CN100590869C - 大功率led封装结构 - Google Patents
大功率led封装结构 Download PDFInfo
- Publication number
- CN100590869C CN100590869C CN200810099758.XA CN200810099758A CN100590869C CN 100590869 C CN100590869 C CN 100590869C CN 200810099758 A CN200810099758 A CN 200810099758A CN 100590869 C CN100590869 C CN 100590869C
- Authority
- CN
- China
- Prior art keywords
- positive
- radiating block
- led
- led chips
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810099758.XA CN100590869C (zh) | 2008-06-04 | 2008-06-04 | 大功率led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810099758.XA CN100590869C (zh) | 2008-06-04 | 2008-06-04 | 大功率led封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101286508A CN101286508A (zh) | 2008-10-15 |
CN100590869C true CN100590869C (zh) | 2010-02-17 |
Family
ID=40058586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810099758.XA Ceased CN100590869C (zh) | 2008-06-04 | 2008-06-04 | 大功率led封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100590869C (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101737662B (zh) * | 2010-01-18 | 2011-05-04 | 赵翼 | 集成封装大功率led照明光源制作方法及led照明灯 |
CN102338294A (zh) * | 2010-07-21 | 2012-02-01 | 江苏苏能光电科技有限责任公司 | 适用于交流电直驱的集成led光源 |
CN102374406A (zh) * | 2010-08-26 | 2012-03-14 | 杭州创元光电科技有限公司 | 用显示类芯片制作的led芯片光源模块 |
CN102032483B (zh) * | 2010-09-27 | 2013-06-26 | 陈炜旻 | Led面光源 |
CN102185084A (zh) * | 2011-04-26 | 2011-09-14 | 深圳市天电光电科技有限公司 | Led封装支架及其单体、led封装结构 |
CN103307572A (zh) * | 2012-03-07 | 2013-09-18 | 欧司朗股份有限公司 | 模块及其制造方法和配有该模块的照明装置 |
CN102691912B (zh) * | 2012-05-29 | 2013-10-30 | 山水照明科技(常熟)有限公司 | Led灯 |
-
2008
- 2008-06-04 CN CN200810099758.XA patent/CN100590869C/zh not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
CN101286508A (zh) | 2008-10-15 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SHENZHEN KENA INDUSTRIAL CO., LTD. Free format text: FORMER OWNER: XU HONG Effective date: 20090605 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090605 Address after: Baoan District Gongming Town, Shenzhen City, Guangdong Province, heshuikou Village tenth Lang Industrial Zone Post encoding: 518106 Applicant after: SHENZHEN KENA INDUSTRY CO., LTD. Address before: Long Jinhua Garden Court A block 1102 in Guangdong city of Shenzhen province Nanshan District post encoding Jin: 518000 Applicant before: Xu Hong |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C35 | Partial or whole invalidation of patent or utility model | ||
IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20111019 Decision number of declaring invalidation: 17396 Granted publication date: 20100217 |
|
C35 | Partial or whole invalidation of patent or utility model | ||
IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20111019 Decision number of declaring invalidation: 17396 Granted publication date: 20100217 |