KR20120103052A - Apparatus and method for treating wafer - Google Patents

Abstract

PURPOSE: A wafer processing apparatus and a method for processing a wafer are provided to prevent contamination and damage of the wafer. CONSTITUTION: A robot arm(400) comprises a first side(401) and a second side(402). A first absorbing body(410) is placed on the first side. A first vacuum pressure generating unit provides vacuum pressure to the first absorbing body. A first senor unit sensing the absorption of a wafer is arranged on the first side. A second absorbing body(440) is placed on the second side. A second vacuum pressure generating unit provides the vacuum pressure to the second absorbing body. The robot arm comprises a first flow path(430) and a second fluid path(460).

Description

Wafer processing apparatus and wafer processing method {APPARATUS AND METHOD FOR TREATING WAFER}

Embodiments relate to a wafer processing apparatus and a method of processing a wafer.

The wafer is produced as a wafer for semiconductor device manufacturing through a series of processes. The main processes of wafer fabrication are largely slicing, lapping, etching with alkaline solution, double side grinding (DSG), light etching, polishing, And a cleaning process.

In such processes, the wafer can be transferred in various ways.

Embodiments provide a wafer processing apparatus and a method of processing a wafer to prevent contamination or damage generated during processing of the wafer.

A wafer processing apparatus according to an embodiment includes a first accommodating portion accommodating a wafer; A wafer processor which processes the wafer; A second accommodating portion accommodating a wafer processed by the wafer processing portion; And a robot arm comprising a first face for transferring the wafer from the first receptacle and a second face for transferring the processed wafer to the second receptacle.

A method of processing a wafer according to an embodiment comprises: adsorbing a wafer using a first side of a robot arm; Transferring a wafer adsorbed through the first face of the robot arm from a first receptacle; Processing the wafer transferred from the first receptacle; Adsorbing the processed wafer using a second side of the robot arm; And transferring the wafer adsorbed through the second face of the robot arm to a second receptacle.

The wafer processing apparatus according to the embodiment transfers the wafer before processing using the first side of the robot, and transfers the processed wafer using the second side.

That is, the wafer processing apparatus according to the embodiment may transfer the wafer to which the grinding process is to be performed and the wafer to which the grinding process is completed using different surfaces.

As a result, the wafer after the grinding process and / or the cleaning process is completed can be transferred to a relatively clean surface.

Therefore, the wafer processing apparatus and the method of processing the wafer according to the embodiment can easily prevent contamination and damage of the wafer.

1 illustrates a wafer grinding apparatus according to an embodiment.
2 is a perspective view of a robot according to an embodiment.
3 is a perspective view illustrating a part of a robot according to an embodiment.
4 is a plan view showing a first side of the robot arm.
5 is a plan view showing a second side of the robot arm.
FIG. 6 is a cross-sectional view taken along the line AA ′ of FIG. 3.
7 is a flowchart illustrating a process of grinding a wafer by the wafer grinding apparatus according to the embodiment.

In the description of the embodiments, in the case where each wafer, part, bar, or chuck is described as being formed "on" or "under" of each part, bar, wafer, or chuck, "On" and "under" include both being formed "directly" or "indirectly" through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 illustrates a wafer grinding apparatus according to an embodiment. 2 is a perspective view of a robot according to an embodiment. 3 is a perspective view illustrating a part of a robot according to an embodiment. 4 is a plan view showing a first side of the robot arm. 5 is a plan view showing a second side of the robot arm. FIG. 6 is a cross-sectional view illustrating a cross section taken along line AA ′ in FIG. 3. 7 is a flowchart illustrating a process of grinding a wafer by the wafer grinding apparatus according to the embodiment.

1 to 6, a wafer grinding apparatus according to an embodiment includes a first cassette 11, a second cassette 12, a robot 20, a centering portion 30, a transfer arm 40, and a rear cleaner. 50, a turn table 60, a grinding wheel 70, a chuck table 80, and a cleaning unit 90.

The wafer to be ground is loaded in the first cassette 11, and the first cassette 11 temporarily receives the wafer. That is, the first cassette 11 is a wafer accommodating portion for accommodating the wafer to be ground.

The second cassette 12 temporarily accommodates the wafer on which the grinding process is completed. That is, the second cassette 12 is a wafer accommodating part for accommodating the wafer on which the grinding process is completed. In addition, the temporarily received wafer is unloaded from the second cassette 12 for further processing.

The robot 20 transfers the wafer to be ground from the first cassette 11 to the centering portion 30. In addition, the robot 20 transfers the wafer from which the grinding process is completed to the second cassette 12 from the cleaning unit 90. That is, the robot 20 is a transfer device for transferring the wafer to be ground and the wafer on which the grinding process is completed.

2 to 6, the robot 20 includes a driving unit 100, a first link unit 210, a second link unit 220, a third link unit 230, and an inversion driving unit 300. ), A robot arm 400, a first vacuum pump 510 and a second vacuum pump 520.

The driving unit 100 may drive the first link unit 210, the second link unit 220, and the third link unit 230. In addition, the driving unit 100 supports the first link unit 210. The driving unit 100 may support the first vacuum pump 510 and the second vacuum pump 520. In addition, the driving unit 100 may drive the first vacuum pump 510 and the second vacuum pump 520.

The first link unit 210 is connected to the driver 100. The first link unit 210 is supported by the drive unit 100 and is driven to rotate. The first link unit 210 may be rotated about the first rotation driver 211.

The second link unit 220 is connected to the first link unit 210. In more detail, the second link unit 220 is connected to an end of the first link unit 210. The second link unit 220 is supported by the first link unit 210 and is driven to rotate. The second link unit 220 may be rotated about the second rotation driver 221.

The third link unit 230 is connected to the second link unit 220. In more detail, the third link unit 230 is connected to an end of the second link unit 220. The third link unit 230 is supported by the second link unit 220 and is driven to rotate. The third link unit 230 may be rotated about the third rotation driver 231.

The inversion driver 300 is connected to the third link unit 230. The inversion driver 300 may invert the robot arm 400. That is, the inversion driver 300 may rotate the robot arm 400 about a rotation axis in a direction in which the third link unit 230 extends. The inversion driver 300 may further include a servo motor for rotating the robot arm 400.

The robot arm 400 is connected to the inversion driver 300. The robot arm 400 may be inversely driven by the inversion driver 300. The robot arm 400 may absorb the wafer to be ground from the first cassette 11 and suck the ground and cleaned wafer from the cleaning unit 90.

As shown in FIGS. 3-6, the robot arm 400 includes a first face 401 and a second face 402. The first face 401 and the second face 402 are opposed to each other. The first side 401 is in direct contact with the wafer to be ground. The second side 402 is in direct contact with the ground and cleaned wafer.

The first surface 401 is provided with a first adsorption portion 410. The first adsorption part 410 is backing holes formed in the first surface 401. Four back holes may be formed, but are not limited thereto.

The first sensor 420 may be disposed on the first surface 401 to sense whether the wafer to be ground is adsorbed.

The second suction part 440 is provided on the second surface 402. The second adsorption part 440 is back holes formed in the second surface 402. Four back holes may be formed, but are not limited thereto.

In addition, a second sensor unit 450 may be disposed on the second surface 402 to sense whether the wafer on which the grinding process is completed is adsorbed.

In addition, the robot arm 400 includes a first flow path 430 and a second flow path 460.

The first flow path 430 is connected to the first adsorption part 410. In addition, the first flow path 430 is connected to the first hose 511, and is connected to the first vacuum pump 510 through the first hose 511. Vacuum pressure may be transmitted to the first adsorption part 410 through the first flow path 430.

The second flow path 460 is connected to the second adsorption part 440. In addition, the second flow path 460 is connected to the second hose 521, and is connected to the second vacuum pump 520 through the second hose 521. The vacuum pressure may be transmitted to the second adsorption part 440 through the second flow path 460.

The first vacuum pump 510 may be provided in the driving unit 100. The first vacuum pump 510 is connected to the first hose 511. The first vacuum pump 510 may apply a vacuum pressure to the first adsorption part 410 through the first hose 511 and the first flow path 430.

The second vacuum pump 520 may be provided in the driving unit 100. The second vacuum pump 520 is connected to the second hose 521. The second vacuum pump 520 may apply a vacuum pressure to the second adsorption part 440 through the second hose 521 and the second flow path 460.

That is, the first vacuum pump 510 and the second vacuum pump 520 generate a vacuum pressure and apply the vacuum pressure generators to the first adsorption part 410 and the second adsorption part 440. to be.

The first vacuum pump 510 and the second vacuum pump 520 separately apply a vacuum pressure to the first adsorption part 410 and the second adsorption part 440. Accordingly, when the grinding completed wafer is detached, it is possible to fundamentally prevent the phenomenon of contamination.

That is, the vacuum pressures of the first adsorption part 410 and the second adsorption part 440 are applied through different paths. Accordingly, contaminants of the first surface 401 are not ejected to the second surface 402.

In the present embodiment, the first suction part 410 is provided on the first surface 401, and the second suction part 440 is provided on the second surface 402, and the robot arm 400 is provided. Although this wafer was demonstrated to adsorb | suck by a vacuum pressure, it is not limited to this. That is, the first surface 401 may be provided with a first grip part instead of the suction part, and the second surface 402 may be provided with a second grip part. The first grip part and the second grip part may grip edge portions of the wafer. Accordingly, the robot arm 400 may grip and transfer the wafer in a grip manner instead of vacuum pressure.

The centering unit 30 centers the wafer transferred by the robot 20. The centering unit 30 centers the transferred wafer and sucks the transfer arm 40 in position.

The transfer arm 40 absorbs and transports the wafer. In more detail, the transfer arm 40 sucks the centered wafer from the centering portion 30 and causes the back cleaner 50 to be abnormal. The backside cleaner 50 cleans the backside of the transferred wafer. In addition, the transfer arm 40 transfers the wafer whose rear surface is cleaned to the chuck table 80.

In addition, the transfer arm 40 transfers the ground wafer from the chuck table 80 to the cleaning unit 90.

The chuck table 80 vacuum-absorbs the transferred wafer. The wafer vacuum-adsorbed to the chuck table 80 is positioned on the grinding wheel 70 by the rotation of the turn table 60.

Thereafter, the grinding wheel 70 grinds the wafer adsorbed on the chuck table 80. After the grinding process is completed, the turn table 60 is rotated again, and the wafer adsorbed on the other chuck table is positioned below the grinding wheel 70.

The cleaning unit 90 is ground by the grinding wheel 70 and cleans the wafer transferred by the transfer arm 40.

The centering unit 30, the transfer arm 40, the rear cleaner 50, the turn table 60, the grinding wheel 70, the chuck table 80 and the cleaning unit 90 may be Corresponds to the wafer processing unit for grinding or cleaning the wafer.

As illustrated in FIG. 7, the grinding apparatus according to the embodiment may grind the wafer by the following process.

The wafer to be ground is loaded in the first cassette 11. The robot 20 then uses the first side 401 to adsorb the wafer to be ground. That is, the wafer to be ground is adsorbed onto the first side 401.

Thereafter, the wafer adsorbed by the first surface 401 is transferred to the centering device 30 by the robot 20.

The centering device 30 then centers the transferred wafer.

Thereafter, the centered wafer is transferred to the rear cleaner 50 by the transfer arm 40. The back cleaner 50 cleans the back surface of the wafer.

Subsequently, the wafer whose rear surface is cleaned is transferred to the chuck table 80 by the transfer arm 40 and is vacuum-adsorbed. The wafer vacuum-adsorbed to the chuck table 80 is positioned on the grinding wheel 70 by the rotation of the turn table 60.

Thereafter, the grinding wheel 70 grinds the wafer adsorbed on the chuck table 80.

After the grinding process is completed, the turn table 60 is rotated again, and the wafer adsorbed on the other chuck table is positioned below the grinding wheel 70.

In addition, the ground wafer is transferred to the cleaning unit 90 by the transfer arm 40 and cleaned.

Thereafter, the robot arm 400 may be inverted so that the second surface 402 faces the wafer by the inversion driver 300.

Thereafter, the cleaned wafer is adsorbed onto the second surface 402 and transferred to the second cassette 12 by the robot 20. Thereafter, the wafer transferred to the second cassette 12 is unloaded.

As such, the grinding apparatus according to the embodiment transfers the wafer to be ground using the first surface 401 and transfers the wafer that has been ground and cleaned using the second surface 402.

That is, the grinding apparatus according to the embodiment adsorbs the wafer using different surfaces for transfer before and after the grinding process.

Therefore, the grinding apparatus according to the embodiment can easily prevent contamination and damage of the wafer, and can reduce the defective rate as a whole.

The robot 20 according to the present embodiment may be applied to various wafer processing apparatuses such as a cleaning apparatus, an etching apparatus, or a polishing apparatus, as well as a grinding apparatus. That is, the grinding apparatus according to the embodiment corresponds to a wafer processing apparatus for grinding the wafer.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

First Cassette 11 First Side 401
Second Cassette 12 Second Side 402
Robot 20 First adsorption unit 410
Centering portion 30, second adsorption portion 440
Transfer arm 40, first sensor unit 420
Rear cleaner 50, second sensor unit 450
Turntable 60 First flow path 430
Grinding Wheel 70, Second Flow Path 460
Chuck Table 80 First Hose 511
Cleaning unit (90) Second hose (521)
Driver 100
First link portion 210
Second link portion 220
Third link section 230
Inversion driver 300
Robot arm (400)
First vacuum pump 510
Second vacuum pump 520

Claims (10)

A first accommodating portion accommodating the wafer;
A wafer processor which processes the wafer;
A second accommodating portion accommodating a wafer processed by the wafer processing portion; And
And a robot arm comprising a first face for transferring the wafer from the first receptacle and a second face for transferring the processed wafer to the second receptacle. The method of claim 1, wherein the robot arm is
A first adsorption part provided on the first surface; And
Wafer processing apparatus including a second adsorption portion provided on the second surface. 3. The apparatus of claim 2, further comprising: a first vacuum pressure generating unit providing a vacuum pressure to the first adsorption unit; And
And a second vacuum pressure generator configured to provide a vacuum pressure to the second suction part. The wafer processing apparatus of claim 1, wherein the wafer processing unit comprises a grinding unit for grinding the wafer. The method of claim 1, further comprising a cleaning unit for cleaning the processed wafer,
The robot arm transfers the wafer cleaned by the cleaning unit to the second housing unit using the second surface. The wafer processing apparatus of claim 1, further comprising an inversion driver configured to invert the robot arm. Using the first side of the robotic arm to adsorb the wafer;
Transferring a wafer adsorbed through the first face of the robot arm from a first receptacle;
Processing the wafer transferred from the first receptacle;
Adsorbing the processed wafer using a second side of the robot arm; And
Transferring the wafer adsorbed through the second face of the robot arm to a second receptacle. 8. The method of claim 7, wherein the adsorbed wafer is transferred from the first receptacle,
And the robotic arm processes the wafer to be inverted. 8. The method of claim 7, wherein processing the wafer comprises grinding the wafer. 8. The method of claim 7, wherein processing the wafer comprises cleaning the wafer.

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