CN107870525A - 控制基板的表面物性的方法 - Google Patents

控制基板的表面物性的方法 Download PDF

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Publication number
CN107870525A
CN107870525A CN201710606628.XA CN201710606628A CN107870525A CN 107870525 A CN107870525 A CN 107870525A CN 201710606628 A CN201710606628 A CN 201710606628A CN 107870525 A CN107870525 A CN 107870525A
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CN
China
Prior art keywords
composition
construction unit
alkyl
substrate
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710606628.XA
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English (en)
Chinese (zh)
Inventor
河野绅
河野绅一
中川裕介
岛谷聪
浅野贵夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
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Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN107870525A publication Critical patent/CN107870525A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201710606628.XA 2016-09-28 2017-07-24 控制基板的表面物性的方法 Pending CN107870525A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016189459A JP6741540B2 (ja) 2016-09-28 2016-09-28 基板の表面物性を制御する方法
JP2016-189459 2016-09-28

Publications (1)

Publication Number Publication Date
CN107870525A true CN107870525A (zh) 2018-04-03

Family

ID=61761855

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710606628.XA Pending CN107870525A (zh) 2016-09-28 2017-07-24 控制基板的表面物性的方法

Country Status (2)

Country Link
JP (1) JP6741540B2 (ja)
CN (1) CN107870525A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112368645A (zh) * 2018-06-13 2021-02-12 布鲁尔科技公司 用于euv光刻的粘附层

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5616129A (en) * 1979-07-18 1981-02-16 Hitachi Ltd Pattern forming method
TW392229B (en) * 1997-01-23 2000-06-01 Matsushita Electric Ind Co Ltd Method of manufacturing semiconductor device and apparatus for same
JP2011197425A (ja) * 2010-03-19 2011-10-06 Tokyo Ohka Kogyo Co Ltd 表面改質材料、レジストパターン形成方法及びパターン形成方法
TW201437767A (zh) * 2013-03-26 2014-10-01 Fujifilm Corp 壓印用之形成下層膜的組成物及圖案形成方法
TW201602209A (zh) * 2014-06-20 2016-01-16 Fujifilm Corp 下層膜形成用樹脂組成物、積層體、圖案形成方法及元件的製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332100B2 (ja) * 1992-03-24 2002-10-07 株式会社東芝 パターン形成方法
JP2014192187A (ja) * 2013-03-26 2014-10-06 Renesas Electronics Corp 半導体装置の製造方法
TWI635365B (zh) * 2014-08-21 2018-09-11 日商富士軟片股份有限公司 Sublayer film forming composition, laminate, pattern forming method, imprint forming kit, and device manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5616129A (en) * 1979-07-18 1981-02-16 Hitachi Ltd Pattern forming method
TW392229B (en) * 1997-01-23 2000-06-01 Matsushita Electric Ind Co Ltd Method of manufacturing semiconductor device and apparatus for same
JP2011197425A (ja) * 2010-03-19 2011-10-06 Tokyo Ohka Kogyo Co Ltd 表面改質材料、レジストパターン形成方法及びパターン形成方法
TW201437767A (zh) * 2013-03-26 2014-10-01 Fujifilm Corp 壓印用之形成下層膜的組成物及圖案形成方法
TW201602209A (zh) * 2014-06-20 2016-01-16 Fujifilm Corp 下層膜形成用樹脂組成物、積層體、圖案形成方法及元件的製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
程辉明等: "《先进电子制造技术》", 31 July 2008 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112368645A (zh) * 2018-06-13 2021-02-12 布鲁尔科技公司 用于euv光刻的粘附层

Also Published As

Publication number Publication date
JP2018056269A (ja) 2018-04-05
JP6741540B2 (ja) 2020-08-19

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