CN107492590A - A kind of LED component and its process - Google Patents
A kind of LED component and its process Download PDFInfo
- Publication number
- CN107492590A CN107492590A CN201610408902.8A CN201610408902A CN107492590A CN 107492590 A CN107492590 A CN 107492590A CN 201610408902 A CN201610408902 A CN 201610408902A CN 107492590 A CN107492590 A CN 107492590A
- Authority
- CN
- China
- Prior art keywords
- resistance
- led
- chip
- several
- different wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The present invention discloses a kind of LED component and its process, LED chip including several different wave lengths, several miniature resistance chips, the LED chip of each a different wave length miniature resistance chip of connecting forms several branch roads, several described branch roads are separate, and several described branch roads can be driven with the driving voltage of identical numerical value.The present invention is realized by an equal amount of driving voltage to drive the LED of different pressure drops, simplifies drive circuit.
Description
Technical field
The present invention relates to a kind of LED component and its process.
Background technology
The development of LED is from monochromatic burner to white light and then RGB three-basic-colour lamps.Due to different wave length LED chip just
It is widely different to operating voltage, such as the driving forward voltage about 3.2V of blue light, and the driving forward voltage about 2V of feux rouges, thus give
Drive circuit brings additional complexity, it is impossible to the LED component of different pressure drops is driven with same voltage.
The content of the invention
The purpose of the present invention is overcome the shortcomings of in existing product, there is provided a kind of LED component and its process.
In order to achieve the above object, the present invention is achieved by the following technical solutions：
A kind of LED component of the present invention, including the LED chip of several different wave lengths, several miniature resistance chips, it is described every
The LED chip of an one different wave length miniature resistance chip of all connecting forms several branch roads, and several described branch roads are mutual
Independent, several described branch roads can be driven with the driving voltage of identical numerical value.
In the present invention, the maximum drive forward voltage in the LED chip of several different wave lengths is a, described and required drive
The resistance of the miniature resistance of series connection of the maximum LED chip of dynamic forward voltage is 0 ohm, the resistance of remaining miniature resistance for a with
The difference of driving forward voltage and the ratio of driving current for the LED chip accordingly connected.
LED chip as preferred different wave length is three, and the miniature resistance chip is three.
The LED of three different wave lengths of the invention is red light leda, blue lamp ledb, green light ledc, three of the series connection
Miniature resistance is respectively resistance rd, resistance re, resistance rf, and the red light leda connects to form tie point with resistance rd, described
Blue lamp ledb connects to form the second branch road with resistance re, and the green light ledc connects to form the 3rd branch road with resistance rf, and described
One branch road, the second branch road, the 3rd branch road are separate.
The miniature resistance of the present invention is can routing silicon resistor chip.
A kind of process of LED component of the present invention, comprises the following steps：
First by the LED chip of several different wave lengths, several miniature resistance chips are welded by silver paste, white glue is viscous or eutectic
Welding carrys out die bond, and then the LED chip of different wave length is connected with corresponding miniature resistance chip with gold thread, then is packaged.
Packaged type includes 5050 encapsulation, the high-power encapsulation of RGB.
Beneficial effects of the present invention are as follows：The present invention is realized by an equal amount of driving voltage to drive different pressure drops
LED, simplify drive circuit.
Brief description of the drawings
Fig. 1 is the circuit theory schematic diagram of embodiments of the invention 2；
Fig. 2 is a kind of structural representation of 5050 encapsulation of embodiments of the invention 2；
Fig. 3 is a kind of structural representation of the high-power encapsulation of RGB of embodiments of the invention 2.
Embodiment
Technical scheme is described further with reference to Figure of description：
Embodiment 1：A kind of LED component of the present invention, including the LED chip of several different wave lengths, several miniature resistor cores
Piece, the LED chip of each a different wave length miniature resistance chip of connecting form several branch roads, it is described several
Branch road is separate, and several described branch roads can use identical driving voltage to drive.Miniature resistance is can routing silicon resistor chip.
The forward voltage of maximum drive in the LED chip of several different wave lengths is a, described and required driving voltage
The resistance of the miniature resistance being in series of maximum LED chip is 0 ohm, and the resistance of remaining miniature resistance is a and corresponding string
The difference of driving forward voltage and the ratio of driving current of the LED chip of connection.Such as the driving needed for certain branch road b LED chip
Forward voltage is Vb, the resistance Rb of required series connection=（a-Vb）/I.
A kind of process of LED component, comprises the following steps：
First by the LED chip of several different wave lengths, several miniature resistance chips by silver paste weld or white glue bonding or
Eutectic welding carrys out die bond, then with gold thread by the LED chip of different wave length and corresponding miniature resistance chip（Bondable
Silicon Resistor Chip）It is connected, then is packaged.Packaged type includes 5050 encapsulation, the high-power encapsulation of RGB.
The LED chip of each a different wave length miniature resistance chip of connecting is formed several branch roads by the present invention,
Make up the forward voltage drop for balancing each wavelength LED, it is possible to the LED component of different-waveband is driven using identical voltage.
The present invention realizes the LED component that different pressure drops are driven by same driving voltage, simplifies drive circuit.
Embodiment 2：
As shown in figure 1, a kind of LED component of the present invention, including the LED chip of three different wave lengths, three miniature resistance chips,
The LED of three different wave lengths is red light leda, blue lamp ledb, green light ledc, and three miniature resistance of the series connection are respectively
Resistance rd, resistance re, resistance rf, the red light leda connect to form tie point with resistance rd, the blue lamp ledb and resistance
Re connects to form the second branch road, and the green light ledc connects to form the 3rd branch road with resistance rf, the tie point, second
Road, the 3rd branch road are separate.
Miniature resistance is silicon resistor chip.
Blue lamp ledb driving forward voltage is maximum, and blue lamp ledb driving forward voltage is about 3.2V, feux rouges led1
Driving forward voltage about 2V, green light ledc driving forward voltage be 2.8V, if driving current is 350mA, then resistance re
Resistance be 0 ohm, resistance rd resistance is 3.2V and 2V difference 1.2V and 350mA ratio, then resistance rd is 3.4 Europe
Nurse, resistance rf resistance are 3.2V and 2.8V difference 0.4V and 350mA ratio, then resistance rf is 1.1 ohm, thus
Make up the positive decompression for balancing each wavelength LED, it is possible to the LED component of different-waveband is driven using identical voltage.
A kind of process of LED component, comprises the following steps：
First by the LED chip of several different wave lengths, several miniature resistance chips are welded by silver paste, gluing or eutectic welds
Die bond is fetched, then the LED chip of different wave length is connected with corresponding miniature resistance chip with gold thread, then is packaged.Envelope
Dress can be packaged by silica gel technique.Packaged type includes 5050 encapsulation, the high-power encapsulation of RGB.
As shown in Fig. 2 the LED of three different wave lengths is red light leda1, blue lamp ledb3, green light ledc4,
Three miniature resistance of series connection are respectively resistance rd2, resistance re, resistance rf5, and the red light leda1 connects with resistance rd2
Tie point is formed, blue lamp ledb driving voltage is maximum, and resistance re is 0 ohm, therefore blue lamp ledb forms the second branch road,
The green light ledc4 connects to form the 3rd branch road with resistance rf5, and the tie point, the second branch road, the 3rd branch road are mutually only
It is vertical.Red light leda1, blue lamp ledb3, green light ledc4, resistance rd2, resistance rf5 are welded according to the position shown in Fig. 2 by silver paste
Connect or eutectic welding carrys out die bond, then with gold thread by red light leda1, blue lamp ledb3, green light ledc4 and corresponding resistance
Rd2, resistance rf5 are connected.
As shown in figure 3, the LED of three different wave lengths is red light leda1, blue lamp ledb3, green light ledc4,
Three miniature resistance of series connection are respectively resistance rd2, resistance re6, resistance rf5, the red light leda1 and resistance rd2 string
Connection forms tie point, and blue lamp ledb3 driving forward voltage is maximum, and resistance re6 is 0 ohm, therefore blue lamp ledb is formed
Second branch road, the green light ledc4 connect to form the 3rd branch road with resistance rf5, the tie point, the second branch road, the 3rd
Road is separate.Red light leda1, blue lamp ledb3, green light ledc4, resistance rd2, resistance rf5 are led to according to the position shown in Fig. 3
Cross silver paste welding or eutectic welding carrys out die bond, then with gold thread by red light leda1, blue lamp ledb3, green light ledc4 and correspondingly
Resistance rd2, resistance rf5 be connected.
The present invention realizes the LED that different pressure drops are driven by an equal amount of driving voltage, simplifies drive circuit.
It should be noted that listed above is only a kind of specific embodiment of the invention.It is clear that the invention is not restricted to
Upper embodiment, there can also be many deformations.In a word, one of ordinary skill in the art can directly lead from present disclosure
All deformations for going out or associating, are considered as protection scope of the present invention.
Claims (7)
- A kind of 1. LED component, it is characterised in that the LED chip including several different wave lengths, several miniature resistance chips, The LED chip of each a different wave length miniature resistance chip of connecting forms several branch roads, several described branch Road is separate, and several described branch roads can use the driving voltage of identical value to drive.
- 2. LED component according to claim 1, it is characterised in that the maximum in the LED chip of several different wave lengths Driving forward voltage is a, and the resistance of the miniature resistance of connecting of the LED chip maximum with required driving forward voltage is 0 Europe Nurse, the resistance of remaining miniature resistance is a and the difference and driving current that drive forward voltage of the LED chip accordingly connected Ratio.
- 3. a kind of LED component according to claim 1, it is characterised in that the LED chip of the different wave length is three, institute Miniature resistance chip is stated as three.
- 4. a kind of LED component according to claim 3, it is characterised in that the LED of three different wave lengths is red light Leda, blue lamp ledb, green light ledc, three miniature resistance of the series connection are respectively resistance rd, resistance re, resistance rf, described Red light leda connects to form tie point with resistance rd, and the blue lamp ledb connects to form the second branch road with resistance re, described green Lamp ledc connects to form the 3rd branch road with resistance rf, and the tie point, the second branch road, the 3rd branch road are separate.
- 5. a kind of LED component according to claim 1, it is characterised in that the miniature resistance is can routing silicon resistor chip.
- 6. a kind of process of LED component, it is characterised in that comprise the following steps：First the LED chip of several different wave lengths, several miniature resistance chips are welded gluing or eutectic by silver paste and welded Die bond is fetched, then the LED chip of different wave length is connected with corresponding miniature resistance chip with gold thread, then is packaged.
- 7. a kind of process of LED component according to claim 6, the packaged type includes 5050 encapsulation, the big work(of RGB Rate encapsulates and other similar multi-chip packages.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610408902.8A CN107492590A (en) | 2016-06-12 | 2016-06-12 | A kind of LED component and its process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610408902.8A CN107492590A (en) | 2016-06-12 | 2016-06-12 | A kind of LED component and its process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107492590A true CN107492590A (en) | 2017-12-19 |
Family
ID=60641862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610408902.8A Pending CN107492590A (en) | 2016-06-12 | 2016-06-12 | A kind of LED component and its process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107492590A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864299A (en) * | 2020-11-10 | 2021-05-28 | 深圳市奥拓电子股份有限公司 | Public utmost point pin detached full-color LED lamp pearl and LED display screen |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101232761A (en) * | 2007-01-18 | 2008-07-30 | 精工电子有限公司 | Led drive circuit |
| CN201425281Y (en) * | 2009-03-05 | 2010-03-17 | 福建鸿博光电科技有限公司 | R\G\B LED adjustable color temperature lamp |
| CN101702296A (en) * | 2009-11-03 | 2010-05-05 | 康佳集团股份有限公司 | LED display |
| CN102740556A (en) * | 2011-04-14 | 2012-10-17 | 日亚化学工业株式会社 | Light emitting diode driving device capable of inhibiting high higher harmonic component |
| CN104470147A (en) * | 2014-12-22 | 2015-03-25 | 福建鸿博光电科技有限公司 | LED circuit |
-
2016
- 2016-06-12 CN CN201610408902.8A patent/CN107492590A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101232761A (en) * | 2007-01-18 | 2008-07-30 | 精工电子有限公司 | Led drive circuit |
| CN201425281Y (en) * | 2009-03-05 | 2010-03-17 | 福建鸿博光电科技有限公司 | R\G\B LED adjustable color temperature lamp |
| CN101702296A (en) * | 2009-11-03 | 2010-05-05 | 康佳集团股份有限公司 | LED display |
| CN102740556A (en) * | 2011-04-14 | 2012-10-17 | 日亚化学工业株式会社 | Light emitting diode driving device capable of inhibiting high higher harmonic component |
| CN104470147A (en) * | 2014-12-22 | 2015-03-25 | 福建鸿博光电科技有限公司 | LED circuit |
Non-Patent Citations (1)
| Title |
|---|
| 潘永雄: "《STM8S系列单片机原理与应用》", 28 February 2015 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864299A (en) * | 2020-11-10 | 2021-05-28 | 深圳市奥拓电子股份有限公司 | Public utmost point pin detached full-color LED lamp pearl and LED display screen |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104282676A (en) | Integrated LED lamp panel packaging structure and technology | |
| CN101442087B (en) | Low power low light loss white light LED | |
| CN104037302B (en) | LED (light-emitting diode) package assembly | |
| CN107492590A (en) | A kind of LED component and its process | |
| CN105140374A (en) | Routing-free LED packaging structure and preparation method therefor | |
| CN107785345A (en) | Lead frame, array of lead frames and packaging body | |
| CN107305922A (en) | A kind of stereo luminous light source of charged integrated 360-degree and preparation method thereof | |
| CN206490057U (en) | One kind is with drive, panchromatic temperature, with brightness upside-down mounting COB light source | |
| CN206179898U (en) | Chip level white light LED packaging structure | |
| CN204596777U (en) | Based on LED light source and the LED silk of face-down bonding | |
| CN204088362U (en) | A kind of chip upside-down mounting type LED silk | |
| CN209691752U (en) | A kind of double-colored temperature COB light source | |
| CN101994913A (en) | Improvement on 3528RGB three-in-one LED packaging structure for LED electronic display | |
| CN208189630U (en) | A kind of LED light integrated encapsulation structure | |
| CN208939007U (en) | A kind of COB light source structure | |
| CN208806270U (en) | A kind of LED encapsulation structure | |
| CN209216966U (en) | A kind of novel patch formula all-colour LED high power light source encapsulating structure | |
| CN105609620B (en) | A kind of preparation method of LED light engine encapsulating structure | |
| CN110224055A (en) | A kind of encapsulating structure and packaging technology of paster type light emitting type | |
| CN217562564U (en) | Packaging structure of three-color LED chip | |
| CN108461604A (en) | A kind of LED light integrated encapsulation method and encapsulating structure | |
| CN204315626U (en) | A kind of LED having the LED support of reinforcement to encapsulate | |
| WO2019033725A1 (en) | White led consisting of three primary colors rgb and application thereof | |
| CN103337578A (en) | Method and structure of upright-installed dual-electrode chip inverted pasting application | |
| CN208570598U (en) | A kind of chip type light emitting diode of built-in IC |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171219 |
|
| RJ01 | Rejection of invention patent application after publication |