JP2024017100A - Washing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently wash an entire lower surface of a curved workpiece in a short period of time.

SOLUTION: A washing device 1 brings a washing brush 71 into contact with a lower surface of a curved wafer (workpiece) W, thereby washing the wafer. The washing device comprises: a suction pad 64 which suction-holds a center portion of an upper surface of the wafer W; the washing brush 71 which comes into contact with the lower surface of the wafer W suction-held by the suction pad 64; a horizontal movement mechanism 80 which horizontally moves the suction pad 64 and the washing brush 71 relative to each other; a lifting mechanism 90 which vertically lifts/lowers the suction pad 64 and the washing brush 71 relative to each other; and a control part 100. The control part 100 horizontally moves the suction pad 64 and the washing brush 71 relative to each other, and lifts/lowers the suction pad 64 and the washing brush 71 relative to each other on the basis of lower surface height information of the wafer W which has been preset in accordance with a horizontal position of the wafer W with respect to the washing brush 71. In this way, the control part keeps the washing brush 71 into contact with the lower surface of the wafer W so as to wash the lower surface of the wafer W.

SELECTED DRAWING: Figure 2

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a cleaning device for cleaning the lower surface of a curved workpiece.

For example, in a processing device that processes a workpiece such as a wafer, the upper surface of the workpiece is suction-held by a suction pad and transported to a predetermined position, while the lower surface of the workpiece is cleaned by a cleaning device. As such a cleaning device, one is known that cleans the lower surface of the workpiece by horizontally moving a suction pad that sucks and holds the workpiece and a cleaning brush that contacts the lower surface of the workpiece (for example, , see Patent Documents 1 and 2).

By the way, when the workpiece is a wafer, a resin layer may be formed on one side of the workpiece before the workpiece is ground.The wafer on which such a resin layer is formed has its outer periphery damaged by strong force. Since it is warped and curved, the entire surface cannot be suctioned and held by a suction pad. For this reason, only the flat central portion of the wafer is suctioned and held by the suction pad.

Japanese Patent Application Publication No. 11-031674 JP2005-302831A

However, in the case of a curved wafer whose central portion is suctioned and held by a suction pad, it is not possible to clean the entire lower surface of the wafer by bringing the cleaning brush into contact with the entire lower surface of the wafer. For this reason, two fluids, air and water, are injected onto the outer periphery of the lower surface of the curved wafer, where the cleaning brush cannot come into contact with, to clean the outer periphery of the lower surface, but this cleaning takes a lot of time. The problem is that it is inefficient.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a cleaning device that can efficiently clean the entire lower surface of a curved workpiece in a short time.

The present invention, which achieves the above object, is a cleaning device that cleans a curved workpiece by bringing a cleaning brush into contact with the lower surface of the workpiece, which comprises: a suction pad that suctions and holds a central portion of the upper surface of the workpiece with a suction surface; a cleaning brush whose surface contacts the lower surface of the workpiece held by suction; a horizontal movement mechanism that relatively horizontally moves the suction pad and the cleaning brush in a direction parallel to the holding surface; and the suction pad and the cleaning brush. a lifting mechanism for relatively raising and lowering the suction pad and the cleaning brush in a direction perpendicular to the suction surface; By relatively raising and lowering the suction pad and the cleaning brush based on the lower surface height information of the workpiece set in advance with respect to the horizontal position of the workpiece, the lower surface of the curved workpiece is cleaned. The method is characterized in that the lower surface of the workpiece is cleaned by keeping the brush in contact with the workpiece.

According to the present invention, the suction pad (workpiece) and the cleaning brush are moved relatively horizontally while being relatively raised and lowered based on preset lower surface height information of the workpiece. The lower surface of the workpiece can be cleaned by keeping the cleaning brush in contact with the entire lower surface of the workpiece, and the entire lower surface of the curved workpiece can be efficiently cleaned in a short time.

1 is a partially cutaway perspective view of a grinding device including a cleaning device according to the present invention. (a) to (c) are partially cutaway side views showing the process of cleaning an upwardly curved workpiece using the cleaning apparatus according to the first embodiment of the present invention. (a) to (c) are partially cutaway side views showing the process of cleaning a downwardly curved workpiece using the cleaning device according to the first embodiment of the present invention. (a) and (b) are partially cutaway side views showing a process of cleaning an upwardly curved workpiece using a cleaning device according to a second embodiment of the present invention. It is a perspective view of the cleaning brush used for the cleaning device concerning a 2nd embodiment of the present invention.

Embodiments of the present invention will be described below based on the accompanying drawings.

<First embodiment>
First, the configuration of a grinding device including a cleaning device according to a first embodiment of the present invention will be described below based on FIG. In the following, the arrow directions shown in FIG. 1 will be described as the X-axis direction (left-right direction), the Y-axis direction (front-back direction), and the Z-axis direction (up-down direction), respectively.

[Configuration of grinding device]
The grinding apparatus 1 shown in FIG. 1 grinds the back surface (in FIG. 1, the top surface) of a disk-shaped wafer W, which is a workpiece (workpiece), and includes the following components.

That is, the grinding apparatus 1 includes a chuck table 10 that suction-holds the wafer W, a grinding unit 20 that grinds the back surface (in FIG. 1, the top surface) of the wafer W held on the holding surface 10a of the chuck table 10. A spinner cleaning means 30 that cleans the wafer W, a robot 40 that carries the wafer W into and out of the cassette 2, and a robot 40 that suction-holds the wafer W aligned on the alignment table 4 and transports it to the chuck table 10. 1 conveyance means 50, a second conveyance means 60 that suction-holds the ground wafer W and conveys it from the chuck table 10 to the spinner cleaning means 30, and A cleaning device 70 for cleaning is provided as a main component.

Here, the wafer W is made of a single crystal silicon base material, and a resin layer F is formed on one surface (the lower surface in the state shown in FIG. 1). Note that the resin layer F seals the device chip placed on the top surface of the silicon base material, and the electrodes of the device chip are exposed on the ground surface of the resin layer F that is ground with a grinding wheel. .

Next, the configuration of the chuck table 10, the grinding unit 20, the spinner cleaning means 30, the robot 40, the first conveyance unit 50 and the second conveyance unit 60, which are the main components of the grinding apparatus 1, and the cleaning apparatus 70 according to the present invention. We will explain each of them.

(Chuck table)
The chuck table 10 is a disc-shaped member, and a disc-shaped porous member 10A made of porous ceramic or the like is incorporated in the center thereof. Here, the upper surface of the porous member 10A constitutes a holding surface 10a that suction-holds the disc-shaped wafer W, and the holding surface 10a is selectively connected to a suction source (not shown).

The chuck table 10 is rotated around the axis at a predetermined speed by a rotation mechanism (not shown) including an electric motor as a drive source provided below the chuck table 10. The horizontal movement mechanism allows reciprocating movement in the Y-axis direction (back and forth direction) between the processing position P1 and the delivery position P2. Note that the horizontal movement mechanism (not shown) is constituted by a known ball screw mechanism or the like.

A thickness measuring device 5 is arranged near the chuck table 10 located at the processing position P1 on the base 1A. The thickness measuring device 5 is a height gauge, and includes a first contact 5a that contacts the top surface of the wafer W held on the chuck table 10, and a second contact 5b that contacts the top surface of the outer peripheral portion of the chuck table 10. It is equipped with Therefore, by subtracting the top surface height of the chuck table 10 measured by the second contactor 5b from the top surface height of the wafer W measured by the first contactor 5a, the thickness of the wafer W during the grinding process can be calculated. can be measured.

(Grinding unit)
As shown in FIG. 1, the grinding unit 20 includes a holder 21 that is open at the top, a spindle motor 22 that is a rotational drive source that is fixed to the holder 21 in a vertical position, and is rotationally driven by the spindle motor 22. It includes a spindle 23, a disk-shaped mount 24 attached to the lower end of the spindle 23, and a grinding wheel 25 detachably attached to the lower surface of the mount 24. Here, a plurality of rectangular block-shaped grindstones 25a, which are processing tools, are attached to the grinding wheel 25 in an annular shape.

By the way, the grinding unit 20 can be moved up and down along the direction (Z-axis direction) perpendicular to the holding surface 10a of the chuck table 10 by the vertical movement mechanism 11, and this vertical movement mechanism 11 is shown in FIG. As shown, it is disposed on the −Y-axis direction end surface (front surface) of a rectangular box-shaped column 12 vertically erected on the +Y-axis direction end portion (rear end portion) of the upper surface of the base 1A. This vertical movement mechanism 11 moves a rectangular plate-shaped lifting plate 13 attached to the back of a holder 21 to a pair of left and right guide rails 14 together with the holder 21 and a spindle motor 22, a grinding wheel 25, etc. held by the holder 21. It moves up and down along the Z-axis direction. Here, the pair of left and right guide rails 14 are arranged perpendicularly to the front surface of the column 12 and parallel to each other.

Further, between the pair of left and right guide rails 14, a rotatable ball screw shaft 15 is vertically provided along the Z-axis direction (vertical direction), and the upper end of the ball screw shaft 15 is a drive source. It is connected to an electric motor 16 that can rotate in forward and reverse directions. Here, the electric motor 16 is mounted vertically via a rectangular plate-shaped bracket 17 mounted on the upper surface of the column 12. The lower end of the ball screw shaft 15 is rotatably supported by the column 12, and the ball screw shaft 15 has a horizontally protruding portion (not shown) provided on the back surface of the elevating plate 13 toward the rear (+Y-axis direction). The nut members are screwed together.

Therefore, when the electric motor 16 is driven to rotate the ball screw shaft 15 in the forward and reverse directions, the elevating plate 13 to which the nut member (not shown) that is screwed onto the ball screw shaft 15 is attached, moves along the Z-axis direction together with the grinding unit 20. Move up and down.

(Spinner cleaning means)
The spinner cleaning means 30 is for cleaning the back surface of the wafer W whose back surface (in FIG. 1, the top surface) has been ground, and includes a spinner table 31 that holds and rotates the wafer W after the grinding process, and a wafer It includes a washing water nozzle 32 that sprays washing water toward the back surface of the W, and a polygonal cylindrical cover 33 that covers the spinner table 31 and the washing water nozzle 32 and is movable up and down. Note that pure water is preferably used as the washing water.

(robot)
The robot 40 is an articulated robot, and a plate-shaped robot hand 43 is attached to the tip of a rectangular box-shaped attachment part 41 via a holder 42 . The robot 40 is provided with a horizontal movement mechanism 44 that moves the mounting section 41 and the robot hand 43 in the horizontal direction, and a lifting mechanism 45 that moves the mounting section 41 and the robot hand 43 up and down.

(First and second conveyance means)
The basic configuration of the first conveyance means 50 and the second conveyance means 60 is the same, and the first conveyance means 50 has a disk-shaped conveyance pad at the tip of an arm 52 horizontally attached to the upper end of a vertical rotation shaft 51. Similarly, the second conveyance means 60 also supports a disk-shaped conveyance pad 63 horizontally at the tip of an arm 62 that is horizontally attached to the upper end of a vertical rotation shaft 61. It is configured as follows. Note that by rotating the rotation shafts 51 and 61 of the first conveyance means 50 and the second conveyance means 60 by a predetermined angle by a rotation mechanism (not shown), the respective conveyance shafts attached to the tips of the respective arms 52 and 62 are rotated by a predetermined angle. The pads 53 and 63 move in the horizontal direction while drawing circular arcs around the respective rotational axes 51 and 61.

(Cleaning equipment)
The configuration of the cleaning device 70 according to the present invention will be explained based on FIG. 2. The cleaning device 70 includes a suction pad 64 of the second conveying means 60 that suction-holds the center portion of the upper surface of the wafer W with a suction surface 64a; A cleaning brush 71 that contacts the lower surface of the wafer W held by the suction pad 64, a horizontal movement mechanism 80 that relatively horizontally moves the suction pad 64 and the cleaning brush 71, and a horizontal movement mechanism 80 that moves the suction pad 64 and the cleaning brush 71 vertically. The wafer W is provided with an elevating mechanism 90 that relatively moves up and down in a direction, a height measuring device 72 that measures the height of the lower surface of the wafer W, and a control section 100.

The suction pad 64 is fixed to the center of the lower surface of the disc-shaped plate 65, and its outer diameter is set smaller than the outer diameter of the wafer W, as shown in FIG. Suction and hold the center of the top surface. Here, when the center part of the upper surface of the wafer W having the resin layer F formed on the lower surface is suctioned and held by the suction pad 64, as shown in FIG. It is curved in an arcuate shape.

A plate 65 to which a suction pad 64 is fixed at the center of the lower surface is supported horizontally by three pins (only two are shown in FIG. 2) 66, and this plate 66 is connected to an arm 62 via a support 67. is supported at the tip of the

Here, a disc-shaped porous member 64A made of porous ceramic or the like is incorporated in the lower central part of the suction pad 64, and the lower surface of this porous member 10A constitutes a suction surface 64a. . A suction path 6 is opened in the porous member 64A and is formed vertically in the arm 62, the support 67, the support 68 interposed between the transport pad 63 and the plate 65, the plate 65, and the suction pad 63. ing.

A piping 7 is connected to the suction path 6, and branch pipes 7a and 7b branching from the piping 7 are connected to an air supply source 8 such as an air compressor and a suction source 9 such as a vacuum pump, respectively. , electromagnetic on-off valves V1 and V2 are installed between the branch pipes 7a and 7b, respectively. The electromagnetic on-off valves V1 and V2 are electrically connected to the control section 100, and their opening and closing operations are controlled by the control section 100.

The cleaning brush 71 is composed of a rotatable roll sponge that extends parallel to the suction surface 64a of the suction pad 64, and as shown in FIG. It is arranged diagonally on the stand 1A. The cleaning brush 71 is rotationally driven by an electric motor 73, which is electrically connected to a control section 100 and whose operation is controlled by the control section 100.

The horizontal movement mechanism 80 is a mechanism for horizontally rotating the suction pad 64 around the rotating shaft 61 shown in FIG. shall be moved horizontally along the Here, a slider 82 that moves horizontally along the guide rail 81 is fitted into the guide rail 81, and a vertical guide rail 91 that constitutes a lifting mechanism 90 is attached to the slider 82. There is.

Further, the elevating mechanism 90 includes a slider 92 that fits into the guide rail 91 so as to be movable up and down, and the slider 92 is connected to the arm 62 of the second conveying means 60.

Therefore, the suction pad 64 and the wafer W sucked and held by the suction pad 64 can be moved in the horizontal direction relative to the cleaning brush 71 by the horizontal movement mechanism 80, and can also be moved in the vertical direction (Z It can be moved up and down in the axial direction). Note that the horizontal movement mechanism 80 and the lifting mechanism 90 are electrically connected to the control section 100, and their operations are controlled by the control section 100.

The height measuring device 72 is located near the cleaning brush 71 on the base 1A (see FIG. 1) (specifically, upstream in the horizontal movement direction of the suction pad 64 and the wafer W (arrow direction in FIG. 2)) (see FIG. 2) on the right side of the cleaning brush 71. In this embodiment, an optical height measuring device is used as the height measuring device 72. Reference numeral 72 includes a light projector (not shown) that projects light toward the bottom surface of the wafer W, and a light receiver (not shown) that receives the light reflected from the bottom surface of the wafer W. 72 is electrically connected to the control unit 100, and transmits a height signal obtained by measurement to the control unit 100. In this embodiment, an optical type height measuring device is used as the height measuring device 72. However, an ultrasonic type may also be used.

The control unit 100 includes a CPU (Central Processing Unit) that performs arithmetic processing according to a control program, and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The control unit 80 controls the lifting mechanism 90 based on the height information of the lower surface of the wafer W measured by the height measuring device 72 to move the suction pad 64 and the wafer W held thereon to the cleaning brush 71. It functions to raise and lower.

[Action of grinding device]
Next, the operation of the grinding device 1 configured as described above will be explained based on FIG. 1.

When grinding the wafer W, the robot 40 takes out the wafer W before the grinding process from the cassette 2. After the wafer W taken out from the cassette 2 is aligned on the alignment table 4, it is suction-held by the first conveyance means 50 and conveyed to the chuck table 10 waiting at the delivery position P2.

On the chuck table 10, the wafer W is placed on the holding surface 10a of the chuck table 10 with its surface facing down. Then, since the porous member 10A is evacuated by a suction source (not shown), negative pressure is generated in the porous member 10A, and the wafer W placed on the holding surface 10a of the porous member 10A is held by the negative pressure. It is held by suction on the surface 10a.

From the above state, a horizontal movement mechanism (not shown) is driven to move the chuck table 10 in the +Y-axis direction to the processing position P1, and the wafer W, which is suctioned and held by the chuck table 10, is moved to the grinding wheel 25 of the grinding unit 20. Position downward. Then, a rotation mechanism (not shown) is driven to rotate the chuck table 10 at a predetermined speed. At the same time, the spindle motor 22 is started to rotate the grinding wheel 25 at a predetermined speed.

As described above, while the wafer W and the grinding wheel 25 are rotating, the vertical movement mechanism 11 is driven to lower the grinding wheel 25 in the −Z-axis direction. That is, when the electric motor 16 is driven and the ball screw shaft 15 rotates, the elevating plate 13, which is provided with a nut member (not shown) that is screwed onto the ball screw shaft 15, moves along with the holder 21, the grinding wheel 25, etc. in the -Z axis direction. descend. Then, the lower surface (processed surface) of the grindstone 25a of the grinding wheel 25 comes into contact with the upper surface (back surface) of the wafer W. In this way, when the grinding wheel 25 is further lowered by a predetermined amount (grinding allowance) in the −Z-axis direction from the state where the lower surface of the grinding wheel 25a is in contact with the upper surface of the wafer W, the upper surface of the wafer W is touched by the grinding wheel 25a. Only a predetermined amount is ground. Note that the thickness of the wafer W during the grinding process is measured by a thickness measuring device 5.

When the above-described grinding process on the wafer W is completed, the evacuation of the porous member 10A of the chuck table 10 is stopped, and the suction holding of the wafer W is released. Then, the wafer W after the grinding process is transported by the second transport means 60 to the spinner cleaning means 30, and during the transport process, the lower surface of the wafer W is cleaned by the cleaning device 70.

That is, as shown in FIG. 2, when the horizontal movement mechanism 80 moves the suction pad 64 and the curved wafer W held therein horizontally relative to the cleaning brush 71 in the direction of the arrow shown (to the left), the height measuring device 72 optically measures the height of the lower surface of the wafer W along the radial direction from the outer peripheral end of the wafer W, and transmits the measurement result to the control unit 100 . Then, the control unit 100 sequentially stores the height measurement results in the memory as measurement data.

Then, as shown in FIG. 2(a), the wafer W is horizontally moved relative to the cleaning brush 71 by the horizontal movement mechanism 80 in the direction of the illustration or the arrow shown in the figure, and the outer peripheral end (starting end) of the wafer W is moved toward the cleaning brush 71. 71, the control unit 100 reads the height of the lower surface of the wafer W at the outer peripheral edge from the memory, and controls the height of the wafer W using the lifting mechanism 90 so that the cleaning brush 71 contacts the lower surface of the wafer W. .

Similarly, as shown in FIG. 2B, when the wafer W has moved horizontally to a position where the cleaning brush 71 contacts the intermediate part thereof, the lower surface height of the wafer W at that position is stored in the memory of the control unit 100. The control unit 100 controls the height of the wafer W using the lifting mechanism 90 so that the cleaning brush 71 comes into contact with the lower surface of the wafer W.

As shown in FIG. 2(c), when the wafer W is horizontally moved to a position where the cleaning brush 71 contacts the outer peripheral end (terminal end) of the wafer W, the height of the lower surface of the wafer W at that position is The information is read from the memory of the control unit 100, and the control unit 100 controls the height of the wafer W by the lifting mechanism 90 so that the cleaning brush 71 contacts the lower surface of the wafer W.

As described above, in this embodiment, while the wafer W is horizontally moved by the horizontal movement mechanism 80, the lifting mechanism 90 is controlled while the height of the lower surface of the wafer W is measured by the height measuring device 72, and the cleaning brush is Since the cleaning brush 71 continues to be in contact with the lower surface of the wafer W, the entire lower surface of the curved wafer W can be efficiently cleaned by the cleaning brush 71 in a short time.

The above description has been about cleaning a wafer W that is curved upward in a convex manner using the cleaning device 70, but a wafer W that is curved in a downward convex manner can also be cleaned through the processes shown in FIGS. 3(a) to 3(c). I can do it.

In addition, in the above embodiment, since the height measuring device 72 is arranged at a position horizontally apart from the cleaning brush 71, the height of the lower surface of the wafer W measured by the height measuring device is controlled. However, if the height of the bottom surface of the wafer W at the contact point of the cleaning brush 71 to the wafer W is measured by the height measuring device 72, the measurement result can be stored in the memory of the control unit 100. The height of the bottom surface of the wafer W at the point of contact with the cleaning brush 71 is measured by the height measuring device 72, and at the same time, the bottom surface of the wafer W is cleaned by the cleaning brush 71 in real time. can do.

<Second embodiment>
Next, a cleaning device according to a second embodiment of the present invention will be described based on FIGS. 4 and 5. Note that in FIG. 4, the same elements as those shown in FIGS. 2 and 3 are denoted by the same reference numerals, and a redundant explanation of them will be omitted below.

The cleaning device 70' according to the present embodiment has a configuration in which the suction pad 64 and the wafer W are rotated around a vertical axis, and the cleaning brush 71' is fixed. This is the same as that of the cleaning device 70 according to the first embodiment.

That is, in the cleaning device 70' according to the present embodiment, the arm 62 includes an electric motor 74 as a rotational drive source, an encoder 75 for detecting the rotation speed and direction of the electric motor 74, and a rotation side and a fixed side. A rotary joint 76 is installed to connect the two. A rotary shaft 77 extends vertically downward from the electric motor 74 through the arm 62, and the conveyance pad 63 is attached to the lower end of the rotary shaft 77.

Further, the suction path 6 that passes through the rotary joint 76, the rotating shaft 77, the transport pad 63, the support column 68, and the plate 65 opens to the porous member 64A of the suction pad 64.

In the cleaning device 1' according to the present embodiment, the cleaning brush 71' is composed of a cylindrical sponge, as shown in FIG. 5, and the cleaning brush 71' is fixed without rotating. There is. A height measuring device 72 is disposed near the cleaning brush 71' (specifically, on the upstream side in the horizontal movement direction of the wafer W (in the direction of the arrow in FIG. 4)).

In the cleaning apparatus 70' configured as described above, the suction pad 64 and the wafer W held thereon are rotated by the electric motor 74 in the direction of the arrow in FIG. 4 (counterclockwise) around the vertical central axis. , the suction pad 64 and the wafer W are horizontally moved relative to the cleaning brush 71' by the horizontal movement mechanism 80. At the same time, the height of the lower surface of the wafer W is measured by the height measuring device 72, and based on the measurement data, the suction pad 64 and the wafer W are raised and lowered relative to the cleaning brush 71' by the lifting mechanism 90. The lower surface of the wafer W is cleaned by the cleaning brush 71' while keeping the cleaning brush 71' in contact with the lower surface of the wafer W.

Here, FIG. 4(a) shows a state in which the cleaning brush 71' is cleaning the central part of the lower surface of the wafer W that is curved upward, and FIG. The state in which the end (terminus) is being cleaned is shown. Although FIG. 4 shows a state in which a wafer W that is curved convexly upward is being cleaned, the cleaning apparatus 70' according to this embodiment also similarly cleans a wafer W that is curved convexly downwardly. be able to.

Therefore, similarly to the cleaning apparatus 70 according to the first embodiment, in the cleaning apparatus 70' according to the present embodiment, the wafer W is moved horizontally by the horizontal movement mechanism 80, and the wafer W is Since the lifting mechanism 90 is controlled while measuring the height of the lower surface so that the cleaning brush 71 continues to be in contact with the lower surface of the wafer W, similarly to the cleaning apparatus 70 according to the first embodiment, the height of the curved wafer W is The entire lower surface can be efficiently cleaned in a short time by the cleaning brush 71'.

As described above, the wafer W whose lower surface has been cleaned by the cleaning device 70 or 70' is conveyed by the second conveyance means 60 to the spinner cleaning means 30 shown in FIG. 1 and delivered to the spinner table 31.

In the spinner cleaning means 30, the spinner table 31 and the wafer W suction-held thereon rotate at a predetermined speed, and cleaning water is sprayed from the cleaning water nozzle 32 toward the rotating wafer W. The upper surface of the wafer W is cleaned with cleaning water, and foreign matter such as grinding debris adhering to the upper surface of the wafer W is removed. The wafer W, which has been cleaned in this manner, is suction-held by the robot hand 43 of the robot 40 and transported to the cassette 3 shown in FIG. do.

In the cleaning apparatuses 70 and 70' according to the first and second embodiments described above, the suction pad 64 and the wafer W held thereon are horizontally moved relative to the cleaning brushes 71 and 71'. Although a configuration in which the cleaning brushes 71 and 71' are horizontally moved and raised and lowered relative to the transfer pad 64 and the wafer W has been adopted, a configuration in which the cleaning brushes 71 and 71' are moved horizontally and raised and lowered relative to the transfer pad 64 and the wafer W may be adopted.

Moreover, although the embodiment in which the present invention is applied to the cleaning devices 70 and 70' provided in the grinding device 1 that grinds the wafer W has been described above, the present invention is also applicable to processing any workpiece other than the wafer W. The present invention can be similarly applied to a cleaning device provided in any other processing equipment. That is, the workpiece may be a rectangular substrate. Further, a protective tape may be attached to the lower surface of the workpiece that contacts the holding surface of the chuck table, and the protective tape may be cleaned by the cleaning device.

In addition, the application of the present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the technical ideas described in the claims, specification, and drawings. Of course.

1: Grinding device, 1A: Base, 2, 3: Cassette, 4: Positioning table,
5: Thickness measuring device, 6: Suction path, 7: Piping, 7a, 7b: Branch pipe, 8: Air supply source,
9: Suction source, 10: Chuck table, 10A: Porous member, 10a: Holding surface,
11: Vertical movement mechanism, 12: Column, 13: Elevating plate, 14: Guide rail,
15: ball screw shaft, 16: electric motor, 17: bracket, 20: grinding unit,
21: Holder, 22: Spindle motor, 23: Spindle, 24: Mount,
25: Grinding wheel, 25a: Grindstone, 30: Spinner cleaning means,
31: spinner table, 32: cleaning water nozzle, 33: cover, 40: robot,
41: Mounting part, 42: Holder, 43: Robot hand, 44: Horizontal movement mechanism,
45: Lifting mechanism, 50: First conveyance means, 51: Rotating shaft, 52: Arm,
53: Transport pad, 60: Second transport means, 61: Rotating shaft, 62: Arm,
63: conveyance pad, 64: suction pad, 64A: porous member, 64a: suction surface,
65: Plate, 66: Pin, 67, 68: Support, 70, 70': Cleaning device,
71, 71': Cleaning brush, 72: Height measuring device, 73, 74: Electric motor,
75: encoder, 76: rotary encoder, 77: rotation axis, 80: horizontal movement mechanism,
81: Guide rail, 82: Slider, 90: Lifting mechanism,
91: Guide rail, 92: Slider, 100: Control unit,
F: resin layer, P1: processing position, P2: delivery position, V1, V2: electromagnetic on-off valve,
W: Wafer

Claims (3)

A cleaning device that cleans a curved workpiece by bringing a cleaning brush into contact with the lower surface of the workpiece,
A suction pad that suctions and holds the center part of the upper surface of the workpiece with a suction surface,
a cleaning brush whose suction surface contacts the lower surface of the workpiece held by suction;
a horizontal movement mechanism that relatively horizontally moves the suction pad and the cleaning brush in a direction parallel to the holding surface;
an elevating mechanism that relatively raises and lowers the suction pad and the cleaning brush in a direction perpendicular to the suction surface;
a control unit;
Equipped with
The control section is
The suction pad and the cleaning brush are moved horizontally relative to each other, and the suction pad and the cleaning brush are moved based on the lower surface height information of the workpiece, which is preset with respect to the horizontal position of the workpiece with respect to the cleaning brush. A cleaning device that cleans the lower surface of a curved work by keeping the cleaning brush in contact with the lower surface of the work by moving the brush up and down relative to the work. Equipped with a height measuring device that measures the height of the lower surface of the workpiece from below the workpiece,
The control unit moves the suction pad and the height measuring device relatively horizontally, and measures the lower surface height of the workpiece with respect to the horizontal position of the workpiece using the height measuring device, and also measures the height of the lower surface of the workpiece with respect to the horizontal position of the workpiece. The cleaning device according to claim 1, wherein the suction pad and the cleaning brush are moved up and down relative to each other based on the height of the lower surface with respect to the horizontal position. 3. The cleaning device according to claim 1, wherein the cleaning brush comprises a cleaning brush roll sponge extending parallel to the suction surface.

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