CN201204205Y - 大功率led封装结构 - Google Patents
大功率led封装结构 Download PDFInfo
- Publication number
- CN201204205Y CN201204205Y CN200820117321.XU CN200820117321U CN201204205Y CN 201204205 Y CN201204205 Y CN 201204205Y CN 200820117321 U CN200820117321 U CN 200820117321U CN 201204205 Y CN201204205 Y CN 201204205Y
- Authority
- CN
- China
- Prior art keywords
- positive
- led chips
- radiating block
- encapsulation structure
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200820117321.XU CN201204205Y (zh) | 2008-06-04 | 2008-06-04 | 大功率led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200820117321.XU CN201204205Y (zh) | 2008-06-04 | 2008-06-04 | 大功率led封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201204205Y true CN201204205Y (zh) | 2009-03-04 |
Family
ID=40426520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200820117321.XU Expired - Fee Related CN201204205Y (zh) | 2008-06-04 | 2008-06-04 | 大功率led封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201204205Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102214772A (zh) * | 2010-04-12 | 2011-10-12 | 一诠精密电子工业(中国)有限公司 | 高功率发光二极管支架 |
CN104930378A (zh) * | 2015-06-25 | 2015-09-23 | 青岛海信宽带多媒体技术有限公司 | 光模块 |
-
2008
- 2008-06-04 CN CN200820117321.XU patent/CN201204205Y/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102214772A (zh) * | 2010-04-12 | 2011-10-12 | 一诠精密电子工业(中国)有限公司 | 高功率发光二极管支架 |
CN102214772B (zh) * | 2010-04-12 | 2013-04-24 | 一诠精密电子工业(中国)有限公司 | 高功率发光二极管支架 |
CN104930378A (zh) * | 2015-06-25 | 2015-09-23 | 青岛海信宽带多媒体技术有限公司 | 光模块 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHENZHEN KENA INDUSTRIAL CO., LTD. Free format text: FORMER OWNER: XU HONG Effective date: 20090605 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090605 Address after: Baoan District Gongming Town, Shenzhen City, Guangdong Province, heshuikou village under Lang Industrial Zone tenth, zip code: 518106 Patentee after: SHENZHEN KENA INDUSTRY CO., LTD. Address before: Guangdong Province, Shenzhen City, Nanshan District Jinlong garden Jinhua court A block 1102, zip code: 518000 Patentee before: Xu Hong |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090304 Termination date: 20160604 |