CN107785473B - 一种集成led光源封装支架 - Google Patents
一种集成led光源封装支架 Download PDFInfo
- Publication number
- CN107785473B CN107785473B CN201710865807.5A CN201710865807A CN107785473B CN 107785473 B CN107785473 B CN 107785473B CN 201710865807 A CN201710865807 A CN 201710865807A CN 107785473 B CN107785473 B CN 107785473B
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- circuit layer
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- negative anodes
- light source
- light trough
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- 238000009413 insulation Methods 0.000 claims abstract description 23
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 4
- 238000009738 saturating Methods 0.000 claims 1
- 230000008859 change Effects 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710865807.5A CN107785473B (zh) | 2017-09-22 | 2017-09-22 | 一种集成led光源封装支架 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710865807.5A CN107785473B (zh) | 2017-09-22 | 2017-09-22 | 一种集成led光源封装支架 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107785473A CN107785473A (zh) | 2018-03-09 |
CN107785473B true CN107785473B (zh) | 2019-04-30 |
Family
ID=61433419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710865807.5A Active CN107785473B (zh) | 2017-09-22 | 2017-09-22 | 一种集成led光源封装支架 |
Country Status (1)
Country | Link |
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CN (1) | CN107785473B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110473952A (zh) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | 电路led支架及led |
CN111370556B (zh) * | 2020-04-08 | 2021-04-30 | 广东良友科技有限公司 | 一种led支架光源封装结构及其工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102347324A (zh) * | 2011-09-30 | 2012-02-08 | 常熟市广大电器有限公司 | 一种新型led集成封装结构 |
CN203297985U (zh) * | 2013-05-21 | 2013-11-20 | 惠州市优科光电科技有限公司 | 一种通用式led光源模组 |
CN205793610U (zh) * | 2016-05-26 | 2016-12-07 | 东莞联桥电子有限公司 | 一种防潮防尘的新型电路板结构 |
CN205881945U (zh) * | 2016-08-15 | 2017-01-11 | 丹阳蓝思信息技术有限公司 | 一种大功率led芯片的散热封装 |
KR20170047996A (ko) * | 2015-10-26 | 2017-05-08 | 주식회사 서광 | Led 조명장치 및 그 제조방법 |
-
2017
- 2017-09-22 CN CN201710865807.5A patent/CN107785473B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102347324A (zh) * | 2011-09-30 | 2012-02-08 | 常熟市广大电器有限公司 | 一种新型led集成封装结构 |
CN203297985U (zh) * | 2013-05-21 | 2013-11-20 | 惠州市优科光电科技有限公司 | 一种通用式led光源模组 |
KR20170047996A (ko) * | 2015-10-26 | 2017-05-08 | 주식회사 서광 | Led 조명장치 및 그 제조방법 |
CN205793610U (zh) * | 2016-05-26 | 2016-12-07 | 东莞联桥电子有限公司 | 一种防潮防尘的新型电路板结构 |
CN205881945U (zh) * | 2016-08-15 | 2017-01-11 | 丹阳蓝思信息技术有限公司 | 一种大功率led芯片的散热封装 |
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Publication number | Publication date |
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CN107785473A (zh) | 2018-03-09 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20190401 Address after: 244100 Jinqiao Industrial Park, Yian District, Tongling City, Anhui Province (Jiangwei Precision) 10 Applicant after: Tongling Jiangwei Technology Co.,Ltd. Address before: 244131 Jinqiao Industrial Park, Tongling County, Tongling, Anhui Applicant before: ANHUI ZHONGWEI PHOTOELECTRIC MATERIAL Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210709 Address after: 244100 building 10, Jinqiao Industrial Park (Jiangwei precision), Yi'an District, Tongling City, Anhui Province Patentee after: Lin Hai Address before: 244100 building 10, Jinqiao Industrial Park (Jiangwei precision), Yi'an District, Tongling City, Anhui Province Patentee before: Tongling Jiangwei Technology Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240506 Address after: 244000 Building 1, Yi'an Economic Development Zone (Jiangwei Electronics), Yi'an District, Tongling City, Anhui Province Patentee after: Tongling Zhenghao Technology Co.,Ltd. Country or region after: China Address before: 244100 building 10, Jinqiao Industrial Park (Jiangwei precision), Yi'an District, Tongling City, Anhui Province Patentee before: Lin Hai Country or region before: China |