CN107615895A - 一种图形导电材料的制备方法 - Google Patents

一种图形导电材料的制备方法 Download PDF

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Publication number
CN107615895A
CN107615895A CN201580080231.0A CN201580080231A CN107615895A CN 107615895 A CN107615895 A CN 107615895A CN 201580080231 A CN201580080231 A CN 201580080231A CN 107615895 A CN107615895 A CN 107615895A
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CN
China
Prior art keywords
layer
metal
circuit pattern
photosensitive
photosensitive material
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CN201580080231.0A
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English (en)
Inventor
刘学明
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Anhui Tatfook Optoelectronics Technology Co ltd
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Anhui Tatfook Optoelectronics Technology Co ltd
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Application filed by Anhui Tatfook Optoelectronics Technology Co ltd filed Critical Anhui Tatfook Optoelectronics Technology Co ltd
Publication of CN107615895A publication Critical patent/CN107615895A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

一种图形导电材料的制备方法，该方法通过在柔性基底材料的至少一表面贴敷感光材料(S101)，然后通过除去电路图案区域的感光材料来形成所述电路图案(S102)，在电路图案表面形成金属导电层，从而得到图形导电材料(S103)。该方法能够通过图形电镀工艺，一次成型制作出最终想要的电路图案，简化工艺流程并提高效率。

Description

PCT国内申请，说明书已公开。

Claims (17)

  1. PCT国内申请，权利要求书已公开。
CN201580080231.0A 2015-12-31 2015-12-31 一种图形导电材料的制备方法 Pending CN107615895A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/100183 WO2017113325A1 (zh) 2015-12-31 2015-12-31 一种图形导电材料的制备方法

Publications (1)

Publication Number Publication Date
CN107615895A true CN107615895A (zh) 2018-01-19

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ID=59224318

Family Applications (1)

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CN201580080231.0A Pending CN107615895A (zh) 2015-12-31 2015-12-31 一种图形导电材料的制备方法

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CN (1) CN107615895A (zh)
WO (1) WO2017113325A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113301724A (zh) * 2021-05-24 2021-08-24 福莱盈电子股份有限公司 软硬结合板短槽孔加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1333649A (zh) * 2000-02-09 2002-01-30 松下电器产业株式会社 复制材料及其制造方法以及用其制造的布线基片
CN1335743A (zh) * 2000-07-26 2002-02-13 赵远涛 制作印刷线路板的工艺方法
JP2010108964A (ja) * 2008-10-28 2010-05-13 Toray Ind Inc 回路基板の製造方法
CN102733179A (zh) * 2011-04-07 2012-10-17 宁龙仔 人造纤维及纺织品化学镀和电镀铜方法
CN104411093A (zh) * 2014-11-05 2015-03-11 深圳市新宇腾跃电子有限公司 一种单面柔性电路板的生产工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102711375A (zh) * 2012-06-13 2012-10-03 田茂福 具有改良的可焊性的柔性线路板和方法
CN105072815B (zh) * 2015-07-07 2018-05-08 安徽中大印制电路有限公司 一种柔性电路板的生产工艺

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1333649A (zh) * 2000-02-09 2002-01-30 松下电器产业株式会社 复制材料及其制造方法以及用其制造的布线基片
CN1335743A (zh) * 2000-07-26 2002-02-13 赵远涛 制作印刷线路板的工艺方法
JP2010108964A (ja) * 2008-10-28 2010-05-13 Toray Ind Inc 回路基板の製造方法
CN102733179A (zh) * 2011-04-07 2012-10-17 宁龙仔 人造纤维及纺织品化学镀和电镀铜方法
CN104411093A (zh) * 2014-11-05 2015-03-11 深圳市新宇腾跃电子有限公司 一种单面柔性电路板的生产工艺

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
吴新开: "《电工与电子技术实验》", 31 March 2013 *
张怀武: "《现代印制电路原理与工艺》", 31 January 2010 *
陈亚: "《现代实用电镀技术》", 31 January 2003 *
陈治良: "《电镀车间技术指南》", 31 May 2007 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113301724A (zh) * 2021-05-24 2021-08-24 福莱盈电子股份有限公司 软硬结合板短槽孔加工方法

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WO2017113325A1 (zh) 2017-07-06

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Application publication date: 20180119