CN107924921B - 基于金属栅极工艺的低成本闪速存储器制造流程 - Google Patents
基于金属栅极工艺的低成本闪速存储器制造流程 Download PDFInfo
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/819,401 | 2015-08-05 | ||
| US14/819,401 US9431253B1 (en) | 2015-08-05 | 2015-08-05 | Fabrication flow based on metal gate process for making low cost flash memory |
| PCT/US2016/045895 WO2017024274A1 (en) | 2015-08-05 | 2016-08-05 | Low cost flash memory fabrication flow based on metal gate process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107924921A CN107924921A (zh) | 2018-04-17 |
| CN107924921B true CN107924921B (zh) | 2022-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680045464.1A Active CN107924921B (zh) | 2015-08-05 | 2016-08-05 | 基于金属栅极工艺的低成本闪速存储器制造流程 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9431253B1 (enExample) |
| JP (1) | JP7021821B2 (enExample) |
| CN (1) | CN107924921B (enExample) |
| WO (1) | WO2017024274A1 (enExample) |
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| KR102568562B1 (ko) * | 2017-01-24 | 2023-08-18 | 삼성전자주식회사 | 반도체 장치 |
| US10868027B2 (en) * | 2018-07-13 | 2020-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and method for preventing silicide contamination during the manufacture of micro-processors with embedded flash memory |
| EP3742476B1 (en) * | 2019-05-20 | 2024-11-06 | Infineon Technologies AG | Method of implanting an implant species into a substrate at different depths |
| CN113130516A (zh) | 2020-01-15 | 2021-07-16 | 联华电子股份有限公司 | 半导体影像感测元件及其制作方法 |
| US20250351346A1 (en) * | 2024-05-10 | 2025-11-13 | Stmicroelectronics International N.V. | Non-volatile memory cell with single poly floating gate and contact control gate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518942A (en) * | 1995-02-22 | 1996-05-21 | Alliance Semiconductor Corporation | Method of making flash EPROM cell having improved erase characteristics by using a tilt angle implant |
| KR0179175B1 (ko) * | 1995-10-05 | 1999-03-20 | 문정환 | 반도체 메모리 장치 및 제조방법 |
| EP1005079B1 (en) * | 1998-11-26 | 2012-12-26 | STMicroelectronics Srl | Process for integrating in a same chip a non-volatile memory and a high-performance logic circuitry |
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| JP4829015B2 (ja) * | 2006-06-20 | 2011-11-30 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| JP2008205379A (ja) | 2007-02-22 | 2008-09-04 | Toshiba Corp | 不揮発性半導体メモリ及びその製造方法 |
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| JP5167721B2 (ja) | 2007-08-10 | 2013-03-21 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
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| US20120223381A1 (en) | 2011-03-03 | 2012-09-06 | Lu Hau-Yan | Non-volatile memory structure and method for manufacturing the same |
| JP2013197533A (ja) | 2012-03-22 | 2013-09-30 | Toshiba Corp | 記憶装置及びその製造方法 |
| US8930866B2 (en) * | 2013-03-11 | 2015-01-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of converting between non-volatile memory technologies and system for implementing the method |
| US9236453B2 (en) | 2013-09-27 | 2016-01-12 | Ememory Technology Inc. | Nonvolatile memory structure and fabrication method thereof |
-
2015
- 2015-08-05 US US14/819,401 patent/US9431253B1/en active Active
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2016
- 2016-07-29 US US15/223,109 patent/US10211303B2/en active Active
- 2016-08-05 JP JP2018506188A patent/JP7021821B2/ja active Active
- 2016-08-05 CN CN201680045464.1A patent/CN107924921B/zh active Active
- 2016-08-05 WO PCT/US2016/045895 patent/WO2017024274A1/en not_active Ceased
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| US20170040332A1 (en) | 2017-02-09 |
| JP7021821B2 (ja) | 2022-02-17 |
| JP2018526821A (ja) | 2018-09-13 |
| US10211303B2 (en) | 2019-02-19 |
| US9431253B1 (en) | 2016-08-30 |
| CN107924921A (zh) | 2018-04-17 |
| WO2017024274A1 (en) | 2017-02-09 |
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