CN107785382A - 阵列基板的制作方法及显示装置的制作方法 - Google Patents
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- 238000002360 preparation method Methods 0.000 title claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 120
- 239000000126 substance Substances 0.000 claims abstract description 100
- 238000002161 passivation Methods 0.000 claims abstract description 38
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 7
- -1 aldehyde radical Chemical class 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 229920001467 poly(styrenesulfonates) Polymers 0.000 claims description 4
- 229960002796 polystyrene sulfonate Drugs 0.000 claims description 4
- 239000011970 polystyrene sulfonate Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- YMMGRPLNZPTZBS-UHFFFAOYSA-N 2,3-dihydrothieno[2,3-b][1,4]dioxine Chemical compound O1CCOC2=C1C=CS2 YMMGRPLNZPTZBS-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 description 11
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000005416 organic matter Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 3
- 229920006389 polyphenyl polymer Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 241001044684 Amadina fasciata Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-M ethenesulfonate Chemical compound [O-]S(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-M 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明提供了一种阵列基板的制作方法及显示装置的制作方法,包括如下步骤:在钝化层表面形成水溶性有机物层;在水溶性有机物层表面形成光阻层,进行黄光工程,得到包括多个间隔设置的光阻区域的光阻层图案和包括多个间隔设置的水溶性有机物区域的水溶性有机物层图案,所述水溶性有机物层区域的横截面小于光阻区域的底面横截面;对钝化层进行干蚀刻,使得钝化层图案的横截面与水溶性有机物层图案的横截面相同。本发明通过在钝化层的表面设置水溶性有机物层,使得剥离液能够溶解水溶性有机物层,进而剥除覆盖在水溶性有机物层之上的光阻和透明电极,从而提高了透明电极的剥离效率。
Description
技术领域
本发明涉及显示技术领域,具体涉及一种阵列基板制作方法 及显示装置的制作方法。
背景技术
薄膜晶体管液晶显示器(thin film transistor-liquid crystal display,简称TFT-LCD)是当前应用最为广泛的平板显 示器,随着制造液晶面板的技术日趋成熟与先进,简化生产工艺, 缩短制程时间,提高制程效率是降低生产成本以在行业剧烈竞争 中得以生存的重要途径。因此,三道光刻工艺制备TFT-LCD阵列 基板结构的技术应运而生。
三道光刻工艺是基于四道光刻工艺的基础上,利用半色调光 罩,结合透明电极的剥离工艺,在钝化层挖洞之后,不移除光阻 直接透明电极成膜,成膜后再移除光阻。而透明电极剥离工艺的 难点在于光阻上覆盖有透明电极,剥离液只能从没有被透明电极 覆盖的底切区域开始剥离光阻,在底切较小的区域,存在剥离效 率不高、光阻残留的问题而影响面板质量。
发明内容
本发明提供阵列基板的制作方法及显示装置的制作方法,以 解决在剥离透明电极过程中,由于剥离液接触剥离区域较小,导 致光阻和透明电极剥离效率较低,以增加剥离时间的问题。
为实现上述目的,本发明提供的技术方案如下:
根据本发明的一个方面,提供了一种阵列基板的制作方法, 所述阵列基板的制作方法包括如下步骤:
步骤S10、提供一基板;
步骤S20、在所述基板表面沉积钝化层;
步骤S30、在所述钝化层表面形成水溶性有机物层,所述水溶 性有机物为易溶于水的材料;
步骤S40、在所述水溶性有机物层表面涂布光阻层,对所述光 阻层进行曝光、显影,得到光阻层图案和水溶性有机物层图案, 所述光阻层图案包括多个间隔设置的光阻区域,所述水溶性有机 物层图案包括多个间隔设置的水溶性有机物区域,所述光阻区域 设置在所述水溶性有机物区域上方,所述水溶性有机物区域的横 截面小于所述光阻区域底面的横截面;
步骤S50、对所述钝化层进行干蚀刻,使得所述钝化层图案的 横截面与所述水溶性有机物层图案的横截面相同;
步骤S60、在所述基板上方沉积透明电极,所述透明电极包括 覆盖于所述基板表面的第一电极和覆盖于所述光阻层图案表面的 第二电极;
步骤S70、剥离所述水溶性有机物层图案与所述光阻层图案, 除去所述第二电极,以使所述透明电极图案化。
根据本发明一实施例,所述水溶性有机物包括羟基、醛基、 羧基、氨基和磺酸基中的一者或至少两者。
根据本发明一实施例,所述水溶性有机物由3,4-乙撑二氧噻 吩聚合物和聚苯乙烯磺酸盐两种物质构成。
根据本发明一实施例,在对所述光阻层进行曝光、显影时, 由于显影液对所述光阻层图案下面的所述水溶性有机物层的侧向 腐蚀,使得所述水溶性有机物区域的横截面小于所述光阻区域的 横截面,所述光阻区域呈梯形,所述光阻区域的上横截面小于下 横截面。
根据本发明一实施例,所述步骤S50包括:
采用蚀刻气体对所述钝化层进行蚀刻,使得所述钝化层图案 的横截面与所述水溶性有机物层图案的横截面相同,同时采用所 述蚀刻气体蚀刻所述水溶性有机物层,使得所述水溶性有机物层 图案的横截面进一步缩小。
根据本发明一实施例,所述步骤S70包括:
采用剥离液剥离所述水溶性有机物层,同时剥离所述光阻层 图案和所述第二电极,其中,所述水溶性有机物层图案溶于所述 剥离液中。
根据本发明的另一方面,提供了一种显示装置的制作方法, 所述显示装置的制作方法包括阵列基板的制作方法和彩膜基板的 制作方法,所述阵列基板的制作方法包括如下步骤:
步骤S10、提供一基板;
步骤S20、在所述基板表面沉积钝化层;
步骤S30、在所述钝化层表面形成水溶性有机物层,所述水溶 性有机物为易溶于水的材料;
步骤S40、在所述水溶性有机物层表面涂布光阻层,对所述光 阻层进行曝光、显影,得到光阻层图案和水溶性有机物层图案, 所述光阻层图案包括多个间隔设置的光阻区域,所述水溶性有机 物层图案包括多个间隔设置的水溶性有机物区域,所述光阻区域 设置在所述水溶性有机物区域上方,所述水溶性有机物区域的横 截面小于所述光阻区域底面的横截面;
步骤S50、对所述钝化层进行干蚀刻,使得所述钝化层图案的 横截面与所述水溶性有机物层图案的横截面相同;
步骤S60、在所述基板上方沉积透明电极,所述透明电极包括 覆盖于所述基板表面的第一电极和覆盖于所述光阻层图案表面的 第二电极;
步骤S70、剥离所述水溶性有机物层与所述光阻层,除去所述 第二电极,以使所述透明电极图案化。
根据本发明一实施例,所述水溶性有机物包括羟基、醛基、 羧基、氨基和磺酸基中的一者或至少两者。
根据本发明一实施例,所述水溶性有机物由3,4-乙撑二氧噻 吩聚合物和聚苯乙烯磺酸盐两种物质构成。
根据本发明一实施例,在对所述光阻层进行曝光、显影时, 由于显影液对所述水性有机物区域的侧向腐蚀,使得所述水溶性 有机物区域的横截面小于所述光阻区域的横截面,所述光阻区域 呈梯形,所述光阻区域的上横截面小于下横截面。
本发明提供一种阵列基板的制作方法及显示装置的制作方 法,通过在钝化层的表面设置水溶性有机物层,以增大剥离区域 面积,使得剥离液能够溶解水溶性有机物层,进而剥除覆盖在水 溶性有机物层之上的光阻和透明电极,从而提高了透明电极的剥 离效率。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案,下面将 对实施例或现有技术描述中所需要使用的附图作简单介绍,显而 易见地,下面描述中的附图仅仅是发明的一些实施例,对于本领 域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根 据这些附图获得其他的附图。
图1为本发明实施例中阵列基板的制作流程图;
图2a-2e为本发明实施例中阵列基板的制作流程结构示意图;
具体实施方式
以下各实施例的说明是参考附加的图示,用以例示本发明可 用以实施的特定实施例。本发明所提到的方向用语,例如[上]、 [下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等,仅是参考附 加图式的方向。因此,使用的方向用语是用以说明及理解本发明, 而非用以限制本发明。在图中,结构相似的单元是用以相同标号 表示。
下面结合附图和具体实施例对本发明做进一步的说明:
如图1所示为本发明实施例中阵列基板的制作流程图,图 2a-2e为本发明实施例中阵列基板的制作流程结构示意图。
如图2a所示,步骤S10、提供一基板101;
步骤S10中提供的基板101,通常情况下为薄膜晶体管基板, 包括衬底和薄膜晶体管阵列;所述衬底为玻璃衬底。
步骤S20、在所述基板101表面沉积钝化层102;
其中,步骤S20中采用气相沉积技术在所述基板101表面沉积 钝化层102,所述钝化层102采用氮化硅和氧化硅中的其中一者或 两者制备。
步骤S30、在所述钝化层102表面形成水溶性有机物层103,所 述水溶性有机物为易溶于水的材料;
所述水溶性有机物包括羟基、醛基、氨基和磺酸基中的一者 或至少两者。
根据本发明一实施例,所述水溶性有机物层由3,4-乙撑二氧 噻吩聚合物和聚苯乙烯磺酸盐两种物质构成,其中,3,4-乙撑二 氧噻吩聚合物在水中的溶解度较低,加入可溶于水中的聚苯乙烯 磺酸盐后,所述水系有机混合物的溶解性大大提升,可以通过调 整3,4-乙撑二氧噻吩聚合物和聚苯乙烯磺酸盐的比例而获得不同 溶解性的水溶性有机物层,具体比例依据实际情况而定。
由于水溶性有机物层103为易溶于水材料制备,所以在后续的 制程中非常容易清洗,这在很大程度上提高了后续的透明电极剥 离效率。
如图2b所示,步骤S40、在所述水溶性有机物层表面涂布光阻 层,对所述光阻层进行曝光、显影,得到光阻层图案和水溶性有 机物层图案,所述光阻层图案包括多个间隔设置的光阻区域,所 述水溶性有机物层图案包括多个间隔设置的水溶性有机物区域 103a,所述光阻区域104设置在所述水溶性有机物区域103a上方, 所述水溶性有机物区域103a的横截面小于所述光阻区域104底面 的横截面。
在该步骤S40中,先进行黄光工程,即在所述水溶性有机物层 103表面涂布光阻层,对光阻层进行曝光、显影,得到光阻层图案 和水溶性有机物层图案;在显影液对水溶性有机物层103进行蚀刻 的过程中,由于显影液的侧向蚀刻而使得所述水溶性有机物层区域103a的横截面小于所述光阻区域104的横截面,但是不被光阻层 保护的水溶性有机物区域,所述水溶性有机物被完全清洗。
黄光工程中采用半色调光罩对所述光阻层曝光,形成过孔以 及完成狭缝电极的形状化。
如图2c所示,步骤S50、对所述钝化层102进行干蚀刻,使得 所述钝化层图案的横截面与所述水溶性有机物层图案的横截面相 同;
在步骤S50中,对所述钝化层102进行干蚀刻,得到钝化层区 域102a,由于在对钝化层102进行干蚀刻的过程中,干蚀刻气体对 水溶性有机物层103的侧向蚀刻会进一步增大缩小水溶性有机物 层区域103a的横截面,从而在后续的透明电极剥离制程中使得剥 离液水里进入光阻覆盖区,提高了透明电极膜层的剥离效率。
如图2d所示,步骤S60、在所述基板101上方沉积透明电极105, 所述透明电极包括覆盖于所述基板表面的第一电极1052和覆盖于 所述光阻层图案表面的第二电极1051;由于底切(undercut)的存 在,透明电极在底切处断开,为剥离液能够顺利溶解水溶性有机物层103图案提供了有利条件。
如图2e所示,步骤S70、剥离所述水溶性有机物层图案与所述 光阻层图案,除去所述第二电极1051,以使所述透明电极105图案 化。
在步骤S70过程中,剥离液顺利溶解水溶性有机物层图案,从 而将覆盖其上的光阻层图案和第二电极1051图案剥除,完成透明 电极105的图案化。
根据本发明的另一方面,提供了一种显示装置的制作方法, 所述显示装置的制作方法包括阵列基板的制作方法和彩膜基板的 制作方法,所述阵列基板的制作方法包括如下步骤:
步骤S10、提供一基板;
步骤S20、在所述基板表面沉积钝化层;
步骤S30、在所述钝化层表面形成水溶性有机物层,所述水溶 性有机物为易溶于水的材料;
步骤S40、在所述水溶性有机物表面涂布光阻层,对所述光阻 层进行曝光、显影,得到光阻层图案和水溶性有机物层图案,所 述光阻层图案包括多个间隔设置的光阻区域,所述水溶性有机物 层图案包括多个间隔设置的水溶性有机物区域,所述光阻区域设 置在所述水溶性有机物区域上方,所述水溶性有机物区域的横截 面小于所述光阻区域底面的横截面;
步骤S50、对所述钝化层进行干蚀刻,使得所述钝化层图案的 横截面与所述水溶性有机物层图案的横截面相同;
步骤S60、在所述基板上方沉积透明电极,所述透明电极包括 覆盖于所述基板表面的第一电极和覆盖于所述光阻层图案表面的 第二电极;
步骤S70、剥离所述水溶性有机物层图案与所述光阻层图案, 除去所述第二电极,以使所述透明电极图案化。
本实施例中显示装置的制作方法原理跟上述阵列基板的制作 方法的原理一致,具体可参考上述优选实施例的阵列基板制作方 法的工作原理,此处不再做赘述。
本发明提供一种阵列基板的制作方法及显示装置的制作方 法,通过在钝化层的表面设置水溶性有机物层,以增大剥离区域 面积,使得剥离液能够溶解水溶性有机物层,进而剥除覆盖在水 溶性有机物层之上的光阻和透明电极,从而提高了透明电极的剥 离效率。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优 选实施例并非用以限制本发明,本领域的普通技术人员,在不脱 离本发明的精神和范围内,均可作各种更动与润饰,因此本发明 的保护范围以权利要求界定的范围为准。
Claims (10)
1.一种阵列基板的制作方法,其特征在于,所述阵列基板的制作方法包括如下步骤:
步骤S10、提供一基板;
步骤S20、在所述基板表面沉积钝化层;
步骤S30、在所述钝化层表面形成水溶性有机物层,所述水溶性有机物为易溶于水的材料;
步骤S40、在所述水溶性有机物层表面涂布光阻层,对所述光阻层进行曝光、显影,得到光阻层图案和水溶性有机物层图案,所述光阻层图案包括多个间隔设置的光阻区域,所述水溶性有机物层图案包括多个间隔设置的水溶性有机物区域,所述光阻区域设置在所述水溶性有机物区域上方,所述水溶性有机物区域的横截面小于所述光阻区域底面的横截面;
步骤S50、对所述钝化层进行干蚀刻,使得所述钝化层图案的横截面与所述水溶性有机物层图案的横截面相同;
步骤S60、在所述基板上方沉积透明电极,所述透明电极包括覆盖于所述基板表面的第一电极和覆盖于所述光阻层图案表面的第二电极;
步骤S70、剥离所述水溶性有机物层图案与所述光阻层图案,除去所述第二电极,以使所述透明电极图案化。
2.根据权利要求1所述的阵列基板的制作方法,其特征在于,所述水溶性有机物包括羟基、醛基、羧基、氨基和磺酸基中的一者或至少两者。
3.根据权利要求2所述的阵列基板的制作方法,其特征在于,所述水溶性有机物由3,4-乙撑二氧噻吩聚合物和聚苯乙烯磺酸盐两种物质构成。
4.根据权利要求1所述的阵列基板的制作方法,其特征在于,在对所述光阻层进行曝光、显影时,由于显影液对所述水性有机物区域的侧向腐蚀,使得所述水溶性有机物区域的横截面小于所述光阻区域的横截面,所述光阻区域呈梯形,所述光阻区域的上横截面小于下横截面。
5.根据权利要求2所述的阵列基板的制作方法,其特征在于,所述步骤S50包括:
采用蚀刻气体对所述钝化层进行蚀刻,使得所述钝化层图案的横截面与所述水溶性有机物层图案的横截面相同,同时采用所述蚀刻气体蚀刻所述水溶性有机物层,使得所述水溶性有机物层图案的横截面进一步缩小。
6.根据权利要求2所述的阵列基板的制作方法,其特征在于,所述步骤S70包括:
采用剥离液剥离所述水溶性有机物层图案,同时剥离所述光阻层图案和所述第二电极,其中,所述水溶性有机物层图案溶于所述剥离液中。
7.一种显示装置的制作方法,其特征在于,所述显示装置的制作方法包括阵列基板的制作方法和彩膜基板的制作方法,所述阵列基板的制作方法包括如下步骤:
步骤S10、提供一基板;
步骤S20、在所述基板表面沉积钝化层;
步骤S30、在所述钝化层表面形成水溶性有机物层,所述水溶性有机物为易溶于水的材料;
步骤S40、在所述水溶性有机物层表面涂布光阻层,对所述光阻层进行曝光、显影,得到光阻层图案和水溶性有机物层图案,所述光阻层图案包括多个间隔设置的光阻区域,所述水溶性有机物层图案包括多个间隔设置的水溶性有机物区域,所述光阻区域设置在所述水溶性有机物区域上方,所述水溶性有机物区域的横截面小于所述光阻区域底面的横截面;
步骤S50、对所述钝化层进行干蚀刻,使得所述钝化层图案的横截面与所述水溶性有机物层图案的横截面相同;
步骤S60、在所述基板上方沉积透明电极,所述透明电极包括覆盖于所述基板表面的第一电极和覆盖于所述光阻层图案表面的第二电极;
步骤S70、剥离所述水溶性有机物层与所述光阻层,除去所述第二电极,以使所述透明电极图案化。
8.根据权利要求7所述的显示装置的制作方法,其特征在于,所述水溶性有机物包括羟基、醛基、羧基、氨基和磺酸基中的一者或至少两者。
9.根据权利要求8所述的显示装置的制作方法,其特征在于,所述水溶性有机物由3,4-乙撑二氧噻吩聚合物和聚苯乙烯磺酸盐两种物质构成。
10.根据权利要求7所述的阵列基板的制作方法,其特征在于,在对所述光阻层进行曝光、显影时,由于显影液对所述水性有机物区域的侧向腐蚀,使得所述水溶性有机物区域的横截面小于所述光阻区域的横截面,所述光阻区域呈梯形,所述光阻区域的上横截面小于下横截面。
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WO2019109445A1 (zh) | 2019-06-13 |
EP3723129A4 (en) | 2021-09-15 |
KR20200091446A (ko) | 2020-07-30 |
JP2021501473A (ja) | 2021-01-14 |
JP6947925B2 (ja) | 2021-10-13 |
EP3723129A1 (en) | 2020-10-14 |
KR102323956B1 (ko) | 2021-11-09 |
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