CN107734878A - 一种pcb盲孔的化学镀填充方法及其化学镀溶液 - Google Patents
一种pcb盲孔的化学镀填充方法及其化学镀溶液 Download PDFInfo
- Publication number
- CN107734878A CN107734878A CN201710966417.7A CN201710966417A CN107734878A CN 107734878 A CN107734878 A CN 107734878A CN 201710966417 A CN201710966417 A CN 201710966417A CN 107734878 A CN107734878 A CN 107734878A
- Authority
- CN
- China
- Prior art keywords
- chemical plating
- silica gel
- blind holes
- fill method
- blind hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 39
- 239000000126 substance Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000741 silica gel Substances 0.000 claims abstract description 27
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 238000000608 laser ablation Methods 0.000 claims abstract description 10
- 239000011241 protective layer Substances 0.000 claims abstract description 7
- 239000000945 filler Substances 0.000 claims abstract description 3
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 2
- 230000001133 acceleration Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 nanogold Chemical compound 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Laser Beam Processing (AREA)
Abstract
本发明提供了一种PCB盲孔的化学镀填充方法，其包括提供待处理的多层印刷电路板，在所述电路板的上表面上沉积耐高温保护层，并开口露出盲孔的位置；利用激光束对上述盲孔的位置进行激光钻孔，形成多个盲孔；利用硅胶填充所述多个盲孔并进行固化，所述硅胶中掺杂并分散有催化粒子；激光烧蚀所述硅胶，去除大部分硅胶，并在所述多个盲孔内表面形成一层硅胶残留层；将电路板进入化学镀溶液进行金属化学镀填充所述多个盲孔。
Description
技术领域
本发明涉及化学镀领域，具体涉及一种PCB盲孔的化学镀填充方法。
背景技术
化学镀是一种在材料表面形成均匀金属镀层的方法，特别是当材料是树脂、陶瓷等非金属时，这些材料无法直接电镀得到想要的金属涂层，化学镀则是非常好的选择。化学镀不仅操作简单，而且得到的金属镀层质量也比较高，镀层均匀性好，孔隙率低。化学镀的应用范围很广，在印刷电路板领域，用于通孔、盲孔或者叠孔的孔金属化，还有化学镀金，浸银等工序。
通常孔化学镀要经过前处理（粗化）、吸附、还原这三个主要过程，其中前处理对镀层是否上镀，镀层质量有极大的影响。特别是在孔壁表面非常光滑的情况，这个时候表面预处理就显得十分重要。一般情况下，孔壁表面粗化可以使用化学微蚀处理，以达到表面改性，增加表面接触面积，提供附着性。但是这种方法有较多局限性，在应用的材料不同时要调整不同的配方，并且处理程度不易控制，容易降低材料表面平整度，影响后续镀层质量；对材料进行蚀刻粗化，容易导致材料老化，寿命减少；另外，化学药品的引入也带来了环境健康等问题。现有技术（例如CN103866303A）中的化学镀在盲孔中填充金属，容易在盲孔的开口处堆积堵塞盲孔，使得所述盲孔的下部分没有连续的被填充金属，可以参见附图6，这样会导致缺陷的产生。
发明内容
基于解决上述的问题，本发明提供了一种PCB盲孔的化学镀填充方法，其包括以下步骤：
（1）提供待处理的多层印刷电路板，在所述电路板的上表面上沉积耐高温保护层，并开口露出盲孔的位置；
（2）利用激光束对上述盲孔的位置进行激光钻孔，形成多个盲孔；
（3）利用硅胶填充所述多个盲孔并进行固化，所述硅胶中掺杂并分散有催化粒子；
（4）激光烧蚀所述硅胶，去除大部分硅胶，并在所述多个盲孔内表面形成一层硅胶残留层；
（5）将电路板进入化学镀溶液进行金属化学镀填充所述多个盲孔；
（6）去除所述耐高温保护层。
根据本发明的实施例，所述催化粒子为奈米银、纳米金、纳米铂和纳米钯中的一种或几种。
根据本发明的实施例，所述硅胶残余层的厚度为大于100微米。
根据本发明的实施例，所述激光钻孔的激光能量大于所述激光烧蚀的激光能量。
根据本发明的实施例，所述激光钻孔的激光能量为100-125mJ。
根据本发明的实施例，所述激光烧蚀的激光能量为80-90mJ。
根据本发明的实施例，所述硅胶残余层的表面粗糙度大于20微米。
根据本发明的实施例，所述化学镀溶液的具体配比为：5-100g/L的五水硫酸铜，1-10g/L的盐酸，5-20g/L的硫酸，0.001-0.05g/L的加速剂，0.005-0.05g/L的稳定剂，其余为蒸馏水。
本发明的优点如下：
（1）利用硅胶的高吸附性进行化学液体的吸附，增强金属填充能力；
（2）催化粒子直接携带于硅胶内，很方便填充于盲孔中，且比较易于控制催化粒子的使用量；
（3）利用激光烧蚀去掉部分的硅胶，一方面可以留下催化粒子（此时激光能量需要较小，否则粒子容易团聚），利用方面可以制造出较为粗糙的硅胶材料层，该种粗糙的表面可以增强催化粒子的吸附和化学镀溶液的吸附，也为填充的金属提供较好的附着能力。
附图说明
图1-5为本发明的PCB盲孔的化学镀填充方法的过程图；
图6为现有的PCB盲孔的化学镀填充方法的填充效果图。
具体实施方式
参见图1-5，本发明的PCB盲孔的化学镀填充方法，其包括以下步骤：
（1）提供待处理的多层印刷电路板1，在所述电路板1的上表面上沉积耐高温保护层3，并开口露出盲孔的位置；
（2）参见图1，利用激光束对上述盲孔的位置进行激光钻孔，形成多个盲孔2；
（3）利用硅胶4填充所述多个盲孔2并进行固化，所述硅胶4中掺杂并分散有催化粒子，所述催化粒子为纳米银、纳米金、纳米铂和纳米钯中的一种或几种；
（4）激光烧蚀所述硅胶4，去除大部分硅胶4，并在所述多个盲孔内表面形成一层硅胶残留层5；
（5）将电路板1进入化学镀溶液进行金属化学镀，形成金属6填充所述多个盲孔2；
（6）去除所述耐高温保护层3。
为了保证催化粒子不至于因高温而聚集，所述激光钻孔的激光能量大于所述激光烧蚀的激光能量，所述激光烧蚀的激光能量为80-90mJ，所述激光钻孔的激光能量为100-125mJ。可以利用激光的烧蚀形成较为粗糙的残余层5，所述硅胶残余层5的厚度为大于100微米。所述硅胶残余层5的表面粗糙度大于20微米。
所述化学镀溶液的具体配比为：5-100g/L的五水硫酸铜，1-10g/L的盐酸，5-20g/L的硫酸，0.001-0.05g/L的加速剂，0.005-0.05g/L的稳定剂，其余为蒸馏水。该稳定剂用于防止镀层的铜再次被氧化或溶解。
最后应说明的是：显然，上述实施例仅仅是为清楚地说明本发明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引申出的显而易见的变化或变动仍处于本发明的保护范围之中。
Claims (8)
1.一种PCB盲孔的化学镀填充方法，其包括以下步骤：
（1）提供待处理的多层印刷电路板，在所述电路板的上表面上沉积耐高温保护层，并开口露出盲孔的位置；
（2）利用激光束对上述盲孔的位置进行激光钻孔，形成多个盲孔；
（3）利用硅胶填充所述多个盲孔并进行固化，所述硅胶中掺杂并分散有催化粒子；
（4）激光烧蚀所述硅胶，去除大部分硅胶，并在所述多个盲孔内表面形成一层硅胶残留层；
（5）将电路板进入化学镀溶液进行金属化学镀，形成金属填充所述多个盲孔；
（6）去除所述耐高温保护层。
2.根据权利要求1所述的PCB盲孔的化学镀填充方法，其特征在于：所述催化粒子为纳米银、纳米金、纳米铂和纳米钯中的一种或几种。
3.根据权利要求1所述的PCB盲孔的化学镀填充方法，其特征在于：所述硅胶残余层的厚度为大于100微米。
4.根据权利要求1-3中任一项所述的PCB盲孔的化学镀填充方法，其特征在于：所述激光钻孔的激光能量大于所述激光烧蚀的激光能量。
5.根据权利要求4所述的PCB盲孔的化学镀填充方法，其特征在于：所述激光钻孔的激光能量为100-125mJ。
6.根据权利要求4所述的PCB盲孔的化学镀填充方法，其特征在于：所述激光烧蚀的激光能量为80-90mJ。
7.根据权利要1所述的PCB盲孔的化学镀填充方法，其特征在于：所述硅胶残余层的表面粗糙度大于20微米。
8.根据权利要1所述的PCB盲孔的化学镀填充方法，其特征在于：所述化学镀溶液的具体配比为：5-100g/L的五水硫酸铜，1-10g/L的盐酸，5-20g/L的硫酸，0.001-0.05g/L的加速剂，0.005-0.05g/L的稳定剂，其余为蒸馏水。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710966417.7A CN107734878B (zh) | 2017-10-17 | 2017-10-17 | 一种pcb盲孔的化学镀填充方法及其化学镀溶液 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710966417.7A CN107734878B (zh) | 2017-10-17 | 2017-10-17 | 一种pcb盲孔的化学镀填充方法及其化学镀溶液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107734878A true CN107734878A (zh) | 2018-02-23 |
| CN107734878B CN107734878B (zh) | 2018-09-21 |
Family
ID=61211305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710966417.7A Active CN107734878B (zh) | 2017-10-17 | 2017-10-17 | 一种pcb盲孔的化学镀填充方法及其化学镀溶液 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107734878B (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5460921A (en) * | 1993-09-08 | 1995-10-24 | International Business Machines Corporation | High density pattern template: materials and processes for the application of conductive pastes |
| TW201121374A (en) * | 2009-12-10 | 2011-06-16 | Unimicron Technology Corp | Embedded wiring board and method for fabricating the same |
| CN102224770A (zh) * | 2008-12-02 | 2011-10-19 | 松下电工株式会社 | 电路基板的制造方法以及由该制造方法获得的电路基板 |
| CN104838731A (zh) * | 2012-12-14 | 2015-08-12 | 上村工业株式会社 | 印刷电路板的制造方法及利用该制造方法制造出的印刷电路板 |
-
2017
- 2017-10-17 CN CN201710966417.7A patent/CN107734878B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5460921A (en) * | 1993-09-08 | 1995-10-24 | International Business Machines Corporation | High density pattern template: materials and processes for the application of conductive pastes |
| CN102224770A (zh) * | 2008-12-02 | 2011-10-19 | 松下电工株式会社 | 电路基板的制造方法以及由该制造方法获得的电路基板 |
| TW201121374A (en) * | 2009-12-10 | 2011-06-16 | Unimicron Technology Corp | Embedded wiring board and method for fabricating the same |
| CN104838731A (zh) * | 2012-12-14 | 2015-08-12 | 上村工业株式会社 | 印刷电路板的制造方法及利用该制造方法制造出的印刷电路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107734878B (zh) | 2018-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6839219B2 (en) | Laminate for forming capacitor layer and method for manufacturing the same | |
| JPS6177395A (ja) | 電気泳動的に折出した樹脂コ−テイングに金属を結合させる方法 | |
| TW201607397A (zh) | 印刷電路板中的通孔 | |
| US4734299A (en) | Sensitizing agent for electroless plating and method for sensitizing substrate with the agent | |
| TWI628989B (zh) | 印刷電路板的線路與層間導通之製造方法 | |
| CN108738237A (zh) | 一种埋嵌铝排结构印制电路板的制造方法 | |
| TWI291382B (en) | Method of forming a metal thin film with micro holes by ink-jet printing | |
| TW201924929A (zh) | 陶瓷元件及其製造方法 | |
| CN107734878A (zh) | 一种pcb盲孔的化学镀填充方法及其化学镀溶液 | |
| JP2016119424A (ja) | プリント配線板用基板及びプリント配線板並びにプリント配線板用基板の製造方法 | |
| TWI327452B (en) | Process for manufacturing a wiring substrate | |
| CN104661449B (zh) | 一种基于激光活化技术的孔金属化方法 | |
| JP2013093359A (ja) | 半導体チップ搭載用基板及びその製造方法 | |
| JP5938948B2 (ja) | 半導体チップ搭載用基板及びその製造方法 | |
| JP2006019654A (ja) | 多層配線板およびその製造方法 | |
| TW201709221A (zh) | 異向導電性膜 | |
| JP5495002B2 (ja) | プリント配線板、およびその製造方法 | |
| JP2000151096A (ja) | プリント配線板の製造方法 | |
| JP5840304B2 (ja) | ビルドアップ多層基板の製造方法、及びビルドアップ多層基板 | |
| JPH06260759A (ja) | プリント回路板の製造方法 | |
| JP2011060969A (ja) | 配線基板の製造方法 | |
| JPH06260757A (ja) | プリント回路板の製造方法 | |
| JPH06510568A (ja) | 直接電気メッキ用温和塩基性促進液剤 | |
| RU2395938C1 (ru) | Способ изготовления печатных плат | |
| JP2022149296A (ja) | プリント配線板とその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Electroless plating filling method for PCB blind hole and electroless plating solution thereof Effective date of registration: 20210827 Granted publication date: 20180921 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: NANTONG CIRCUIT ELECTRONIC Co.,Ltd. Registration number: Y2021980008496 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220929 Granted publication date: 20180921 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: NANTONG CIRCUIT ELECTRONIC CO.,LTD. Registration number: Y2021980008496 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Method of Electroless Plating Filling PCB Blind Hole and Its Electroless Plating Solution Effective date of registration: 20220930 Granted publication date: 20180921 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: NANTONG CIRCUIT ELECTRONIC CO.,LTD. Registration number: Y2022980017222 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230627 Granted publication date: 20180921 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: NANTONG CIRCUIT ELECTRONIC CO.,LTD. Registration number: Y2022980017222 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |