JP5554661B2 - Dicing machine - Google Patents

Description

  The present invention relates to an apparatus for carrying a dicing process by transporting a workpiece (workpiece) such as a semiconductor wafer to a machining means, and more particularly, to a static elimination process for the workpiece.

  In the semiconductor device manufacturing process, division lines are arranged in a lattice pattern on the workpiece surface, and devices such as IC and LSI are formed in each of a plurality of regions partitioned by the division lines. Each region in which these devices are formed is cut along dicing lines, that is, diced, whereby individual chips are manufactured.

  As a device for dicing a workpiece, there is known a cutting device for cutting a workpiece sucked and held on a chuck table with a cutting blade (for example, see Patent Document 1).

  In such a cutting apparatus, static electricity is generated during processing and cleaning of the workpiece, and this static electricity may damage a device formed on the workpiece and cause the quality to deteriorate. In view of this, a technique has been proposed in which ion blowing means for ejecting ionized air is installed in the cutting apparatus in order to remove static electricity charged on the workpiece (see, for example, Patent Document 2).

JP 2001-358093 A JP 2004-327613 A

  By the way, in the dicing apparatus, the place where the static elimination is particularly required includes a spinner cleaning portion and a temporary placement portion on which the workpiece is placed immediately before the processed workpiece is accommodated in the cassette.

  However, when installing ion blowing means for the spinner cleaning portion and the temporary placement portion, a space for arranging these ion blowing means is required in the processing apparatus, and the space for other components is pressed. There is a problem. Moreover, not only the material cost for the two ion blowing means is required, but also the work cost for installing these ion blowing means in the dicing apparatus is required, so the manufacturing cost of the dicing apparatus increases. There is a problem of doing.

  This invention is made | formed in view of this point, and it aims at providing the dicing processing apparatus which can perform a static elimination process to the workpiece | work in the several location in an apparatus using a single ion blow means. .

  The dicing apparatus according to the present invention includes a holding means for holding a work, a processing means for processing the work held by the holding means, a cassette stage for mounting a cassette containing a plurality of the works, and the cassette A temporary placement unit for temporarily placing the work immediately before the work is accommodated in the work, a spinner cleaning means for spin-cleaning the work processed by the processing means, and blowing the ionized air onto the work. A dicing processing apparatus having ion blowing means for relaxing charging, and conveying means for conveying the workpiece between the holding means, the temporary placement unit, and the spinner cleaning means, wherein the ion blowing means includes: A spout for ejecting the ionized air, and blowing of the ionized air by adjusting the direction of the spout An adjustment unit that adjusts the position; and a control unit that operates the adjustment unit. The control unit cleans the workpiece from the holding table of the spinner cleaning unit after the workpiece is cleaned by the spinner cleaning unit. When unloading, the adjustment unit is operated so that the ionized air is blown toward the work on the holding table and the temporary placement is performed immediately before the work is accommodated in the cassette. When the work is placed on the part, the adjustment part is operated so that the ionized air is blown toward the work on the temporary placement part.

  According to this dicing apparatus, since the adjustment part is operated so that the ionized air is blown to the work on the holding table of the spinner cleaning means and the work on the temporary placement part by the adjusting part. It is possible to blow ionized air following the workpiece conveyed in the apparatus. Thereby, it becomes possible to perform static elimination processing on the workpiece at a plurality of locations in the apparatus using a single ion blowing means.

  In the dicing apparatus, the control unit holds the jet port on the transport unit while the transport unit transports the workpiece from the holding table of the spinner cleaning unit to the temporary placement unit. The mode which operates the said adjustment part so that the ionized air may be sprayed toward the said workpiece | work may be included.

  ADVANTAGE OF THE INVENTION According to this invention, the dicing processing apparatus which can perform a static elimination process to a workpiece | work in the several location in an apparatus using a single ion blow means can be provided.

It is a perspective view showing the whole dicing processing device concerning an embodiment of the invention. It is a perspective view which shows the cutting means provided in the apparatus. It is a schematic diagram which shows operation | movement of the ion blow means provided in the apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a perspective view showing an entire dicing apparatus 1 according to an embodiment of the present invention. In the following, for convenience of explanation, the lower right side (X-axis direction side shown in FIG. 1) shown in FIG. 1 is referred to as “front side”, and the upper left side (−X-axis direction side shown in FIG. 1). It shall be called “rear side”. Further, the left side (Y-axis direction side shown in FIG. 1) shown in FIG. 1 is called “left side”, and the right side (−Y-axis direction side shown in FIG. 1) is called “right side”. Shall. Further, the upper side (Z-axis direction side shown in FIG. 1) shown in FIG. 1 is called “upper side”, and the lower side (−Z-axis direction side shown in FIG. 1) is called “lower side”.

  As shown in FIG. 1, in the dicing apparatus 1 according to the present embodiment, the workpiece W is cut by a cutting means disposed inside the apparatus, and the spinner is applied to the workpiece W after cutting. A cleaning process is performed by the cleaning means 10.

  Here, the workpiece | work W which is a workpiece of the dicing apparatus 1 is demonstrated. On the surface of the workpiece W, division lines are arranged in a lattice pattern, and devices such as IC and LSI (not shown) are formed in each of a plurality of areas partitioned by the division lines. The workpiece W is cut along the scheduled division line by the dicing apparatus 1 and divided into individual chips.

The workpiece W is not particularly limited, but for example, a semiconductor wafer such as silicon (Si), gallium hirsode (GaAs), and silicon carbide (SiC), an adhesive member such as DAF provided on the back surface of the wafer for chip mounting, or , Semiconductor product packages, ceramic, glass, sapphire (Al ₂ O ₃ ) inorganic material substrates, various electronic components such as LCD drivers, and various processing materials that require micron-order processing position accuracy Is mentioned.

  The workpiece W is supplied to the dicing apparatus 1 while being supported via the expansion tape T at the center of the opening of the annular frame F. The expansion tape T has an adhesive surface on one side (the upper surface shown in FIG. 1), and the annular frame F and the workpiece W are attached to the adhesive surface. The annular frame F is made of a plate material such as metal.

  A work W supported on the annular frame F via the expansion tape T (hereinafter referred to as “work 2 affixed to the frame”) is accommodated in a cassette 3 for accommodating the work with the work W disposed on the upper side. Is done. A plurality of paired left and right support portions for supporting the vicinity of the end portion of the annular frame F are provided in the cassette 3 in the vertical direction. By this support portion, the work 2 attached to the frame is accommodated in the cassette 3 in a horizontal state and at a certain interval in the vertical direction.

  As shown in FIG. 1, the dicing apparatus 1 according to the present embodiment includes a base 4 on which the cassette 3 is placed on the upper surface, and a rear side of the base 4 (the −X axis direction side shown in FIG. 1). And the cabinet 5 provided in the above. An operation display panel 6 is provided on the left side surface 5 a of the cabinet 5. The operation display panel 6 is constituted by a touch panel, for example. Various settings relating to dicing are performed using this operation display panel 6.

  A chuck table 7 as a holding means for holding the workpiece W is provided at the center on the base 4. The chuck table 7 is connected to a negative pressure generating mechanism disposed in the base 4 and is configured to be able to suck and hold the workpiece W. Further, the chuck table 7 is connected to a rotation driving mechanism disposed in the base 4 and is configured to be able to rotate the work W held by suction.

  The chuck table 7 is provided on a base table 8 constituting a part of a table transport mechanism capable of transporting the chuck table 7 in the front-rear direction. This table transport mechanism is connected to a driving means disposed inside the base 4 and attaches / detaches the work 2 attached to the frame 2 before cutting and attaches / detaches the workpiece 4 on the base 4 and cutting processing described later. The chuck table 7 can be reciprocated in the front-rear direction between the processing position by the means 20.

  A cassette stage 9 is provided on the left side of the chuck table 7 on the base 4, and a spinner cleaning means 10 is provided on the right side. On the cassette stage 9, a cassette 3 in which the workpieces 2 attached to a plurality of frames are accommodated is set. The cassette stage 9 is connected to an elevating mechanism (not shown) and is configured to be movable in the vertical direction.

  The spinner cleaning means 10 includes a spinner table 101 and four clamps 102 provided around the spinner table 101. The spinner table 101 is connected to a lifting mechanism (not shown). The elevating mechanism moves the spinner table 101 in the vertical direction between a workpiece transfer position exposed on the surface of the base 4 and a workpiece cleaning position in the base 4. At the workpiece transfer position, the workpiece 2 affixed to the frame after cutting or cleaning is attached and detached. At the workpiece cleaning position, the rotating workpiece W is subjected to a cleaning process. In the cleaning process, the cleaning water is ejected from the cleaning water nozzle and the workpiece W is cleaned, and then dry air is blown. Similar to the chuck table 7, the spinner table 101 is connected to a negative pressure generating mechanism and a rotational drive mechanism disposed in the base 4, and is configured to suck and hold the workpiece W and to rotate.

  Above the chuck table 7, a temporary placement unit 11 is provided on which the work 2 attached to the frame is temporarily placed (temporarily placed). The temporary placement unit 11 includes a pair of guide rails 11a and 11b configured to be close to and away from each other. These guide rails 11 a and 11 b are exposed from the base 4 between the chuck table 7 and the cassette stage 9 and have a shape (L-shaped) bent so as to extend on the chuck table 7. ing.

  In the upper area of the chuck table 7, a transfer arm 12 is provided as a transfer means. The transfer arm 12 transfers the workpiece 2 attached to the frame in the cassette 3 to the chuck table 7 disposed at the workpiece attachment / detachment position. The transfer arm 12 includes a linear guide 121 that extends in the left-right direction on the front surface 5 b of the cabinet 5, and an arm 122 that is supported so as to be movable in the left-right direction along the linear guide 121. . The arm 122 is provided with a clamp part 123 extending to the left side and a plurality of (four in this embodiment) suction pads 124 facing downward. The clamp part 123 grips the annular frame F of the workpiece 2 attached to the frame accommodated in the cassette 3. The suction pad 124 sucks and holds the annular frame F of the workpiece 2 attached to the frame placed on the temporary placement unit 11. Moreover, the arm 122 is configured to be movable in the vertical direction while expanding and contracting in the vertical direction and holding the work 2 attached to the frame by suction.

  In the upper region of the spinner cleaning means 10, a transfer arm 13 as a transfer means is provided. The transport arm 13 transports the work 2 attached to the frame on the chuck table 7 onto the spinner table 101, while transporting the work 2 attached to the frame on the spinner table 101 to the temporary placement unit 11. The transfer arm 13 includes a linear guide 131 that extends in the left-right direction on the front surface 5 b of the cabinet 5, and an arm 132 that is supported so as to be movable in the left-right direction along the linear guide 131. . The arm 132 is provided with a plurality of (four in this embodiment) suction pads 133 facing downward. The suction pad 133 sucks and holds the annular frame F of the work 2 attached to the frame placed on the temporary placement unit 11. The arm 132 is configured to be movable in the vertical direction while expanding and contracting in the vertical direction and holding the work 2 attached to the frame by suction.

  On the right side of the spinner cleaning means 10 on the base 4, an ion blowing means 14 is provided. The ion blow means 14 is a pair of support pillars 141a and 141b erected on the front end and the rear end of the base 4 and a pivotably attached between the upper ends of these support pillars 141a and 141b. And a cylindrical jet port 143 provided in a plurality on one surface of the rotating unit 142. The spout 143 is provided in a cylindrical shape that opens toward the left side on one surface of the rotating portion 142. A flow path of ionized air (hereinafter, referred to as “ionized air” as appropriate) is formed inside the support columns 141 a and 141 b and the rotating unit 142, and communicates with the ejection port 143. These flow paths are connected to an ionized air generator (not shown) installed in the base 4. The ionized air generated by the ionized air generating device passes through the flow paths in the support columns 141a and 141b and the rotating unit 142 and is ejected from the ejection port 143. As an ionized air generating device, for example, a device that applies voltage to a needle-like electrode to cause corona discharge and ionizes air passing near the electrode is suitable.

  An adjustment unit 144 is provided on the support columns 141a and 141b. The adjustment unit 144 is connected to a drive mechanism (not shown) provided in the base 4 and adjusts the rotation position of the rotation unit 142 to adjust the ejection port 143 in an arbitrary direction. Thereby, the blowing position of the ionized air from the jet nozzle 143 is adjusted. The adjustment of the rotation position of the rotation unit 142 by the adjustment unit 144 is based on a control signal from the control unit 15 described later.

  The control unit 15 controls the entire dicing apparatus 1 according to the present embodiment. For example, the control unit 15 performs transfer control in the transfer arms 12 and 13, movement control and rotation control in the chuck table 7, and elevation control, rotation control and cleaning control in the spinner cleaning means 10. In addition, the control unit 15 performs ejection control from the ejection port 143 in the ion blowing unit 14 and rotation control of the rotation unit 142 (control for adjusting the blowing position of ionized air).

  Here, the structure of the cutting means 20 as a processing means which the dicing apparatus 1 which concerns on this Embodiment has is demonstrated. FIG. 2 is a perspective view of the cutting means 20 included in the dicing apparatus 1 according to the present embodiment. FIG. 2 shows a state in which the base table 8 is moved rearward by the table transport mechanism and is arranged at the machining position of the chuck table 7. As described above, the cutting means 20 is disposed in the cabinet 5.

  The cutting means 20 is configured to cut the workpiece W by relatively moving the chuck table 7 holding the workpiece 2 attached to the frame and the pair of blade units 22 a and 22 b having the cutting blade 21. . The cutting means 20 includes a gate-shaped column portion 23 erected so as to straddle the table transport mechanism. A pair of blade unit moving mechanisms 24 a and 24 b for moving the pair of blade units 22 a and 22 b in the left-right direction above the chuck table 7 are provided on the front surface of the column portion 23.

  The blade unit moving mechanisms 24a and 24b include a pair of Y-axis tables 25a and 25b that are slidably provided with a pair of guide rails extending in the left-right direction (Y-axis direction). The blade unit moving mechanisms 24a and 24b include Z-axis tables 26a and 26b that are arranged on the front surfaces of the Y-axis tables 25a and 25b and can slide a pair of guide rails extending in the vertical direction (Z-axis direction). Yes. Blade units 22a and 22b are attached to the lower ends of the Z-axis tables 26a and 26b.

  With such a configuration, the cutting means 20 adjusts the position of the chuck table 7 disposed at the processing position, and adjusts the positions of the blade units 22a and 22b by the blade unit moving mechanisms 24a and 24b. The workpiece W on the table 7 is cut.

  Next, the cutting operation with respect to the workpiece | work W in the dicing apparatus 1 which concerns on this Embodiment is demonstrated, referring FIG. 1 and FIG. When cutting the workpiece W, after the cassette stage 9 is raised or lowered and positioned at a predetermined height, the transfer arm 12 moves to the left side. Then, one of the workpieces 2 affixed to the frame in the cassette 3 is gripped by the clamp unit 123 and pulled out to the right side and temporarily placed on the temporary placement unit 11.

  The workpiece 2 attached to the frame temporarily placed on the temporary placement portion 11 is aligned concentrically with the chuck table 7. Then, after being sucked and held by the suction pad 124 of the transfer arm 12, the transfer arm 12 extends downward, and when the work 2 affixed to the frame is placed on the chuck table 7, the suction pad 124 is sucked. Canceled. The chuck table 7 is in a state where negative pressure is generated by the negative pressure generating mechanism. As a result, the work 2 attached to the frame is sucked and held on the chuck table 7 positioned at the work attaching / detaching position.

  Then, it moves to the cutting process to the workpiece W. In the cutting process, first, when the base table 8 moves, the chuck table 7 holding the workpiece 2 attached to the frame is moved to a processing position facing the pair of blade units 22a and 22b on the rear side. (See FIG. 2). Then, the cutting blades 21 of the pair of blade units 22a and 22b are aligned with the planned division lines in the X-axis direction of the workpiece W by the Y-axis tables 25a and 25b. Thereafter, the pair of blade units 22a and 22b are moved downward by the Z-axis tables 26a and 26b, and the workpiece W is cut by the cutting blade 21 rotated at high speed.

  When the workpiece W is cut by the cutting blade 21, the chuck table 7 is cut forward to the front side (X-axis direction side) and cut along the planned division line of the workpiece W. When the work W has been cut along one scheduled division line, the pair of blade units 22a and 22b moves by one chip in the Y-axis direction, and the cutting blade 21 is aligned with the adjacent scheduled division line. . Then, the chuck table 7 is again cut and fed to the front side (X-axis direction side), and cutting is performed along the scheduled division line. This operation is repeated, and cutting is performed along all the planned division lines in the X-axis direction of the workpiece W.

  When the workpiece W on the chuck table 7 is diced along all the planned division lines in the X-axis direction, the chuck table 7 rotates 90 degrees, and along the planned division line in the Y-axis direction of the workpiece W. Cutting is started. When the cutting along all the planned division lines of the workpiece W on the chuck table 7 is completed, the chuck table 7 is returned to the workpiece attaching / detaching position.

  Subsequently, the work 2 attached to the frame is transported to the spinner cleaning means 10 by the transport arm 13, and the process moves to the work W cleaning process. In this case, the arm 132 of the transfer arm 13 extends downward, and the suction pad 133 is sucked to the annular frame F. At the same time, the negative pressure suction of the chuck table 7 is released, and the entire work 2 attached to the frame is held by the suction pad 133. Then, the arm 132 is contracted upward, and the work 2 attached to the frame is raised, and then moved to the right side. When the arm 132 of the transfer arm 13 extends downward and the work 2 affixed to the frame is placed on the spinner table 101 above the spinner cleaning means 10, the suction of the suction pad 133 is released. The spinner table 101 is in a state where negative pressure is generated by the negative pressure generating mechanism. As a result, the work 2 affixed to the frame is sucked and held on the spinner table 101 positioned at the work delivery position of the spinner cleaning means 10.

  Subsequently, the spinner table 101 is lowered and rotated to the workpiece cleaning position, and the annular frame F is held by the clamp 102. Thereafter, cleaning water is ejected from the cleaning water nozzle onto the rotating workpiece W, and the workpiece W is cleaned. After this cleaning, the workpiece W is subjected to a drying process such as spraying dry air. When the cleaning and drying of the workpiece W are completed, the spinner table 101 is raised to the workpiece transfer position.

  Thus, in the cleaning process by the spinner cleaning means 10, the work W is cleaned by rotating the spinner table 101 at a high speed. Therefore, static electricity is generated by friction between the surface of the spinner table 101 that holds the workpiece W and the back surface of the workpiece W that contacts the spinner table 101. Therefore, it is necessary to remove the static electricity charged on the work W in order to prevent the quality of the device formed on the work W from deteriorating.

  Accordingly, the upper surface of the work W on the spinner table 101 is removed from the jet outlet 143 of the ion blowing means 14 in order to remove the static electricity charged on the work W at the same time when the spinner table 101 rises to the work transfer position or a certain time before that. Ionized air is ejected toward The ionized air appropriately generates positive ions and negative ions. When the static electricity charged on the workpiece W is positive, it is neutralized by negative ions. On the other hand, when the static electricity charged on the workpiece W is negative, it is neutralized by positive ions. Thus, by discharging the ionized air toward the upper surface of the work W, static electricity charged on the work W can be removed.

  Subsequently, the arm 132 of the transfer arm 13 extends downward, and the suction pad 133 is attracted to the annular frame F. At the same time, the negative pressure suction of the spinner table 101 is released, and the entire work 2 attached to the frame is held by the transfer arm 13. Then, the transfer arm 13 is moved to the left side, and the work 2 attached to the frame is transferred to the temporary placement unit 11.

  When the workpiece W is separated from the holding surface of the spinner table 101, peeling electrification occurs on the back surface of the workpiece W. Therefore, when the work W is moved away from the holding surface of the spinner table 101 and is transported to the temporary placement unit 11 by the transport arm 13, the jet blower 143 of the ion blowing means 14 is provided on the upper and lower surfaces of the work W being transported. In the direction, ionized air is ejected. Thus, by discharging ionized air toward the upper surface and the lower surface of the workpiece W being conveyed, static electricity charged on the workpiece W can be more effectively removed.

  The workpiece 2 attached to the frame placed on the temporary placement unit 11 is carried into the cassette 3 by the arm 122 moving to the left side after being gripped by the clamp unit 123 of the transport arm 12. . At this time, in order to ensure the neutralization of the workpiece W carried into the cassette 3, ionized air flows from the ejection port 143 of the ion blowing means 14 toward the upper surface and the lower surface of the workpiece W on the temporary placement unit 11. Erupted. Thus, by discharging ionized air toward the upper surface and the lower surface of the workpiece W immediately before being accommodated in the cassette 3, static electricity charged on the workpiece W can be more effectively removed.

  As described above, in the dicing apparatus 1 according to the present embodiment, the workpiece W is unloaded from the cassette 3, and after being subjected to the dicing process and the cleaning process, is loaded into the cassette 3. In this case, after the cleaning process by the spinner cleaning means 10, the workpiece W is transported from the spinner table 101 to the temporary placement unit 11, and the ionized air is placed on the temporary placement unit 11 on the upper and lower surfaces. Since it is ejected (only on the upper surface on the spinner table 101), the static electricity charged on the workpiece W can be effectively removed until it is accommodated in the cassette 3.

  FIG. 3 is a schematic diagram for explaining the operation of the ejection port 143 of the ion blowing means 14 of the dicing apparatus 1 according to the present embodiment. 3A shows a state in which the workpiece W is arranged on the spinner table 101, and FIG. 3B shows a state in which the workpiece W is being conveyed from the spinner table 101 to the temporary placement unit 11. FIG. 3C shows a state in which the workpiece W is disposed on the temporary placement unit 11. It is assumed that the ejection pressure of ionized air ejected from the ejection port 143 of the ion blowing means 14 is always constant.

  As shown in FIG. 3A, when the workpiece W is arranged on the spinner table 101, as shown by an arrow A, the blowing position of ionized air ejected from the ejection port 143 is on the spinner table 101. The adjustment unit 144 is operated by the control unit 15 so as to be on the upper surface of the workpiece W. Thereby, the rotation position of the rotation part 142 is adjusted so that the jet nozzle 143 faces downward, and ionized air is jetted from the jet nozzle 143 toward the upper surface of the work W on the spinner table 101.

  Further, as shown in FIG. 3B, when the workpiece W is being conveyed from the spinner table 101 to the temporary placement unit 11, ionized air ejected from the ejection port 143 as indicated by an arrow B. The adjustment unit 144 is operated by the control unit 15 so that the spraying positions of the workpiece W are the upper and lower surfaces of the workpiece W being conveyed. Thereby, the rotation position of the rotation part 142 is adjusted so that the jet nozzle 143 faces upward from the state shown in FIG. 3A, and the upper surface of the workpiece W being conveyed from the spinner table 101 to the temporary placement part 11. And ionized air is ejected toward the lower surface. Since the static electricity is also charged on the back surface of the workpiece W, blowing ionized air on the bottom surface of the workpiece W is effective in removing static electricity from the workpiece W.

  Further, as shown in FIG. 3C, when the workpiece W is placed on the temporary placement unit 11, the blowing position of the ionized air ejected from the ejection port 143 as shown by the arrow C is temporarily placed. The adjustment unit 144 is operated by the control unit 15 so as to be the upper and lower surfaces of the workpiece W on the unit 11. Thereby, the rotation position of the rotation part 142 is adjusted so that the jet nozzle 143 faces downward from the state shown in FIG. 3B, and toward the upper surface and the lower surface of the workpiece W on the temporary placement unit 11, Ionized air is ejected.

  That is, in the dicing apparatus 1 according to the present embodiment, the direction of the jet outlet 143 is adjusted following the position of the workpiece W from the cleaning process by the spinner cleaning means 10 until it is accommodated in the cassette 3, Ionized air is blown onto the upper surface (upper surface and lower surface). Thereby, it is possible to effectively remove the static electricity charged on the workpiece W from immediately after the cleaning process which is easily charged to immediately before being accommodated in the cassette 3.

  As described above, according to the dicing apparatus 1 according to the present embodiment, the air that has been ionized by the adjustment unit 144 from the ejection port 143 to the workpiece W on the chuck table 7 and the workpiece W on the temporary placement unit 11. Is operating to spray. Thereby, the ionized air can be sprayed following the workpiece W moving in the apparatus. As a result, it is possible to perform the charge removal process on the workpiece W at a plurality of locations in the apparatus using the single ion blowing means 14. Therefore, it is possible to realize the dicing apparatus 1 including the ion blowing means 14 that can surely remove the charge of the work W without pressing the space in the apparatus.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the case where the ejection pressure of ionized air ejected from the ejection outlet 143 of the ion blowing means 14 is always constant has been described. However, the ejection pressure can be changed as appropriate. It is. For example, the ejection pressure may be adjusted according to the distance from the workpiece W. It is also possible to adjust the ejection pressure according to the amount of charge in the workpiece W. In the case of such changes, the ejection pressure can be adjusted flexibly according to the distance to the workpiece W or the amount of charge in the workpiece W, so that the workpiece W can be more effectively subjected to charge removal.

  Since the work can be neutralized at a plurality of locations in the apparatus using a single ion blowing means, the present invention is not limited to the above dicing apparatus, and performs various processes such as laser dicing, grinding, polishing, etc. It is possible to apply to this processing apparatus.

DESCRIPTION OF SYMBOLS 1 Dicing processing apparatus 2 Work | work affixed on the frame 3 Cassette 4 Base 5 Cabinet 5a Left side surface 5b Front 6 Operation display board 7 Chuck table 8 Base table 9 Cassette stage 10 Spinner cleaning means 101 Spinner table 102 Clamp 11 Temporary placement Parts 11a and 11b guide rails 12 and 13 transport arms 121 and 131 linear guides 122 and 132 arms 123 clamp parts 124 and 133 suction pads 14 ion blowing means 141a and 141b strut parts 142 rotating parts 143 jet outlets 144 adjusting parts 15 control parts 20 Cutting means 21 Cutting blades 22a, 22b Blade unit 23 Column 24a, 24b Blade unit moving mechanism W Work F Ring frame T Expansion tape

Claims (2)

Holding means for holding the workpiece;
Processing means for processing the workpiece held by the holding means;
A cassette stage for mounting a cassette containing a plurality of the workpieces;
A temporary placement section for temporarily placing the workpiece immediately before the workpiece is accommodated in the cassette;
A spinner cleaning means for spin cleaning the workpiece processed by the processing means;
Ion blowing means for blowing the ionized air onto the workpiece to relieve charging of the workpiece;
A dicing apparatus having a conveying unit that conveys the workpiece between the holding unit, the temporary placement unit, and the spinner cleaning unit,
The ion blowing means includes
A spout for ejecting the ionized air;
An adjusting unit that adjusts the blowing position of the ionized air by adjusting the direction of the jet port;
A control unit for operating the adjustment unit,
When the work is unloaded from the holding table of the spinner cleaning means after the work is cleaned by the spinner cleaning means, the control unit directs the jet port toward the work on the holding table. When the adjustment unit is operated so as to blow ionized air and the workpiece is placed on the temporary placement unit immediately before the workpiece is accommodated in the cassette, the ejection port is placed on the temporary placement unit. The dicing apparatus is characterized in that the adjustment unit is operated so as to blow the ionized air toward the workpiece.   The control unit is ionized toward the workpiece held by the conveyance unit while the conveyance unit conveys the workpiece from the holding table of the spinner cleaning unit to the temporary placement unit. The dicing apparatus according to claim 1, wherein the adjusting unit is operated so as to blow air.

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