CN107505789B - 阵列基板及显示面板 - Google Patents

阵列基板及显示面板 Download PDF

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CN107505789B
CN107505789B CN201710847460.1A CN201710847460A CN107505789B CN 107505789 B CN107505789 B CN 107505789B CN 201710847460 A CN201710847460 A CN 201710847460A CN 107505789 B CN107505789 B CN 107505789B
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array substrate
gate lines
electrostatic conducting
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goa
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CN107505789A (zh
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洪光辉
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Wuhan China Star Optoelectronics Technology Co Ltd
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    • GPHYSICS
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    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136204Arrangements to prevent high voltage or static electricity failures
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    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0288Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0292Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using a specific configuration of the conducting means connecting the protective devices, e.g. ESD buses
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0296Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices involving a specific disposition of the protective devices
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/22Antistatic materials or arrangements
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits

Abstract

本发明公开了一种阵列基板及显示面板,所述阵列基板包括:GOA单元;若干栅极信号线,所述若干栅极信号线与所述GOA单元电连接;静电导通装置,所述静电导通装置电连接在所述若干栅极信号线之间,使所述若干栅极信号线相互形成电连接。本发明的阵列基板通过在栅极信号线之间设置静电导通装置,将栅极信号线连接在一起共同抵抗ESD,可以明显提高阵列基板的抗ESD能力,提高产品质量。

Description

阵列基板及显示面板
技术领域
本发明涉及显示技术领域,特别是涉及一种阵列基板及显示面板。
背景技术
在显示面板的生产制程中,由于某些外在因素,例如连续的工艺操作以及搬运或者环境变化等,通常会在面板中产生静电荷的积累。由于玻璃本身是绝缘物质,因此除非有适当的放电通道,否则静电荷会一直停留在基板表面。当静电荷积累到一定数量之后,将会产生放电(ESD,Electrostatic Discharge)。
静电放电发生时的时间很短,大量的电荷在很短的时间内发生转移将产生极高的电流,击穿半导体器件,或者产生足够的热量融化半导体器件,这种危害通常在不易察觉的情况下引起部分元器件的降级或者报废,带来较大的经济损失。因此,静电放电会给电子产品带来致命的危害,它不仅降低了产品的可靠性,还增加了维修成本。每年静电放电会给电子制造工业带来数十亿美元的损失。
GOA(Gate Driver on Array)技术即阵列基板行驱动技术,是利用薄膜晶体管(Thin Film Transistor,TFT)液晶显示器阵列制程将栅极扫描驱动电路制作在薄膜晶体管阵列基板上,以实现逐行扫描的驱动方式,具有降低生产成本和实现面板窄边框设计的优点,为多种显示器所使用。
GOA电路具有两项基本功能:第一是输出栅极扫描驱动信号,驱动面板内的栅极线,打开显示区内的TFT,以对像素进行充电;第二是移位寄存功能,当一个栅极扫描驱动信号输出完成后,通过时钟控制进行下一个栅极扫描驱动信号的输出,并依次传递下去。GOA技术能减少外接IC的焊接(bonding)工序,有机会提升产能并降低产品成本,而且可以使液晶显示面板更适合制作窄边框的显示产品。
现有的阵列基板没有设计防静电单元,而Gate走线层很容易吸引电路,一旦一行Gate发生静电,静电无处释放,就会导致显示区域的Pixel(像素)被击伤或者GOA电路被击伤,这样最终会影响面板的正常功能进而降低产品的良率。
因此,提供一种改进的阵列基板及显示面板实为必要。
发明内容
本发明主要解决的技术问题是提供一种阵列基板及显示面板,通过设置静电导通装置来导通栅极信号线共同抵抗静电,提高阵列基板抗ESD的能力。
为解决上述技术问题,本发明采用的第一个技术方案是:提供一种阵列基板,所述阵列基板包括:GOA单元;若干栅极信号线,所述若干栅极信号线与所述GOA单元电连接;静电导通装置,所述静电导通装置电连接在所述若干栅极信号线之间,使所述若干栅极信号线相互形成电连接,其中,所述静电导通器件是TFT器件,所述TFT器件的源极和漏极分别与相邻两条所述栅极信号线连接,所述TFT器件的栅极悬空。
进一步的,所述GOA单元包括若干GOA子单元,所述若干栅极信号线与所述若干GOA子单元一一形成电连接。
进一步的,所述TFT器件的个数是两个或以上,且所述TFT器件相互串联。
进一步的,所述静电导通装置是二极管环,所述二极管环有两种静电导通路径,可以导通正电荷和负电荷。
进一步的,所述二极管环的个数是两个或以上,所述二极管环并联。
进一步的,所述静电导通装置是Poly电阻。
进一步的,所述Poly电阻的个数是两个或以上,所述Ploy电阻并联。
进一步的,所述阵列基板包括非显示区,所述GOA单元和静电导通装置位于所述非显示区。
为解决上述技术问题,本发明采用的第二个技术方案是:提供一种显示面板,所述显示面板包括上述阵列基板。
本发明的有益效果是:区别于现有技术,本发明在栅极信号线之间设置静电导通装置,将栅极信号线电连接在一起,共同抵抗ESD,从而提高阵列基板的抗ESD能力,从而提高产品质量。
附图说明
图1是本发明阵列基板第一实施方式的结构示意图;
图2是本发明阵列基板第二实施方式的结构示意图;
图3是本发明阵列基板第三实施方式的结构示意图;
图4是本发明阵列基板第四实施方式的局部结构示意图;
图5是本发明阵列基板第五实施方式的局部结构示意图。
具体实施方式
参阅图1,图1是本发明阵列基板第一实施方式的结构示意图。
如图1所示,该阵列基板分为显示区11和非显示区12。该阵列基板包括GOA单元101、若干栅极信号线102以及静电导通装置。进一步的,GOA单元101包括若干GOA子单元1011,栅极信号线102与若干GOA子单元1011一一形成电连接。静电导通装置电连接在若干栅极信号线102之间,使栅极信号线102相互形成电连接。需要说明的是,在本实施方式中,GOA单元分布于该阵列基板的两侧,其他实施方式中,GOA单元也可以只分布于该阵列基板的一侧,本发明对此不作限定。
在本实施方式中,静电导通装置是TFT器件103。TFT器件103和GOA单元101均位于非显示区12。GOA单元101包括若干GOA子单元1011,栅极信号线102有若干条,GOA子单元1011和栅极信号线102一一形成电连接。TFT器件103包括源极1031、漏极1032以及栅极1033。源极1031与一条栅极信号线102连接,漏极1032与另一条相邻的栅极信号线102连接,栅极1033悬空。在正常工作时,源极1031和漏极1032之间的电阻比较大,不会影响面板的正常工作。也就是说,在正常工作时,TFT器件103对相邻栅极信号线102之间的电位不会有影响。但是,一旦一行或几行栅极信号线102发生ESD时,TFT器件103会起到静电导通作用,使得整个面板的所有栅极信号线102一起抵抗ESD,因此可显著提高阵列基板的抗ESD能力。
在其他实施方式中,TFT器件103所连接的两条栅极信号线102也可以不相邻。两条栅极信号线102之间的TFT器件103的个数也可以是两个或以上,这两个或以上的TFT器件103可以并联也可以串联,本发明对此均不作限定。例如,将2个TFT器件103串联后连接在两条栅极信号线102之间。再例如,将2个TFT器件103并联后连接在两条栅极信号线102之间,另一个TFT器件103直接连接在两条栅极信号线102之间。
区别于现有技术,本发明在栅极信号线之间设置静电导通装置,将栅极信号线电连接在一起,共同抵抗ESD,从而提高阵列基板的抗ESD能力,从而提高产品质量。
参阅图2,图2是本发明阵列基板第二实施方式的结构示意图。
如图2所示,该阵列基板分为显示区21和非显示区22。该阵列基板包括GOA单元201、若干栅极信号线202以及静电导通装置。进一步的,GOA单元201包括若干GOA子单元2011,栅极信号线202与若干GOA子单元2011一一形成电连接。静电导通装置电连接在若干栅极信号线202之间,使栅极信号线202相互形成电连接。需要说明的是,在本实施方式中,GOA单元分布于该阵列基板的两侧,其他实施方式中,GOA单元也可以只分布于该阵列基板的一侧,本发明对此不作限定。
在本实施方式中,静电导通装置是二极管环203。二极管环203和GOA单元201均位于非显示区22。GOA单元201包括多个GOA子单元2011,栅极信号线202有多条,GOA子单元2011和栅极信号线202一一形成电连接。二极管环203有两种导通路径,分别可以导通正电荷和负电荷。在正常工作时,二极管环203的电阻比较大,不会影响面板的正常工作。也就是说,在正常工作时,二极管环203对相邻栅极信号线202之间的电位不会有影响。但是,一旦一行或几行栅极信号线202发生ESD时,二极管环203会起到静电导通作用,其正电荷导通路径导通正电荷,负电荷导通路径导通负电荷,使得整个阵列基板上的所有栅极信号线202一起抵抗ESD,因此可显著提高阵列基板的抗ESD能力。
在其他实施方式中,二极管环203的所连接的两条栅极信号线202也可以不相邻。两条栅极信号线202之间的二极管环203的个数也可以是两个或以上,这两个或以上的二极管环203可以并联也可以串联,本发明对此均不作限定。例如,将两个二极管环203串联后连接在两条栅极信号线202之间。再例如,将两个二极管环203并联后连接在两条栅极信号线202之间,另一个二极管环203直接连接在两条栅极信号线202之间。
区别于现有技术,本发明在栅极信号线之间设置静电导通装置,将栅极信号线电连接在一起,共同抵抗ESD,从而提高阵列基板的抗ESD能力,从而提高产品质量。
参阅图3,图3是本发明阵列基板第三实施方式的结构示意图。
如图3所示,该阵列基板分为显示区31和非显示区32。该阵列基板包括GOA单元301、若干栅极信号线302以及静电导通装置。进一步的,GOA单元301包括若干GOA子单元3011,栅极信号线302与若干GOA子单元3011一一形成电连接。静电导通装置电连接在若干栅极信号线302之间,使栅极信号线302相互形成电连接。需要说明的是,在本实施方式中,GOA单元分布于该阵列基板的两侧,其他实施方式中,GOA单元也可以只分布于该阵列基板的一侧,本发明对此不作限定。
在本实施方式中,静电导通装置是Poly电阻303。Poly电阻303和GOA单元301均位于非显示区32。GOA单元301包括多个GOA子单元3011,栅极信号线302有多条,GOA子单元3011和栅极信号线302一一形成电连接。在正常工作时,Poly电阻303的电阻比较大,不会影响面板的正常工作。也就是说,在正常工作时,Poly电阻303对相邻栅极信号线302之间的电位不会有影响。但是,一旦一行或几行栅极信号线302发生ESD时,Poly电阻303会起到静电导通作用,使得整个阵列基板上的所有栅极信号线302一起抵抗ESD,因此可显著提高阵列基板的抗ESD能力。
在其他实施方式中,Poly电阻303所连接的两条栅极信号线302也可以不相邻。两条栅极信号线302之间的Poly电阻303的个数也可以是两个或以上,这两个或以上Poly电阻303可以并联也可以串联,本发明对此均不作限定。
参阅图4,图4是本发明阵列基板第四实施方式的局部结构示意图。
该实施方式的结构示意图与第三实施方式的结构示意图基本类似。但是该实施方式与第三实施方式局部有所不同,其局部示意图如图4所示。
在本实施例中,两条栅极信号线402之间的Poly电阻403包括第一Poly电阻4031、第二Poly电阻4032和第三Poly电阻4033。第一Poly电阻4031和第二Poly电阻4032以及第三Poly电阻4033串联后连接在两条栅极信号线402之间。
在正常工作时,由于第一Poly电阻4031和第二Poly电阻4032以及第三Poly电阻4033串联,所以电阻相对于电路中的导电装置较大,不会影响面板的正常工作。也就是说,在正常工作时,Poly电阻403对相邻栅极信号线402之间的电位不会有影响。但是,一旦一行或几行栅极信号线402发生ESD时,Poly电阻403会起到静电导通作用,使得整个阵列基板上的所有栅极信号线402一起抵抗ESD。
参阅图5,图5是本发明阵列基板第五实施方式的局部结构示意图。
该实施方式的结构示意图与第三实施方式的结构示意图基本类似。但是该实施方式与第三实施方式局部有所不同,其局部示意图如图5所示。
在本实施例中,两条栅极信号线502之间的Poly电阻503包括第一Poly电阻5031、第二Poly电阻5032和第三Poly电阻5033。第一Poly电阻5031和第二Poly电阻5032以及第三Poly电阻5033并联在在两条栅极信号线502之间。
在正常工作时,虽然第一Poly电阻5031和第二Poly电阻5032以及第三Poly电阻5033并联,但是电阻相对于电路中的导电装置仍然较大,不会影响面板的正常工作。也就是说,在正常工作时,Poly电阻503对相邻栅极信号线502之间的电位不会有影响。但是,一旦一行或几行栅极信号线502发生ESD时,Poly电阻503会起到静电导通作用,使得整个阵列基板上的所有栅极信号线502一起抵抗ESD。因此可显著提高阵列基板的抗ESD能力。同时,由于有多个Ploy电阻并联,即使有一个Ploy电阻损坏本发明的静电导通装置仍然可以正常工作,对电路起保护作用。
区别于现有技术,本发明中的阵列基板通过在栅极信号线之间设置Poly电阻,将栅极信号线连接在一起共同抵抗ESD,可以明显提高阵列基板的抗ESD能力。
本发明中所述的阵列基板可以应用到显示面板和显示装置中。
以上所述仅为本发明的实施方式,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。

Claims (9)

1.一种阵列基板,其特征在于,所述阵列基板包括:
GOA单元;
若干栅极信号线,所述若干栅极信号线与所述GOA单元电连接;
静电导通装置,所述静电导通装置电连接在所述若干栅极信号线之间,使所述若干栅极信号线相互形成电连接,其中,所述静电导通器件是TFT器件,所述TFT器件的源极和漏极分别与不相邻的两条所述栅极信号线连接,所述TFT器件的栅极悬空。
2.根据权利要求1所述的阵列基板,其特征在于,所述GOA单元包括若干GOA子单元,所述若干栅极信号线与所述若干GOA子单元一一形成电连接。
3.根据权利要求1所述的阵列基板,其特征在于,所述TFT器件的个数是两个或以上,且所述TFT器件相互串联。
4.根据权利要求1所述的阵列基板,其特征在于,所述静电导通装置是二极管环,所述二极管环有两种静电导通路径,可以导通正电荷和负电荷。
5.根据权利要求4所述的阵列基板,其特征在于,所述二极管环的个数是两个或以上,所述二极管环并联。
6.根据权利要求1所述的阵列基板,其特征在于,所述静电导通装置是Poly电阻。
7.根据权利要求6所述的阵列基板,其特征在于,所述Poly电阻的个数是两个或以上,所述Ploy电阻并联。
8.根据权利要求1所述的阵列基板,其特征在于,所述阵列基板包括非显示区,所述GOA单元和静电导通装置位于所述非显示区。
9.一种显示面板,其特征在于,所述显示面板包括如权利要求1-8任一所述的阵列基板。
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