柔性电子器件可能应用于可穿戴设备(例如嵌入正常服装织物内的健康监控传感器)、或者可以移动并适合任何环境的柔性照明和标牌。为了实现这些想法，需要抛弃刚性部件，并且需要生产这种器件时使用的加工技术的更大创新，以使它们与其刚性对应物相比同样便宜或更加便宜。例如，由于典型金属线的坚硬特性不会使织物移动并感觉像“正常”织物，因此在织物中使用固体布线来形成电子连接是不可接受的。类似地，通过印刷电路板原型设计公司或通过创建笨重的电路试验板，对于传统的刚性电子设备而言，对带有控制芯片和其他集成部件的新电路设计的创建通常是快速且便宜的。然而，这种原型控制电路和部件阵列的系统在大多数情况下不适用于柔性电子设备公司。
在专利文献中描述的形成柔性多部件电子器件的方法有很多。在US-A-2014/0098557中描述了一个示例，其描述了通过“柔性线”连接的层压式LED阵列的生产。然而，所描述的方法需要将每个LED和连接器分别放置到柔性基板上，导致高度劳动密集型工艺，这不适合经济的高生产量生产。
在US-A-2004/0026033中可以找到形成包含刚性部件的柔性电子器件的另一个示例，其描述了使用导电粘合剂(或更具体地，ACA)将微芯片附着到已经预先印刷有柔性电子电路设计的柔性基板。该方法使用商业拾取和放置机器将倒装芯片器件放置在所需位置处，然后施加压力和加热以将芯片附着到电路。虽然这种方法适用于某些用途，但是需要使用拾取和放置机器而不是典型的倒装芯片组装单元，后者通常被设计为每次将部件放置在相同的位置。对拾取和放置机器的依赖对生产速度和相关的虚增成本非常有制约性。拾取和放置机器通常每小时只能堆积大约3000件物品，这对于包含大量部件或大型部件阵列的设备的高生产量工业生产来说是不够的或经济上不可行的。通常在这种情况下，有限的拾取和放置机器速度的问题通过在生产线中增加更多拾取和放置机器来“解决”；然而，这种方法自然是非常昂贵的且空间受限。
柔性设备的一种应用是生产均匀的光源。均匀光源在现代生活的许多领域都有应用，例如室内照明、海报和标志的背部照明。大多数商用和家用光源使用旧的、低效率和刚性的发光器件，例如荧光灯管和灯丝灯泡。这种光源的环境影响非常差，因为例如荧光灯泡含有高度有毒的汞，而且这些传统光源的高功耗在现代标准下是差的。由于LED的功耗更低、寿命更长、环境特性更强，因此LED相比荧光灯管和灯丝灯泡提供显著的优点。LED通常用于许多显示设备中(例如平板电视和小型显示器)，在这些显示设备中，它们被拾取并放置在刚性PCB(印刷电路板)上并焊接到位。目前形成均匀光线的方法涉及通过刚性散射片对侧面安装的LED进行背反射。
EP-A-2717313公开了一种生产大面积LED照明设备的方法，其中LED被直接嵌入到小珠(bead)中，其然后被涂覆到基板上。该工艺需要将LED直接嵌入小珠中，然后将其处理成夹在两个导电基板之间。该工艺不适合当前的印刷方法，并且不允许使用非金属底部基板。将LED涂覆到基板上会导致LED的不均匀、不规则的旋转，因此不能提供图案化特性。
US-A-20150204490公开了一种印刷的柔性大面积器件，其包含LED和光散射机构。如US-A-20120164796中所公开的，LED是印刷的微型LED，而不是标准的市售LED。该工艺需要两个分离的导电层，因此需要光学透明的导电层。使用了包含金属氧化物的散射颗粒。
发明内容
所附权利要求限定了本发明的多个方面。
根据本发明的一个实施例，提供了一种用于形成表面安装电子部件的预配置阵列的方法。该方法包括以特定的间隔布置将电子部件附接到柔性基板，该特定的间隔布置对应于这些电子部件在表面安装器件的完成的电路设计上的所需位置。有利地，在该第一加工步骤中，将包含各向异性导电粘合剂的粘结材料附着到表面安装电子部件的电极。然后，使用均匀的压力和低温或紫外光，而不需要诸如焊接之类的高温技术或诸如拾取和放置机器之类的时间密集型技术，这种预先配置的部件阵列能够快速且容易地转移到最终基板上的印刷电子电路。
使用本发明的实施例，通过去除对现场/在线拾取和放置机器的需要，可以加速表面安装部件到柔性印刷电子电路上的堆积。以所需的布置将部件预先组织在柔性背衬上，这允许将所有部件在一个步骤中堆积到电路上。这能够比使用拾取和放置机器快得多，并且可以允许将部件同时放置在设备电路上。对于该应用，设想可以将导电粘合剂(或更有利的，各向异性导电粘合剂(ACA))用作电子接合材料和粘合剂两者，以将部件粘结到印刷电子电路的表面。还设想可以将导电粘合剂以期望的量和图案印刷到第一基板上，然后可以将部件的连接器放置到导电粘合剂衬垫中。在此之后，可以将具有热释放粘合剂的第二基板或承载基板施加到部件的顶侧。该第二基板可以首先用来保护部件并用来确保它们不会从其所需位置移动。然后，设想可以通过首先移除柔性背衬并露出部件的涂覆有ACA的底侧，来将这些部件阵列直接施加到预先印刷的电子电路。然后使用光学配准标记或穿孔对准孔，将部件阵列与预先印刷的电路图案对齐，并且使用热和压力对部件进行电和物理连接。当ACA固化时，ACA固化步骤的热量可允许热释放粘合剂释放第二衬底，留下包含所有部件的完成的电路。通过这种方式，可以克服在线拾取和放置机器的限制，并允许快速和经济地生产柔性电子设备。
使用本发明的实施例的方法，可以通过暂时将LED和其他部件以所需的阵列预先放置在柔性热释放衬里上，然后使用辊到辊的工艺将部件转移到印刷电路，从而来填充柔性电子器件。通过使用柔性的、分层的聚合物散射体，可以在柔性基板上形成均匀的光输出。这允许生产具有均匀光输出的柔性的、薄的、弯曲的甚至3D结构。聚合物散射体还具有保护特性，这意味着整个器件可以比现有技术中的普通器件更薄。
附图说明
图1至图3示出了用于形成诸如LED、电阻器、电容器和其他电子部件的表面安装器件(SMD)的预制阵列的步骤。
图1示出了第一基板上的ACA印刷衬垫。
图2示出了放置在ACA衬垫上的电子部件(在这种情况下为表面安装的LED)。
图3示出了放置在部件顶部上的第二基板。第二基板涂覆有热释放粘合剂。
图4至图8示出了能够如何使用预配置SMD片材。
图4示出了当第一基板从其余材料剥离掉以使电子部件的下侧与相关联的ACA露出时的步骤。
图5示出了如下工艺：通过对准两个基板使得涂覆有ACA的电子部件的电极位于印刷电路板的电极上方，将电子部件附着到预印刷电路板。
图6示出了如何通过施加热和垂直压力将电子部件粘结到预印刷电路板。
图7示出了最终的工艺步骤，其中将基板从部件的顶部剥离掉，留下固定到电路板的电子部件。
图8示出了完成的器件的一部分。
图9至图12示出了一些可能的预配置SMD片材，但并不意图以任何方式进行限制。
图13示出了以连续辊形式制造预配置SMD片材的方法。
图14示出了在辊对辊工艺中使用预制SMD片材制造器件的方法。
图15示出了包含LED和多个附加光学层的完成的器件的一部分。
具体实施方式
构造方法
图1所示的预配置SMD片材的构造的第一步包括将导电粘合剂102的衬垫印刷到柔性基板101上。优选的是，此处使用的导电粘合剂为各向异性导电粘合剂，并且其在基板101上形成为使得它将正确地安装要使用的电子部件。还可以优选的是，在柔性基板101上施加涂层以确保粘合剂不粘附到基板，从而将易于稍后去除柔性基板并使导电粘合剂大部分保留在部件的触点上。
图2示出了下一步骤，其中将电子部件103放置在已经位于第一基板101上的导电粘合剂102的顶部上。该步骤可以通过拾取和放置机器或本领域已知的其他精确放置系统来完成。图3中示出了第三步，其中将涂覆有粘合剂层104的第二基板105与已经放置在导电粘合剂102的顶部上的电子部件103接触放置，所述导电粘合剂102形成在底部涂覆的基板101上。需要粘合剂层104将部件103的顶部临时粘结到第二基板105，因此在这种情况下可以使用热释放粘合剂。由此得到的预配置SMD片材可以作为即用型的片材进行堆叠、或者在准备切割的未切割的辊中堆叠、或者用于辊对辊工艺。
为了使用该预配置SMD片材，初始步骤包括如图4所示去除第一基板101，从而露出每个电子部件103的下侧和导电粘合剂涂层102。导电粘合剂102的另一侧固定到部件103的电触点，并且电子部件103由涂覆在第二基板105上的粘合剂104保持在正确的位置中。
接下来，将印刷电路板106放置在露出的导电粘合剂102下面，如图5所示，并且排列成使得电子部件103的电触点与印刷电路板106上的触点107对齐。这可以使用第二基板105和印刷电路板106上的对准标记(例如穿孔对准孔或光学配准标记108)来完成。接着，如图6所示，将热和压力施加到印刷电路板106的顶部和底部表面，将导电粘合剂102向下压到印刷电路板106的触点上，并且向上压到电子部件103的电触点上。但是，在紫外线固化ACA的情况下可以使用聚焦光。通过使用ACA，可以涂覆部件103的底部的整个表面而不仅仅涂覆电极；通过这样做，可以确保电子部件103牢固地粘附到印刷电路板106，并且在电子部件103的电极和印刷电路板106上的触点107之间存在良好的导电接合。使用ACA意味着只能在导电粘合剂102被挤压在印刷电路板106上的触点107和电子部件103上的触点之间的位置中进行电接合，不能在导电粘合剂不与电子部件103上的电触点和电路板107的电触点106接触的区域中或者通过导电粘合剂的主体在x轴或y轴上进行电连接。在这种情况下，导电粘合剂将用作接合材料和电绝缘体。具有粘合剂涂层104的第二基板105保持在适当的位置并且用于将片材105与电路板106排成列，并且还用于在施加热和压力时保护电子部件。在固化之后，如图7所示，将顶部的具有粘合剂涂层104的透明片材105移除，从而留下用导电粘合剂102固定到电路板106的电子部件103。
图8示出使用导电粘合剂102将电子部件103固定到电路板106的完成的单元，导电粘合剂102提供电子部件103的触点和电路板106上的触点107之间的导电连接。
使用上面强调的工艺的原理，图13描绘了用于以连续辊形式制造预配置SMD片材的可能方法。首先，在生产工艺开始时，放置涂覆有不粘涂层的第一基板101的辊。有涂层的第一基板101在导辊202下方通过，以确保其正确进入印刷工艺203。然后，印刷工艺203将导电粘合剂印刷到有涂层的基板101上。已经经过印刷工艺203的有涂层的基板101然后进入固化工艺205，然后进入检查系统204。检查系统204还在印刷工艺中、固化工艺之后、SMD部件103在印刷基板上的放置处、以及产品输出部分处使用。印刷有导电粘合剂的有涂层的基板101然后进入拾取和放置系统207，该系统207将SMD部件103放置在印刷的导电粘合剂102上，该印刷的导电粘合剂102已经被印刷在有涂层的基板101上的特定位置中。然后将具有涂覆的粘合剂106的第二基板105(用作顶部保护和定位基板)向下传送通过加热的压力辊208，其通过速率与有涂层的第一基板101在相同的辊208下通过的速率相同，从而封装SMD电子部件103和导电粘合剂102。完成的产品在检查204之后卷成辊209以用于其他生产系统。
使用上面概述的工艺的原理，图14描绘了用于在辊对辊工艺中使用预制的SMD片材制造柔性器件的可能方法。首先，要印刷有电子电路的基板106通过导辊和进给系统302从辊拉出。然后，通过由光学系统304监控的印刷机构303将基板106印刷有电子电路。然后，使用印刷机构303进行了印刷的基板106被传送通过固化系统305。预配置SMD片材209的辊被展开并且以同步的方式被传送通过引导件，使得预配置SMD片材209与基板106上的印刷电子电路排成列。在预配置SMD片材被传送到同步辊并且与印刷电子电路对齐之前，预配置SMD片材的保护性的第一基板101用导辊307移除并存放在另一个辊306上以供稍后回收。然后，将基板106和预配置SMD片材209在压力机309处用压力和热压在一起，使得导电粘合剂102形成导电连接并将电子部件103粘附到印刷电子电路。然后，将来自预制的SMD片材的保护性顶片(第二基板)105移除到辊310，然后将完成的电子器件的片材卷到滚筒或辊311上，准备好用于切割和使用。
大面积光源
上述工艺的一个应用是生产大面积光源，特别是包含印刷导电迹线和电极的均匀大面积表面安装器件(SMD)发光二极管(LED)光源。
该生产方法包括首先使用导电可印刷油墨将必要的电力和控制电路印刷到基板106上。有利的是，使用丝网印刷、柔性版印刷或本领域已知的其他典型的大量、高速印刷技术来印刷导电油墨。然后，通过将LED 103放置在电极上并使用导电粘合剂102(例如，各向同性导电粘合剂(ICA)、各向异性导电粘合剂(ACA)、非导电粘合剂(NCA)或其组合)将它们保持在适当位置，来堆积印刷基板106。用于将LED 103粘附到基板106表面的粘合剂可以预先施加到基板106或LED表面，或者预先施加到这两者。在将LED 103放置到电极107上之前，将LED 103以特定的取向预先布置在热释放纸(第二基板)105上。一旦与电极107对准，然后使用升高的温度将LED 103转移到印刷基板106上以首先释放热释放纸105，然后固化粘合剂102，该粘合剂102将LED 103牢固地保持在适当的位置。
在使用了ACA的情况下，可能需要预固化步骤，在该预固化步骤中，ACA在较低温度下B阶化，然后，ACA伴随垂直施加到LED阵列的特定压力在较高温度下完全固化。
一旦LED阵列附着到印刷基板106以形成印刷器件，可以施加多个另外的层。这些层可以包括但不限于光导、扩散层、反射层、单个或多个相互依赖的透镜层、微透镜阵列和色彩校正层。这样的附加层可以提供所需色彩和色温的均匀照明。
完成的电路可以被涂覆在多层扩散材料中的一层中，例如如图15所示。典型地，由光学透明和未着色的柔性材料(诸如硅酮聚合物硅酮树脂184)制成的主光导层401被沉积并半固化到基板106上，与基板106的表面形成结合，但仍足够柔顺以用于下一个阶段。然后在导光层401的表面上形成全向扩散层402；这可以通过以下方式来进行：附接预制的扩散片材料，或者使用可以混合到第二硅酮混合物中并且均匀地散布在光导的表面上的微米级聚合物/玻璃珠层。
然后通过诸如冲压之类的标准切割机构将完成的单元从辊311释放。
替代实施例
在单条生产线中可能有许多印刷系统和许多预配置SMD片材，以及许多加热和加压工艺。生产线也可以包括封装部分。
本领域技术人员在阅读以上描述时可以是显而易见的替代实施例仍然落入由所附权利要求限定的本发明的范围内。

Claims (22)

1.一种将多个电子部件(103)连接到柔性电路板(106)的方法，所述方法包括：
a.提供承载所述电子部件(103)的承载基板(105)，每个所述电子部件(103)具有涂覆有导电粘合剂(102)的至少一个电触点；以及
b.将所述承载基板(105)施加到所述柔性电路板(107)，使得所述电子部件(103)经由所述导电粘合剂(102)粘附到所述柔性电路板(106)并与所述柔性电路板(106)电接触。
2.根据权利要求1所述的方法，其中，在所述电子部件(103)粘附到所述柔性电路板(106)之后，移除所述承载基板(105)。
3.根据权利要求1或权利要求2所述的方法，其中，所述导电粘合剂(102)设置在柔性基板(101)上，并且其中在将所述承载基板(105)施加到所述柔性电路板(107)之前移除所述柔性基板(101)。
4.根据权利要求3所述的方法，其中，所述柔性基板(101)具有用于抑制所述导电粘合剂(102)粘附到其的涂层。
5.根据权利要求3或权利要求4所述的方法，其中，提供所述承载基板(105)的步骤包括将所述导电粘合剂(102)沉积到所述柔性基板(101)上并将所述电子部件(103)放置在所述导电粘合剂(102)上。
6.根据前述任一权利要求所述的方法，其中，将所述承载基板(105)施加到所述柔性电路板(107)的步骤包括使用所述承载基板(105)和/或所述柔性电路板(107)上的对准标记或孔(108)将所述承载基板(105)与所述柔性电路板(107)对准。
7.根据前述任一权利要求所述的方法，其中，所述导电粘合剂(102)是各向异性导电粘合剂。
8.根据前述任一权利要求所述的方法，其中，将所述承载基板(105)施加到所述柔性电路板(106)的步骤包括固化所述导电粘合剂(102)以将所述电子部件(103)粘附到所述柔性电路板(106)。
9.根据权利要求8所述的方法，其中，所述电子部件(103)通过热释放粘合剂(104)安装在所述承载基板(105)上，并且其中所述导电粘合剂(102)被热固化，由此释放所述热释放粘合剂(104)。
10.根据前述任一权利要求所述的方法，其中，所述承载基板(105)设置在连续辊上。
11.根据前述任一权利要求所述的方法，其中，在所述电子部件(103)粘附到所述柔性电路板(106)之后将所述柔性电路板(106)存放在辊上。
12.根据前述任一权利要求所述的方法，其中，所述电子部件(103)包括发光二极管(LED)。
13.根据权利要求12所述的方法，包括在所述柔性电路板(106)上施加一个或多个光学层(401，402)。
14.根据权利要求13所述的方法，其中，所述光学层包括以下中的一项或多项：光导、扩散层、反射层、单个或多个相互依赖的透镜层、微透镜阵列和色彩校正层。
15.一种承载多个电子部件(103)的承载基板(105)，每个所述电子部件(103)具有涂覆有导电粘合剂(102)的至少一个电触点。
16.根据权利要求15所述的承载基板(105)，其中，所述电子部件(103)通过粘合剂层(104)安装在所述承载基板(105)上。
17.根据权利要求16所述的承载基板(105)，其中，所述粘合剂层(104)包括热释放粘合剂。
18.根据权利要求15至17中任一项所述的承载基板(105)，其中，所述导电粘合剂(102)是各向异性导电粘合剂。
19.根据权利要求15至18中任一项所述的承载基板(105)，其中，所述电子部件(103)设置在所述承载基板(105)和柔性基板(101)之间。
20.根据权利要求19所述的承载基板(105)，其中，所述柔性基板(101)具有用于抑制所述导电粘合剂(102)粘附到其的涂层。
21.一种形成权利要求18至20中任一项所述的承载基板(105)的方法，包括将所述导电粘合剂(102)沉积到所述柔性基板(101)上并将所述电子部件(103)放置在所述导电粘合剂(102)上。
22.根据权利要求21所述的方法，其中，所述柔性基板(101)设置在连续辊(201)上。
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US20180182944A1 (en) 2018-06-28
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EP3314646B1 (en) 2021-08-25
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