JP2022163857A - Substrate processing apparatus - Google Patents

Abstract

To provide a substrate processing apparatus having a static elimination unit in which the efficiency of eliminating static electricity from a substrate is enhanced while eliminating the increase in size and cost of an apparatus.SOLUTION: A substrate processing apparatus 1 includes a table 30 for holding the lower surface of a substrate 19, a transfer unit 52 for holding the upper surface of the substrate 19 and carrying the substrate 19 into and out of the table 30, a unit 21 which has a first air injection port 29 for injecting ionized air, and spraying ionized air onto the substrate 19 to perform static elimination on the substrate, an air injection unit 61 which has a second air injection port 69 for injecting air in a direction intersecting with the ionized air injected from the static elimination unit 21, and can change the traveling direction of the ionized air. In either a state where the substrate 19 is held on the table 30 or a state where the substrate 19 is held by the transfer unit 52, the direction of the ionized air jetted from the static elimination unit 21 is changed by the air jetting unit 61, whereby it is possible to spray the ionized air onto the substrate 19 regardless of whether the substrate 19 is held on the table 30 or by the transfer unit 52.SELECTED DRAWING: Figure 1

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus having a static elimination unit that alleviates charging of a substrate.

In a substrate processing apparatus that cuts or grinds a substrate such as a semiconductor wafer, the substrate is unloaded from the holding surface of the holding table. There is a risk that the device formed in the For this reason, it is necessary to blow ionized air onto the substrate to remove static electricity. A changing mechanism has been proposed (see Patent Document 1, for example).

JP 2012-049359 A

However, in order to move the static elimination unit and change the injection direction of the ionized air, a driving part such as a motor is required, and in order to secure a space for installing the static elimination unit, the device becomes large and costly. Therefore, in a substrate processing apparatus provided with a static elimination unit for static elimination of a substrate, a solution is to prevent the increase in the size of the apparatus and the increase in cost, and to improve the static elimination efficiency of the substrate. I have a problem.

The present invention for solving the above problems comprises a holding table that holds the lower surface of a substrate, and a transfer unit that holds the upper surface of the substrate and carries the substrate into or out of the holding table. a static elimination unit having a first air injection port for injecting ionized air and blowing the ionized air onto the substrate to reduce the charging of the substrate; and an air injection unit capable of changing the traveling direction of the ionized air, wherein the substrate is held by the holding table and held by the transfer unit. and , the direction of the ionized air jetted from the static elimination unit is changed by the air jetting unit, and the substrate is held by either the holding table or the transport unit. , a substrate processing apparatus capable of blowing the ionized air toward a substrate.

In the substrate processing apparatus according to the present invention, the first air injection port is formed toward the upper surface of the substrate held on the holding table, and the second air injection port is held by the transfer unit. It is preferable that the groove is formed toward the lower surface of the substrate carried out from the holding table.

In the substrate processing apparatus according to the present invention, the first air injection port is formed toward the lower surface of the substrate carried out from the holding table by the transfer unit, and the second air injection port is formed toward the lower surface of the substrate carried out from the holding table. It is preferably formed toward the upper surface of the substrate held by the substrate.

A substrate processing apparatus according to the present invention includes a plurality of the first air ejection ports, a plurality of the second air ejection ports, and a direction in which the first air ejection ports are arranged and a direction in which the second air ejection ports are aligned. It is preferable that the alignment direction is parallel.

In the substrate processing apparatus according to the present invention, the first air injection port is one slit-shaped, the second air injection port is one slit-shaped, and the first air injection port extends It is preferable that the extension direction of the second air injection port is parallel to the extension direction of the second air ejection port.

A substrate processing apparatus according to the present invention includes a holding table that holds the lower surface of a substrate, a transfer unit that holds the upper surface of the substrate and carries the substrate into or out of the holding table, and ionized air. A static elimination unit that has a first air injection port and blows ionized air onto a substrate to reduce the charging of the substrate, and a second air that injects air in a direction intersecting the ionized air injected from the static elimination unit. and an air ejection unit having an ejection port and capable of changing the traveling direction of the ionized air, whereby ionization is performed by ejecting ionization from the static elimination unit onto the exposed upper surface of the substrate while the substrate is held on the holding table. In addition to being able to blow air, even when the state where the substrate is held by the holding table is switched to the state where it is held by, for example, the transport unit, the direction of the ionized air jetted from the static elimination unit can be controlled by the air jet unit. , so that the ionized air can be blown toward the exposed lower surface of the held substrate. In other words, the ionized air can be blown onto the substrate in either the state where the substrate is held by the holding table or the state where the substrate is held by the transfer unit. Further, since there is no need to provide a motor or the like as a drive source for moving the static elimination unit to change the injection direction of the ionized air as in the conventional art, the size of the apparatus does not increase and the cost does not increase. It is also possible to improve the static elimination efficiency.
Compared to the static elimination unit, the static elimination unit has more parts and is larger in size, so installation locations are limited. There is a high degree of freedom in where it can be installed. Therefore, even if the static elimination unit cannot be placed in a suitable place for static elimination of the substrate due to the layout inside the substrate processing apparatus, the substrate can be discharged by installing the air injection unit in a location where the static elimination unit can assist in changing the progress of the ionized air. It is possible to appropriately blow ionized air onto the surface to eliminate static electricity.

In the substrate processing apparatus according to the present invention, the first air ejection port is formed toward the upper surface of the substrate held by the holding table, and the second air ejection port is held by the transfer unit and held by the holding table. When the substrate is held on the holding table, ionized air is supplied from the static elimination unit while air injection from the air injection unit is stopped. The ionized air is sprayed directly onto the exposed upper surface of the substrate, and when the substrate is switched from being held by the holding table to being held by the transfer unit, ionized air is injected from the static elimination unit and the air injection unit The ionized air can be blown to the lower surface of the substrate by jetting the air from the substrate in a direction intersecting with the ionized air, changing the traveling direction of the ionized air toward the exposed lower surface of the substrate.

In the substrate processing apparatus according to the present invention, the first air injection port is formed toward the lower surface of the substrate carried out from the holding table by the transfer unit, and the second air injection port is formed toward the substrate held on the holding table. When the substrate is held on the holding table, ionized air is injected from the static elimination unit and air is injected from the air injection unit in a direction intersecting with the ionized air. By changing the traveling direction of the ionized air toward the upper surface, which is the exposed surface of the substrate, the ionized air can be blown onto the upper surface of the substrate. When the board is switched to the held state, the air injection unit stops blowing air, and the ionized air is blown directly from the static elimination unit to the exposed lower surface of the substrate whose upper surface side is held. becomes possible.

A substrate processing apparatus according to the present invention includes a plurality of first air ejection ports, a plurality of second air ejection ports, and a direction in which the first air ejection ports are aligned and a direction in which the second air ejection ports are aligned. By being parallel, the ionized air jetted from the plurality of first air jetting ports so as to form an air curtain without leaving a gap in the arranging direction is jetted so as to form an air curtain in the arranging direction. By changing the traveling direction of the air jetted from the second air jet port, it is possible to jet the ionized air to substantially the entire desired exposed surface of the substrate without leakage.

In the substrate processing apparatus according to the present invention, the first air injection port has a single slit shape, the second air injection port has a single slit shape, and the extending direction of the first air injection port Since the extending direction of the second air ejection port is parallel, the ionized air ejected from the first air ejection port so as to form an air curtain without leaving a gap in the extending direction, The air jetted from the second air jet port so as to form an air curtain in the extending direction changes the traveling direction, and the ionized air can be jetted to substantially the entire desired exposed surface of the substrate without omission. Become.

1 is an overall perspective view showing an example of a substrate processing apparatus; FIG. FIG. 11 is a side view for explaining a state in which ionized air jetted from a static elimination unit is directly jetted onto the upper surface, which is the exposed surface, of the substrate held by the holding table while the jetting of air from the air jetting unit is stopped; be. The ionized air ejected from the static elimination unit is ejected from the air ejection unit onto the exposed lower surface, which is the exposed surface, of the substrate carried out from the holding table and held by the transport unit. It is a side view explaining the state which changes so that it may go to the lower surface side, and is blowing on the lower surface of a board|substrate. The ionized air jetted from the static elimination unit onto the exposed upper surface of the substrate held by the holding table is jetted from the air jetting unit in a direction intersecting with the ionized air so that the advancing direction is directed toward the upper surface of the substrate. It is a side view explaining the state which is changed and is spraying on the upper surface of a board|substrate. A state in which the ionized air jetted from the static elimination unit is directly sprayed onto the exposed lower surface, which is the exposed surface, of the substrate carried out from the holding table and held by the transport unit, while the air jetting unit is stopping the jetting of the air. It is a side view explaining.

The substrate processing apparatus 1 shown in FIG. 1 is, for example, a cutting apparatus that cuts a substrate 19 held on a holding table 30 by a cutting unit (not shown). The substrate processing apparatus 1 includes a laser processing apparatus that performs desired processing (for example, substrate modification and groove formation) on the substrate 19 by laser irradiation, a grinding apparatus that grinds and thins the substrate 19 with a rotating grindstone, Alternatively, it may be a polishing apparatus that polishes the substrate 19 with a polishing pad.

The substrate 19 shown in FIG. 1 is, for example, a circular plate-shaped silicon semiconductor wafer, and devices 192 are arranged in grid-like regions partitioned by dividing lines 191 on a surface 190 of the substrate 19 facing upward. formed. For example, the back surface 193 of the substrate 19 is attached to the attachment surface (front surface) of the dicing tape 198 . The outer periphery of the dicing tape 198 is adhered to an annular frame 197, whereby the substrate 19 is supported by the annular frame 197 via the dicing tape 198, and a work set 199 capable of being handled using the annular frame 197. It has become. The center of the annular frame 197 and the center of the substrate 19 are substantially aligned. The substrate 19 is not limited to the above example, and may be a single substrate instead of the work set 199. In addition to silicon, gallium arsenide, sapphire, gallium nitride, resin, ceramics, silicon carbide, or the like may be used. or a package substrate or the like.

As shown in FIG. 1, a housing 100 is disposed on the rear side (−X direction side) of the substrate processing apparatus 1 on the apparatus base 10, and a processing chamber is defined inside the housing 100. , the substrate 19 is cut by a cutting means (not shown) having a cutting blade in the processing chamber.
The front side (+X direction side) on the device base 10 of the substrate processing device 1 is capable of reciprocating in the X-axis direction, and the work set 199 is loaded into and unloaded from the holding table 30 that can enter the processing chamber inside the housing 100. It also serves as an attachment/detachment area where the substrate 19 that has undergone cutting is washed.
An input unit 101 such as a touch panel capable of inputting control data and the like to a control unit that controls the entire apparatus of the substrate processing apparatus 1 is arranged on the outer surface of the housing 100 .

The holding table 30 is surrounded by a cover 31 and is rotatable about a rotation axis in the Z-axis direction by a rotation unit (not shown) arranged below the cover 31 . A bellows cover 311 that expands and contracts in the X-axis direction is connected to the cover 31 , and below the cover 31 and the bellows cover 311 is a cutting device (not shown) that reciprocates the holding table 30 in the cutting feed direction (X-axis direction). A feed unit is provided. The cutting feed unit is, for example, a ball screw mechanism that feeds the holding table 30 by rotating a ball screw with a motor.

The holding table 30 shown in FIG. 1 holding the substrate 19 has, for example, a circular shape in plan view, and suction-holds the substrate 19 on a flat holding surface 300 communicating with a suction source (not shown). Further, around the holding table 30, when the substrate 19 is a work set 199 as in this embodiment, four fixing clamps 32 capable of clamping and fixing the annular frame 197 are provided at equal intervals in the circumferential direction. are evenly distributed.

As shown in FIG. 1, a cassette mounting table 13 is installed at one corner of the apparatus base 10 of the substrate processing apparatus 1 on the -Y direction side, and the cassette mounting table 13 is arranged below it. It is possible to move up and down in the Z-axis direction by an ascending/descending elevator. Then, in a state where the cassette 14 containing a plurality of work sets 199 on the inner shelf is mounted on the cassette mounting table 13, the cassette mounting table 13 is moved up and down by the elevator, so that the desired substrates are removed from the cassette 14. The height position when putting in and out 19 is adjusted.

For example, in front of an opening (not shown) on the +Y direction side of the cassette 14 mounted on the cassette mounting table 13 shown in FIG. A push-pull 15 for inserting 199 into the cassette 14 is provided.

For example, above the movement path of the holding table 30, a centering guide 16 consisting of a pair of guide rails for aligning a work set 199 pulled out from the cassette 14 by the push-pull 15 movable in the Y-axis direction to a predetermined position. are arranged. Each guide rail having an L-shaped cross section and extending in the Y-axis direction can be separated from or approached to each other in the X-axis direction, and is arranged so that the stepped guide surfaces (inner surfaces) face each other. there is When the work sets 199 are carried into the holding table 30 , one work set 199 is pulled out from the cassette 14 by the push-pull 15 and placed on the centering guide 16 . Further, when cleaning of the work set 199 after machining is completed, the work set 199 placed on the centering guide 16 by the first transfer unit 51 or the second transfer unit 52 is inserted into the cassette 14 by the push-pull 15. Placed on an internal shelf.
When the work set 199 is placed, the pair of guide rails of the centering guide 16 approach each other and support the outer peripheral edge of the annular frame 197 to position (center) the work set 199 with respect to the holding table 30. At times, they are separated from each other so as to leave space above the holding surface 300 of the holding table 30 .

As shown in FIG. 1, the substrate processing apparatus 1 includes a transport unit that holds the substrate 19 and loads the substrate 19 into the holding table 30 or unloads the substrate 19 from the holding table 30. , for example, includes a first transport unit 51 that transports the substrate 19 as a work set 199 and a second transport unit 52 that transports the work set 199 .

For example, a first transport unit 51 and a second transport unit 52 are arranged on the front surface of the housing 100 .
The first transport unit 51 includes a holding pad 511 that holds the work set 199 held by the holding table 30 from above, a vertical movement unit 512 that vertically moves the holding pad 511, and a reciprocating movement of the holding pad 511 in the Y-axis direction. and a Y-axis movement unit 513 that enables
The Y-axis movement unit 513 is, for example, an electric actuator or the like arranged on the front surface of the housing 100 .
For example, the vertical movement unit 512 is an electric cylinder (or a pneumatic cylinder) or the like attached to the slider 514 of the Y-axis movement unit 513 .

A holding pad 511 attached to the lower end side of a lifting rod (not shown) of the vertical motion unit 512 has, for example, an H shape in plan view, and has four suction cups 515 for sucking the annular frame 197 that supports the substrate 19 . It has it on the bottom. Each suction board 515 communicates with a suction source such as a vacuum generator (not shown) that generates a suction force.
In this embodiment, the push-pull 15 is reciprocally movable in the Y-axis direction together with the holding pad 511, but the push-pull 15 may be independently movable in the Y-axis direction.

The second transport unit 52 that unloads the substrate 19 (workset 199) after cutting from the holding table 30 shown in FIG. , a holding pad 521 for holding the work set 199 held by the holding table 30 from above, a vertical movement unit 522 for vertically moving the holding pad 521, and a Y-axis movement for reciprocating the holding pad 521 in the Y-axis direction. a unit 523;

The Y-axis movement unit 523 is, for example, an electric actuator or the like arranged on the front surface of the housing 100 . The slide block 524 of the Y-axis moving unit 523 shown in FIG. 1 is longer in the X-axis direction than the slider 514 of the first transport unit 51. A vertically moving unit 522 and a holding pad 521 are attached to the . Therefore, the vertical movement unit 512 of the holding pad 521 is displaced from the movement line of the holding pad 521 of the second transport unit 52 in the X-axis direction. Therefore, when the work set 199 is unloaded from the holding table 30 , the holding pad 521 of the second transfer unit 52 can transfer the work set 199 in the Y-axis direction without colliding with the first transfer unit 51 .

The holding pad 521 has, for example, an H shape in a plan view, and has four suction cups 525 on its lower surface for sucking an annular frame 197 communicating with a suction source (not shown) and supporting the substrate 19 .

As shown in FIG. 1, within the movable range of the first transport unit 51 and the second transport unit 52, the single wafer cleaning unit 12 for cleaning the substrate 19 after processing is arranged. The cleaning unit 12 sucks and holds the work set 199 on a holding table 120 having a flat holding surface 121, and rotates cleaning water from a cleaning nozzle (not shown) rotating above the substrate 19. The surface 190 is cleaned by spraying on the surface 190 .

The substrate processing apparatus 1 has a first air injection port 29 (see FIG. 2) for injecting ionized air, a cassette side static elimination unit 21 for blowing the ionized air onto the substrate 19 to reduce the charge on the substrate 19, and a cleaning unit. It has a unit-side static elimination unit 22 and a second air injection port 69 (see FIG. 2) that injects air in a direction that intersects the ionized air injected from the cassette-side static elimination unit 21 to change the traveling direction of the ionized air. cassette-side air injection unit 61, and a second air injection port 69 for injecting air in a direction intersecting with the ionized air injected from the cleaning unit-side static elimination unit 22, so that the advancing direction of the ionized air can be changed. and a washing unit side air injection unit 62.

In this embodiment, the cassette-side static elimination unit 21 is mounted on the cassette mounting table 13 and is positioned forward and below an opening (not shown) on the +Y direction side of the cassette 14 in a state where the work set 199 can be pulled out by the push-pull 15. In addition, it is arranged at a position outside and above the outer periphery of the holding table 30 positioned at the position where the substrate 19 is carried in (a position that does not interfere with carrying the substrate 19 into and out of the holding surface 300). 1, 2, and 3, the cassette-side air injection unit 61 that can operate together with the cassette-side static elimination unit 21 is located outside the outer circumference of the holding table 30, and is located further than the cassette-side static elimination unit 21 in the examples shown in FIGS. placed in a low position.

In this embodiment, the cleaning unit side static elimination unit 22 is arranged at a position outside and above the outer periphery of the holding table 120 of the cleaning unit 12 shown in FIG. is set. In the example shown in FIG. 1, the cleaning unit side air injection unit 62 that operates together with the cleaning unit side static elimination unit 22 is located outside the outer periphery of the holding table 120 and closer to the holding table 120 than the cleaning unit side static elimination unit 22. , is disposed at a position lower than the cleaning unit side static elimination unit 22 .

Since the cassette side static elimination unit 21 and the cleaning unit side static elimination unit 22 have substantially the same configuration, the configuration of the cleaning unit side static elimination unit 22 shown in FIG. 1 will be described below.
The cleaning unit side static elimination unit 22 is, for example, a pulse AC type nozzle type ionizer equipped with an internal power supply electrode needle or the like, but is not limited to this, and may be a pulse DC type ionizer. , may be of the fan type. The cleaning unit side static elimination unit 22 is communicated with an air supply source (not shown) such as a compressor, and has a first air injection port 29 on the tip side. The first air injection port 29 may be circular or elongated.

The cleaning unit-side static elimination unit 22 converts the air supplied from an air supply source (not shown) into positively charged ionized air and, for example, approximately the same amount of negatively charged ionized air when performing static elimination on at least the substrate 19 . , from the first air injection port 29 . It should be noted that the ion balance of the ionized air injected by the cleaning unit side static elimination unit 22 is appropriately variable.

In this embodiment, as shown in FIG. 1, a plurality of cleaning unit side static elimination units 22 are arranged side by side on the front surface of a gate-shaped support column 107 erected on the apparatus base 10. A plurality of first air injection ports 29 arranged side by side are opened so as to intersect the holding surface 121 of the holding table 120 from obliquely above. The plurality of cleaning unit side static elimination units 22 are arranged so that the distance from end to end is longer than the diameter of the holding table 120 in the X-axis direction, which is the direction in which they are arranged. The cleaning unit side static elimination unit 22 is arranged, for example, on a virtual tangential line that passes through the +X direction side periphery of the holding table 120, and faces the +X direction side periphery across the center of the holding table 120. Another one may be arranged on an imaginary tangent line passing through the outer circumference on the −X direction side.
In addition, the number of the cleaning unit side static elimination units 22 may be one.

The cleaning unit-side air injection unit 62 shown in FIG. 1 is, for example, a long, narrow pipe nozzle that communicates with an air supply source (not shown), has a length longer than the diameter of the holding table 120, and is parallel to the X-axis direction. extends to A nozzle-shaped cleaning unit side air injection unit 62 extending in the X-axis direction has a plurality of second air injection ports 69 that open obliquely upward on the outer surface on the holding table 120 side. The direction in which the plurality of second air injection ports 69 are arranged is the X-axis direction, and is parallel to the direction in which the plurality of first air injection ports 29 of the cleaning unit side static elimination units 22 are arranged.

For example, the cleaning unit side static elimination unit 22 is not provided in plurality, and has a bar shape extending in the X-axis direction instead of a nozzle shape. It may be formed so as to extend in the X-axis direction in the form of a single slit having a length longer than at least the diameter of the substrate 19 held by suction.
In addition, on the outer surface of the cleaning unit side air injection unit 62, which is a single elongated pipe nozzle, a slit-shaped second slit having a length longer than at least the diameter of the substrate 19 held by suction on the holding table 120 is provided. An air jet port 69 is formed, and the extending direction (X-axis direction) of the first air jet port 29 and the extending direction (X-axis direction) of the second air jet port 69 are parallel. good too.

The configuration of the cassette side static elimination unit 21 shown in FIGS. 1 and 2 is substantially the same as the configuration of the cleaning unit side static elimination unit 22, and the configuration of the cassette side air injection unit 61 is similar to that of the cleaning unit side air injection unit 61. The configuration is substantially the same as that of the injection unit 62 . In this embodiment, a plurality of cassette side static elimination units 21 shown in FIGS. 1 and 2 are arranged in the X-axis direction so that the distance from end to end is longer than the diameter of the holding table 30. there is Further, the first air injection port 29 of each cassette side static elimination unit 21 is opened in a direction crossing the holding surface 300 of the holding table 30 from obliquely above. A cassette-side air injection unit 61 in the form of an elongated pipe nozzle extends parallel to the X-axis direction with a length longer than the diameter of the holding table 30 . The cassette-side air injection unit 61 extending in the X-axis direction has a plurality of second air injection ports 69 opening obliquely upward on its outer surface on the side of the holding table 30 . That is, the direction in which the plurality of second air injection ports 69 are arranged is the X-axis direction, and is parallel to the direction in which the plurality of first air injection ports 29 of the cassette-side static elimination units 21 are arranged.

The operation of each component of the substrate processing apparatus 1 shown in FIG. The operation of the unit 22) and the cassette side air injection unit 61 (washing unit side air injection unit 62) will be described in detail.

First, the cassette 14 housing a plurality of work sets 199 shown in FIG. 1 is placed on the cassette placing table 13, and then the height of the cassette 14 is adjusted by the elevator. Next, the push-pull 15 moves in the -Y direction to enter the inside of the cassette 14 and grip the annular frame 197 of the work set 199 placed on the target shelf. One workpiece set 199 is pulled out from the cassette 14 by the push-pull 15 and an annular frame 197 is placed on the centering guide 16 . Then, the pair of guide rails of the centering guide 16 approach each other to support the outer peripheral edge of the annular frame 197 while centering the work set 199 (detection of the center position).

The Y-axis moving unit 513 of the first transfer unit 51 moves the holding pad 511 in the Y-axis direction so that the holding pad 511 is positioned above the annular frame 197 on the centering guide 16 so that the center of the holding pad 511 and the work set are aligned. The center of 199 is almost matched. Further, the vertical movement unit 512 lowers the holding pad 511, and the four suction cups 515 come into contact with the upper surface of the annular frame 197 to perform suction.
state.

Then, the pair of guide rails of the centering guide 16 move away from each other, creating a clearance for the work set 199 to descend between the pair of guide rails. Then, the holding pad 511 is lowered to place the work set 199 on the holding surface 300 of the holding table 30 that has been positioned below the centering guide 16 in advance. After the holding table 30 sucks and holds the substrate 19 on the holding surface 300, and the annular frame 197 is held and fixed by the fixing clamps 32, the holding pad 511 releases the holding pad 511 from sucking the annular frame 197, and the holding pad 511 holds the workpiece. Leave set 199.

In the present embodiment, the holding pad 511 adsorbs and holds the annular frame 197, and does not directly adsorb and hold the surface 190, which is the upper surface of the substrate 19. Therefore, the so-called separation electrification is small, but the substrate The dicing tape to which the substrate 19 and the substrate 19 are adhered until the substrate 19 is sucked and held by the holding table 30 and the peeling electrification that occurs when the surface 190 of the 19 is directly sucked and held by the transfer unit When the substrate 198 is charged, or when the substrate 19 is a substrate on which a device requiring strict control of the amount of charge is formed, the substrate 19 of the work set 199 and the dicing tape 198 are positive (+ ), or negative (-) charge, the substrate 19 may not be appropriately subjected to the dicing process described later, or the device may be destroyed due to electrification.

Therefore, a plurality of cassette-side neutralization units 21 and cassette-side air jets are placed on the surface 190, which is the exposed surface of the substrate 19 of the work set 199 sucked and held by the holding table 30 shown in FIG. The unit 61 blows ionized air.

Specifically, air is supplied from an air supply source (not shown) to the plurality of cassette side static elimination units 21 shown in FIGS. 1 and 2, and each cassette side static elimination unit 21 is positively charged ionized air. and, for example, approximately the same amount of negatively charged ionized air, and are jetted from the first air jet port 29 . In this embodiment, the first air injection port 29 of the cassette side static elimination unit 21 is formed toward the upper surface 190 (surface 190), which is the exposed surface of the substrate 19 held on the holding table 30. Ionized air 291 jetted from a plurality of cassette-side static elimination units 21 arranged in the axial direction forms an air curtain that crosses at least the substrate 19 in the X-axis direction, and reaches the holding table 30 positioned obliquely downward. The work set 199 held by suction is sprayed. Here, no air is injected from the cassette side air injection unit 61 .

The air curtain-like ionized air 291 flows along substantially the entire upper surface of the dicing tape 198 , which is the exposed surface of the work set 199 , and substantially the entire upper surface 190 (surface 190 ) of the substrate 19 . and the static electricity charged on the dicing tape 198 is uniformly removed.

Next, the holding table 30 sucking and holding the neutralized substrate 19 is fed in the -X direction by a cutting feed unit (not shown) and enters the processing chamber (not shown) inside the housing 100 shown in FIG. Then, in the processing chamber, the substrate 19 is fully cut or half cut by dicing, and the processing is completed.

A cutting feed unit (not shown) feeds the holding table 30 in the +X direction and carries it out of the processing chamber. Then, for example, the second carrying unit 52 shown in FIG. The holding pad 521 is moved in the Y-axis direction by the Y-axis moving unit 523 and positioned above the work set 199 held on the holding table 30, so that the center of the holding pad 521 and the center of the work set 199 substantially coincide. become a state. Further, the vertical movement unit 522 lowers the holding pad 521, and the four suction cups 525 come into contact with the upper surface of the annular frame 197 for suction.

When the holding pad 521 is raised in this state and the work set 199 is removed from the holding surface 300 of the holding table 30 on which the vacuum suction is stopped, peeling electrification occurs, and the substrate 19 of the work set 199 after removal and the dicing tape are separated from each other. 198 may be charged.

2 in which the substrate 19 is held by the holding table 30 is changed to the state in which the substrate 19 is held by the second transport unit 52 shown in FIG. The direction of the ionized air 291 is changed by the cassette-side air injection unit 61, and the lower surface 193 (the dicing tape 198 in this embodiment), which is the exposed surface of the substrate 19 held by the second transfer unit 52 shown in FIG. The ionized air 291 is blown toward the lower surface of the .

In this embodiment, as shown in FIG. 2, the first air injection port 29 of the cassette side static elimination unit 21 is formed toward the upper surface 190, which is the exposed surface of the substrate 19 held by the holding table 30. As shown in FIG. 3, the second air injection port 69 of the cassette side air injection unit 61 is held by the holding pad 521 of the second transfer unit 52 and carried out from the holding table 30. 193 (the lower surface of the dicing tape 198 in this embodiment).

Air is supplied from an air supply source (not shown) to the plurality of cassette side static elimination units 21 shown in FIGS. , from the first air injection port 29 . In this embodiment, the ionized air 291 forms an air curtain and is jetted obliquely downward as shown in FIG. Further, from the cassette side air injection unit 61, the direction intersecting with the ionized air 291 injected obliquely downward toward the holding table 30 from the cassette side static elimination unit 21, that is, held by the holding pad 521 of the second conveying unit 52. Compressed air 699 with a predetermined pressure is jetted in a direction toward the lower surface of the dicing tape 198 that is the exposed surface of the work set 199 .

As a result, the traveling direction of the ionized air 291 ejected from the cassette side static elimination unit 21 by the air 699 ejected from the cassette side air ejection unit 61 is the exposed surface of the substrate 19 held by the second transport unit 52. It is changed to face the bottom surface 193 (the bottom surface of the dicing tape 198 in this embodiment). The ionized air 291 in the form of an air curtain flows along substantially the entire lower surface of the dicing tape 198, which is the exposed surface of the work set 199, so that the substrate 19 and the dicing tape 198 are uniformly neutralized.

For example, after the work set 199 is neutralized as described above as the holding pad 521 sucking and holding the work set 199 is lifted and moved in the +Y direction, the work set 199 is moved to the cleaning unit 12 shown in FIG. The work set 199 is carried onto the holding table 120 by the second transfer unit 52, and the work set 199 is placed on the holding table 120 with the substrate 19 facing upward and held by suction.

In this embodiment, the holding pad 521 sucks and holds the annular frame 197, and does not directly suck and hold the exposed surface 190 of the substrate 19 facing upward. However, if the surface 190 of the substrate 19 is directly sucked and held by the second transfer unit 52 , for example, the separation charge remains on the exposed surface 190 of the substrate 19 . Therefore, in this case, air is supplied to the plurality of cleaning unit side static elimination units 22 shown in FIG. Here, no air is jetted from the washing unit side air jet unit 62 shown in FIG.

The ionized air sprayed from the cleaning unit side static elimination units 22 in the form of an air curtain advances obliquely downward, and remains on substantially the entire upper surface of the dicing tape 198, which is the exposed surface of the work set 199, and the substrate. It flows along substantially the entire surface of the upper surface 190 (surface 190) of 19, and thereby the substrate 19 and the dicing tape 198 are neutralized.

After the static elimination is completed, a cleaning nozzle (not shown) revolves above the work set 199 so as to reciprocate at a predetermined angle. Further, by rotating the holding table 120 at a predetermined rotational speed, cleaning water is sprayed from the cleaning nozzles toward the entire surface 190 of the substrate 19 to perform cleaning. After cleaning, the work set 199 is air dried or spin dried.

After cleaning the substrate 19 , for example, the holding pad 511 of the first transfer unit 51 shown in FIG. 1 is positioned above the work set 199 on the holding table 120 . Further, the holding pad 511 is lowered, and the four suction cups 515 come into contact with the upper surface of the annular frame 197 for suction.

Next, the holding pad 511 is lifted by the vertical movement unit 512, so that the work set 199 is charged by peeling electrification even when the work set 199 is removed from the holding table 120 that has been released from suction holding. Therefore, air is supplied from an air supply source (not shown) to the plurality of cleaning unit side static elimination units 22 shown in FIG. Inject from the injection port 29 . Then, ionized air is jetted obliquely downward in the form of an air curtain from each cleaning unit side static elimination unit 22 . Also, in the direction intersecting with the ionized air jetted obliquely downward toward the holding table 120 from the cleaning unit side static elimination unit 22 , that is, in the exposed surface of the work set 199 held by the holding pad 511 of the first transport unit 51 . Compressed air with a predetermined pressure is jetted from the cleaning unit side air jet unit 62 in the direction toward the lower surface of a certain dicing tape 198 .

As a result, the traveling direction of the ionized air jetted from the cleaning unit side static elimination unit 22 is changed by the air jetted from the cleaning unit side air jetting unit 62 to the dicing tape 198 of the work set 199 held by the first transfer unit 51 . is changed to face the bottom of the . The ionized air in the form of an air curtain flows along substantially the entire bottom surface of the dicing tape 198, thereby uniformly removing static electricity charged on the substrate 19 and the dicing tape 198 after cleaning.

After the static elimination is completed, the holding pad 511 moves in the -Y direction, and the annular frame 197 of the work set 199 is placed on the centering guide 16 . Furthermore, after the annular frame 197 is gripped by the push-pull 15 , the work set 199 is inserted into the shelf of the cassette 14 .

As described above, the substrate processing apparatus 1 according to the present invention includes the holding table 30 that holds the lower surface 193 (rear surface 193) of the substrate 19, and the upper surface 190 side (front surface 190 side) of the substrate 19, for example, through the annular frame 197. a second transport unit 52 for carrying the substrate 19 into or out of the holding table 30, and a first air injection port 29 for injecting ionized air. and a second air injection port 69 for injecting ionized air in a direction intersecting the ionized air injected from the cassette side static elimination unit 21. , and a cassette-side air injection unit 61 capable of changing the traveling direction of ionized air, the cassette-side static elimination unit 21 can be ejected onto the upper surface 190 , which is the exposed surface of the substrate 19 while the substrate 19 is held on the holding table 30 . In addition, even when the state of the substrate 19 held by the holding table 30 is switched to the state of being held by the second transport unit 52, the cassette side static elimination unit The direction of the ionized air jetted from 21 is changed by the cassette side air jetting unit 61 so that the ionized air can be jetted toward the exposed lower surface 193 of the held substrate 19 . In other words, the ionized air can be blown onto the substrate 19 in either the state where the substrate 19 is held by the holding table 30 or the state where the substrate 19 is held by the second transfer unit 52 . Further, since there is no need to provide a motor or the like as a drive source for rotating the cassette side static elimination unit 21 to change the injection direction of the ionized air as in the conventional art, the size of the apparatus does not increase and the cost does not increase. In addition, it becomes possible to improve the static elimination efficiency of the substrate 19 .

The cassette-side static elimination unit 21, which is an ionizer, has more parts and is larger in size than, for example, the pipe-shaped cassette-side air injection unit 61, so the installation location is limited. For example, the pipe-shaped cassette-side air injection unit 61, which can be made small in size due to its small weight, has a higher degree of freedom in where it can be installed than the cassette-side static elimination unit 21 does. Therefore, even if the cassette side static elimination unit 21 cannot be placed in a place suitable for static elimination of the substrate 19 due to the layout inside the substrate processing apparatus 1, the cassette side air injection unit 61 can be used to blow ionized air onto the cassette side static elimination unit 21. By installing the substrate 19 at a place where it can assist the ionized air, it becomes possible to appropriately blow the ionized air onto the substrate 19 to eliminate static electricity.

In the substrate processing apparatus 1 according to the present invention, the first air injection port 29 is formed toward the exposed upper surface 190 of the substrate 19 held on the holding table 30, and the second air injection port 69 is formed. is formed toward the exposed lower surface 193 of the substrate 19 held by the second transport unit 52 and carried out from the holding table 30 , so that when the substrate 19 is held by the holding table 30 , , the cassette side static elimination unit 21 blows ionized air directly onto the exposed upper surface 190 of the substrate 19 in a state in which air injection from the cassette side air injection unit 61 is stopped, and the substrate 19 is held on the holding table 30. When the state is changed from the held state to the state held by the second transport unit 52, the ionized air is jetted from the cassette side static elimination unit 21 and the air is jetted from the cassette side air jetting unit 61 in a direction intersecting with the ionized air. The ionized air is jetted to change the traveling direction of the ionized air toward the lower surface 193, which is the exposed surface of the substrate 19, so that the lower surface 193 of the substrate 19 (in this embodiment, the lower surface of the dicing tape 198) is ionized. It becomes possible to blow air.

The substrate processing apparatus 1 according to the present invention includes a plurality of first air injection ports 29 and a plurality of second air injection ports 69. Since the alignment direction (X-axis direction) of the air injection ports 69 is parallel, the plurality of first air injection ports 29 can be jetted so as to form an air curtain without leaving a gap in the alignment direction. The traveling direction of the ionized air is changed by the air jetted from the second air jetting port 69 so as to form an air curtain in the alignment direction, and the ionized air is leaked over substantially the entire desired exposed surface of the substrate 19 . It is possible to spray without

In the substrate processing apparatus 1 according to the present invention, for example, the first air injection port 29 has a slit shape, the second air injection port 69 has a slit shape, and the first air injection port 29 has a slit shape. and the extending direction (X-axis direction) of the second air injection port 69 are parallel to each other. The ionized air jetted so as to form an air curtain without opening is changed in the traveling direction by the air jetted from the second air jetting port 69 so as to form an air curtain in the extending direction. It is possible to blow the ionized air to almost the entire surface of the desired exposed surface without leakage.
For example, there may be a plurality of first air injection ports 29 and a single second air injection port 69 may be in the shape of a continuous slit, or vice versa.

It goes without saying that the substrate processing apparatus 1 according to the present invention is not limited to the above-described embodiments, and may be implemented in various forms within the scope of the technical idea. Moreover, the processing of the substrate 19 using the substrate processing apparatus 1 is not limited to the above-described embodiment, and can be changed as appropriate within the range in which the effects of the present invention can be exhibited.

For example, in the substrate processing apparatus 1 according to the present invention, as shown in FIG. (In this embodiment, the lower surface of the dicing tape 198), and as shown in FIG. 190 may be formed.

That is, for example, the cassette-side static elimination unit 21 is arranged at a position above the holding surface 300 outside the outer circumference of the holding table 30 shown in FIGS. It is 4 and 5, the cassette side air injection unit 61 used together with the cassette side static elimination unit 21 is arranged outside the outer periphery of the holding table 30 and at a position higher than the cassette side static elimination unit 21. there is

For example, the plurality of second air injection ports 69 aligned in the X-axis direction of the pipe-shaped cassette-side air injection unit 61 extending in the X-axis direction intersect obliquely from above toward the holding surface 300 of the holding table 30. open in the direction For example, the plurality of cassette-side static elimination units 21 are arranged so that the distance from end to end is longer than the diameter of the holding table 30 in the X-axis direction, which is the alignment direction. Each first air injection port 29 of the cassette side static elimination unit 21 is opened so as to face obliquely upward toward the holding table 30 side.

A plurality of cassette-side neutralization units 21 and cassette-side air jets are applied to the upper surface (front surface) 190, which is the exposed surface of the substrate 19 of the work set 199 sucked and held by the holding table 30 shown in FIG. A case where the unit 61 blows ionized air to eliminate static electricity will be described below.

Specifically, air is supplied from an air supply source (not shown) to the cassette side static elimination unit 21 shown in FIG. . In this embodiment, ionized air 291 jetted from a plurality of cassette-side static elimination units 21 arranged side by side in the X-axis direction is jetted obliquely upward in the form of an air curtain. In addition, from the cassette side air injection unit 61, the direction intersecting with the ionized air 291 injected from the cassette side static elimination unit 21, that is, the upper surface of the dicing tape 198 which is the exposed surface of the work set 199 held by the holding table 30 , and the upper surface 190 of the substrate 19, compressed air 699 with a predetermined pressure is jetted.

Air 699 jetted from the cassette-side air jetting unit 61 causes the traveling direction of the ionized air 291 jetted from the cassette-side static elimination unit 21 to change the traveling direction of the upper surface of the dicing tape 198 and the substrate 19 as shown in FIG. The direction is changed to the upper surface 190 , and the substrate 19 and the dicing tape 198 are uniformly neutralized by the air curtain-like ionized air 291 .

On the lower surface 193 (the lower surface of the dicing tape 198 in this embodiment), which is the exposed surface of the substrate 19 of the work set 199 held by suction on the holding pad 521 of the second transport unit 52 shown in FIG. A case where the cassette-side static elimination unit 21 blows ionized air to eliminate static will be described below.
In this case, no air is injected from the cassette side air injection unit 61, and ionized air 291 forms an air curtain from the cassette side static elimination unit 21 shown in FIG. It is sprayed as it is on the lower surface side of the work set 199 sucked and held by the vacuum cleaner, and flows along substantially the entire lower surface of the dicing tape 198, which is the exposed surface of the work set 199, thereby electrifying the substrate 19 and the dicing tape 198. The static electricity that had accumulated is evenly removed.

19: Substrate 190: Front surface (upper surface) of substrate 191: Planned division line 192: Device 193: Back surface (lower surface) of substrate 198: Dicing tape 197: Annular frame 1: Substrate processing apparatus 10: Apparatus base 100: Housing 101: Input unit 13: cassette mounting table 14: cassette 15: push-pull 16: centering guide 30: holding table 300: holding surface 31: cover 311: bellows cover 51: first transfer unit 511: holding pad 515: suction cup 512: upper and lower Movement unit 513: Y-axis movement unit 514: Slider
52: Second transport unit
521: Holding pad 522: Vertical movement unit 523: Y-axis movement unit 524: Slide block 525: Suction plate 107: Portal column 21: Cassette side static elimination unit : Second air injection port 22: Cleaning unit side static elimination unit 29: First air injection port 62: Cleaning unit side air injection unit 69: Second air injection port 12: Cleaning unit 120: Holding table

Claims (5)

a holding table that holds the bottom surface of the substrate;
a transport unit that holds the upper surface of the substrate and loads the substrate into or out of the holding table;
a static elimination unit having a first air injection port for injecting ionized air, and for blowing the ionized air onto the substrate to reduce the charging of the substrate;
an air injection unit having a second air injection port for injecting air in a direction intersecting with the ionized air injected from the static elimination unit, and capable of changing the traveling direction of the ionized air;
In either a state in which the substrate is held by the holding table or a state in which the substrate is held by the transfer unit, the direction of the ionized air injected from the static elimination unit is changed by the air injection unit. 1. A substrate processing apparatus capable of blowing the ionized air toward a substrate regardless of whether the substrate is held by the holding table or the transfer unit. The first air injection port is formed toward the upper surface of the substrate held on the holding table,
2. A substrate processing apparatus according to claim 1, wherein said second air injection port is formed toward the lower surface of the substrate held by said transfer unit and carried out from said holding table. the first air injection port is formed toward the lower surface of the substrate carried out from the holding table by the carrying unit;
2. A substrate processing apparatus according to claim 1, wherein said second air injection port is formed toward the upper surface of the substrate held on said holding table. A plurality of the first air injection ports are provided, a plurality of the second air injection ports are provided, and a direction in which the first air injection ports are arranged is parallel to a direction in which the second air injection ports are arranged. 4. The substrate processing apparatus according to claim 1, 2 or 3, characterized in that: The first air injection port is one slit-shaped, the second air injection port is one slit-shaped, and the direction in which the first air injection port extends and the second air injection port are aligned. 4. The substrate processing apparatus according to claim 1, wherein the direction of extension of the port is parallel.

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