CN107833651A - 一种复合纳米银膏及快速烧结封装方法 - Google Patents
一种复合纳米银膏及快速烧结封装方法 Download PDFInfo
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- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
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Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108520855A (zh) * | 2018-05-11 | 2018-09-11 | 北京科技大学 | 一种纳米银浆提高陶瓷覆铜板可靠性的方法 |
CN109623068A (zh) * | 2019-01-10 | 2019-04-16 | 哈尔滨工业大学(深圳) | 一种基于多点超声振动的纳米银连接方法 |
CN109887638A (zh) * | 2019-01-14 | 2019-06-14 | 上海大学 | 纳米银颗粒与镀银碳化硅颗粒混合的多尺度纳米银浆及其制备方法 |
CN110289120A (zh) * | 2019-05-09 | 2019-09-27 | 深圳市先进连接科技有限公司 | 一种复合烧结银预成型片的制备及封装方法 |
CN111354514A (zh) * | 2020-03-06 | 2020-06-30 | 深圳第三代半导体研究院 | 一种基于多维纳米材料的封装膏体及其制备方法 |
CN111415767A (zh) * | 2020-03-06 | 2020-07-14 | 深圳第三代半导体研究院 | 一种基于多维金属纳米材料膏体及其互连工艺 |
CN111627823A (zh) * | 2020-05-13 | 2020-09-04 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种低温快速生成高强度高熔点接头的芯片连接方法 |
CN111843169A (zh) * | 2020-06-29 | 2020-10-30 | 华北水利水电大学 | 一种超声波焊接铜薄板与镍薄板的方法 |
CN111843166A (zh) * | 2020-06-29 | 2020-10-30 | 华北水利水电大学 | 一种超声波焊接铜薄板和铝薄板的方法 |
CN111843168A (zh) * | 2020-06-29 | 2020-10-30 | 华北水利水电大学 | 一种超声波焊接镍薄板的方法 |
CN111975011A (zh) * | 2020-07-20 | 2020-11-24 | 华南理工大学 | 一种芯片无压烧结互连用纳米铜浆及其制备方法与应用 |
CN112157371A (zh) * | 2020-09-23 | 2021-01-01 | 哈尔滨工业大学(深圳) | 一种亚微米Cu@Ag焊膏及其制备方法 |
CN112217079A (zh) * | 2020-10-10 | 2021-01-12 | 西南交通大学 | 一种稀土钡铜氧超导带材的低阻连接方法 |
CN112457825A (zh) * | 2020-11-30 | 2021-03-09 | 哈尔滨工业大学 | 一种具有高导热、低烧结温度的浆料的制备方法和应用 |
CN114262583A (zh) * | 2021-12-21 | 2022-04-01 | 深圳市中金岭南有色金属股份有限公司科学技术开发院 | 用于大功率led芯片、元器件高导互联固晶的银导电胶 |
CN114310038A (zh) * | 2022-02-24 | 2022-04-12 | 电子科技大学 | 银盐纳米银复合焊膏及制备方法烧结方法和应用 |
CN114473103A (zh) * | 2022-04-19 | 2022-05-13 | 合肥阿基米德电子科技有限公司 | 一种液态金属锡辅助纳米银烧结工艺 |
CN115401196A (zh) * | 2021-05-28 | 2022-11-29 | 季华实验室 | 一种双金属材料及其制备方法和双金属膏体和互连方法 |
CN115863295A (zh) * | 2022-12-31 | 2023-03-28 | 江苏富乐华功率半导体研究院有限公司 | 一种用于银烧结的复合焊片结构及其制备方法 |
CN116871511A (zh) * | 2023-07-13 | 2023-10-13 | 南京芯兴电子科技有限公司 | 一种无裂纹低孔洞纳米银膏的制备方法及烧结方法 |
EP4074436A4 (en) * | 2019-10-15 | 2023-10-25 | Senju Metal Industry Co., Ltd. | JOINING MATERIAL, JOINING MATERIAL PRODUCTION METHOD, AND ASSEMBLED BODY |
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CN102290117A (zh) * | 2011-04-25 | 2011-12-21 | 深圳市唯特偶新材料股份有限公司 | 一种低温烧结纳米银浆及其制备方法 |
CN102935518A (zh) * | 2012-10-31 | 2013-02-20 | 哈尔滨工业大学深圳研究生院 | 一种芯片贴装用纳米银浆及其制备方法 |
CN103219090A (zh) * | 2013-04-10 | 2013-07-24 | 张宇 | 一种纳米银包覆高分子微球复合导电银浆的制备方法 |
CN104668551A (zh) * | 2015-01-28 | 2015-06-03 | 哈尔滨工业大学深圳研究生院 | 一种用作热界面材料的双峰分布纳米银膏及其制备方法 |
CN107221373A (zh) * | 2017-06-30 | 2017-09-29 | 华南理工大学 | 一种芯片封装用低温烧结混合型导电银浆及其制备方法 |
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2017
- 2017-10-25 CN CN201711005729.8A patent/CN107833651A/zh active Pending
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CN102290117A (zh) * | 2011-04-25 | 2011-12-21 | 深圳市唯特偶新材料股份有限公司 | 一种低温烧结纳米银浆及其制备方法 |
CN102935518A (zh) * | 2012-10-31 | 2013-02-20 | 哈尔滨工业大学深圳研究生院 | 一种芯片贴装用纳米银浆及其制备方法 |
CN103219090A (zh) * | 2013-04-10 | 2013-07-24 | 张宇 | 一种纳米银包覆高分子微球复合导电银浆的制备方法 |
CN104668551A (zh) * | 2015-01-28 | 2015-06-03 | 哈尔滨工业大学深圳研究生院 | 一种用作热界面材料的双峰分布纳米银膏及其制备方法 |
CN107221373A (zh) * | 2017-06-30 | 2017-09-29 | 华南理工大学 | 一种芯片封装用低温烧结混合型导电银浆及其制备方法 |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108520855A (zh) * | 2018-05-11 | 2018-09-11 | 北京科技大学 | 一种纳米银浆提高陶瓷覆铜板可靠性的方法 |
CN109623068B (zh) * | 2019-01-10 | 2021-02-19 | 哈尔滨工业大学(深圳) | 一种基于多点超声振动的纳米银连接方法 |
CN109623068A (zh) * | 2019-01-10 | 2019-04-16 | 哈尔滨工业大学(深圳) | 一种基于多点超声振动的纳米银连接方法 |
CN109887638A (zh) * | 2019-01-14 | 2019-06-14 | 上海大学 | 纳米银颗粒与镀银碳化硅颗粒混合的多尺度纳米银浆及其制备方法 |
CN110289120A (zh) * | 2019-05-09 | 2019-09-27 | 深圳市先进连接科技有限公司 | 一种复合烧结银预成型片的制备及封装方法 |
EP4074436A4 (en) * | 2019-10-15 | 2023-10-25 | Senju Metal Industry Co., Ltd. | JOINING MATERIAL, JOINING MATERIAL PRODUCTION METHOD, AND ASSEMBLED BODY |
CN111354514B (zh) * | 2020-03-06 | 2021-06-22 | 深圳第三代半导体研究院 | 一种基于多维纳米材料的封装膏体及其制备方法 |
CN111354514A (zh) * | 2020-03-06 | 2020-06-30 | 深圳第三代半导体研究院 | 一种基于多维纳米材料的封装膏体及其制备方法 |
CN111415767A (zh) * | 2020-03-06 | 2020-07-14 | 深圳第三代半导体研究院 | 一种基于多维金属纳米材料膏体及其互连工艺 |
CN111627823A (zh) * | 2020-05-13 | 2020-09-04 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种低温快速生成高强度高熔点接头的芯片连接方法 |
CN111843169B (zh) * | 2020-06-29 | 2022-01-07 | 华北水利水电大学 | 一种超声波焊接铜薄板与镍薄板的方法 |
CN111843168A (zh) * | 2020-06-29 | 2020-10-30 | 华北水利水电大学 | 一种超声波焊接镍薄板的方法 |
CN111843166B (zh) * | 2020-06-29 | 2022-06-07 | 华北水利水电大学 | 一种超声波焊接铜薄板和铝薄板的方法 |
CN111843169A (zh) * | 2020-06-29 | 2020-10-30 | 华北水利水电大学 | 一种超声波焊接铜薄板与镍薄板的方法 |
CN111843168B (zh) * | 2020-06-29 | 2022-01-07 | 华北水利水电大学 | 一种超声波焊接镍薄板的方法 |
CN111843166A (zh) * | 2020-06-29 | 2020-10-30 | 华北水利水电大学 | 一种超声波焊接铜薄板和铝薄板的方法 |
CN111975011A (zh) * | 2020-07-20 | 2020-11-24 | 华南理工大学 | 一种芯片无压烧结互连用纳米铜浆及其制备方法与应用 |
CN111975011B (zh) * | 2020-07-20 | 2022-01-18 | 华南理工大学 | 一种芯片无压烧结互连用纳米铜浆及其制备方法与应用 |
CN112157371A (zh) * | 2020-09-23 | 2021-01-01 | 哈尔滨工业大学(深圳) | 一种亚微米Cu@Ag焊膏及其制备方法 |
CN112217079A (zh) * | 2020-10-10 | 2021-01-12 | 西南交通大学 | 一种稀土钡铜氧超导带材的低阻连接方法 |
CN112457825A (zh) * | 2020-11-30 | 2021-03-09 | 哈尔滨工业大学 | 一种具有高导热、低烧结温度的浆料的制备方法和应用 |
CN115401196A (zh) * | 2021-05-28 | 2022-11-29 | 季华实验室 | 一种双金属材料及其制备方法和双金属膏体和互连方法 |
CN115401196B (zh) * | 2021-05-28 | 2023-11-07 | 季华实验室 | 一种双金属材料及其制备方法和双金属膏体和互连方法 |
CN114262583B (zh) * | 2021-12-21 | 2022-12-20 | 深圳市中金岭南有色金属股份有限公司科学技术开发院 | 用于大功率led芯片、元器件高导互联固晶的银导电胶 |
CN114262583A (zh) * | 2021-12-21 | 2022-04-01 | 深圳市中金岭南有色金属股份有限公司科学技术开发院 | 用于大功率led芯片、元器件高导互联固晶的银导电胶 |
CN114310038A (zh) * | 2022-02-24 | 2022-04-12 | 电子科技大学 | 银盐纳米银复合焊膏及制备方法烧结方法和应用 |
CN114473103A (zh) * | 2022-04-19 | 2022-05-13 | 合肥阿基米德电子科技有限公司 | 一种液态金属锡辅助纳米银烧结工艺 |
CN115863295A (zh) * | 2022-12-31 | 2023-03-28 | 江苏富乐华功率半导体研究院有限公司 | 一种用于银烧结的复合焊片结构及其制备方法 |
CN115863295B (zh) * | 2022-12-31 | 2023-10-24 | 江苏富乐华功率半导体研究院有限公司 | 一种用于银烧结的复合焊片结构及其制备方法 |
CN116871511A (zh) * | 2023-07-13 | 2023-10-13 | 南京芯兴电子科技有限公司 | 一种无裂纹低孔洞纳米银膏的制备方法及烧结方法 |
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Address after: 518000 Guangdong city in Shenzhen Province, Nanshan District City Xili town of Harbin Institute of Technology campus of Shenzhen University Applicant after: HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN GRADUATE SCHOOL Applicant after: SHANGHAI AEROSPACE EQUIPMENT MANUFACTORY Co.,Ltd. Address before: 518000 Guangdong city in Shenzhen Province, Nanshan District City Xili town of Harbin Institute of Technology campus of Shenzhen University Applicant before: HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN GRADUATE SCHOOL Applicant before: SHANGHAI AEROSPACE EQUIPMENTS MANUFACTURER |
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Effective date of registration: 20200630 Address after: 518000 Guangdong Shenzhen Nanshan District Taoyuan street Shenzhen University city Harbin Institute of Technology Campus Applicant after: HARBIN INSTITUTE OF TECHNOLOGY (SHENZHEN) Applicant after: SHANGHAI AEROSPACE EQUIPMENT MANUFACTORY Co.,Ltd. Address before: 518000 Guangdong city in Shenzhen Province, Nanshan District City Xili town of Harbin Institute of Technology campus of Shenzhen University Applicant before: HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN GRADUATE SCHOOL Applicant before: SHANGHAI AEROSPACE EQUIPMENT MANUFACTORY Co.,Ltd. |
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Application publication date: 20180323 |