CN107522822A - 感光性树脂组合物、覆盖膜及电路板 - Google Patents
感光性树脂组合物、覆盖膜及电路板 Download PDFInfo
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- CN107522822A CN107522822A CN201611099396.5A CN201611099396A CN107522822A CN 107522822 A CN107522822 A CN 107522822A CN 201611099396 A CN201611099396 A CN 201611099396A CN 107522822 A CN107522822 A CN 107522822A
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- Prior art keywords
- polymer combination
- photosensitive polymer
- methyl
- photosensitive
- acrylate
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- Granted
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- 239000011342 resin composition Substances 0.000 title abstract description 8
- 239000012787 coverlay film Substances 0.000 title 1
- 239000004593 Epoxy Substances 0.000 claims abstract description 27
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims abstract description 21
- -1 carboxylic acid modified bisphenol Chemical class 0.000 claims abstract description 11
- 229920000642 polymer Polymers 0.000 claims description 77
- 239000011347 resin Substances 0.000 claims description 43
- 229920005989 resin Polymers 0.000 claims description 43
- 239000002253 acid Substances 0.000 claims description 34
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 29
- 230000004888 barrier function Effects 0.000 claims description 27
- 239000003086 colorant Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 238000001723 curing Methods 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- UTLJATUUOXBWPZ-UHFFFAOYSA-N C(C=C)(=O)OC.[O] Chemical compound C(C=C)(=O)OC.[O] UTLJATUUOXBWPZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000000280 densification Methods 0.000 claims description 7
- 238000000016 photochemical curing Methods 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 5
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- UJOBWOGCFQCDNV-UHFFFAOYSA-N Carbazole Natural products C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- SSOONFBDIYMPEU-UHFFFAOYSA-N [3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COCC(CO)(CO)COC(=O)C=C SSOONFBDIYMPEU-UHFFFAOYSA-N 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 2
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 claims 1
- WTNMMKJWWSEFNO-UHFFFAOYSA-N CC(C)[S] Chemical compound CC(C)[S] WTNMMKJWWSEFNO-UHFFFAOYSA-N 0.000 claims 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 claims 1
- FBBZJPZVRCWILD-UHFFFAOYSA-N diphenylphosphanyl-(2,3,4-trimethylphenyl)methanone Chemical compound CC1=C(C)C(C)=CC=C1C(=O)P(C=1C=CC=CC=1)C1=CC=CC=C1 FBBZJPZVRCWILD-UHFFFAOYSA-N 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 16
- 238000003860 storage Methods 0.000 abstract description 7
- 239000000049 pigment Substances 0.000 abstract description 6
- 239000000178 monomer Substances 0.000 abstract description 3
- 238000004132 cross linking Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- GTCAXTIRRLKXRU-UHFFFAOYSA-N methyl carbamate Chemical compound COC(N)=O GTCAXTIRRLKXRU-UHFFFAOYSA-N 0.000 description 9
- 239000003513 alkali Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 6
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000975 dye Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- FHQRDEDZJIFJAL-UHFFFAOYSA-N 4-phenylmorpholine Chemical compound C1COCCN1C1=CC=CC=C1 FHQRDEDZJIFJAL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229930182559 Natural dye Natural products 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- SMWDFEZZVXVKRB-UHFFFAOYSA-N anhydrous quinoline Natural products N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- MZRQZJOUYWKDNH-UHFFFAOYSA-N diphenylphosphoryl-(2,3,4-trimethylphenyl)methanone Chemical class CC1=C(C)C(C)=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MZRQZJOUYWKDNH-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 235000019285 ethoxyquin Nutrition 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000978 natural dye Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
- C08F283/105—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule on to unsaturated polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
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- Chemical & Material Sciences (AREA)
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- Polymers & Plastics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
一种感光性树脂组合物,其包括羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、光引发剂及色料,该感光性树脂组合物中的羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物在紫外光的照射下会发生交联反应而固化形成致密的网状结构。该感光性树脂组合物具有较好的存放性,可以在常温下长时间保存,可以降低感光性树脂组合物的保存成本。另,本发明还提供一种由所述感光性树脂组合物制得的覆盖膜,一种应用该覆盖膜制得的电路板。
Description
技术领域
本发明涉及一种感光性树脂组合物,由该感光性树脂组合物制得的覆盖膜,及应用该覆盖膜制得的电路板。
背景技术
近年来,印刷电路板被广泛应用于各种电子产品上。目前应用于印刷电路板的感光材料主要为防焊绿漆油墨,该防焊绿漆油墨可以给裸露的导电线路提供一耐热、抗湿、耐化学品侵蚀的外部保护层,以防止在焊铅或焊锡时造成线路短路,同时还可以保护金属导电线路免受酸、碱等腐蚀性溶液的腐蚀。
目前,市面上的防焊绿漆油墨一般包括主剂及硬化剂。其中,主剂主要由感光固化性的环氧丙烯酸树脂组成,硬化剂主要由热固化性的环氧树脂组成。在未使用时,该主剂及硬化剂分别包装在不同的容器中。在使用时,将主剂及硬化剂按照一定的比例混合后使用,存放及使用均较为麻烦。
虽然市面上的防焊绿漆油墨技术已较为成熟,可以满足耐热性、耐化性等需求。但是,由于该防焊绿漆油墨的组成中含有环氧树脂,而环氧树脂在常温下易与主剂中主树脂的羧酸基反应,因此,所述防焊绿漆油墨须保存于低温(低于5℃的温度),在一定程度上增加了存放成本及变质风险。
发明内容
有鉴于此,有必要提供一种新型的感光性树脂组合物,以解决以上问题。
另,还有必要提供一种由所述感光性树脂组合物制得的覆盖膜。
另,还有必要提供一种应用所述覆盖膜制得的电路板。
一种感光性树脂组合物,其包括羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、光引发剂及色料,该感光性树脂组合物中的羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物在紫外光的照射下会发生交联反应而固化形成致密的网状结构。
一种覆盖膜,其包括树脂层及结合于该树脂层至少一表面的离型膜,该树脂层由上述感光性树脂组合物涂覆在离型膜的表面后形成。
一种电路板,其包括电路基板及结合于该电路基板至少一表面的绝缘层,该绝缘层由上述感光性树脂组合物经光固化后形成。
所述感光性树脂组合物主要由羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、光引发剂及色料组成。在紫外光的照射下,光引发剂会引发羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体及感光预聚物发生交联反应而固化形成致密的网状结构。该感光性树脂组合物中不包含环氧树脂,因此,该感光性树脂组合物具有较好的存放性,可以在常温下长时间保存,降低了感光性树脂组合物的保存成本。此外,由该感光性树脂组合物制得的覆盖膜及绝缘层具有较强附着力、耐化性、耐热性及耐挠折性。
附图说明
图1是本发明一较佳实施例的覆盖膜的截面示意图。
图2是本发明一较佳实施例的电路板的截面示意图。
主要元件符号说明
覆盖膜 100
离型膜 10
树脂层 20
电路板 200
电路基板 201
绝缘层 202
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请结合参阅图1~2,本发明较佳实施方式提供一种感光性树脂组合物,其主要用于制作覆盖膜100及电路板200的绝缘层202。该感光性树脂组合物包括羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、光引发剂及色料。所述羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体及感光预聚物中均含有碳碳双键(C=C),在紫外光的照射下,该感光性树脂组合物中的羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物会发生交联反应而固化形成致密的网状结构。
所述羧酸改性双酚型环氧(甲基)丙烯酸酯中的双键的个数与感光单体中的双键的个数的比值范围为(1:20)~(1:50)。
所述感光性树脂组合物中,所述羧酸改性双酚型环氧(甲基)丙烯酸酯的含量为100重量份,所述感光单体的含量为20~80重量份,所述感光预聚物的含量为10~40重量份,所述光引发剂的含量为5~15重量份,所述色料的含量为1~5重量份。该感光性树脂组合物的表面能介于30达因(dyne)至60达因之间。
所述羧酸改性双酚型环氧(甲基)丙烯酸酯的分子量的范围大致为15000~35000g/mol,如此可以确保所述感光性树脂组合物的表面能介于30达因至60达因之间,且可以保证在使用该感光性树脂组合物制作覆盖膜100的过程中无残膜出现。所述羧酸改性双酚型环氧(甲基)丙烯酸酯的酸值的范围大致为70~130mgKOH/g,如此可以确保所述感光性树脂组合物具有较强的耐酸性。
所述感光单体的官能团中包含以下官能团中的一种或几种:-C(CH3)2-、-CF2-、-CH2-CH2-CH2-O-、及该类官能团的极性较低,其可以进一步确保所述感光性树脂组合物的表面能介于30达因至60达因之间,且可以使该感光性树脂组合物可以达到制备覆盖膜100及绝缘层202的制程要求。在至少一实施例中,该感光单体可选自丙氧化三羟甲基丙烷三丙烯酸酯及二季戊四醇六丙烯酸酯中的一种或两种。可以理解的,在其它实施方式中,所述感光单体不限于此。该感光单体用于提高感光性树脂组合物的粘度和附着性。
所述感光预聚物为丙烯酸氨基甲酸酯。该丙烯酸氨基甲酸酯的分子量的范围大致为3000~10000g/mol,该丙烯酸氨基甲酸酯的伸长率为200~1400%。该感光预聚物用于提高感光性树脂组合物形成的覆盖膜的耐挠折、耐热性等物理性能。
所述光引发剂包括但不限于α-羟基酮、酰基瞵氧化物、α-氨基酮及肟酯中的几种或几种。具体的,所述光引发剂包括但不限于2-羟基-2-甲基-1-苯基-1-丙酮、1-羟基环已基苯基酮、2,4,6(三甲基苯甲酰基)二苯基氧化膦、2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、苯基双(2,4,6-三甲基苯甲酰基)氧化膦、2-芐基-2-二甲基氨基-1-(4-吗啉代苯基)-1-丁酮、安息香双甲醚、二苯甲酮、异丙基硫杂蒽酮及咔唑肟酯中的一种或几种。在紫外光的照射下,该光引发剂可以引发所述感光性树脂组合物中的羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物发生交联反应而形成致密的网状结构。
所述色料可以为染料或颜料。该颜料可以为有机颜料、无机颜料或金属颜料。该颜料在水﹑油酯﹑树脂﹑有机溶剂等介质中不溶解,但可以均匀地分散在这些介质中,该颜料可以使介质着色并具有一定的遮盖力。该染料为可以将被染物染成各种颜色的有机化合物,该颜料可以为天然染料或合成染料。该染料分子在水﹑油酯﹑树脂﹑有机溶剂等介质中可以通过吸附扩散等化学或物理化学的作用转移,而使介质染色。
所述感光性树脂组合物中还可以包括溶剂,该溶剂用于溶解感光性树脂组合物中的其它组分并调整感光性树脂组合物的粘度。该溶剂可以为乙醇、乙醚、甲苯、丁酮等常规应用于感光性树脂组合物的溶剂。
所述感光性树脂组合物还包括填料。该填料可以为常规应用于感光性树脂组合物的有机填料或无机填料。该填料用于改善所述感光性树脂组合物的机械性能。
所述感光性树脂组合物中还包括添加剂。该添加剂可以为增稠剂、流平剂、消泡剂、密着剂、阻燃剂中的一种或几种。
所述感光性树脂组合物中不含有环氧树脂,如此,可以避免环氧树脂与感光性树脂组合物中的羧基反应,因此,该感光性树脂组合物可以在常温下长时间保存,且不变质。该感光性树脂组合物在紫外光照射下羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物可以发生光固化反应而形成致密的网状结构,从而使由该感光性树脂组合物制得的绝缘层具有较强附着力、耐化性、耐热性、耐挠折性。
所述感光性树脂组合物的制备方法可以为:将羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、色料溶剂及光引发剂等按照预定的比例加入至反应瓶中,混合搅拌,使羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、色料及光引发剂混合均,即制得感光性树脂组合物。所述溶剂的添加量可根据需要进行变更,只要使所述羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、色料溶剂及光引发剂能后完全溶解即可。
请参阅图1,一种覆盖膜100,其包括树脂层20及结合于该树脂层20至少一表面的离型膜10。该树脂层20通过将上述感光性树脂组合物涂覆在离型膜10的表面后形成。可以理解的,在至少一实施方式中,在将所述感光性树脂组合物涂覆在离型膜10的表面后,还可以对所述感光性树脂组合物进行烘烤以去除感光性树脂组合物中的溶剂。
请参阅图2,一种电路板200,其应用于电脑、电子阅读器、平板电脑、智能手表等电子装置(图未示)上。该电路板200包括电路基板201及结合于该电路基板201至少一表面的绝缘层202。该绝缘层202通过将所述覆盖膜100的树脂层20贴合在电路基板201的表面,移除离型膜10,接着使用紫外光照射后对树脂层20进行光固化后形成。在光固化的过程中,树脂层20内的羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物在光引发剂的作用下会发生交联反应而固化形成致密的网状结构,从而得到紧密的结合在电路基板201的表面的绝缘层202。其中,所述紫外光的能量大于等于300mJ/cm2。所述绝缘层202具有较强的耐化性、耐热性、耐挠折性及附着力。所述绝缘层202用于保护所述电路基板201,防止在的电路基板201上焊锡时造成的线路短路,保护电路基板201上的导电线路及电子元件(图未示)等免受其它碱性溶液或酸性溶液的腐蚀。
下面通过实施例进一步对本发明的感光性树脂组合物进行说明。
实施例1
向容积为500ml的反应瓶中依次加入100g羧酸改性双酚型环氧(甲基)丙烯酸酯、30g丙氧化三羟甲基丙烷三丙烯酸酯、10g二季戊四醇六丙烯酸酯、20g丙烯酸氨基甲酸酯、7g 2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、3g异丙基硫杂蒽酮、2g色料、40g丁酮,搅拌溶解,即制得感光性树脂组合物。
比较例1
向容积为500ml的反应瓶中依次加入100g羧酸改性双酚型环氧(甲基)丙烯酸酯、12g丙氧化三羟甲基丙烷三丙烯酸酯、4g二季戊四醇六丙烯酸酯、20g丙烯酸氨基甲酸酯、7g2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、3g异丙基硫杂蒽酮、2g色料、40g丁酮,搅拌溶解,即制得感光性树脂组合物。
比较例2
向容积为500ml的反应瓶中依次加入100g羧酸改性双酚型环氧(甲基)丙烯酸酯、30g乙氧化三羟甲基丙烷三丙烯酸酯、10g二季戊四醇六丙烯酸酯、20g丙烯酸氨基甲酸酯、7g 2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、3g异丙基硫杂蒽酮、2g色料、40g丁酮,搅拌溶解,即制得感光性树脂组合物。
比较例3
向容积为500ml的反应瓶中依次加入100g羧酸改性双酚型环氧(甲基)丙烯酸酯、30g丙氧化三羟甲基丙烷三丙烯酸酯、10g二季戊四醇六丙烯酸酯、7g 2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、3g异丙基硫杂蒽酮、2g色料、40g丁酮,搅拌溶解,即制得感光性树脂组合物。
比较例4
向容积为500ml的反应瓶中依次加入100g羧酸改性双酚型环氧(甲基)丙烯酸酯、30g丙氧化三羟甲基丙烷三丙烯酸酯、10g二季戊四醇六丙烯酸酯、18.5g热固性树脂双酚A二缩水甘油醚环氧树脂、0.55g热固性树脂三聚氰胺、7g 2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、3g异丙基硫杂蒽酮、2g色料、40g丁酮,搅拌溶解,即制得感光性树脂组合物。
对上述实施例1及比较例1~4中所制得的感光性树脂组合物分别进行表面能测试及存放性测试。其中,所述表面能测试为常规使用的表面能的测试方法。所述存放性测试为将感光性树脂组合物分别在常温下存放1个月,观察感光性树脂组合物是否变质。表面能及存放性的测试结果参见表一。
将上述实施例1及比较例1~4中制得的感光性树脂组合物分别涂覆在离型膜10的表面,在60℃下烘烤20min,从而在离型膜10的表面形成树脂层20,制得覆盖膜100,然后将所述覆盖100的树脂层20贴合在电路基板201的表面,使用能量为300mJ/cm2的紫外光照射,使树脂层20光固化二而转化为绝缘层202贴合在电路基板201的表面,制得电路板200对所述电路板200进行附着力测试、耐碱性测试、漂锡耐热性测试及耐挠曲性测试。测试结果参见表一。
所述附着力评价方法为:采用百格测试法,用百格刀在电路板200的绝缘层202上均匀划出100个格子,然后用3M610胶带进行拉扯剥离,剥离的格子数越少表示附着力越好。
参考国标GB9286-98百格法测试标准:
附着力等级5B:切口边缘光滑,格子边缘没有任何剥离。
附着力等级4B:切口相交处有小片剥落,划格区内实际破损<5%。
附着力等级3B:切口的边缘和/或相交处有被剥落,其面积为5%~15%。
附着力等级2B:沿切口边缘有部分剥落或整大片剥落,或部分格子被整片剥落。剥落面积15%~35%。
附着力等级1B:切口边缘大片剥落/或者一些方格部分或全部剥落,其面积为35%~65%。
附着力等级0B:在划线的边缘及交叉点处有成片的脱落,且脱落面积大于65%。
所述耐碱性测试为:将所述电路板200浸泡于摩尔浓度为10%的NaOH溶液中30min,绝缘层202无脱落则耐碱性最强,绝缘层202表面轻微溶解且呈现消光或轻微坑洞则耐碱性次之,绝缘层202澎润脱落或溶解则耐碱性最差。
所述漂锡耐热性测试中,若漂锡耐热性测试在大于等于260℃的温度下持续大于等于10sec,锡不脱落,则漂锡耐热性测试结果为“通过”,表明电路板达到耐热性的需求。
所述耐挠曲性测试为将所述电路板200弯折180度,重复弯折至绝缘层202出现裂痕,绝缘层202出现裂痕时弯折的次数越多,绝缘层202的耐挠曲性能越好。
表一:由实施例1及比较例1~4的感光性树脂的表面能和存放性能的测试结果及由感光性树脂组合物制得的绝缘层的附着力、耐碱性、漂锡耐热性和耐挠曲性测试结果
由上表可知,实施例1及比较例4的感光性树脂组合物制得的绝缘层的附着力最好。实施例1及比较例1~4的感光性树脂组合物制得的绝缘层均具有较好的漂锡耐热性,其中,实施例1及比较例4的感光性树脂组合物制得的绝缘层的漂锡耐热性最好。实施例1的感光性树脂组合物的耐挠曲性最好。实施例1的感光性树脂组合物的表面能最低,比较例1的感光性树脂组合物的表面能次之,比较例3~4的感光性树脂组合物的表面能测不出。实施例1及比较例1~3的感光性树脂组合物的存放性能较好,比较例4的感光性树脂组合物的存放性能最差。综合以上测试结果可知,本发明的感光性树脂组合物具有合适的表面能、较好的常温存放性能,且本发明的感光性树脂组合物制得的绝缘层具有较好的附着力、耐碱性、漂锡耐热性及耐挠曲性。
本发明的感光性树脂组合物主要由羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、光引发剂及色料组成。在紫外光的照射下,光引发剂会引发羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体及感光预聚物发生交联反应而固化形成致密的网状结构。该感光性树脂组合物中不包含环氧树脂,因此,该感光性树脂组合物具有较好的存放性,可以在常温下长时间保存,可降低感光性树脂组合物的保存成本。此外,由该感光性树脂组合物制得的覆盖膜及绝缘层具有较强附着力、耐化性、耐热性及耐挠折性。
另外,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。
Claims (10)
1.一种感光性树脂组合物,其特征在于:该感光性树脂组合物包括羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物、光引发剂及色料,该感光性树脂组合物中的羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体、感光预聚物在紫外光的照射下会发生交联反应而固化形成致密的网状结构。
2.如权利要求1所述的感光性树脂组合物,其特征在于:所述羧酸改性双酚型环氧(甲基)丙烯酸酯、感光单体及感光预聚物中均含有碳碳双键,其中,所述羧酸改性双酚型环氧(甲基)丙烯酸酯中的双键的个数与感光单体中的双键的个数的比值范围为(1:20)~(1:50),所述羧酸改性双酚型环氧(甲基)丙烯酸酯的分子量的范围为15000~35000g/mol,所述羧酸改性双酚型环氧(甲基)丙烯酸酯的酸值的范围为70~130mgKOH/g。
3.如权利要求1所述的感光性树脂组合物,其特征在于:所述感光性树脂组合物的表面能介于30达因至60达因之间。
4.如权利要求1所述的感光性树脂组合物,其特征在于:所述感光性树脂组合物中,羧酸改性双酚型环氧(甲基)丙烯酸酯的含量为100重量份,感光单体的含量为20~80重量份,感光预聚物的含量为10~40重量份,光引发剂的含量为5~15重量份,色料的含量为1~5重量份。
5.如权利要求1所述的感光性树脂组合物,其特征在于:所述感光单体的官能团中包含以下官能团中的一种或几种:-C(CH3)2-、-CF2-、-CH2-CH2-CH2-O-、
6.如权利要求1所述的感光性树脂组合物,其特征在于:所述感光单体选自丙氧化三羟甲基丙烷三丙烯酸酯及二季戊四醇六丙烯酸酯中的一种或两种。
7.如权利要求1所述的感光性树脂组合物,其特征在于:所述感光预聚物为丙烯酸氨基甲酸酯。
8.如权利要求1所述的感光性树脂组合物,其特征在于:所述光引发剂包括但不限于2-羟基-2-甲基-1-苯基-1-丙酮、1-羟基环已基苯基酮、2,4,6(三甲基苯甲酰基)二苯基氧化膦、2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、苯基双(2,4,6-三甲基苯甲酰基)氧化膦、2-芐基-2-二甲基氨基-1-(4-吗啉代苯基)-1-丁酮、安息香双甲醚、二苯甲酮、异丙基硫杂蒽酮及咔唑肟酯中的一种或几种。
9.一种覆盖膜,其包括树脂层及结合于该树脂层至少一表面的离型膜,其特征在于:该树脂层由权利要求1~8任意一项所述的感光性树脂组合物涂覆在离型膜的表面后形成。
10.一种电路板,其包括电路基板、及结合于该电路基板至少一表面的绝缘层,其特征在于:该绝缘层由包括权利要求1~8任意一项所述的感光性树脂组合物经光固化后形成。
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