CN113798730A - 一种微纳米银铜合金焊料及其制备方法 - Google Patents
一种微纳米银铜合金焊料及其制备方法 Download PDFInfo
- Publication number
- CN113798730A CN113798730A CN202111158493.8A CN202111158493A CN113798730A CN 113798730 A CN113798730 A CN 113798730A CN 202111158493 A CN202111158493 A CN 202111158493A CN 113798730 A CN113798730 A CN 113798730A
- Authority
- CN
- China
- Prior art keywords
- copper
- silver
- nano silver
- micron
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 45
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 64
- 239000000843 powder Substances 0.000 claims abstract description 60
- 238000005476 soldering Methods 0.000 claims abstract description 36
- 239000006104 solid solution Substances 0.000 claims abstract description 36
- 239000011258 core-shell material Substances 0.000 claims abstract description 33
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical group [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims abstract description 30
- 230000004907 flux Effects 0.000 claims abstract description 27
- 239000002270 dispersing agent Substances 0.000 claims abstract description 26
- 239000011230 binding agent Substances 0.000 claims abstract description 25
- 239000003085 diluting agent Substances 0.000 claims abstract description 25
- 238000002156 mixing Methods 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims description 65
- 239000000243 solution Substances 0.000 claims description 35
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 33
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid group Chemical group C(CC(O)(C(=O)O)CC(=O)O)(=O)O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 33
- 229910052802 copper Inorganic materials 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 238000006243 chemical reaction Methods 0.000 claims description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 24
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical group CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 claims description 22
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 229910052709 silver Inorganic materials 0.000 claims description 17
- 239000004332 silver Substances 0.000 claims description 16
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(I) nitrate Inorganic materials [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 14
- 238000000703 high-speed centrifugation Methods 0.000 claims description 12
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 12
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical group CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 claims description 11
- 229920002367 Polyisobutene Polymers 0.000 claims description 11
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 claims description 11
- 229940088601 alpha-terpineol Drugs 0.000 claims description 11
- 229940068918 polyethylene glycol 400 Drugs 0.000 claims description 11
- 239000001384 succinic acid Substances 0.000 claims description 11
- 238000001291 vacuum drying Methods 0.000 claims description 11
- 238000000227 grinding Methods 0.000 claims description 10
- 239000011259 mixed solution Substances 0.000 claims description 9
- 239000000725 suspension Substances 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 7
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- 150000001879 copper Chemical class 0.000 claims description 7
- 239000003960 organic solvent Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 238000010301 surface-oxidation reaction Methods 0.000 claims description 7
- 101710134784 Agnoprotein Proteins 0.000 claims description 6
- 239000011812 mixed powder Substances 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 5
- 238000003760 magnetic stirring Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 12
- 239000002105 nanoparticle Substances 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000011859 microparticle Substances 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000004100 electronic packaging Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 230000001476 alcoholic effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111158493.8A CN113798730A (zh) | 2021-09-30 | 2021-09-30 | 一种微纳米银铜合金焊料及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111158493.8A CN113798730A (zh) | 2021-09-30 | 2021-09-30 | 一种微纳米银铜合金焊料及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113798730A true CN113798730A (zh) | 2021-12-17 |
Family
ID=78897160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111158493.8A Pending CN113798730A (zh) | 2021-09-30 | 2021-09-30 | 一种微纳米银铜合金焊料及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113798730A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114378474A (zh) * | 2022-01-13 | 2022-04-22 | 北京工业大学 | 一种纳米银包覆微米铜焊膏及其制备方法 |
CN117300434A (zh) * | 2023-09-28 | 2023-12-29 | 汕尾市栢林电子封装材料有限公司 | 一种封装焊片及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB768126A (en) * | 1953-10-15 | 1957-02-13 | Nat Res Dev | Brazing and fluxes therefor |
CN105127609A (zh) * | 2015-10-15 | 2015-12-09 | 哈尔滨工业大学 | 铜/银核壳纳米颗粒低温烧结复合焊膏及其制备方法 |
CN109664049A (zh) * | 2019-01-14 | 2019-04-23 | 哈尔滨理工大学 | 一种用于电子封装领域的多尺度微纳米颗粒复合焊膏及其制备方法 |
CN110238562A (zh) * | 2019-06-28 | 2019-09-17 | 华中科技大学 | 一种微纳米复合金属焊膏制备方法、产品及应用 |
CN110977238A (zh) * | 2019-12-25 | 2020-04-10 | 哈尔滨工业大学 | 一种纳米imc均匀增强锡基焊料及其制备方法 |
CN112157371A (zh) * | 2020-09-23 | 2021-01-01 | 哈尔滨工业大学(深圳) | 一种亚微米Cu@Ag焊膏及其制备方法 |
CN112756841A (zh) * | 2020-12-25 | 2021-05-07 | 哈尔滨工业大学(深圳) | 一种用于低温烧结互连的微纳复合银铜合金焊膏及制备方法 |
-
2021
- 2021-09-30 CN CN202111158493.8A patent/CN113798730A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB768126A (en) * | 1953-10-15 | 1957-02-13 | Nat Res Dev | Brazing and fluxes therefor |
CN105127609A (zh) * | 2015-10-15 | 2015-12-09 | 哈尔滨工业大学 | 铜/银核壳纳米颗粒低温烧结复合焊膏及其制备方法 |
CN109664049A (zh) * | 2019-01-14 | 2019-04-23 | 哈尔滨理工大学 | 一种用于电子封装领域的多尺度微纳米颗粒复合焊膏及其制备方法 |
CN110238562A (zh) * | 2019-06-28 | 2019-09-17 | 华中科技大学 | 一种微纳米复合金属焊膏制备方法、产品及应用 |
CN110977238A (zh) * | 2019-12-25 | 2020-04-10 | 哈尔滨工业大学 | 一种纳米imc均匀增强锡基焊料及其制备方法 |
CN112157371A (zh) * | 2020-09-23 | 2021-01-01 | 哈尔滨工业大学(深圳) | 一种亚微米Cu@Ag焊膏及其制备方法 |
CN112756841A (zh) * | 2020-12-25 | 2021-05-07 | 哈尔滨工业大学(深圳) | 一种用于低温烧结互连的微纳复合银铜合金焊膏及制备方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114378474A (zh) * | 2022-01-13 | 2022-04-22 | 北京工业大学 | 一种纳米银包覆微米铜焊膏及其制备方法 |
CN117300434A (zh) * | 2023-09-28 | 2023-12-29 | 汕尾市栢林电子封装材料有限公司 | 一种封装焊片及其制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108526751B (zh) | 一种可用于无压烧结的微纳米混合焊膏及其制备方法 | |
CN101803016B (zh) | 附着方法和使用该方法生产的器件 | |
CN109664049B (zh) | 一种用于电子封装领域的多尺度微纳米颗粒复合焊膏及其制备方法 | |
CN108847395B (zh) | 一种用于低温快速连接的预烧结纳米网络银膜制备及封装方法 | |
CN112157371B (zh) | 一种亚微米Cu@Ag焊膏及其制备方法 | |
CN112756841B (zh) | 一种用于低温烧结互连的微纳复合银铜合金焊膏及制备方法 | |
CN107833651A (zh) | 一种复合纳米银膏及快速烧结封装方法 | |
CN113798730A (zh) | 一种微纳米银铜合金焊料及其制备方法 | |
CN106825998B (zh) | 一种用作大功率芯片封装的无氧化纳米铜焊膏及其制备方法 | |
CN109332939B (zh) | 一种单相纳米银铜合金固溶体焊膏及其制备方法 | |
JP6855539B2 (ja) | 電力半導体接合用焼結ペースト組成物 | |
JP7476261B2 (ja) | 焼結ダイアタッチ及び類似した用途のためのナノ銅ペースト及びフィルム | |
CN115410934A (zh) | 一种微米In与纳米Cu@Ag核壳混合材料互连工艺 | |
CN110814569A (zh) | 一种用于功率器件封装的多尺度Cu@Ag微纳米复合钎料及制备方法 | |
CN109967747A (zh) | 一种多层金属膜及其制备方法 | |
CN111408870A (zh) | 纳米双金属超固溶结构焊膏及其制备方法 | |
JP2015141860A (ja) | 接合材料及びそれを用いた半導体装置 | |
CN108161270B (zh) | 一种用于低温封装铝合金与LED芯片的颗粒增强Sn-Zn纳米焊料及制备方法 | |
CN114974656A (zh) | 一种纳米复合低温浆料、制备方法及其应用 | |
CN113523649A (zh) | 一种复合焊膏的制备方法 | |
CN114864134A (zh) | 一种纳米合金复合低温浆料、制备方法及其应用 | |
CN114055008A (zh) | 一种制备超细焊锡膏的金属粉、焊锡膏及其制备方法 | |
CN114654126B (zh) | 一种银包覆铜焊膏及其制备方法 | |
Lai et al. | Study on the interconnect performance of multicomponent paste for 3rd generation semiconductor packaging | |
KR20210112877A (ko) | 소결접합용 구리 페이스트 조성물 및 이의 용도 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220525 Address after: No. 10, Jinma Road, Maqun street, Qixia District, Nanjing, Jiangsu 210049 Applicant after: Nanjing Hengdian advanced Microwave Technology Research Institute Co.,Ltd. Applicant after: NANJING HENGDIAN ELECTRONICS CO.,LTD. Address before: 210000 No. 10, Jinma Road, Maqun street, Qixia District, Nanjing City, Jiangsu Province Applicant before: Nanjing Hengdian advanced Microwave Technology Research Institute Co.,Ltd. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211217 |