CN108029216B - 电路结构体及电连接箱 - Google Patents

电路结构体及电连接箱 Download PDF

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Publication number
CN108029216B
CN108029216B CN201680049628.8A CN201680049628A CN108029216B CN 108029216 B CN108029216 B CN 108029216B CN 201680049628 A CN201680049628 A CN 201680049628A CN 108029216 B CN108029216 B CN 108029216B
Authority
CN
China
Prior art keywords
solder
circuit board
adhesive sheet
circuit structure
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201680049628.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN108029216A (zh
Inventor
陈登
中村有延
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of CN108029216A publication Critical patent/CN108029216A/zh
Application granted granted Critical
Publication of CN108029216B publication Critical patent/CN108029216B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/03—Cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Connection Or Junction Boxes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CN201680049628.8A 2015-09-15 2016-08-30 电路结构体及电连接箱 Expired - Fee Related CN108029216B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-181828 2015-09-15
JP2015181828A JP6528620B2 (ja) 2015-09-15 2015-09-15 回路構成体および電気接続箱
PCT/JP2016/075287 WO2017047373A1 (ja) 2015-09-15 2016-08-30 回路構成体および電気接続箱

Publications (2)

Publication Number Publication Date
CN108029216A CN108029216A (zh) 2018-05-11
CN108029216B true CN108029216B (zh) 2020-03-17

Family

ID=58288895

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680049628.8A Expired - Fee Related CN108029216B (zh) 2015-09-15 2016-08-30 电路结构体及电连接箱

Country Status (5)

Country Link
US (1) US10334734B2 (enExample)
JP (1) JP6528620B2 (enExample)
CN (1) CN108029216B (enExample)
DE (1) DE112016004181T5 (enExample)
WO (1) WO2017047373A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6432792B2 (ja) * 2015-09-29 2018-12-05 株式会社オートネットワーク技術研究所 回路構成体及び電気接続箱
JP6939542B2 (ja) * 2017-12-28 2021-09-22 株式会社オートネットワーク技術研究所 電気接続装置
JP6958515B2 (ja) * 2018-09-03 2021-11-02 株式会社オートネットワーク技術研究所 回路構造体及び電気接続箱
DE102019101973A1 (de) * 2019-01-28 2020-07-30 Eugen Forschner Gmbh Verbindungsanordnung zum Verbinden einer Stromschiene mit einem Gehäuse
JP7135999B2 (ja) * 2019-05-13 2022-09-13 株式会社オートネットワーク技術研究所 配線基板
US11382241B2 (en) * 2019-09-25 2022-07-05 Baidu Usa Llc Cooling devices for edge computing and heterogeneous computing electronics hardware
US11778793B2 (en) * 2021-03-31 2023-10-03 Toyota Motor Engineering & Manufacturing North America, Inc. Systems including an integrated power module with vias and methods of forming the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004147416A (ja) * 2002-10-23 2004-05-20 Auto Network Gijutsu Kenkyusho:Kk 回路体の形成方法
CN1926928A (zh) * 2004-03-29 2007-03-07 三洋电机株式会社 电路装置及其制造方法
CN104170535A (zh) * 2012-03-19 2014-11-26 日清纺控股株式会社 电子部件的制造方法
US8929078B2 (en) * 2009-12-10 2015-01-06 Robert Bosch Gmbh Electronic control device

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Publication number Priority date Publication date Assignee Title
JP2536657B2 (ja) * 1990-03-28 1996-09-18 三菱電機株式会社 電気装置及びその製造方法
JPH0442597A (ja) * 1990-06-08 1992-02-13 Matsushita Electric Works Ltd セラミック多層配線板の製造方法
JPH05327166A (ja) * 1992-05-26 1993-12-10 Hitachi Ltd 電子部品実装方法
JPH07254775A (ja) * 1994-03-16 1995-10-03 Sankyo Seiki Mfg Co Ltd 回路基板
JPH08116153A (ja) * 1994-10-14 1996-05-07 Sony Corp プリント基板とプリント基板製造方法
JP3628058B2 (ja) * 1995-03-09 2005-03-09 シチズン時計株式会社 樹脂封止型半導体装置
US6518868B1 (en) * 2000-08-15 2003-02-11 Galaxy Power, Inc. Thermally conducting inductors
BRPI0100051B1 (pt) * 2001-01-11 2016-11-29 Brasil Compressores Sa gabinete de dispositivo eletrônico
DE10129788B4 (de) * 2001-06-20 2005-11-10 Siemens Ag Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts
US6724631B2 (en) * 2002-04-22 2004-04-20 Delta Electronics Inc. Power converter package with enhanced thermal management
JP4261213B2 (ja) * 2003-02-14 2009-04-30 株式会社オートネットワーク技術研究所 回路構成体の製造方法
TWI230425B (en) * 2004-02-06 2005-04-01 South Epitaxy Corp Bumping process for light emitting diode
US7310233B2 (en) * 2005-01-28 2007-12-18 Tyco Electronics Power Systems Apparatus and method for transferring heat from an electrical module
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
JP5512082B2 (ja) * 2007-12-17 2014-06-04 株式会社東芝 半導体装置の製造方法及び半導体装置
DE102011012673A1 (de) * 2010-03-17 2011-09-22 Hitachi Automotive Systems, Ltd. Elektronische Steuereinrichtung für Fahrzeuge
JP5408502B2 (ja) * 2010-09-06 2014-02-05 株式会社デンソー 電子制御ユニット
KR101407194B1 (ko) * 2013-05-10 2014-06-12 현대오트론 주식회사 차량의 전자제어장치
JP6278695B2 (ja) * 2013-12-26 2018-02-14 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004147416A (ja) * 2002-10-23 2004-05-20 Auto Network Gijutsu Kenkyusho:Kk 回路体の形成方法
CN1926928A (zh) * 2004-03-29 2007-03-07 三洋电机株式会社 电路装置及其制造方法
US8929078B2 (en) * 2009-12-10 2015-01-06 Robert Bosch Gmbh Electronic control device
CN104170535A (zh) * 2012-03-19 2014-11-26 日清纺控股株式会社 电子部件的制造方法

Also Published As

Publication number Publication date
JP2017060256A (ja) 2017-03-23
CN108029216A (zh) 2018-05-11
US20190045635A1 (en) 2019-02-07
US10334734B2 (en) 2019-06-25
DE112016004181T5 (de) 2018-05-30
JP6528620B2 (ja) 2019-06-12
WO2017047373A1 (ja) 2017-03-23

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Granted publication date: 20200317