CN107891427B - Robot arm and transfer robot - Google Patents
Robot arm and transfer robot Download PDFInfo
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- CN107891427B CN107891427B CN201710864986.0A CN201710864986A CN107891427B CN 107891427 B CN107891427 B CN 107891427B CN 201710864986 A CN201710864986 A CN 201710864986A CN 107891427 B CN107891427 B CN 107891427B
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- 229920006351 engineering plastic Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
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- 239000012080 ambient air Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Provided are a robot arm and a transfer robot, which prevent adhesion of machining chips. The plate-shaped robot arm (2) is provided with a first holding unit (21) which makes air flow along one surface (211a) to perform non-contact adsorption holding on the wafer; and a second holding unit (22) for sucking and holding the wafer on the other surface (221a), wherein the holding unit (21) comprises: a first plate member (211); a groove (213) formed in one surface, one end of which opens to the outer periphery of the plate member; a discharge port (214) for discharging air from the other end of the groove toward one end; and a supply passage (215) formed inside the holding unit and communicating the discharge port with a first connection port (216) of the mounting portion (12), wherein the holding unit (22) has: a second plate member (221); a suction port (224) which communicates the other surface with a suction source (61); and a suction passage (223) formed inside the holding unit and communicating the suction port (224) with a second connection port (226) provided in a mounting section (12) attached to the robot (1).
Description
Technical Field
The present invention relates to a robot arm for holding a wafer in a processing apparatus or the like and a transfer robot for holding a wafer by the robot arm and transferring the wafer.
Background
In a processing apparatus such as a cutting apparatus or a grinding apparatus for processing a semiconductor wafer or the like, for example, a plate-shaped workpiece is taken out from the inside of a cassette mounted on a cassette stage and conveyed to a holding table, or after the processing of the plate-shaped workpiece is completed, the processed plate-shaped workpiece is stored in the cassette. Further, in the processing apparatus, a transfer robot that takes out a wafer from a cassette or stores a wafer in a cassette is arranged, and the transfer robot has a robot arm having a holding surface that sucks and holds a wafer on one surface (see, for example, patent document 1).
Patent document 1: japanese patent laid-open publication No. 2013-198960
The robot arm described in patent document 1 has a suction port formed in the holding surface thereof, and a communication passage formed therein for communicating the holding surface with a suction source constituted by a vacuum generator or the like. In a state where the holding surface is brought into contact with the wafer, a suction force generated by the suction source is transmitted to the suction port on the holding surface, and the robot arm can suction and hold the wafer.
Here, if the wafer has a warp or a front surface becomes uneven, suction holding cannot be performed. Therefore, air may be ejected from the holding surface of the robot arm to generate the bernoulli effect, thereby performing suction holding. However, such a robot arm needs to eject a large amount of air, and the thickness of the flow path for circulating the air in the robot arm is increased, so that the robot arm may not enter the box. In addition, in the invention of japanese patent No. 4299111, for example, the holding part is inserted into the cassette, but since the thickness of the robot arm is thick, when the thickness of the wafer is thick, it is impossible to insert into the cassette.
In addition, in the case where the processing apparatus including the transfer robot is, for example, a grinding apparatus, grinding chips generated by grinding may adhere to a wafer after processing as a transfer target, and when the wafer is sucked and held by bringing the robot arm into contact with the surface to be ground of the wafer, the grinding chips may adhere to the holding surface of the robot arm. Further, the robot arm in a state where the grinding chips are attached to the holding surface sucks and holds a new wafer before processing, and the grinding chips may be attached to the wafer before processing.
Therefore, the following problems are present in a robot arm that holds a wafer to be transferred, the robot arm being provided in a transfer robot provided in a processing apparatus: the wafer cassette is capable of being inserted into a cassette to take in and out a wafer, and is capable of carrying the wafer without contaminating a holding surface by adhesion of processing chips such as grinding chips to the holding surface and without adhesion of the processing chips to a newly processed wafer.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a robot arm and a transfer robot that ensure that machining chips do not adhere to a newly machined wafer.
The present invention for solving the above problems is a plate-shaped robot arm including: one surface for holding the wafer by suction; and a mounting portion mounted on a robot, wherein the robot arm has a holding unit that communicates the one surface with an air supply source, ejects air, and generates a negative pressure by flowing the air in a direction of the one surface to suction-hold the wafer, the holding unit including: a groove having one end opened at an outer peripheral edge on one face; an air ejection port that ejects air from the other end of the groove toward the one end; and an air supply path formed inside the holding unit, the air supply path communicating the air ejection port with the connection port of the mounting portion, the air ejected from the air ejection port being circulated in the groove to generate a negative pressure on the one surface, thereby sucking and holding the wafer, the robot arm being capable of taking out the wafer from the cassette in which the wafer is stored in the shelf shape and storing the wafer in the cassette.
Preferably, the robot arm includes a switching unit that switches between a first air flow rate at which the air ejected from the air ejection port is circulated through the groove and the wafer is sucked and held by the one surface in a non-contact manner, and a second air flow rate at which the air larger than the first air flow rate is circulated through the groove and the wafer is sucked and held by the one surface, and the switching unit switches between the first air flow rate and the second air flow rate to selectively perform the suction and holding with respect to the non-contact and the contact.
Further, the present invention is a robot arm which is a plate-shaped robot arm including: one surface for holding the wafer by suction; another surface for sucking and holding the wafer; and a mounting part mounted on the robot, wherein the robot arm comprises: a first holding unit which communicates the one surface with an air supply source, ejects air, and generates a negative pressure by flowing the air in a direction of the one surface to suction-hold the wafer; and a second holding unit that communicates the other surface with a suction source to suction and hold the wafer, the first holding unit including: a plate-shaped first plate member; a groove formed such that one end thereof opens to an outer peripheral side of the first plate member on the one surface; an air ejection port that ejects air from the other end of the groove toward the one end; and an air supply path formed inside the first holding unit and communicating the air ejection port with the first connection port of the mounting portion, the second holding unit including: a plate-shaped second plate member; a suction port for communicating the other surface with a suction source; and a suction passage formed inside the second holding unit and communicating the suction port with the second connection port of the mounting portion.
Further, the present invention for solving the above problems is a transfer robot for transferring a wafer, the transfer robot including a holder to which the mounting portion of the robot arm is attached, the transfer robot including: a communication path selectively communicating with the suction source and the air supply source via a valve connected to one end of the communication path; and a coupling unit that is connected to the other end of the communication path and couples the communication destination of the communication path to the first connection port and the second connection port of the robot arm attached to the holder, the coupling unit including: a branching portion that branches the communication path into two; a first pipe connecting the branch portion and the first connection port; a first check valve disposed in the first pipe and blocking a flow of air in a direction from the first connection port toward the branch portion; a second pipe connecting the branch portion and the second connection port; a throttle valve disposed in the second pipe; and a second check valve that is disposed in the second pipe in parallel with the throttle valve and blocks the flow of air in a direction from the branch portion toward the second connection port.
The robot arm of the present invention has a holding unit that communicates one surface with an air supply source, ejects air, and generates a negative pressure by flowing the air in one surface direction to suction-hold a wafer, the holding unit including: a groove having one end opened at an outer peripheral edge on one face; an air ejection port that ejects air from the other end of the groove toward the one end; and an air supply path formed inside the holding unit, communicating the air ejection port with the connection port of the mounting portion, and allowing air ejected from the air ejection port to flow through the groove to generate a negative pressure on one surface by the bernoulli effect to suction-hold the wafer.
The robot arm of the present invention includes a first holding unit that communicates the one surface with an air supply source, and causes air to be ejected and air to flow along the one surface to generate a negative pressure, thereby performing suction holding of the wafer; and a second holding unit that communicates the other surface with a suction source to suction and hold the wafer, the first holding unit including: a plate-shaped first plate member; a groove formed such that one end thereof opens to an outer peripheral side of the first plate member on the one surface; an air ejection port that ejects air from the other end of the groove toward one end; and an air supply path formed inside the first holding unit and communicating the air discharge port with the first connection port of the mounting portion, the second holding unit including: a plate-shaped second plate member; a suction port for communicating the other surface with a suction source; and a suction passage formed inside the second holding unit and communicating the suction port with the second connection port of the mounting portion. Therefore, the robot arm according to the present invention can selectively hold a wafer in a contact state or in a non-contact state during holding of the wafer, and for example, can carry the wafer by bringing the wafer before processing into contact with the second holding means and performing suction holding, and can carry the wafer after processing with grinding chips or the like attached thereto by suction holding the wafer after processing in a non-contact manner by the first holding means without attaching the grinding chips to the robot arm. Further, since the robot arm is not contaminated with grinding chips and the like adhering to the wafer after grinding, the robot arm can be prevented from adhering the grinding chips to the wafer newly subjected to processing.
The transfer robot of the present invention is an optimum device configuration for effectively operating the robot arm of the present invention, and can transfer a wafer to a predetermined transfer position without attaching grinding chips to a newly processed wafer.
Drawings
Fig. 1 is a perspective view showing an example of a transfer robot.
Fig. 2 (a) is a perspective view showing an example of the first holding unit in a state where the bonding surface is directed upward, and fig. 2 (B) is a perspective view showing an example of the first holding unit in a state where one surface, which is a wafer suction surface, is directed upward.
Fig. 3 (a) is a perspective view showing an example of the second holding unit in a state where the bonding surface is directed upward, and fig. 3 (B) is a perspective view showing an example of the second holding unit in a state where the other surface, which is the wafer suction surface, is directed upward.
Fig. 4 is a cross-sectional view showing an example of the robot arm.
Fig. 5 is a cross-sectional view showing an example of a robot arm having a first connection port and a second connection port formed on one surface.
Fig. 6 is an explanatory diagram schematically showing the configuration of the coupling unit, the valve, and the communication path.
Fig. 7 is a plan view showing an example of the first holding unit having a rectangular outer shape.
Fig. 8 is a plan view showing an example of the first holding unit in which 1 groove is formed.
Description of the reference symbols
1: a transfer robot; 12: an installation part; 14: a support; 2: a robot arm; 21: a first holding unit; 211: a first plate member; 211 a: one face of a robot arm; 211 b: a faying surface of the first panel member; 212: a base; 213: a groove; 213 a: one end of the slot; 213 b: the other end of the slot; 214: an air outlet; 215: an air supply path; 215 a: one end of the air supply path; 215 b: the other end of the air supply path; 216: a first connection port; 22: a second holding unit; 221: a second plate member; 221 a: the other side of the robot arm; 221 b: a faying surface of the second panel member; 222: a base; 223: an aspiration path; 223 a: one end of the suction path; 224: a suction port; 226: a second connection port; 3: a drive section; 30: a first arm; 31: a second arm; 32: a robot arm rotation unit; 33: a first arm rotating unit; 34: a second arm rotating unit; 40: an electric motor; 40 a: a front end portion of the motor; 40 b: a rear end portion of the motor; 41: a housing; 42: an encoder; 9: a Z-axis direction moving mechanism; 7: a valve; 8: a communication path; 5: a connecting unit; 50: a branching section; 51: a first piping; 52: a second pipe; 53: a first check valve; 54: a throttle valve; 55: a second check valve; 60: an air supply source; 61: an attraction source; w: a wafer; wa: a front side of the wafer; wb: the back side of the wafer; t: a holding table; t1: an adsorption part; t1 a: a holding surface; t2: a frame body.
Detailed Description
The transfer robot 1 shown in fig. 1 is disposed, for example, in a grinding apparatus not shown, and performs the following operations: the wafers W stored in the cassette in the form of shelves are carried out of the cassette, held by a plate-like robot arm 2 and stored in the cassette, or carried to a holding table T. The plate-shaped robot arm 2 of the transfer robot 1 includes: a first surface 211a for holding the wafer W by suction in a non-contact manner; another surface 221a for holding the wafer by suction; and a mounting portion 12 mounted on the transfer robot 1.
The wafer W shown in fig. 1 is, for example, a semiconductor wafer having a circular plate-like outer shape, and a plurality of devices are formed on the front surface Wa of the wafer W, and, for example, a protective tape, not shown, is bonded to the front surface Wa to protect the front surface Wa. The back surface Wb of the wafer W is a surface to be processed by grinding or the like.
The robot arm 2 shown in fig. 1 includes: a first holding unit 21 that communicates the one surface 211a facing downward in fig. 1 with the air supply source 60, ejects air, and generates a negative pressure by flowing the air along the one surface 211a to suction-hold the wafer W; and a second holding unit 22 for holding the wafer W by suction by communicating the other surface 221a facing upward in fig. 1 with the suction source 61.
The first holding unit 21 shown in fig. 2 (a) and (B) can hold the wafer W by suction in a non-contact manner by using the bernoulli principle. The first holding unit 21 includes, for example, a plate-shaped first plate member 211, the plate-shaped first plate member 211 is made of engineering plastic such as acrylic or polycarbonate, or stainless steel, and is formed into a substantially circular shape having an outer diameter substantially equal to the outer diameter of the disc-shaped wafer W shown in fig. 1, and a rectangular base 212 is integrally formed on the outer peripheral portion of the first plate member 211. The surface of the one surface 211a of the first plate member 211 may be smoothly finished, and an end portion (ridge) of the one surface 211a of the first plate member 211 may be chamfered so as not to damage the wafer W when the first plate member 211 is brought into contact with the wafer W. The outer shape of the first holding unit 21 is not limited to a substantially circular shape, and may be formed in a triangular cross shape in which a part of a circle is partially cut off, as shown by a chain line L2 in fig. 2 (B), for example.
A groove 213 is formed in one surface 211a of the first plate member 211, and one end 213a of the groove 213 is open to the outer peripheral side of the first plate member 211. The surface of the first plate member 211 opposite to the one surface 211a serves as a contact surface 211b that contacts the second holding unit 22 shown in fig. 1. The grooves 213 extend radially at equal angles (for example, 120 degrees) in three directions from the center of the first surface 211a toward the radial outer side of the first plate member 211, and have a depth of about equal to the middle portion in the thickness direction (Z-axis direction) of the first plate member 211 from the first surface 211 a. The width and depth of each groove 213 have a constant profile of the same size. The number of the grooves 213 to be formed is not limited to the number in the present embodiment, and four or more grooves may be radially formed on the one surface 211a at uniform intervals in the circumferential direction. Further, by narrowing a part of the width of the groove 213, the air passing through the groove 213 may be accelerated by the narrowed part. When the first holding unit 21 and the second holding unit 22 shown in fig. 3 (a) and (B) are combined, the portion of the base 212 on the-Y direction side of the imaginary line L1 forms the mounting portion 12 shown in fig. 1, and the mounting portion 12 is mounted to the transfer robot 1. Further, for example, a guide portion may be provided at an outer peripheral end portion of the first plate member 211, the guide portion contacting an outer peripheral region of the wafer W to regulate movement of the wafer W in the planar direction of the first plate member 211 (i.e., lateral sliding of the wafer W). The guide portions are made of, for example, rubber or sponge, and are fixed to the outer peripheral end portion of the first plate member 211 at regular intervals in the circumferential direction so as to be shifted from the one end 213a of the groove 213 (for example, four guide portions are fixed at 90-degree intervals).
The other end 213b of each groove 213 communicates with each air ejection port 214 formed in the center of the one surface 211 a. Each air ejection port 214 is opened radially outward of the one surface 211a, and horizontally ejects air from the other end 213 of each groove 213 toward the one end 213 a. For example, the area of the air ejection port 214 is formed smaller than the cross-sectional area of the air supply path 215. Instead of forming the air ejection ports 214 on the one surface 211a as in the present embodiment, for example, a removable nozzle pad may be disposed on the one surface 211a of the first plate member 211, and the air ejection ports 214 may be formed on the nozzle pad.
As shown in fig. 2 (a), an air supply passage 215 through which air flows is formed to extend linearly inside the first holding unit 21, i.e., from inside the first plate member 211 to inside the base portion 212. The air supply path 215 is not open to the contact surface 211b of the first holding unit 21. One end 215a of the air supply passage 215 is formed to extend from the inside of the base 212 toward the one surface 211a, and communicates with a first connection port 216 that opens at the one surface 211 a. As shown in fig. 2 (B), the other end 215B of the air supply passage 215 communicates with each air outlet 214. The first connection port 216 communicates with the air supply source 60 shown in fig. 1. Further, an orifice or the like for accelerating the air passing through the air supply passage 215 may be formed in the air supply passage 215.
The second holding unit 22 shown in fig. 3 (a) and (B) includes, for example, a plate-shaped second plate member 221, and the second holding unit 22 has the same shape as the first holding unit 21, in which the plate-shaped second plate member 221 is made of engineering plastic such as acrylic or polycarbonate, or stainless steel, and is formed in a substantially circular shape having an outer diameter substantially equal to the outer diameter of the disc-shaped wafer W. In addition, an end portion (ridge) of the other surface 221a of the second plate member 221 may be chamfered so as not to damage the wafer W when the second plate member 221 contacts the wafer W. The second plate member 221 has a bonding surface 221B bonded to the bonding surface 211B of the first plate member 211 shown in fig. 2 (a) and (B), and the surface on the opposite side of the bonding surface 221B serves as the other surface 221a to which the robot arm 2 sucks and holds the wafer W. The outer shape of the second holding means 22 is not limited to a substantially circular shape, and for example, when the shape of the first holding means 21 is formed in a triangular cross shape in which a part of a circle is partially cut off as shown by a virtual dashed line L2 in fig. 2 (B), the second holding means 22 is preferably formed in a triangular cross shape in the same manner.
A rectangular base 222 is integrally formed on the outer peripheral portion of the second plate member 221. As shown in fig. 3 (a), a suction path 223 is formed from the inside of the second holding unit 22, that is, from the inside of the base 222 to the inside of the second plate member 221. The suction passage 223 is formed to extend linearly toward the inside of the second plate member 221 inside the base 222 and to extend in an arc shape along the outer periphery of the second plate member 221 inside the second plate member 221. Further, the suction passage 223 is not opened in the contact surface 221b of the second holding unit 22.
The second plate member 221 is provided with a plurality of suction ports 224, and the suction ports 224 communicate the other surface 221a of the second plate member 221 with a suction source 61 shown in fig. 1, which is constituted by a compressor, a vacuum generator, and the like. The suction ports 224 are, for example, a set of 9 in total of 3 × 3, and each suction port 224 is formed to penetrate from the suction passage 223 toward the other surface 221a and communicates with the suction passage 223. For example, a total of 9 suction ports 224 are opened at three locations separated by a uniform angle (for example, 120 degrees) in the circumferential direction at the outer peripheral portion of the other surface 221 a. The shape of the suction passages 223 and the number and arrangement of the suction ports 224 are not limited to those in the present embodiment, and the suction passages 223 may extend linearly toward the center in the second plate member 221 inside the base 222 and radially outward at a uniform angle from the center in the second plate member 221. The suction ports 224 may be opened at four or more positions separated by a uniform angle in the circumferential direction at the outer peripheral portion of the other surface 221a, or the diameter of the suction ports 224 may be increased so that the ports are opened at three positions separated by 120 degrees in the circumferential direction at the outer peripheral portion of the other surface 221 a. Further, an annular suction pad made of an elastic member such as rubber may be disposed on each suction port 224.
One end 223a of the suction path 223 on the base 222 side shown in fig. 3 (a) is formed from the inside of the base 222 toward the other surface 221a, and communicates with the second connection port 226 that opens to the other surface 221 a. When the second holding unit 22 and the first holding unit 21 are combined, the portion of the base 222 on the-Y direction side of the imaginary line L1 is attached to the attachment portion 12 shown in fig. 1 of the transfer robot 1.
In a state where the first holding unit 21 shown in fig. 2 (a) and (B) and the second holding unit 22 shown in fig. 3 (a) and (B) are overlapped, as shown in fig. 4, the bonding surface 211B of the first holding unit 21 and the bonding surface 221B of the second holding unit 22 are bonded with an appropriate adhesive, and the robot arm 2 is assembled from the first holding unit 21 and the second holding unit 22. Further, screw holes or the like may be formed in the first holding unit 21 and the second holding unit 22 so that the first holding unit 21 and the second holding unit 22 are bonded to each other by screws or the like.
In the present embodiment, the robot arm 2 is configured by bonding two plates, i.e., the first plate member 211 and the second plate member 221, but the first holding unit 21 and the second holding unit 22 may be configured by one plate without bonding.
In the present embodiment, the first connection port 216 is formed on the first surface 211a and the second connection port 226 is formed on the second surface 221a, but the first connection port 216 and the second connection port 226 may be formed on either the first surface 211a or the second surface 221 a. For example, as shown in fig. 5, the first connection port 216 and the second connection port 226 may be formed on the other surface 221 a.
The transfer robot 1 shown in fig. 1 includes a drive unit 3, and the drive unit 3 moves the robot arm 2 to a predetermined position. The driving unit 3 is constituted by, for example, a first arm 30, a second arm 31, a robot arm rotating unit 32 for rotating the robot arm 2 in the horizontal direction, a first arm rotating unit 33, and a second arm rotating unit 34, and its operation is controlled by a control unit, not shown, constituted by a storage element such as a CPU and a memory.
The upper surface of one end of the first arm 30 is coupled to a shaft-shaped robot arm rotating unit 32. An upper surface of one end of the second arm 31 is connected to a lower surface of the other end of the first arm 30 via a first arm rotating unit 33. A second arm rotating unit 34 is coupled to a lower surface of the other end of the second arm 31. The second arm rotating unit 34 is disposed on the Z-axis direction moving mechanism 9.
The robot arm rotating unit 32 horizontally rotates the robot arm 2 with respect to the first arm 30 by a rotational force generated by a not-shown rotation driving source. The first arm rotating unit 33 horizontally rotates the first arm 30 with respect to the second arm 31 by a rotational force generated by a not-shown rotational driving source. The second arm rotating unit 34 horizontally rotates the second arm 31 with respect to the Z-axis direction moving mechanism 9 by a rotational force generated by a not-shown rotation driving source. The operation of the Z-axis direction moving mechanism 9 is controlled by the control unit, and the robot arm 2 is moved up and down in the Z-axis direction on a grinding apparatus not shown.
A housing 41 is fixed to the upper end side of the robot arm rotation unit 32, and the housing 41 rotatably supports a motor 40 having an axial center in the Y-axis direction orthogonal to the vertical direction (Z-axis direction). A rear end portion 40b of the motor 40 and an encoder 42 connected to the rear end portion 40b of the motor 40 and configured to rotationally drive the motor 40 are housed in the case 41. A tip portion 40a of the motor 40 protrudes from the housing 41 in the-Y direction, and the bracket 14 to which the mounting portion 12 of the robot arm 2 is attached is connected to the tip portion 40 a. As the encoder 42 rotates the motor 40, the robot arm 2 connected to the motor 40 via the stand 14 rotates, and the one surface 211a of the robot arm 2 and the other surface 221a of the robot arm 2 can be vertically reversed. The motor 40 may be configured to be movable in the horizontal direction from the housing 41 by an air cylinder or the like, for example.
The first connection port 216 of the first holding unit 21 and the second connection port 226 of the second holding unit are connected to the coupling unit 5 of the robot arm 2 attached to the stand 14, which switches the first connection port 216 and the second connection port 226. For example, the other end 8a of the communication path 8, which is formed of a flexible resin tube, a metal pipe, or the like, is connected to the connection unit 5 disposed on the holder 14. The communication path 8 is provided with a pipe in a bendable manner using a rotary joint or the like, not shown, in the driving unit 3. Alternatively, a pipe is disposed outside the driving unit 3 so as to be bendable, and the other end 8b of the communication path 8 selectively communicates with the suction source 61 and the air supply source 60 via the valve 7 fixed to the side surface of the second arm rotating unit 34 of the driving unit 3.
The valve 7 shown in fig. 1 and 6 functions to switch the communication destination with the communication path 8 to either one of the suction source 61 and the air supply source 60, and the valve 7 is, for example, a solenoid (electromagnet) valve as shown in fig. 6, and a current flows through the electromagnet to generate a magnetic force, and a spool in the valve is pulled and moved by the magnetic force, so that the flow path of air can be switched to communicate with either one of the suction source 61 and the air supply source 60. In addition, the valve 7 is not limited to a solenoid valve.
As shown in fig. 6, the coupling unit 5 that communicates with either one of the suction source 61 and the air supply source 60 via the valve 7 and the communication path 8 includes: a branching portion 50 that branches the communication path 8 into two; a first pipe 51 connecting the branch portion 50 and the first connection port 216; a first check valve 53 disposed in the first pipe 51 and blocking the flow of air in a direction from the first connection port 216 toward the branch portion 50; a second pipe 52 connecting the branch portion 50 and the second connection port 226; a throttle valve 54 disposed in the second pipe 52; and a second check valve 55 that is disposed in the second pipe 52 in parallel with the throttle valve 54 and blocks the flow of air from the branch portion 50 toward the second connection port 226.
Hereinafter, the operation of the robot arm 2 and the operation of the transfer robot 1 when the wafer W is held by the robot arm 2 shown in fig. 1 and the wafer W is transferred by the transfer robot 1 will be described.
First, the motor 40 rotates the coupling unit 5 to set the robot arm 2 in a state where the other surface 221a faces downward. Next, the Z-axis direction moving mechanism 9 shown in fig. 1 moves the transfer robot 1 in the Z-axis direction to position the transfer robot 1 so that the back surface Wb of the wafer W accommodated in a wafer cassette or the like, not shown, faces the other surface 221a of the robot arm 2.
Next, the drive unit 3 rotates the robot arm 2, and positions the robot arm 2 so that, for example, the center of the back surface Wb of the wafer W is located within a triangle connecting the suction ports 224 located at three positions on the other surface 221 a. The robot arm 2 is lowered in the-Z direction, and the other surface 221a comes into contact with the back surface Wb of the wafer W.
The transfer robot 1 is set in a state in which the suction source 61 and the communication path 8 are communicated with each other by the valve 7, performs suction by the suction source 61 shown in fig. 1 and 6, and generates a flow of air in a direction from the other surface 221a toward the suction source 61 in the flow path constituted by the suction port 224, the suction path 223, the second connection port 226, the connection unit 5, the communication path 8, and the valve 7. Inside the coupling unit 5, the second check valve 55 disposed in the second pipe 52 shown in fig. 6 is opened, and air in a direction from the other surface 221a toward the suction source 61 passes through the second check valve 55. Since the first check valve 53 in the first pipe 51 is not opened, no air flows through the first pipe 51. By generating the air flow in the direction from the other surface 221a toward the suction source 61, a suction force is generated on the other surface 221a of the second plate member 221, and the wafer W is sucked and held by the robot arm 2 in a contact state by the suction force.
The drive unit 3 drives the robot arm 2, and carries the wafer W sucked and held by the robot arm 2 out of a wafer cassette, not shown, and onto the holding table T shown in fig. 1. The holding table T shown in fig. 1 has, for example, a circular outer shape, and includes: a holding portion T1 which is made of a porous member or the like and which sucks and holds the wafer W; and a frame T2 supporting the holding portion T1. The robot arm 2 that suctions and holds the back surface Wb of the wafer W places the wafer W on the holding table T so that the back surface Wb of the wafer W faces upward. The holding unit T1 communicates with a suction source, not shown, and the suction force generated by the suction from the suction source is transmitted to the holding surface T1a, so that the holding table T sucks and holds the wafer W on the holding surface T1 a. Further, the suction by the suction source 61 is stopped, and the suction source 61 and the air supply source 60 are switched by the valve 7 so that the communication passage 8 in a state of communicating with the suction source 61 communicates with the air supply source 60. The air supply source 60 supplies air to the coupling unit 5 via the valve 7 and the communication passage 8. The supplied air passes through the throttle valve 54 of the coupling unit 5, and a small amount of air is ejected downward from the other surface 221a of the robot arm 2 through the second connection port 226, the suction passage 223, and the suction port 224. The vacuum suction force remaining between the other surface 221a and the wafer W is broken by the jet pressure of the air, and the wafer W can be reliably detached from the robot arm 2. Then, the wafer W is separated from the other surface 221a of the robot arm 2, the holding table T holds the wafer W, and the robot arm 2 retracts from above the holding table T.
In addition, when air is supplied from the air supply source 60 as described above, air is ejected from the other surface 221a, and air is also ejected from the one surface 211 a.
The wafer W held by the holding table T with the rear surface Wb facing upward is ground from the rear surface Wb side by a grinding unit not shown, and is thinned to a predetermined thickness. During grinding, the rear surface Wb of the wafer W is cleaned with the cleaning water, but grinding chips that have not been completely cleaned adhere to the rear surface Wb of the wafer W. The wafer W after the grinding process is carried out of the holding table T by the transfer robot 1.
When the wafer W is carried out of the holding table T, first, the motor 40 rotates the coupling unit 5, and the robot arm 2 is set in a state in which the one surface 211a faces downward. Next, the drive unit 3 rotates the robot arm 2, and the Z-axis direction movement mechanism 9 shown in fig. 1 moves the transfer robot 1 in the Z-axis direction, thereby positioning the transfer robot 1 so that the back surface Wb of the wafer W held on the holding table T with the back surface Wb side facing upward faces the one surface 211a of the robot arm 2.
Next, the robot arm 2 is lowered in the-Z direction to such an extent that the one surface 211a of the robot arm 2 does not contact the rear surface Wb of the wafer W. After the robot arm 2 is lowered to a predetermined position in the Z-axis direction, the air supply source 60 supplies air of a predetermined pressure to the valve 7. Since the transfer robot 1 is set in a state in which the air supply source 60 and the communication path 8 are communicated with each other by the valve 7, a flow of air in a direction from the air supply source 60 toward the first holding surface 211a is generated in a flow path constituted by the valve 7, the communication path 8, the coupling means 5, the first connection port 216, the groove 213, and the air ejection port 214. In the coupling unit 5, the first check valve 53 disposed in the first pipe 51 is opened, and the air supplied from the air supply source 60 passes through the first check valve 53. The second check valve 55 in the second pipe 52 is not opened, but a small amount of air throttled by the throttle valve 54 is discharged from the other surface 221a through the second connection port 226. That is, when air is supplied from the air supply source 60, air is ejected from both the one surface 211a and the other surface 221 a.
The air ejected from the air ejection port 214 flows at a high speed in the radial direction in each groove 213 formed in the one surface 211 a. Here, for example, since the cross-sectional area of the air supply passage 215 shown in fig. 2 (a) is smaller than the cross-sectional area of the air ejection port 214 shown in fig. 2 (B), when moving from the air supply passage 215 to the air ejection port 214, the flow velocity of air is accelerated, the static pressure is increased, and the ambient air is sucked in, and the suction force for sucking the wafer W is generated. Further, since the air flows in the linear grooves 213 in a rectified state in the radial direction at a high speed, the air around both sides of the grooves 213 is sucked into the grooves 213 by the bernoulli effect, and a negative pressure is generated in the vicinity of the grooves 213, thereby generating an attracting force to the wafer W. The robot arm 2 sucks and holds the wafer W on the one surface 211a in a non-contact state.
After the robot arm 2 performs suction holding of the wafer W in a non-contact manner, the suction holding of the wafer W by the holding table T is released. Further, the robot arm 2 is raised in the + Z direction, and the wafer W is carried out from the holding table T. The robot arm 2 that sucks and holds the processed wafer W in a non-contact manner is rotated by the drive unit 3, and the processed wafer W is conveyed to a wafer cleaning apparatus or the like. The robot arm 2 that has carried the processed wafer W moves to carry a newly processed wafer W.
Further, a throttle valve, not shown, may be provided between the air supply source 60 and the valve 7, and the flow rate of the air supplied to the check valve 53 side may be adjusted to suction and hold the wafer W in a non-contact state by the one surface 211a of the robot arm 2. In this case, the wafer W may be held by suction by increasing the flow rate of the supplied air to bring the wafer W into contact with the one surface 211 a. That is, the throttle valve may function as a switching means for switching between a first air flow rate at which the wafer is sucked and held by one surface in a non-contact manner and a second air flow rate at which air having a flow rate larger than the first air flow rate is circulated in the groove and the wafer is sucked and held by one surface in a contact manner. The wafer W is brought into contact with the one surface 211a and is sucked and held by the one surface 211a, whereby the wafer W can be prevented from sliding laterally.
As described above, the robot arm 2 of the present invention can selectively hold the wafer W in the contact state or in the non-contact state, and as described above, the wafer W before processing can be transferred by bringing the wafer W into contact with the other surface 221a of the second holding unit 22 and performing suction holding, and as described above, the wafer W after processing with grinding chips or the like adhering thereto can be transferred without adhering the grinding chips to the robot arm 2 by performing suction holding in a non-contact manner by the first holding unit 21. Further, the robot arm 2 is not contaminated by grinding chips and the like adhering to the wafer W after grinding, and the robot arm 2 can be prevented from adhering the grinding chips to the wafer W newly subjected to processing.
The transfer robot 1 of the present invention can efficiently cause the robot arm 2 to perform an operation without adhesion of grinding chips, and can transfer a wafer W to a predetermined transfer position without adhesion of grinding chips to the newly processed wafer W.
The robot arm 2 and the transfer robot 1 of the present invention are not limited to the above-described embodiments, and the size, shape, and the like of each of the structures of the robot arm 2 and the transfer robot 1 shown in the drawings are not limited thereto, and may be appropriately changed within a range in which the effects of the present invention can be exhibited. For example, as the first holding unit 21, there are various embodiments shown below.
The first holding unit 23 shown in fig. 7, for example, has: a rectangular plate-like first plate member 231 made of engineering plastic such as acrylic or polycarbonate, stainless steel, or the like; and a rectangular base 232 formed integrally with the first plate member 231. One groove 233 is formed linearly on one surface 231a of the first plate member 231 such that one end 233a opens to the outer peripheral side of the tip end of the first plate member 231, and the one surface 231a serves as a surface for sucking and holding the wafer W in a non-contact manner. An end surface of the other end 233b of the groove 233 communicates with one air ejection port 234, and the air ejection port 234 is formed in the center of the one surface 231a so as to be opened in the surface direction of the one surface 231 a. The air ejection port 234 ejects air from the other end 233b of the groove 233 toward the one end 233 a. Two air supply paths 235 through which air flows are formed to extend linearly inside the first holding unit 23, that is, from the air ejection port 234 to the base 232. As shown in fig. 7, the other ends 235a of the two air supply paths 235 join together and communicate with the air outlet port 234. One end 235b of each air supply passage 235 communicates with each first connection port 236, and each first connection port 236 is formed from the inside of the base 232 toward one surface 231a and opens at the one surface 231 a. Each first connection port 236 communicates with the air supply source 60 shown in fig. 1. Further, each air supply path 235 may be provided with an orifice or the like for accelerating air passing through the air supply path 235. Further, a suction port communicating with a suction source is provided on the other surface opposite to the one surface 231a, and a second holding unit formed in a rectangular shape similarly to the first holding unit 23 is bonded. Further, the first connection port 236 and the second connection port connected to the suction source may be provided on the same surface of either one of the one surface 231a side and the opposite surface side of the one surface 231 a.
For example, as in the first holding unit 24 shown in fig. 8, the first plate member 231 of the first holding unit 23 shown in fig. 7 may be changed to a first plate member 241 having a substantially circular plate shape and having an outer diameter substantially equal to the outer diameter of the disc-shaped wafer W shown in fig. 1. The first holding means 24 is configured in the same manner as the first holding means 23 except that the first plate member 231 is changed to the first plate member 241. The first plate member 231 shown in fig. 7 and the base portion 232 of the first plate member 241 shown in fig. 8 form a mounting portion to be mounted on the transfer robot 1 shown in fig. 1 on the-Y direction side of the imaginary line L1.
Claims (2)
1. A robot arm is a plate-shaped robot arm having one surface for sucking and holding a wafer, the other surface for sucking and holding the wafer, and a mounting portion to be mounted on a robot,
the robot arm includes:
a first holding unit which communicates the one surface with an air supply source, ejects air, and generates a negative pressure by flowing the air in a direction of the one surface to suction-hold the wafer; and
a second holding unit for communicating the other surface with a suction source to perform suction holding on the wafer,
the first holding unit has:
a plate-shaped first plate member;
a groove formed such that one end thereof opens to an outer peripheral side of the first plate member on the one surface;
an air ejection port that ejects air from the other end of the groove toward the one end; and
an air supply path formed inside the first holding unit and communicating the air ejection port with the first connection port of the mounting portion,
the second holding unit has:
a plate-shaped second plate member;
a suction port for communicating the other surface with a suction source; and
and a suction path formed inside the second holding unit and communicating the suction port with the second connection port of the mounting portion.
2. A transfer robot for transferring a wafer, comprising a holder to which the mounting part of the robot arm according to claim 1 is attached,
the transfer robot includes:
a communication path selectively communicating with the suction source and the air supply source via a valve connected to one end of the communication path; and
a connecting means connected to the other end of the communication path for connecting the communication destination of the communication path to the first connection port and the second connection port of the robot arm attached to the holder,
the connecting unit has:
a branching portion that branches the communication path into two;
a first pipe connecting the branch portion and the first connection port;
a first check valve disposed in the first pipe and blocking a flow of air in a direction from the first connection port toward the branch portion;
a second pipe connecting the branch portion and the second connection port;
a throttle valve disposed in the second pipe; and
and a second check valve that is disposed in the second pipe in parallel with the throttle valve and blocks the flow of air in a direction from the branch portion toward the second connection port.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016196279A JP6853646B2 (en) | 2016-10-04 | 2016-10-04 | Robot hand and transfer robot |
| JP2016-196279 | 2016-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107891427A CN107891427A (en) | 2018-04-10 |
| CN107891427B true CN107891427B (en) | 2022-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710864986.0A Active CN107891427B (en) | 2016-10-04 | 2017-09-22 | Robot arm and transfer robot |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6853646B2 (en) |
| KR (1) | KR102258464B1 (en) |
| CN (1) | CN107891427B (en) |
| TW (1) | TWI718335B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11254014B2 (en) * | 2017-07-21 | 2022-02-22 | Electro Scientific Industries, Inc. | Non-contact handler and method of handling workpieces using the same |
| KR102157822B1 (en) * | 2018-06-21 | 2020-09-18 | 에이피시스템 주식회사 | Substrate carrier apparatus and method |
| JP7359583B2 (en) * | 2019-07-22 | 2023-10-11 | 株式会社ディスコ | processing equipment |
| JP7339860B2 (en) | 2019-11-15 | 2023-09-06 | 株式会社ディスコ | processing equipment |
| JP7466360B2 (en) * | 2020-04-10 | 2024-04-12 | ニデックインスツルメンツ株式会社 | Industrial robot hand and industrial robot |
| CN111958615A (en) * | 2020-08-19 | 2020-11-20 | 西安奕斯伟硅片技术有限公司 | Assembly and method for conveying wafer |
| CN112743564A (en) * | 2021-01-12 | 2021-05-04 | 南京迪海智科精密机械有限公司 | Chip grabbing robot and grabbing method |
| JP2023041150A (en) | 2021-09-13 | 2023-03-24 | 株式会社ディスコ | robot hand |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295661A (en) * | 2007-04-24 | 2008-10-29 | 东京毅力科创株式会社 | Substrate attracting device and substrate transfer apparatus |
| JP2009032744A (en) * | 2007-07-24 | 2009-02-12 | Fluoro Mechanic Kk | Bernoulli chuck |
| JP2010264551A (en) * | 2009-05-15 | 2010-11-25 | Lintec Corp | Apparatus and method for transferring plate-like member |
| JP2011009423A (en) * | 2009-06-25 | 2011-01-13 | Disco Abrasive Syst Ltd | Holding table assembly and method of manufacturing holding table |
| TW201246271A (en) * | 2011-01-19 | 2012-11-16 | Tokyo Electron Ltd | Substrate reversing apparatus and substrate reversing method and detachment system and computer storage medium |
| JP2013219069A (en) * | 2012-04-04 | 2013-10-24 | Tokyo Electron Ltd | Device and method for holding substrate |
| JP2014150206A (en) * | 2013-02-04 | 2014-08-21 | Disco Abrasive Syst Ltd | Conveyance device of plate-like material |
| CN105789102A (en) * | 2015-01-13 | 2016-07-20 | 株式会社迪思科 | Conveying Apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0522552D0 (en) * | 2005-11-04 | 2005-12-14 | Univ Salford The | Handling device |
| KR20120103052A (en) * | 2011-03-09 | 2012-09-19 | 주식회사 엘지실트론 | Apparatus and method for treating wafer |
| JP2013198960A (en) | 2012-03-26 | 2013-10-03 | Disco Corp | Robot hand |
-
2016
- 2016-10-04 JP JP2016196279A patent/JP6853646B2/en active Active
-
2017
- 2017-09-05 TW TW106130304A patent/TWI718335B/en active
- 2017-09-22 CN CN201710864986.0A patent/CN107891427B/en active Active
- 2017-09-26 KR KR1020170124091A patent/KR102258464B1/en active IP Right Grant
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295661A (en) * | 2007-04-24 | 2008-10-29 | 东京毅力科创株式会社 | Substrate attracting device and substrate transfer apparatus |
| JP2009032744A (en) * | 2007-07-24 | 2009-02-12 | Fluoro Mechanic Kk | Bernoulli chuck |
| JP2010264551A (en) * | 2009-05-15 | 2010-11-25 | Lintec Corp | Apparatus and method for transferring plate-like member |
| JP2011009423A (en) * | 2009-06-25 | 2011-01-13 | Disco Abrasive Syst Ltd | Holding table assembly and method of manufacturing holding table |
| TW201246271A (en) * | 2011-01-19 | 2012-11-16 | Tokyo Electron Ltd | Substrate reversing apparatus and substrate reversing method and detachment system and computer storage medium |
| JP2013219069A (en) * | 2012-04-04 | 2013-10-24 | Tokyo Electron Ltd | Device and method for holding substrate |
| JP2014150206A (en) * | 2013-02-04 | 2014-08-21 | Disco Abrasive Syst Ltd | Conveyance device of plate-like material |
| CN105789102A (en) * | 2015-01-13 | 2016-07-20 | 株式会社迪思科 | Conveying Apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6853646B2 (en) | 2021-03-31 |
| JP2018058139A (en) | 2018-04-12 |
| KR102258464B1 (en) | 2021-06-01 |
| TWI718335B (en) | 2021-02-11 |
| TW201813794A (en) | 2018-04-16 |
| KR20180037579A (en) | 2018-04-12 |
| CN107891427A (en) | 2018-04-10 |
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