JP2023146378A - Robot hand and wafer transport robot - Google Patents

Abstract

To suction and hold a wafer securely without increasing the size of a robot hand and a wafer transport robot even if the wafer is curved or flat and prevent contamination of the wafer after processing.SOLUTION: A robot hand 70 is formed including: a sucker 75 which is disposed at one surface 701 side, suctions and holds a wafer 100 curved in a recessed shape, and may elastically deform; a first communication port 72 formed at an attachment part 71; a first suction passage 77 which allows the sucker 75 and the first communication port 72 to communicate with each other; a suction port 78 which is open on an other surface 702 and suctions and holds a flat wafer 100; a second communication port 73 formed at the attachment part 71; and a second suction passage 79 which allows the suction port 78 and the second communication port 73 to communicate with each other. Further, a wafer transport robot 60 includes: a robot suction passage 81 which allows a holder 61 and a suction source 80 to communicate with each other; and valves 91, 92 which are disposed at one end of the robot suction passage 81 and switches between the first suction passage 77 and the second suction passage 78.SELECTED DRAWING: Figure 5

Description

The present invention relates to a robot hand that suction-holds a wafer and a wafer transfer robot equipped with the same.

For example, in a grinding device that grinds wafers, a wafer is taken out from a cassette placed on a cassette stage and transported to an alignment table, or a wafer that has been ground and cleaned is transported from a cleaning unit to a cassette. A robot is used to transport wafers and store them in cassettes.

Wafers include not only flat wafers but also curved wafers. For example, a wafer with resin molded on one side becomes curved in a concave shape, with the central region on the resin side depressed as the molded resin contracts. Further, even if the wafer is not resin-molded, some wafers may be warped due to being thinned by grinding.
In order to suction and hold such a wafer, for example, Patent Documents 1 to 3 disclose a wafer transfer method in which an elastically deformable suction cup is arranged on the holding surface of a robot hand, and the suction cup reliably suctions and holds a warped wafer. A robot has been proposed.

Furthermore, Patent Document 4 proposes a wafer transfer robot that is provided with two holding parts, one holding part holds a wafer before grinding, and the other holding part holds a wafer after grinding. has been done.

Japanese Patent Application Publication No. 2017-045784 JP2017-050484A JP2020-202324A Japanese Patent Application Publication No. 2010-082742

However, when wafers before and after grinding are held under suction by the same robot hand, a problem arises in that grinding debris attached to the wafer before grinding is attached to the wafer after grinding via the robot hand.

Further, as proposed in Patent Document 4, when two holding parts are provided on a robot hand, there is a problem that the robot hand and the wafer transfer robot equipped with the same become larger.

Therefore, the robot hand and wafer transfer robot are capable of reliably suctioning and holding curved wafers or flat wafers without increasing the size of the wafer, and also prevent contamination of the wafer after processing. The challenge is to prevent

In order to solve the above problems, the present invention provides a plate-shaped robot hand that has a mounting part that is attached to a holder of a robot and that sucks and holds a wafer. a suction cup that suctions and holds the concave or convex surface of the mount, a first communication port formed in the mounting portion, a first suction path formed inside that communicates the suction cup and the first communication port, and the other surface of the suction cup. A suction port that is open and holds a flat wafer by suction, a second communication port formed in the mounting portion, and a second suction path that is formed inside and communicates the suction port and the second communication port. It is characterized by being prepared.

The present invention also provides a wafer transfer robot that includes a holder to which the mounting portion of the robot hand is attached and that transfers a wafer, the robot suction path communicating the holder with a suction source, and one end of the robot suction path. The present invention is characterized by comprising a valve disposed in the valve for switching between the first suction path and the second suction path.

According to the present invention, the valve is switched to communicate the suction source with the first suction path of the robot hand, and the unprocessed wafer, which is curved in a concave shape, is reliably suctioned and held by the suction cup provided on one surface of the robot hand. can do. In addition, the robot hand is reversed, the valve is switched, the suction source is communicated with the second suction path of the robot hand, and a negative pressure is generated in the suction port opened on the other side of the robot hand to remove the flat wafer after processing. can be reliably sucked and held. Therefore, even if the wafer is curved or thin and flat, it can be reliably sucked and held by the robot hand.

In addition, both sides of the robot hand are used differently, with one side suctioning and holding unprocessed wafers and the other side suctioning and holding wafers after processing. The robot hand and wafer transfer robot do not need to be enlarged. Furthermore, since the wafers before and after processing are not suctioned and held by the same suction cup, there is no problem that the wafer after processing is contaminated by processing debris adhering to the suction cup.

FIG. 1 is a cutaway perspective view of a grinding apparatus equipped with a wafer transfer robot according to the present invention. FIG. 1 is a perspective view of a wafer transfer robot according to the present invention. FIG. 2 is a plan view of one side of the robot hand according to the present invention. FIG. 3 is a plan view of the other side of the robot hand according to the present invention. FIG. 4 is a cross-sectional view taken along the line AA in FIG. 3. FIG. 2 is a system configuration diagram for switching the suction path of the robot hand according to the present invention. FIG. 3 is a side cross-sectional view of the robot hand showing a state in which a curved wafer before grinding is sucked and held by a suction cup. FIG. 3 is a side sectional view of the robot hand showing a state in which a flat wafer after grinding is suctioned and held by a suction port.

FIG. 1 is a partially cutaway perspective view of a grinding device 1. The illustrated grinding device 1 is a device for grinding a disk-shaped wafer as a workpiece, and includes a chuck table that holds the wafer by suction. 10, a grinding mechanism 20 that grinds the wafer, a grinding feed mechanism 30 that moves the grinding mechanism 20 up and down in the Z-axis direction, a thickness measuring means 40 that measures the thickness of the wafer during grinding, and a A cleaning mechanism 50 that cleans the surface of the wafer to be ground, a transfer robot 60 that takes wafers in and out of the cassette 101, an alignment table 102 that aligns the wafers taken out from the cassette 101 by the transfer robot 60, and A first transport mechanism 103 that transports the wafer before grinding that has been aligned by the alignment table 102 to the chuck table 10; and a second transport mechanism that transports the wafer after the grinding process from the chuck table 10 to the cleaning mechanism 50. A mechanism 104 is provided.

The chuck table 10 is a disc-shaped member, and a disc-shaped porous member 13 made of porous ceramic or the like is incorporated in a circular recess 12 formed in the center thereof. The upper surface of the porous member 13 constitutes a holding surface 11 that sucks and holds the disk-shaped wafer 100. Although not shown, the porous member 13 is connected to a suction source such as a vacuum pump. Further, the chuck table 10 is rotated around its vertical axis at a predetermined speed (for example, 300 rpm) by a rotation drive mechanism including a motor, which is a drive source, arranged below the chuck table 10.

Here, the grinding device 1 is equipped with a rectangular box-shaped base 2 that is long in the Y-axis direction (front-back direction), and inside this base 2 is a chuck table 10 and a wafer 100 that is suction-held on the chuck table 10. A horizontal movement mechanism (not shown) is provided for movement along the axial direction (front-back direction). The upper part of the base 2 of the grinding device 1 is covered by a rectangular box-shaped cover 3 that is open at the bottom, and the front surface (-Y direction end face) of this cover 3 is used for inputting various setting values. An input display unit 4 is provided with keys and a display screen.

Further, a rectangular opening 14 that is long in the Y-axis direction is formed on the upper surface of the base 2, and the chuck table 10 is accommodated in this opening 14. The area around the chuck table 10 in the opening 14 is covered with a rectangular plate-shaped cover 15, and the front and rear (-Y direction and +Y direction) portions of the cover 15 in the opening 14 move together with the cover 15. They are respectively covered by bellows-shaped telescopic covers 16 and 17 that expand and contract with each other. Therefore, no matter where the chuck table 10 is located in the front-rear direction (Y-axis direction), the opening 14 is always covered by the cover 15 and the telescopic covers 16 and 17, preventing foreign matter from entering the base 2. It is prevented.

The grinding mechanism 20 includes a spindle 21 having a rotation center axis in the Z-axis direction, a housing 22 that rotatably supports the spindle 21, a spindle motor 23 that rotationally drives the spindle 21, and a lower end of the spindle 21. It includes a mount 24 and a grinding wheel 25 detachably attached to the lower surface of the mount 24. Here, the grinding wheel 25 includes a base 251 and a plurality of substantially rectangular parallelepiped-shaped grindstones 252 arranged in an annular shape on the lower surface of the base 251. Note that each grindstone 252 is a processing tool for grinding the wafer 100, and its lower surface constitutes a grinding surface that contacts the wafer 100.

A rectangular box-shaped column 5 is erected on the +Y-axis direction end (rear end) of the upper surface of the base 2, and a grinding feed mechanism 30 is installed on the -Y-axis direction end (front) of this column 5. The provided grinding feed mechanism 30 moves the grinding mechanism 20 up and down along the direction (Z-axis direction) perpendicular to the holding surface 11 of the chuck table 10, and is provided on the back side of the housing 22. The attached rectangular plate-shaped lifting plate 31 and the holder 26 attached to the lifting plate 31 and supporting the housing 22 are moved together with the housing 22 and the spindle 21 held by the housing 22, the spindle motor 23, the grinding wheel 25, etc. It is moved up and down along the guide rail 32 in the Z-axis direction.

A rotatable ball screw shaft 33 is erected between the pair of left and right guide rails 32 along the Z-axis direction (up and down direction), and the upper end of the ball screw shaft 33 is connected to a forward and reverse drive source. The motor 34 is connected to a motor 34 that can be used. Here, the motor 34 is mounted vertically via a rectangular plate-shaped bracket 35 mounted on the upper surface of the column 5.

The lower end of the ball screw shaft 33 is rotatably supported by the column 5, and the ball screw shaft 33 has a horizontally protruding portion (not shown) provided on the back surface of the elevating plate 31 toward the rear (+Y-axis direction). The nut member is threaded and inserted.

A thickness measuring means 40 for measuring the thickness of the wafer 100 held on the holding surface 11 of the chuck table 10 is arranged on the side of the opening 14 on the upper surface of the base 2 . Here, the thickness measuring means 40 is a contact-type height gauge that measures the thickness of the wafer 100 whose surface to be ground is being ground by the grinding mechanism 20.

The cleaning mechanism 50 cleans the surface to be ground of the wafer after the grinding process, and includes a spinner table 51 that holds and rotates the wafer after the polishing process, and cleaning water and water toward the surface to be polished of the wafer 100. It is equipped with an injection nozzle 52 that injects high-pressure air.

FIG. 2 is a perspective view of a wafer transfer robot 60 according to the present invention. The illustrated wafer transfer robot 60 is an articulated robot, and a plate-shaped robot hand 70 is attached to a holder 61 thereof. Here, a mounting portion 71 is formed at the base end of the robot hand 70, and by inserting and fixing the mounting portion 71 into the holder 61, the robot hand 70 is attached to the holder 61 of the wafer transfer robot 60. It will be installed.

The wafer transfer robot 60 includes a drive unit 62 that moves the robot hand 70 to a predetermined position. This drive unit 62 includes a first arm 63, a second arm 64, a robot hand rotation mechanism 65 that horizontally rotates the robot hand 70, and a first arm rotation mechanism 66 that horizontally rotates the first arm 63. and a second arm turning mechanism 67 that turns the second arm 64 in the horizontal direction.

One longitudinal end of the first arm 63 is rotatably connected to the shaft-shaped robot hand rotation mechanism 65, and the other longitudinal end of the first arm 63 is connected to the shaft-shaped robot hand rotation mechanism 65. One longitudinal end of the second arm 64 is rotatably connected. Further, the other end in the longitudinal direction of the second arm 64 is connected to a second arm turning mechanism 67, and the second arm turning mechanism 67 also has a function of moving the second arm 64 in the Z-axis direction. .

Here, the robot hand turning mechanism 65 turns the robot hand 70 in the horizontal direction with respect to the first arm 63 by a rotational driving force generated by a turning drive source (not shown), and the first arm turning mechanism 66 , the first arm 63 is rotated horizontally with respect to the second arm 64 by a rotational drive force generated by a rotation drive source (not shown). Further, the second arm turning mechanism 67 turns the second arm 64 horizontally with respect to the Z-axis direction moving mechanism 68 using a rotational driving force generated by a turning drive source (not shown). The operation of the Z-axis movement mechanism 68 is controlled by a control section (not shown), and moves the robot hand 70 up and down in the Z-axis direction on the grinding device 1 shown in FIG. 1.

Further, a housing 69 is fixed to the upper end of the robot hand rotating mechanism 65, and a motor (not shown) is housed in the housing 69. A motor output shaft (motor shaft) 691 protrudes from the housing 69 in the Y-axis direction perpendicular to the vertical direction (Z-axis direction), and the holder 61 is attached to the tip of the output shaft 691.

Therefore, by driving a motor (not shown) and rotating the robot hand 70 by half a rotation around the output shaft 691, one surface 701 and the other surface 702 of the robot hand 70 are alternately reversed so that they face upward. can be done.

A circular hole-shaped first communication port 72 is opened in one surface 701 of the mounting portion 71 of the robot hand 70, and a circular hole-shaped communication port 72 is opened in the other surface 702 of the mounting portion 71 of the robot hand 70. The second communication port 73 is open. A robot suction path 81 extending from a suction source 80 via a valve mechanism 90 is connected to the first communication port 72 and the second communication port 73, and as described later, the robot suction path 81 is connected to the suction source 80 by the valve mechanism 90. Communication between the first communication port 72 (first suction path 77 described later) or the second communication port 73 (second suction path 79 described later) and the suction source 90 is selectively switched.

3 is a plan view of one side of the robot hand according to the present invention, FIG. 4 is a plan view of the other side of the robot hand, FIG. 5 is a cross-sectional view taken along line AA in FIG. 3, and FIG. FIG. 2 is a system configuration diagram for switching suction paths.

The robot hand 70 according to the present invention is a flat member having a substantially fork-shaped holding portion 74 at its tip for holding a wafer by suction. Suction cups 75 for suctioning and holding the wafer 100 are provided at four locations (symmetrical positions with respect to the center line in the width direction of the robot hand) of the holding portion 74 on one surface 701 of the robot hand 70 shown in FIG. 3, respectively. A circular hole 76 is opened in the center of each suction cup 75. Here, as shown in FIGS. 2 and 5, each suction cup 75 is formed of an elastic material such as elastically deformable rubber into a tapered cylindrical shape that opens toward the opening side (downward in FIG. 5). The four circular holes 76 opened in each suction cup 75 and the first communication port 72 opened in the attachment part 71 of the robot hand 70 are connected to each other by a first suction path 77 formed inside the robot hand 60. It's communicating.

Furthermore, five locations of the holding portion 74 shown in the drawing on the other surface 702 of the robot hand 70 shown in FIG. Three circular hole-shaped suction ports 78 are opened at one location located at the center. Each suction port 78 and the second communication port 73 opened to the attachment portion 71 of the robot hand 70 communicate with each other through a second suction path 79 formed inside the robot hand 70 .

Here, the system for switching the suction path of the robot hand 70 will be described based on FIG. The first and second robot suction paths 811 and 812 are provided with electromagnetic on-off valves 91 and 92, respectively. A first suction path 811 extending from each electromagnetic on-off valve 91, 92 is connected to a first communication port 72 and a second communication port that open to each mounting portion 71 on one surface 701 and the other surface 702 of the robot hand 70, respectively. 73 respectively. The opening and closing of the electromagnetic on-off valves 91 and 92 is controlled by a control section (not shown).

Next, the grinding process of the wafer 100 by the grinding apparatus 1 including the robot hand 70 and the wafer transfer robot 60 according to the present invention will be described below with reference to FIGS. 7 and 8. Figure 7 is a side sectional view of the robot hand showing a state in which a curved wafer before grinding is suctioned and held by a suction cup, and Figure 8 is a side sectional view of the robot hand showing a state in which a wafer after grinding is suctioned and held by a suction port. 1 is a cross-sectional view. When grinding a wafer 100, the wafer 100 before grinding is taken out from the cassette 101 by the wafer transfer robot 60. Here, as shown in FIG. 7, the surface of the wafer 100 to be ground is molded with a resin 110, and when the resin 110 contracts, the wafer 100 is warped, and the wafer 100 becomes convex downward. It is curved in a concave shape. When taking out such a curved wafer 100 before grinding processing from the cassette 101 by the wafer transfer robot 60, as shown in FIG. 100 is supported by four suction cups 75 (only two shown in FIG. 7). Then, the control section opens one electromagnetic on-off valve 91 shown in FIG. 6 and closes the other electromagnetic on-off valve 92.

Then, each suction cup 95 is evacuated by the suction source 80. That is, air is sucked by the suction source 80 from the circular hole 76 opening in each suction cup 75 through the first suction path 77, the first communication port 72, the first robot suction path 811, and the electromagnetic on-off valve 91 in the open state. Therefore, negative pressure is generated in each suction cup 75, and the wafer 100 curved into an arc is held by the robot hand 70 while being sucked by the negative pressure generated in the four suction cups 75. At this time, each suction cup 75 made of an elastic material is elastically deformed along the curved shape of the wafer 100 and comes into close contact with the convex surface of the wafer 100, so that a gap is formed between the wafer 100 and each suction cup 75. Never. Therefore, a suction error of the wafer 100 due to a vacuum leak or the like does not occur, and the wafer 100 is reliably suction-held by the robot hand 60. Further, since an excessive load is not applied to the support portion of the wafer 100 by the suction cup 75, damage to the wafer 100 is prevented.
Note that each suction cup 75 may be brought into close contact with the concave surface of the wafer 100 to hold the wafer 100 under suction. At this time, the medium-concave wafer 100 housed in the cassette 101 has its concave surface facing down.

When the wafer 100 is taken out from the cassette 101 while being sucked and held by the robot hand 70 as described above, the wafer 100 is transported to the alignment table 102 shown in FIG. will be done. Then, the wafer 100 aligned in this manner is suction-held by the first transport mechanism 103 and transported to the chuck table 10.

On the chuck table 10, the wafer 100 is placed on the holding surface 11 of the chuck table 10 with its surface facing down. Then, since the porous member 13 is evacuated by a suction source (not shown), a negative pressure is generated in the porous member 13, and the wafer 100 placed on the upper surface (holding surface 11) of the porous member 13 is exposed to a negative pressure. It is suctioned and held on the holding surface 11 by pressure.

From the above state, a horizontal movement mechanism (not shown) is driven to move the chuck table 10 in the +Y-axis direction (backward), and the wafer 100 held by the chuck table 10 is positioned below the grinding wheel 25 of the grinding mechanism 20. do. Then, a rotation drive mechanism (not shown) is driven to rotate the chuck table 10 at a predetermined speed. At the same time, the spindle motor 23 is started to rotate the grinding wheel 25 at a predetermined speed (for example, 1000 rpm).

As described above, while the wafer 100 and the grinding wheel 25 are rotating, the grinding feed mechanism 30 is driven to lower the grinding wheel 25 in the −Z-axis direction. That is, when the motor 34 is driven and the ball screw shaft 33 rotates, the elevating plate 31, which is provided with a nut member (not shown) that is screwed and inserted into the ball screw shaft 33, moves along with the housing 22, the grinding wheel 25, etc. in the -Z axis direction. descend. Then, the lower surface (processed surface) of the grindstone 252 of the grinding wheel 25 comes into contact with the upper surface of the wafer 100. In this way, when the grinding wheel 25 is further lowered by a predetermined amount in the −Z-axis direction from the state where the lower surface of the grinding wheel 252 is in contact with the upper surface of the wafer 100, the upper surface of the wafer 100 is ground by the grinding wheel 252 by a predetermined amount. be done. Note that the thickness of the wafer 100 during the grinding process is measured by the thickness measuring mechanism 40.

When the above-described grinding process on the wafer 100 is completed, the evacuation of the porous member 13 is stopped, and the suction and holding of the wafer 100 is released. Then, the thin wafer 100 after the grinding process is transported to the cleaning mechanism 50 by the second transport mechanism 103, and the wafer 100 is placed on the spinner table 51 of the cleaning mechanism 50.

In the cleaning mechanism 50, a spinner table 51 and a wafer 100 placed thereon rotate at a predetermined speed, and cleaning water and high-pressure air are sprayed from a spray nozzle 52 toward the rotating wafer 100, thereby cleaning the wafer. The upper surface (surface to be ground) of the wafer 100 is cleaned with cleaning water or high-pressure air, and foreign matter such as grinding debris attached to the upper surface of the wafer 100 is removed. The wafer 100 that has been cleaned in this way is held under suction by the robot hand 70 of the wafer transfer robot 60 and is transferred to the cassette 101 and stored in the cassette 101.

When the thin flat wafer 100 after grinding is transferred from the cleaning mechanism 50 to the cassette 101 by the wafer transfer robot 60, the robot hand 70 is rotated half a turn so that the other surface 702 of the robot hand 70 is rotated as shown in FIG. It is set facing upward as shown. Then, the holding section 74 of the robot hand 70 enters below the spinner table 51 and then rises, and the control section opens one electromagnetic on-off valve 92 shown in FIG. 6 and closes the other electromagnetic on-off valve 91.

Then, each suction port 78 is evacuated by the suction source 80. That is, the suction source is supplied from the plurality of suction ports 78 opened on the other surface 702 of the robot hand 70 via the second suction path 79, the second communication port 73, the second robot suction path 812, and the electromagnetic on-off valve 92 in the open state. 80, negative pressure is generated in each suction port 78, and as shown in FIG. It is securely held by the robot hand 70 in this state.

Therefore, according to the present embodiment, even if the wafer 100 is curved before being ground, or the wafer 100 is thin and flat after being ground, the robot hand 70 can reliably hold the wafer under suction.
As described above, in the present embodiment, the curved wafer 100 before the grinding process is suctioned and held by the negative pressure generated in the four suction cups 75 provided on one surface 701 of the robot hand 70, and the curved wafer 100 is held thinly after the grinding process. Since the flat wafer 100 is suctioned and held by the negative pressure generated in the plurality of suction ports 78 opened on the other surface 702 of the robot hand 70, processing debris generated on the wafer 100 before the grinding process is transferred to the suction cup 75. Even if the dust adheres to the suction cup 75, the wafer 100 after the grinding process, which is suctioned and held by the negative pressure generated in the plurality of suction ports 78 opened on the other surface 702 of the robot hand 70, will be contaminated by the machining debris adhering to the suction cup 75. Never.

Furthermore, in this embodiment, one surface 701 of one robot hand 70 is used to suction and hold the curved wafer 100 before the grinding process, and the other surface 702 of the robot hand 70 is used to hold the curved wafer 100 after the grinding process. Since it is used to suction and hold a flat wafer 100, it is not necessary to provide two robot hands 70 in the wafer transfer robot 60, and it is possible to prevent the robot hand 70 and the wafer transfer robot 60 equipped with the same from increasing in size and cost. can.

Although the present invention is applied to a robot hand provided in a grinding device and a wafer transfer robot equipped with the same, the present invention is also applicable to a robot hand provided in any processing device other than the grinding device. The present invention can be similarly applied to a wafer transfer robot equipped with this.

Furthermore, in the above embodiments, an example has been described in which a convex portion of a warped wafer is suctioned and held by a suction cup, but a concave portion of the wafer may also be suctioned and held by a suction cup.
In addition, the application of the present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the technical ideas described in the claims, specification, and drawings. Of course.

1: Grinding device, 2: Base, 3: Case, 4: Input display section, 5: Column,
10: chuck table, 11: chuck table holding surface,
12 recess of chuck table, 13: porous member, 14: opening of base,
15: Cover, 16, 17: Telescopic cover, 20: Processing mechanism, 21: Spindle,
22: Housing, 23: Spindle motor, 24: Mount, 25: Grinding wheel,
251: Base, 252: Grindstone, 30: Grinding feed mechanism, 31: Elevating plate,
32: Guide rail, 33: Ball screw shaft, 34: Motor, 35: Bracket,
40: Thickness measuring mechanism, 50: Cleaning mechanism, 51: Spinner table,
52: injection nozzle,
60: Wafer transfer robot, 61: Holder, 62: Drive unit, 63: First arm,
64: second arm, 65: robot hand rotation mechanism, 66: first arm rotation mechanism,
67: Second arm rotation mechanism, 69: Housing, 691: Output shaft (motor shaft),
70: Robot hand, 701: One side of the robot hand,
702: Other surface of robot hand, 71: Mounting part, 72: First communication port,
73: second communication port, 74: holding part, 75: suction cup, 76: circular hole, 77: first suction path,
78: suction port, 79: second suction path, 80: suction source, 81: robot suction path,
811: first robot suction path, 812: second robot suction path, 90: valve mechanism,
91, 92: Electromagnetic on-off valve, 100: Wafer, 101: Cassette,
102: alignment table, 103: first transport mechanism, 104: second transport mechanism,
110: Resin

Claims (2)

A plate-shaped robot hand that has a mounting part that is attached to a holder of a robot and that sucks and holds a wafer,
A suction cup disposed on one side and sucking and holding the concave or convex surface of the wafer curved in a concave shape; a first communication port formed in the mounting portion; and a suction cup and the first communication port formed inside. a first suction path communicating with the
a suction port that opens on the other surface and holds a flat wafer by suction; a second communication port formed in the mounting portion; and a second suction port that is formed inside and communicates the suction port and the second communication port. road and
A robot hand equipped with A wafer transport robot for transporting a wafer, comprising a holder for mounting the attachment part of the robot hand according to claim 1,
a robot suction path that communicates the holder with a suction source; a valve that is disposed at one end of the robot suction path and switches between the first suction path and the second suction path;
A wafer transfer robot equipped with

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