CN107432081A - The manufacture method of flexible printed board and flexible printed board - Google Patents
The manufacture method of flexible printed board and flexible printed board Download PDFInfo
- Publication number
- CN107432081A CN107432081A CN201680003407.7A CN201680003407A CN107432081A CN 107432081 A CN107432081 A CN 107432081A CN 201680003407 A CN201680003407 A CN 201680003407A CN 107432081 A CN107432081 A CN 107432081A
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- Prior art keywords
- insulating barrier
- flexible printed
- printed board
- asperities
- wiring layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides the flexible printed board of stickup and the manufacture method of flexible printed board that can be prevented to the hot plate with even surface.Flexible printed board 10A possesses：Using the 1st insulating barrier 21 formed as the liquid crystal polymer of thermoplastic resin as material；Formed on the surface of the 1st insulating barrier 21, and possess the wiring layer 22 of multiple distributions 221；Configured with 21 opposite side of the 1st insulating barrier in a manner of covering wiring layer 22, and the 2nd insulating barrier 32 formed by thermoplastic resin；It is between wiring layer 22 and the 2nd insulating barrier 32 that both are be bonded, and be filled between distribution 221 and cover the 1st adhesive linkage 31 of the wiring layer 22；And the face with 22 opposite side of wiring layer in the 1st insulating barrier 21 is arranged on, and the 1st asperities portion 211 with asperities degree of 10 mean roughness Rz in the range of 1 μm~5 μm.
Description
Technical field
The present invention relates to the manufacture method of flexible printed board and flexible printed board.
Background technology
In recent years, carry out varied movable robot to come on stage, machine man-based development becomes notable.Furthermore it is possible to
It is worn on human body, the wearable electronic of clothes is also developed with various equipment, be practical.It is these robots, wearable
In electronic equipment, majority is used using power supply, the electric wire of electric signal transmission, but in general electric wire for using copper cash as
Core, the structure that its periphery is coated to insulator, therefore electric wire does not almost have retractility in itself.Thus, for example in robot etc.,
Had more than needed to be waited without prejudice to the activity in its joint, it is necessary to have wire length, this turns into the design for small-sized, lightweight etc.
Upper, obstacle in practical use.
Particularly, in state-of-the-art humanoid humanoid robot, be worn on human body and the strength of auxiliary muscle strength aids in dress
In the purposes put etc., most distributions have for manipulating the electric wire of the motor of end via multi-freedom joint, for transmitting
The electric wire of electric signal from the various sensors for being configured at end.Moreover, in order to improve these in multi-freedom joint
The free degree of distribution, the requirement of the electric wire to can telescopically form improve.
On the other hand, in recent years, arm robot is largely used as industrial robot.This arm robot
In, according to installed in the end effector of the front of robot arm (equivalent to the hand mentioned in human body), robot arm
Joint portion type of drive, from the root of robot arm it is lateral front, in addition to cable, it is sometimes desirable to distribution air pressure
Steam hose, the hydraulic hose of application.By such cable, hose distribution in the case of joint portion, it is possible to send out
The bending of raw cable, broken string.Therefore, cardinal extremity is being leaned on compared with the joint portion of robot arm class using by cable, hose
Position temporarily reaches outside, configures cable in the outer space of joint portion, in the position at the forward end compared with joint portion again
It imported into such wiring method in arm.However, in the outer space of robot arm configures the method for cable, in machine
The space for making cable slack is needed around the joint portion of human arm.
In addition, for example in patent document 1, the joint pivot position in the joint portion of robot arm is disclosed
Supporting rod is set, cable is wound on the supporting rod, the supporting rod that the advance volume has cable is accommodated in robot arm
Portion, so as to the structure for preventing the bending of cable, breaking.Increase however, it is possible to produce the weight as caused by separately setting supporting rod
Caused function is added to reduce (responsiveness, precision etc.).In order to make up function reduction, also have and use motor with a high standard
Deng or the necessary component of increase situation, but in this case, manufacturing cost can increase.The structure of the incorporating section of further cable
Become complicated, therefore have the distribution of cable during robot arm assembling, decompose because of maintenance etc. and take out cable and handed over
Become the problem of extremely complex such when changing.Therefore, in robot arm, to can stretching for the problem of such can be avoided
The requirement of electrical communications component also improve.
As flexible printed board corresponding with the requirement to such electrical communications component, there is such as patent document 2, specially
Flexible printed board as disclosed in sharp document 3.In patent document 2 and patent document 3, processing and forming is disclosed into dextrad
The flexible printed board and forming method that can stretch of pleat shape be alternately arranged with the shape of left-hand bending, so-called.
Flexible printed board disclosed in above-mentioned patent document 2,3, LCP (liquid crystal polymer, Liquid are used as base material film
Crystal Polymer) etc. thermoplastic resin.Then, low tens of DEG C~100 DEG C or so compared with the softening temperature with the resin
Temperature, heat 30 minutes~60 minutes, so as to being molded in a manner of as shape roughly the same with shaping mould.
In addition, illustrated for the disclosure of patent document 2 and patent document 3, in patent document 2, by
Front end sets the multiple moulds for the tabular for foring desired R, applies certain tension force to flexible printed board, while make mould
Tool is mobile and is pressed to flexible printed board, so as to be formed at the state of flexible base board as multiple bent portions.In the state
Under, by being heated to flexible printed board, the flexible printed board with multiple bent portions can be molded.
In addition, in patent document 3, in the multiple guide fingers of fixture possessed formed with desired R, these guide fingers
The interval that can be passed through with flexible printed board configures.Then, flexible printed board is made by between guide finger, further to soft
Property printed base plate apply certain tension force, flexible printed board is heated, so as to be molded with multiple bent portions
Flexible printed board.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 8-57792 publications
Patent document 2：Japanese Unexamined Patent Publication 2011-134884 publications
Patent document 3：Japanese Unexamined Patent Publication 2011-233822 publications
The content of the invention
Invent problem to be solved
But in the composition disclosed in patent document 2, patent document 3, the flexibility of the pleat shape using LCP as material
Printed base plate is three-dimensionally formed.Therefore, the installation difficulty after shaping, therefore the front end of flexible printed board turns into plug-type end
The situation of sub-portion is more.In order that front end forms such plug-type portion of terminal, according to the opening portion for the connector for receiving side
Size, generally require the thickness for 200~300 μm.Therefore, it is necessary to which enhancing film to be pasted on to LCP base material film.In addition, increase
Strong film turns into has been bonded polyimide film, PET (polyethylene terephthalate, Polyethylene in bonding material
Terephthalate) the material of film.
In addition, in order to carry out electric noise reply in the state of expansion performance is kept, also have to being used as material using LCP
Base material (insulating barrier), using LCP as the coating of material, the situation for being bonded the screened film of flexible printed board.Here, with
LCP has glossiness as the base material of material, the surface of coating, in the case where such surface mount strengthens film, screened film,
There is the problem of adaptation difference is such.It is therefore also considered that using the base material to the LCP with glossiness, the surface of coating also with
The material of cementability is as bonding material, but such material is because being the special material of high frequency therefore becoming costliness.In addition, one
As on various materials, have that to replace material be preferable, the isotropic conductivity bonding of screened film in all fields
Material also either with or without replace material it is such the problem of.
In addition, to the base material using LCP as material and the base material one side be provided with layers of foil one side base material lamination
It is very smooth as the surface of the base material of one side base material in the case of the coating of material, is formed equally using LCP, therefore to lower hot plate
Stickup easily occur.Therefore, it is necessary to peel off labour and the time of the base material of stickup etc., efficiently production becomes difficult.With this
Contrast, for the one side base material using polyimide film as base material, filled out on its surface by the silica for being referred to as lubricating material
Material etc. forms small bumps, therefore such stickup is difficult to occur.Therefore, the stickup as described above to lower hot plate turn into
LCP is as phenomenon specific to the base material of material.
In order to prevent such stickup to lower hot plate, it is also considered that in the other sheet materials of the surface configuration of lower hot plate.So
And the process for being laminated to apply temperature and pressure, therefore with the surface shape of the surface transfer sheet material in flexible printed board
The worry of shape.Therefore, it is necessary to which the surface of sheet material also has sufficient flatness, correspondingly, cost can increase.If in addition,
Sheet material as described above is present, then correspondingly, thermal conductance can reduce.Therefore, also have lamination in activity time can it is elongated this
The problem of sample.
As described above, it is desirable to the base material solved using LCP as material is good to the cementability of enhancing film, screened film, but
It can be prevented to opposite problem as the hot plate stickup with even surface.
The present invention is to propose in view of the foregoing, and its object is to provide to reach to prevent from making with liquid crystal polymer
Stickup of the base material to the hot plate with even surface for material and also make with liquid crystal polymer even if without using special bonding agent
Base material as material good is become to the cementability of enhancing film and at least one of screened film in, the flexibility of at least one
The manufacture method of printed base plate and flexible printed board.
For solving the method for problem
In order to solve above-mentioned problem, according to the 1st viewpoint of the present invention, there is provided a kind of flexible printed board, it is characterised in that
It is the flexible printed board for possessing flexibility, it possesses：To be formed as the liquid crystal polymer of thermoplastic resin as material
1st insulating barrier；Formed on the surface of the 1st insulating barrier, and possess the wiring layer of multiple distributions；In side opposite with the 1st insulating barrier
Configured in a manner of covering wiring layer, and the 2nd insulating barrier formed by thermoplastic resin；Between wiring layer and the 2nd insulating barrier
Between and both are bonded, and be filled between distribution and cover the 1st adhesive linkage of the wiring layer；And it is arranged on the 1st insulation
The face of side opposite with wiring layer in layer, and the with asperities degree of 10 mean roughness Rz in the range of 1 μm~5 μm
1 asperities portion.
In addition, the other side of the present invention is, in the present invention as stated above, terminal preferably is set in the end side of the 1st insulating barrier
Portion, portion of terminal possess：Side opposite with wiring layer by the thickness of the 1st insulating barrier and wiring layer augmented and using resin as
The enhancement layer of material；And it is closely sealed with the 1st asperities portion and by enhancement layer 2nd adhesive linkage Nian Jie to the 1st asperities portion.
Further, other side of the invention is, in the present invention as stated above, preferably the 2nd insulating barrier using liquid crystal polymer as
Material and formed, the face of the side opposite with wiring layer in the 2nd insulating barrier be provided with 10 mean roughness Rz 1 μm~
2nd asperities portion of the asperities degree in the range of 5 μm, and be bonded with the 2nd asperities portion and possess the gold with electromagnetic wave shielding performance
Belong to the screen layer of film layer.
In addition, the other side of the present invention is, in the present invention as stated above, base main body portion preferably continuous with portion of terminal is set
There is the bending section bent at least 1.
A kind of in addition, the 2nd viewpoint according to the present invention, there is provided flexible printed board, it is characterised in that possess flexibility
Flexible printed board, it possesses：Using the 1st insulating barrier formed as the liquid crystal polymer of thermoplastic resin as material；
The surface of 1st insulating barrier is formed, and possesses the wiring layer of multiple distributions；In side opposite with the 1st insulating barrier to cover wiring layer
Mode configure, and the 2nd insulating barrier formed using liquid crystal polymer as material；Between wiring layer and the 2nd insulating barrier it
Between and both are bonded, and be filled between distribution and cover the 1st adhesive linkage of the wiring layer；It is arranged in the 2nd insulating barrier
The face of side opposite with wiring layer, and the 2nd asperities with asperities degree of 10 mean roughness Rz in the range of 1 μm~5 μm
Portion；And it is Nian Jie with the 2nd insulating barrier via the 2nd asperities portion, and possess the metal film layer with electromagnetic wave shielding performance
Screen layer.
A kind of in addition, the 3rd viewpoint according to the present invention, there is provided manufacture method of flexible printed board, it is characterised in that be
Possesses the manufacture method of the flexible printed board of flexibility, it includes following processes：1st process, to to be used as thermoplastic resin
One side base material of the face side formed with metal foil layer of the 1st insulating barrier that is formed as material of liquid crystal polymer in, with
The rear side of 1st insulating barrier of the opposite side of metal foil layer, implement roughened processing, being formed has 10 mean roughness Rz in 1 μ
1st asperities portion of the asperities degree in the range of m~5 μm；2nd process, before and after the 1st process, by carrying out figure to metal foil layer
Case is formed, to form the wiring layer for possessing multiple distributions and having desired pattern form；And the 3rd process, make to possess
The 2nd insulating barrier that is formed by thermoplastic resin and it is stacked on the coating of the 1st adhesive linkage of the 2nd insulating barrier and is located on wiring layer,
The coating is heated and pressurizeed, so that the 1st adhesive linkage is filled between distribution while glues wiring layer and the 1st adhesive linkage
Connect.
Further, other side of the invention is in the present invention as stated above, to preferably include following 4th processes：Make to possess to set
Enhancement layer that fat is augmented as material and to the thickness of wiring layer and be stacked on the enhancement layer the 2nd adhesive linkage increasing
End side in strong film, with the 1st asperities portion of the 1st insulating barrier is closely sealed and enhancing film is heated and pressurizeed, so as to which the 2nd be glued
It is Nian Jie with the 1st asperities portion to connect layer.
In addition, the other side of the present invention is that in the present invention as stated above, preferably the 2nd insulating barrier is used as material using liquid crystal polymer
Matter and formed, in the 1st process, to the face side of the side opposite with wiring layer in the 2nd insulating barrier, implement roughened processing, formed
2nd asperities portion of the asperities degree with 10 mean roughness Rz in the range of 1 μm~5 μm, and including following 5th works
Sequence：The screened film and the 2nd asperities portion for making to possess the metal film layer with electromagnetic wave shielding performance are closely sealed, and the screened film is added
Heat and pressurization, are adhered to the 2nd asperities portion so as to form screen layer by the screened film.
In addition, the other side of the present invention is in the present invention as stated above, to preferably include following 6th processes：To at least through
3 processes and the flexible printed board before the hot briquetting that is formed, are heated into the state of at least one position is bent
Type, after the hot briquetting, form bending section.
A kind of in addition, the 4th viewpoint according to the present invention, there is provided manufacture method of flexible printed board, it is characterised in that be
Possesses the manufacture method of the flexible printed board of flexibility, it possesses following processes：1st process, to possessing to be used as thermoplastic resin
In the 2nd insulating barrier and the coating for the 1st adhesive linkage for being stacked on the 2nd insulating barrier that the liquid crystal polymer of fat is formed as material
, the face side of the 2nd insulating barrier of opposite with the 1st adhesive linkage side, implement roughened processing, formation has 10 mean roughness
Rz be 1 μm~5 μm in the range of asperities degree the 2nd asperities portion；2nd process, before and after the 1st process, to to be used as thermoplastic
In one side base material of the face side formed with metal foil layer for the 1st insulating barrier that the liquid crystal polymer of property resin is formed as material
, metal foil layer carry out pattern formed, so as to formed possess multiple distributions and with desired pattern form wiring layer；
3rd process, makes coating be located on wiring layer, and the coating is heated and pressurizeed so that the 1st adhesive linkage be filled into distribution it
Between simultaneously wiring layer is Nian Jie with the 1st adhesive linkage；And the 5th process, make possess the metal film layer with electromagnetic wave shielding performance
Screened film and the 2nd asperities portion it is closely sealed, the screened film is heated and pressurizeed, by the screened film be adhered to the 2nd asperities portion from
And form screen layer.
The effect of invention
In accordance with the invention it is possible to reaching prevents base material using liquid crystal polymer as material to the hot plate with even surface
Paste, also make even if without using special bonding agent base material using liquid crystal polymer as material to strengthening in film and screened film
The cementability of at least one become good in, at least one.
Brief description of the drawings
Fig. 1 is related to an embodiment of the invention, is one of the composition for showing the flexible printed board after being molded
Stereogram.
Fig. 2 is related to an embodiment of the invention, be show shaping after or shaping before flexible printed board composition
The local side cross-sectional view of one.
Fig. 3 is the front of one of the composition for showing the flexible printed board after being molded or the flexible printed board before shaping
Sectional view, it is the figure for showing the state along Fig. 1 line A-A cut-out.
Fig. 4 is the front of one of the composition for showing the flexible printed board after being molded or the flexible printed board before shaping
Sectional view, show the figure of the state along Fig. 1 line B-B cut-out.
Fig. 5 is related to the 1st process, is the figure for the image for showing Embossing processing.
Fig. 6 is related to the 2nd process, is the side cross-sectional view for showing the state for foring the one side base material with wiring layer.
Fig. 7 is related to the 3rd process, is the figure for showing the image that coating is laminated to one side base material, before (a) shows lamination
The composition of one side base material and coating, (b) are the figures for showing the state being laminated using laminater.
Fig. 8 is related to the 4th process and the 5th process, is to show the image for making enhancing film and screened film be bonded intermediate product
Stereogram.
Fig. 9 is related to the 4th process and the 5th process, is to show the image for making enhancing film and screened film be bonded intermediate product
Front cross-sectional view.
Figure 10 is related to the 4th process and the 5th process, is to show to make enhancing film and screened film to the figure after intermediate product fitting
The front cross-sectional view of picture.
Figure 11 is related to the 6th process, is shown in the figure that fixture places the state of the flexible printed board before shaping.
Embodiment
Hereinafter, flexible printed board 10A, the 10B being related to an embodiment of the invention are illustrated.Following
In explanation, illustrated sometimes using XYZ rectangular coordinate systems.X-direction therein is set to flexible printed board 10A, 10B length side
To X1 sides are set to Fig. 1 right side, and X2 sides are set to left side.In addition, Y-direction is set to flexible printed board 10A, 10B width side
Paper in Fig. 1 front side in the vicinity is set to, Y1 sides, Y2 sides are set to paper Right Inboard.In addition, Z-direction is set to flexible printed board
10A, 10B thickness direction, Z1 are set on the inside of the paper in Fig. 2, and Z2 is set to paper nearby side.
Composition ＞s of the ＜ on flexible printed board
Fig. 1 is the stereogram of one of the composition for showing the flexible printed board 10A after being molded.Fig. 2 is after display is molded
Or the side cross-sectional view of one of the composition of flexible printed board 10A, 10B before shaping, omit in way and show.Fig. 3 is display
The front cross-sectional view of one of the composition of the flexible printed board 10B before flexible printed board 10A or shaping after shaping, is aobvious
Show the figure of the state along Fig. 1 line A-A cut-out.In addition, Fig. 4 is before showing the flexible printed board 10A after being molded or shaping
Flexible printed board 10B composition the front cross-sectional view of one, be show along Fig. 1 line B-B cut-out state figure.
As shown in figure 1, flexible printed board 10A after shaping is provided with base main body portion 11 and portion of terminal 12.In base
Plate main part 11 is provided with multiple bending sections 13, and the bending section 13 is set in a manner of the direction of curve depicted alternately switches
Put.Therefore, formed the flexible printed board 10A pleateds (corrugated) after shaping.In addition, also set in flexible printed board 10A
It is equipped with portion of terminal 12.Portion of terminal 12 is that current-carrying part is exposed to surface, and be inserted into the opening portion of the connector of outside
Part.Hereinafter, illustrated for the details of flexible printed board 10A composition.
As shown in Figure 2 to 4, flexible printed board 10A possesses insulating barrier 21, wiring layer 22, adhesive linkage 31, coating
32nd, adhesive linkage 41, enhancement layer 42 and screen layer 51.Base main body portion 11 in them possesses insulating barrier 21, wiring layer 22, bonding
Layer 31 and coating 32.In addition, portion of terminal 12 possesses insulating barrier 21, wiring layer 22 and screen layer 51.
Insulating barrier 21 and wiring layer 22 in above-mentioned each composition are the parts for forming one side base material 20 described later, are to be present in
The part in both base main body portion 11 and portion of terminal 12.Insulating barrier 21 is that such as thickness is 50 μm membranaceous with polymerizable mesogenic
Thing (LCP；Liquid Crystal Polymer) part as material.In addition, insulating barrier 21 is corresponding with the 1st insulating barrier.Should
In LCP, there is type that the condensation polymer by ethylene glycol terephthalate and P-hydroxybenzoic acid forms, by phenol and O-phthalic
Acid is with the type of the condensation polymer composition of P-hydroxybenzoic acid and by 2,6 hydroxy naphthoic acid and the condensation polymer structure of P-hydroxybenzoic acid
Into type, can be any types.
In addition, wiring layer 22 is arranged on the face side (surface side of Z1 sides) of insulating barrier 21, the wiring layer 22 will for example 12 μm
The copper foil layer pattern of thickness is formed as desired pattern form as defined in such, with multiple copper wirings 221 (with distribution
Mode correspondingly) is formed.
Here, the rear side (surface side of Z2 sides) of insulating barrier 21 is provided with asperities portion 211 (corresponding with the 1st asperities portion).
Asperities portion 211 is by implementing defined processing or processing to the rear side of insulating barrier 21, so as to the face side with insulating barrier 21
Compared to roughened part.Such asperities portion 211 is to realize to prevent from gluing lower hot plate 160 (reference picture 7 (b)) described later
The part of patch, it is the part when above-mentioned enhancing film 40 is pasted for improving its adaptation in addition.
Asperities degree as such asperities portion 211, it is desirable to reach the stickup and raising enhancing prevented to lower hot plate 160
At least one of adaptation of film 40, as long as one of they can be reached, it is possible to it is any asperities degree.In addition,
In the case where reaching both adaptations for preventing stickup and raising enhancing film 40 to lower hot plate 160, on asperities portion
211 asperities degree, 10 mean roughness Rz are suitable in the range of 1 μm~5 μm.Wherein, if 10 average roughness
Rz is spent in the range of 1.8 μm~3.2 μm, then confirms peel strength and further improve (aftermentioned).
In addition, adhesive linkage 31 and coating 32 are the parts formed by aftermentioned coating 30, although not deposited in portion of terminal 12
, but in part existing for base main body portion 11.Adhesive linkage 31 in them is set in a manner of covering wiring layer 22, via
The adhesive linkage 31 and be bonded coating 32.In addition, adhesive linkage 31 is corresponding with the 1st adhesive linkage.The adhesive linkage 31 can enumerate such as ring
The bonding material of oxygen system, as long as cementability is good, it is possible to use the bonding material being made up of other materials.In addition, adhesive linkage 31
Thickness is arranged to such as 15 μm, but can be any thickness.
In addition, on adhesive linkage 31, in order to do not turn into aftershaping when obstruction, preferably low elasticity adhesive linkage.Tool
For body, the coefficient of elasticity of liquid crystal polymer (LCP) film is 3~4GPa, thus by by the coefficient of elasticity less than half (
The maximum of coefficient of elasticity is below 2GPa in the case of being 4GPa) the bonding material of coefficient of elasticity be applied to adhesive linkage 31, energy
It is enough to be bonded in the state of not had an impact to mouldability.In addition, as described later, the flexible printed board before by shaping
In the case that 10B is molded, it is 200 DEG C or so in temperature and heats 30 minutes or so.Therefore, under thermal history as described above, glue
The adhesive linkage that connecing property, electrical insulation characteristics do not deteriorate significantly is suitable.
In addition, coating 32 is corresponding with the 2nd insulating barrier.The coating 32 is that for example thickness is in the same manner as insulating barrier 21
50 μm membranaceous is used as the part of material using LCP (Liquid Crystal Polymer).In addition, coating 32 can by with
The LCP of the same type of insulating barrier 21 is formed, and can also be made up of different types of LCP.
Here, in the face side (surface side of Z1 sides) of coating 32, it is also equipped with the asperities portion same with asperities portion 211
321.Asperities portion 321 is to implement defined processing or processing in the same manner as insulating barrier 21 by the face side to coating 32, from
And roughened part.Such asperities portion 321 is for improving the part with the adaptation of screen layer 51.As such
The asperities degree in asperities portion 321, it is same with the asperities degree in above-mentioned asperities portion 211.That is, the close of screen layer 51 is improved as long as can reach
Conjunction property, it is possible to be any asperities degree.In addition, the asperities degree on asperities portion 321,10 mean roughness Rz are at 1 μm~5 μm
In the range of be suitable.Wherein, if 10 mean roughness Rz confirm stripping in the range of 1.8 μm~3.2 μm
Intensity further improves (aftermentioned).
In addition, adhesive linkage 41 is by the part described later for strengthening film 40 and being formed with enhancement layer 42, it is in flexible printed board
Part existing for 10A portion of terminal 12.Adhesive linkage 41 in them is the part Nian Jie with the asperities portion 211 of insulating barrier 21, warp
Enhancement layer 42 is bonded by the adhesive linkage 41.In addition, adhesive linkage 41 is corresponding with the 2nd adhesive linkage.The material of the adhesive linkage 41 can be with
For the material same with above-mentioned adhesive linkage 31, but it can also be other material.In addition, enhancement layer 42 is by with polyimides, PET
(Polyethylene Terephthalate) is formed as the membranaceous component of material, defined thickness.
Here, as described above, portion of terminal 12 is inserted into the part of the opening portion of the connector of outside, thus it is general and
Speech is, it is necessary to defined thickness as 200 μm~300 μm.Therefore, adhesive linkage 41 and enhancement layer 42 (wherein, particularly enhancement layer
42) there is thickness big as being augmented to the thickness of insulating barrier 21 and wiring layer 22.
In addition, the thickness of adhesive linkage 41 in the same manner as above-mentioned adhesive linkage 31, has for example, 15 μm of thickness.In addition, such as
Shown in Fig. 3, the surface of each copper wiring 221 generally in portion of terminal 12, conductive envelope 61 is formed by plating processing etc..
The thickness of the conductive envelope 61 has for example, 12 μm of thickness, but can be any thickness.Therefore, the thickness of enhancement layer 42 turns into
Degree obtained by the thickness for subtracting insulating barrier 21, wiring layer 22, conductive envelope 61 and adhesive linkage 41 from above-mentioned 200 μm~300 μm,
Turn into thickness the best part in portion of terminal 12.
In addition, screen layer 51 is the part for being present in base main body portion 11.Screen layer 51 is to prevent the noise from outside
Invade internal signal wire or prevent the noise in the signal wire of inside to be released to outside part.As for forming the screen
The screened film 50 of layer 51 is covered, film conductivity film can be used.Such film conductivity film can be enumerated metal film layer
One surface side use-case such as PET, polyimides etc. have the covering such as protective layer of electrical insulating property, while another surface side is glued with electric conductivity
Connect the film conductivity film of oxidant layer covering.Be formed as the part of film-form in addition, metal film layer is metal, its thickness is with for example
Set very thin for the mode of 0.1 μm of grade.In addition, the thickness of metal film layer is not limited to 0.1 μm, electromagnetic wave shielding is being maintained
Property, while do not damaging in the scope of flexibility, the metal film layer of various thickness can be used, but in practical, can be in example
As suitably selected in the range of 0.05 μm~2 μm.
Such thin metal film layer is typically for example, by physics as vacuum vapour deposition, sputtering method, ion plating method
It is deposited as vapor growth method (PVD) or chemical gas phase growth methods (CVD) etc. to be formed.In addition, conductive film is overall thick
Degree is arranged to the thickness such as 5~20 μm.As form metal film layer metal material, can use for example silver,
The various metal materials such as aluminium, copper, gold, nickel, chromium, zinc.Wherein, preferably metal is formed using the high silver of cheap aluminium, reliability
Film layer.
In addition, the conductive adhesive layer as film conductivity film, can use it is each to same conductive adhesive layer,
It can use each to different conductive adhesive layer.It is respectively to possess leading for electric conductivity as described above to different conductive adhesive layer
Conductive fillers are dispersed in using resin as the inside of the bonding agent of material, are in contact with each other by pressurization and electroconductive stuffing, so as to
Make the layer of the conductive sex expression on compression aspect.However, it is also possible to for be not pressurized and by electroconductive stuffing autocondensation etc. each other
To possess each composition to different electric conductivity.In addition, as each bonding agent to different conductive adhesive layer, can be by with it is above-mentioned
The bond layer that the same material of such conductive paste is formed.
As such film conductivity film, can enumerate for example, the SF-PC systems of tatsuta electric wires limited company
Row, but as long as the noise of electromagnetism can be shielded, it is possible to use the film conductivity film with other compositions.
Manufacture method ＞s of the ＜ on flexible printed board 10A
Then, the flexible printed board 10A of composition as described above manufacture method is illustrated below.In addition,
In the following description, the process of the 1st process~the 6th is recorded successively, but can certainly be existed each beyond these processes
Kind process.
(1) the 1st process：Asperities portion 211 and the formation in asperities portion 321
Fig. 5 is related to the 1st process, is the figure for the image for showing Embossing processing.Forming asperities portion 211 and asperities portion 321
In the case of, it is however generally that, Embossing processing device 100 as shown in Figure 5 can be used.The Embossing processing device 100, which possesses, to be added
Hot device 110, dandy roll 120 and driven voller 130.Heater 110 is to use such as far-infrared heater, near infrared heater, pottery
The heaters such as porcelain heater, will not have irregular one side copper-coated laminated board 20S, do not have what irregular coating film 30S was heated
Part.Then, one side copper-coated laminated board 20S, coating film 30S is made to rise to more than softening point temperature.
Using heater 110 heat after, one side copper-coated laminated board 20S, coating film 30S be sent to dandy roll 120 with it is driven
Between roller 130.Dandy roll 120 is the roller that surface is provided with the boss surface 121 with minute asperities.Bumps in boss surface 121
It is transferred to one side copper-coated laminated board 20S, coating film 30S surface.In addition, driven voller 130 is close to opposed with dandy roll 120
Roller, it can be added to sending one side copper-coated laminated board 20S, coating film 30S between driven voller 130 and dandy roll 120 with defined
Pressure is pressurizeed.
By the Embossing processing device 100 of such composition, the one side copper-coated laminated board 20S's being heated to more than softening point
Insulating barrier 21, coating film 30S coating 32 between dandy roll 120 and driven voller 130 be pressurized, so as to insulating barrier 21,
Coating 32 is formed into the asperities portion 211 or asperities portion 321 of desired asperities degree.
In addition, the method for forming asperities portion 211 and asperities portion 321 is not limited to Embossing processing.For example, can be in insulating barrier
21st, the rear side of coating 32, copper foil of the lamination with asperities degree corresponding with above-mentioned asperities degree, the copper foil is passed through into etching etc.
Remove, so as to transfer the duplication (duplication) of copper foil (the surface roughness transfer of copper foil in the rear side of insulating barrier 21, coating 32
To the bumps of insulating barrier)., can be to use tool without using such as roller in addition, Embossing processing device 100 is not limited to above-mentioned composition
There are the flat mould of the boss surface same with above-mentioned boss surface 121, the composition pressurizeed and heated.
(2) the 2nd processes：The formation of wiring layer 22 with circuit pattern shape
Fig. 6 is the side cross-sectional view for the state that display forms the one side base material 20 with wiring layer 22.As shown in fig. 6,
After above-mentioned 1st process, the wiring layer 22 with desired circuit pattern shape is formed.In the feelings of wiring layer as formation 22
Under condition, formed using common smooth processing methods such as etchings.Thus, there are multiple copper to match somebody with somebody for the presence formed as shown in Figure 6
The one side base material 20 of the wiring layer 22 of line 221.
In addition, the flexible printed board 10A in present embodiment, can be cut into specific length in one side base material 20
It is etched under state, specific length can also be cut into after being etched.In addition, the 2nd process can be after the 1st process
Carry out, can also be carried out before the 1st process.
(3) the 3rd processes：The lamination of coating 30
Fig. 7 is the figure for showing the image that coating 30 is laminated to one side base material 20.In addition, the list before Fig. 7 (a) display laminations
The composition of face base material 20 and coating 30, Fig. 7 (b) are the figures for showing the state being laminated using laminater 150.Such as Fig. 7 (a) institutes
Show, coating 30 is located at the face side (surface side of Z1 sides) of one side base material 20.Then, after contraposition as defined in progress, layer is used
Pressure device 150 makes coating 30 fit in one side base material 20.
Here, laminater 150 possesses lower hot plate 160 and upper hot plate 170, also possess in addition pressing mechanism (not shown) and
Heating arrangements.Therefore, in the rear side (surface side of Z2 sides of lower hot plate 160 mounting one side base material 20；The side of asperities portion 211), to cover
The mode of lid wiring layer 22 makes the adhesive linkage 31 of coating 30 in place, is filled after laminating between the copper wiring 221 of wiring layer 22
The bonding material composition of adhesive linkage 31.Further, the resin as the top of coating 30 configuration high melting-point polyolefins, fluororesin etc.
Fender 180 of system etc..
In this condition, between lower hot plate 160 and upper hot plate 170, to one side base material 20 and coating 30 carry out pressurization and
Heating, so as to be laminated.The pressure of the pressurization has for example, 1~4MPa pressure, in addition heating-up temperature have for example, 130~
180 DEG C of temperature.In the pressurization and heating, asperities portion 211 directly contacts with lower hot plate 160, but between them, Neng Goufang
Only paste, the lamination process high thus, it is possible to realize productivity.In addition, the product after stickup is set to intermediate product
C1。
In addition, after laminating, as needed, the place that is covered to the non-coating 30 in one side base material 20 (such as terminal
Portion 12 etc.) carry out the surface treatment such as electroless gold plating.In the processing, conductive quilt is formed in each copper wiring 221 of portion of terminal 12
Film 61.
(4) the 4th processes and the 5th process：Strengthen the fitting of film 40 and screened film 50
Fig. 8 is related to the 4th process and the 5th process, is that display makes enhancing film 40 and screened film 50 be bonded intermediate product C1
Image stereogram.Fig. 9 is related to the 4th process and the 5th process, is that display makes enhancing film 40 and screened film 50 to intermediate product
The front cross-sectional view of the image of C1 fittings.Figure 10 is related to the 4th process and the 5th process, is that display makes enhancing film 40 and screened film 50
The front cross-sectional view of image after being bonded to intermediate product C1.
In addition, left side and right side in Fig. 9 and Figure 10, show the cross sectional shape in different parts, left side shows portion of terminal
The cross sectional shape of 12 sides, the cross sectional shape of the side of right side display base plate main part 11.In addition, for convenience of explanation, the 4th process is set to be
Strengthen the fitting of film 40, the 5th process is the fitting of screened film 50, but the 4th process can be made first to be carried out than the 5th process, also may be used
So that the 5th process is first carried out than the 4th process.
As shown in Figure 8 and Figure 9, enhancing film 40 and screened film 50 is made to be bonded intermediate product C1.Enhancing film 40 is pasted on
Portion of terminal 12, but it pastes the part of obstruction when position (position of portion of terminal 12) is shaped to corrugated afterwards not turn into.
In addition, screened film 50 is positioned over the top of layer 32 and is bonded.
In the case where carrying out the fitting of these enhancing films 40 and screened film 50, use and the 3rd process in each fitting
The middle laminater 150 same using laminater.In the fitting, due to the rear side (surface side of Z2 sides) in insulating barrier 21
Asperities portion 211 is provided with, therefore can improve the adaptation between enhancing film 40 and adhesive linkage 41.It is in addition, thick by existing
Face 211, so as in without the position of film 40 is strengthened in place, prevent insulating barrier 21 to be pasted on lower hot plate 160.In addition,
The face side (surface side of Z1 sides) of coating 32 is provided with asperities portion 321, therefore it can be made close between screened film 50
Conjunction property improves.
More than carrying out in the case of such fitting, adhesive linkage 41 and enhancement layer 42 are formed by enhancing film 40, in addition by
Screened film 50 forms screen layer 51.
In addition, after carrying out such paste, as needed, in order to as desired outer shape, be entered using mould etc.
Row processing.In the case of the processing of profile as progress, adhesive linkage 41, the adaptation of screen layer 51 also improve, so as to
Enough prevent their end from being peeled off from insulating barrier 21, coating 32, while the process after execution.In addition, if carry out above-mentioned
Paste, then the flexible printed board 10B of the state formed before shaping.
(5) the 6th processes：Flexible printed board 10B hot briquetting
Figure 11 is related to the 6th process, is shown in the figure that fixture 400 places the state of the flexible printed board 10B before shaping.
As shown in figure 11, in fixture 400, the flexible printed board 10B before shaping is placed in the state of having aligned.The fixture 400 by
Such as metal as SUS304 etc. is formed.Fixture 400 is provided with front end fixing component 410.In front end, fixing component 410 is set
The front end of mounting flexible printed board 10B front is equipped with by portion 411, and is provided with and is inserted into the flexible print for omitting diagram
The hooking pin 412 of the hole portion of brush substrate 10B front.
The hole portion of flexible printed board 10B front is inserted in such hooking pin 412, in this condition, with edge
The mode that configuration in the fixture pin 420 of the assigned position of fixture 400 makes flexible printed board 10B wriggle, while completes flexibility
Placements of the printed base plate 10B to fixture 400.After the placement, apply certain in flexible printed board 10B rear end side
Power.In this condition, the flexible printed board 10B comprising thermoplastic LCP materials is had shown in Fig. 1 with heating such as baking ovens
Such multiple bending sections 13, so as to be formed into the flexible printed board 10A of pleated (corrugated).
Here, with the hot briquetting of baking oven etc. for example, by heating 30 minutes at 200 DEG C to carry out.In such hot briquetting
In the case of, heated in the state of the tension stability when placement location in flexible printed board 10B, the placement to fixture 400
Shaping.Therefore, in flexible printed board 10A after shaping, turn into article shape stabilization, exist in the position as target
The state of bending section 13.
In addition, as shown in figure 1, flexible printed board 10A is arranged to elongated shape.It is soft before shaping in present embodiment
Property printed base plate 10B length (size of X-direction) turns into such as 300mm.On the other hand, flexible printed board after shaping
In 10A, if being shaped to pleated (corrugated) in a manner of the radius of bending section 13 turns into 4mm, length turns into e.g., from about
150mm.However, size example not limited to this, can be set as various sizes (other size examples are similarly).
In addition, after the shaping, as needed, structure is fixed by front end in the flexible printed board 10A after excision forming
The unwanted part of the front of the grade positioning of part 410 etc., is finally completed product.As unwanted part as cutting
Method, the hole portion inserted for hooking pin 412 in flexible printed board 10A is diverted, enter the positioning of beginning-of-line side, opposite side is with touching
The positioning such as hit.Moreover, the cutting clamper of PINNACLE, mould etc. can be used to be cut.However, it is not necessary to part cut
Cutting can be using the method beyond the above method.As such method, it can enumerate and for example use the laser cutting of laser, made
Keyway planer cutting with milling cutter etc..
In addition, rear side (the Z2 sides of the grade of screen layer 51 and the insulating barrier 21 in one side base material 20 are not bonded in the side of coating 30
Surface side) paste enhancing film 40 in the case of, asperities portion 321 can not be formed and only form asperities portion 211.In this case,
By asperities portion 211 be present, so as to ensure its adaptation between enhancing film 40, and with 150 layers of laminater
When covering layer 30 or making the fitting of enhancing film 40, it can prevent that the lower hot plate 160 in laminater 150 from pasting insulating barrier 21.
Operate as described above, form flexible printed board 10A as shown in Figure 1.
＜ is on experimental result ＞
Next, experimental result of the present embodiment is illustrated.First, by the asperities on the surface of LCP films
Degree with enhancing film stickup relation tested obtained by experimental result be shown in Table 1.As the LCP films in the experiment, make
With the LCP film CT-Z of kuraray company systems, its thickness is 50 μm.In addition, as enhancing film, nikkan is used as adhesive linkage
Industrial group NIKAFLEX SAFW, its thickness are 40 μm, and polyimide film (Dong Li-E.I.Du Pont Company's system is used as insulating barrier
Kapton200H/V), its thickness is 50 μm.In addition, using the device same with laminater 150, LCP films and enhancing film are carried out
Hot pressing.In addition, being set to 2MPa to the plus-pressure of LCP films and enhancing film, heating-up temperature is set to 140 DEG C, carry out heating in 2 minutes and
Pressurization.
In addition, the concavo-convex formation on the surface on LCP films, by by with face known to 10 mean roughness Rz
Copper foil and LCP film hot pressing, copper foil then is removed to be formed by etching.Therefore, in this experiment, 10 points of the transfer surface of copper foil are put down
Equal roughness Rz turns into 10 mean roughness Rz on the surface of LCP films.In addition, by according to the ISO29862 (strippings of adhesive tape
90 ° of disbonded tests) and peel strength is determined, the stickup situation of LCP films is determined, the measure of the peel strength has used Shimadzu making
The such measure devices of the universal testing machine AGS-X of institute's company system.
[table 1]
The asperities degree on liquid crystal polymer (LCP) film surface and the relation of the peel strength of enhancing film
As shown in Table 1, in the case where 10 mean roughness Rz are more than 1 μm, peel strength is changed into
More than 0.8kN/m, more than the 0.8kN/m of the peel strength as benchmark.In addition, in 10 mean roughness Rz more than 5 μm
In the case of, although peel strength can obtain the high value well beyond the peel strength as benchmark, using asperities degree as original
Thus the thickness of LCP films produces deviation (thickness deviation), or is also required to consider on being bonded material filling out for such asperities degree
Fill.Therefore, 10 mean roughness Rz are preferably 1 μm~5 μm of scope.
In addition, according to the result of table 1, in the case where 10 mean roughness Rz are 1.8 μm~3.2 μm of scope, stripping
From intensity more than 1.0kN/m, turn into the state for being more difficult to peel off, therefore more preferably.
Then, tested on the asperities degree on the surface to LCP films and the relation of the stickup to hot plate (lower hot plate)
Experimental result, it is shown in Table 2.As the LCP films in the experiment, using the LCP film CT-Z of kuraray company systems, its thickness is
50μm.In addition, the asperities degree Rz on the surface at the position (lower hot plate 160) that the LCP films of laminater 150 are pasted is 2 μm.In addition,
On the concavo-convex formation on the surface of LCP films, the method same with the experiment in table 1 has been used.In addition, the pressurization to LCP films
Power is set to 2MPa, and heating-up temperature is set to 160 DEG C, carries out heating in 2 minutes and pressurization.
[table 2]
The asperities degree on liquid crystal polymer (LCP) film surface and the relation of the stickup to hot plate during lamination
| Rz(μm) | 0.1 | 0.8 | 1.0 | 1.8 | 2.5 | 3.2 |
| Paste | Have | Have | Nothing | Nothing | Nothing | Nothing |
According to above-mentioned experimental result, in the case where 10 mean roughness Rz are 1 μm~3 μm, confirm and do not occur pair
The stickup of lower hot plate 160.In addition, in the case where 10 mean roughness Rz are more than 5 μm, as in table 1 explanatorily, though
Right peel strength can obtain the high value well beyond the peel strength as benchmark, but using asperities degree as reason LCP films
Thickness produces deviation (thickness deviation), or needs to consider filling of the bonding material to such asperities degree.Therefore, 10 average roughness
Degree Rz is preferably 1 μm~5 μm of scope.
In addition, if the result according to table 1 and both tables 2, then be 1.8 μm~3.2 μm in 10 mean roughness Rz
Scope in the case of, peel strength is changed into more being difficult to the state peeled off more than 1.0kN/m, moreover, to lower hot plate 160
Stickup does not also occur, therefore more preferably.
＜ is on effect ＞
The flexible printed board 10A and flexible printed board 10A manufacture method formed as according to more than, is produced such as
Lower such effect.
That is, flexible printed board 10A possesses：The shape using the LCP (liquid crystal polymer) as thermoplastic resin as material
Into insulating barrier 21；And formed on the surface of the insulating barrier 21, and possess the wiring layer 22 of multiple copper wirings 221.In addition
Possess：Configured with 21 opposite side of insulating barrier (Z1 sides) in a manner of covering wiring layer 22, and formed by thermoplastic resin
Coating 32；And it is between wiring layer 22 and coating 32 that both are be bonded, and be filled into multiple copper wirings 221 it
Between, the adhesive linkage 31 of covering wiring layer 22.Further, the face with 22 opposite side of wiring layer (Z2 sides) in insulating barrier 21, if
It is equipped with the asperities portion 211 with asperities degree of 10 mean roughness Rz in the range of 1 μm~5 μm.
Therefore, will for example coating 30 is laminated to one side base material 20 when, the asperities portion 211 of insulating barrier 21 fills with lamination
150 lower hot plate 160 is put directly to contact.However, it can prevent from pasting between asperities portion 211 and lower hot plate 160.Therefore,
The high lamination process of productivity can be realized.
In addition, in present embodiment, the end side of insulating barrier 21 is provided with portion of terminal 12, in the portion of terminal 12, with
22 opposite side of wiring layer (Z2 sides), which possesses, to be augmented to the thickness of insulating barrier 21 and wiring layer 22 and is used as material using resin
Enhancement layer 42 and it is closely sealed with asperities portion 211 and to the adhesive linkage 41 of the Nian Jie enhancement layer 42 in the asperities portion 211.
Therefore, by asperities portion 211 be present, so as to make adhesive linkage 41 to insulating barrier by producing anchoring effect etc.
21 adaptation (cementability) improves.Therefore, it is possible to make adhesive linkage 41 (enhancement layer 42) be difficult to peel off from insulating barrier 21.Therefore,
It need not use and have glossiness expensive (special) bonding material to LCP films with cementability, it is possible to increase be bonded material
Versatility.In addition, being bonded the versatility of material by improving, can also ensure that instead of material.
Further, in present embodiment, coating 32 is formed using liquid crystal polymer as material, in coating 32
With the face of 22 opposite side of wiring layer (Z1 sides), the asperities in the range of 1 μm~5 μm with 10 mean roughness Rz is provided with
The asperities portion 321 of degree.In addition, the screen for possessing the metal film layer with electromagnetic wave shielding performance is bonded with asperities portion 321
Cover layer 51.Therefore, by asperities portion 321 be present, screen layer 51 can be made to coating 32 by producing anchoring effect etc.
Adaptation (cementability) improves.Therefore, it is possible to make screen layer 51 be difficult to peel off from coating 32.Therefore, there is no need to use has
The expensive bonding material to liquid crystalline polymer film with cementability of gloss, it is possible to increase be bonded the versatility of material.In addition, pass through
The versatility of bonding material is improved, can also ensure that alternative materials.
In addition, in present embodiment, the bending section 13 bent at least 1 is provided with base main body portion 11.Therefore, it is soft
Printed base plate 10A is due to being arranged to pleat shape for property, it is thus possible to has retractility.In addition, in shaping, each position can be prevented
Stickup to fixture 400, while pleat shape is shaped to, therefore productivity can be improved.
＜ variations ＞
More than, an embodiment of the invention is illustrated, but the present invention can also carry out in addition it is various
Deformation.Hereinafter, it is explained.
In above-mentioned embodiment, flexible printed board 10A is arranged to pleat shape.However, flexible printed board is not limited to set
The composition of pleat shape is set to, for other shapes (such as straight shape, bending section only exist the shape of 1), can be applied certainly
The present invention.
In addition, in above-mentioned embodiment, asperities portion 211 throughout the whole face of the rear side (surface side of Z2 sides) of insulating barrier 21 and
Formed, and asperities portion 321 is formed throughout the entirety of the face side (surface side of Z1 sides) of coating 32.However, asperities portion 211
Can be at least a portion (such as edge etc.) formation of the rear side (surface side of Z2 sides) of insulating barrier 21, similarly, asperities portion
As long as 321 the face side (surface side of Z1 sides) of coating 32 at least a portion (such as edge etc.) formation.
In addition, in above-mentioned embodiment, flexible printed board 10A possesses adhesive linkage 41 and enhancement layer 42.However, flexible print
Brush substrate can be the composition for not possessing adhesive linkage 41 and at least one in enhancement layer 42.In addition, do not have in flexible printed board
In the case of standby adhesive linkage 41 and enhancement layer 42, it is convenient to omit in the rear side (surface side of Z2 sides) of insulating barrier 21, asperities portion is set
211。
In addition, in above-mentioned embodiment, flexible printed board 10A possesses screen layer 51.However, flexible printed board can be with
Not possess the composition of screen layer 51.In addition, in the case where flexible printed board does not possess screen layer 51, it is convenient to omit covering
The face side (surface side of Z1 sides) of cap rock 32 sets asperities portion 321.
In addition, the flexible printed board 10A in above-mentioned embodiment can have other metal film layers, resin bed, glue
Connect material layer etc..
In addition, in above-mentioned embodiment, the bending section 13 in flexible printed board 10A can be same spacing, same big
It is small, it can also be formed with different spacing or a part of different spacing.In addition, the size (radius etc.) of certain bending section is relative to it
The size (radius etc.) of its bending section can be different.In addition it is also possible to the feelings to configuring multiple bending sections with certain spacing, size
Condition, combine the situation that multiple bending sections are configured with other spacing, size.
In addition, in above-mentioned embodiment, as the roughened processing for forming asperities portion 211 and asperities portion 321, it is set to
Embossing processing, transfer copper foil duplication processing.However, roughened processing not limited to this, can be other methods.As other
Method, physically or chemically injection processing, corona treatment etc. can be enumerated.
The explanation of symbol
10A, 10B ... flexible printed board, 11 ... base main body portions, 12 ... portion of terminal, 13 ... bending sections, 20 ... one side bases
Material, 20S ... one side copper-coated laminated boards, 21 ... insulating barriers (corresponding with the 1st insulating barrier), 22 ... wiring layers, 30 ... coating, 30S ...
Coating film, 31 ... adhesive linkages (corresponding with the 1st adhesive linkage), 32 ... coatings (corresponding with the 2nd insulating barrier), 40 ... enhancing films,
41 ... adhesive linkages (corresponding with the 2nd adhesive linkage), 42 ... enhancement layers, 50 ... screened films, 51 ... screen layers, 61 ... conductive envelopes,
100 ... Embossing processing devices, 110 ... heaters, 120 ... dandy rolls, 121 ... boss surfaces, 130 ... driven vollers, 150 ... lamination dresses
Put, 160 ... lower hot plates, 170 ... upper hot plates, 180 ... fenders, 211 ... asperities portions (corresponding with the 1st asperities portion), 221 ... copper are matched somebody with somebody
Line (corresponding with distribution), 321 ... asperities portions (corresponding with the 2nd asperities portion), 400 ... fixtures, 410 ... front end fixing components, 411 ...
Front end is by portion, 412 ... hooking pins, 420 ... fixture pins, C1 ... intermediate products.
Claims (10)
1. a kind of flexible printed board, it is the flexible printed board for possessing flexibility, it is characterised in that possess：
Using the 1st insulating barrier formed as the liquid crystal polymer of thermoplastic resin as material,
Formed on the surface of the 1st insulating barrier, and possess the wiring layer of multiple distributions,
Configured in side opposite with the 1st insulating barrier in a manner of covering the wiring layer, and formed by thermoplastic resin
2nd insulating barrier,
It is between the wiring layer and the 2nd insulating barrier that both are be bonded, and be filled between the distribution and cover
1st adhesive linkage of the wiring layer, and
The face for the side opposite with the wiring layer being arranged in the 1st insulating barrier, and with 10 mean roughness Rz at 1 μm
1st asperities portion of the asperities degree in the range of~5 μm.
2. flexible printed board according to claim 1, it is characterised in that
The end side of 1st insulating barrier is provided with portion of terminal,
The portion of terminal possesses：
The thickness of the 1st insulating barrier and the wiring layer is augmented in side opposite with the wiring layer and made with resin
For the enhancement layer of material, and
It is closely sealed with the 1st asperities portion and to the 2nd adhesive linkage of the Nian Jie enhancement layer in the 1st asperities portion.
3. flexible printed board according to claim 1 or 2, it is characterised in that
2nd insulating barrier is formed using liquid crystal polymer as material,
The face of side opposite with the wiring layer in the 2nd insulating barrier, it is provided with 10 mean roughness Rz at 1 μm
2nd asperities portion of the asperities degree in the range of~5 μm, and
The screen layer for possessing the metal film layer with electromagnetic wave shielding performance is bonded with the 2nd asperities portion.
4. the flexible printed board according to any one of claims 1 to 3,
The continuous base main body portion of the portion of terminal is being provided with the bending section bent at least 1.
5. a kind of flexible printed board, it is the flexible printed board for possessing flexibility, it possesses：
Using the 1st insulating barrier formed as the liquid crystal polymer of thermoplastic resin as material,
Formed on the surface of the 1st insulating barrier, and possess the wiring layer of multiple distributions,
Configured in side opposite with the 1st insulating barrier in a manner of covering the wiring layer, and material is used as using liquid crystal polymer
Matter and the 2nd insulating barrier formed,
It is between the wiring layer and the 2nd insulating barrier that both are be bonded, and be filled between the distribution and cover
1st adhesive linkage of the wiring layer,
The face for the side opposite with the wiring layer being arranged in the 2nd insulating barrier, and with 10 mean roughness Rz at 1 μm
2nd asperities portion of the asperities degree in the range of~5 μm, and
It is Nian Jie with the 2nd insulating barrier via the 2nd asperities portion, and possess the metallic film with electromagnetic wave shielding performance
The screen layer of layer.
6. a kind of manufacture method of flexible printed board, it is the manufacture method for the flexible printed board for possessing flexibility, under it includes
State process：
1st process, to using the face side of the 1st insulating barrier formed as the liquid crystal polymer of thermoplastic resin as material
The rear side of the 1st insulating barrier of side in one side base material formed with metal foil layer, opposite with the metal foil layer, implement
Roughened processing, form the 1st asperities portion with asperities degree of 10 mean roughness Rz in the range of 1 μm~5 μm；
2nd process, before and after the 1st process, formed by carrying out pattern to the metal foil layer, possess multiple match somebody with somebody to be formed
Line and the wiring layer with desired pattern form, and
3rd process, make possess the 2nd insulating barrier formed by thermoplastic resin, the 1st adhesive linkage with being stacked on the 2nd insulating barrier
Coating be located on the wiring layer, the coating is heated and pressurizeed, so that the 1st adhesive linkage is filled into described match somebody with somebody
It is simultaneously that the wiring layer is Nian Jie with the 1st adhesive linkage between line.
7. the manufacture method of flexible printed board according to claim 6, it is characterised in that including following 4th processes：
The enhancement layer that makes to possess using resin as material and augmented to the thickness of the wiring layer, with being stacked on the enhancing
Layer the 2nd adhesive linkage enhancing film, it is closely sealed with the end side in the 1st asperities portion of the 1st insulating barrier and to the increasing
Strong film is heated and pressurizeed, so as to which the 2nd adhesive linkage is adhered into the 1st asperities portion.
8. the manufacture method of the flexible printed board according to claim 6 or 7, it is characterised in that
2nd insulating barrier is formed using liquid crystal polymer as material,
In the 1st process, to the face side of the side opposite with the wiring layer in the 2nd insulating barrier, implement roughened
Processing, the 2nd asperities portion for the asperities degree in the range of 1 μm~5 μm with 10 mean roughness Rz is formed, and it is described soft
The manufacture method of property printed base plate includes following 5th processes：
The screened film and the 2nd asperities portion for making to possess the metal film layer with electromagnetic wave shielding performance are closely sealed, to the screened film
Heated and pressurizeed, the screened film is adhered to the 2nd asperities portion so as to form screen layer.
9. the manufacture method of the flexible printed board according to any one of claim 6~8, it is characterised in that including under
State the 6th process：
To the flexible printed board before the hot briquetting that is formed at least through the 3rd process, bent making at least one position
In the state of carry out hot briquetting, after the hot briquetting, formed bending section.
10. a kind of manufacture method of flexible printed board, it is characterised in that be the manufacturer for the flexible printed board for possessing flexibility
Method, it includes following processes：
1st process, to possessing the 2nd insulating barrier and lamination to be formed as the liquid crystal polymer of thermoplastic resin as material
The surface of the 2nd insulating barrier of side in the coating of the 1st adhesive linkage of the 2nd insulating barrier, opposite with the 1st adhesive linkage
Side, implement roughened processing, form the 2nd asperities with asperities degree of 10 mean roughness Rz in the range of 1 μm~5 μm
Portion,
2nd process, before and after the 1st process, to to be formed as the liquid crystal polymer of thermoplastic resin as material
The 1st insulating barrier one side base material of the face side formed with metal foil layer in, the metal foil layer carry out pattern and formed, so as to
Formed and possess multiple distributions and the wiring layer with desired pattern form,
3rd process, the coating is located on the wiring layer, the coating is heated and pressurizeed, so that the described 1st is viscous
Connect layer be filled between the distribution it is simultaneously that the wiring layer is Nian Jie with the 1st adhesive linkage, and
5th process, the screened film and the 2nd asperities portion for making to possess the metal film layer with electromagnetic wave shielding performance are closely sealed, right
The screened film is heated and pressurizeed, and the screened film is adhered into the 2nd asperities portion so as to form screen layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-012772 | 2016-01-26 | ||
| JP2016012772A JP6710053B2 (en) | 2016-01-26 | 2016-01-26 | Flexible printed circuit board and method for manufacturing flexible printed circuit board |
| PCT/JP2016/080324 WO2017130473A1 (en) | 2016-01-26 | 2016-10-13 | Flexible printed substrate and method of manufacturing flexible printed substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107432081A true CN107432081A (en) | 2017-12-01 |
| CN107432081B CN107432081B (en) | 2020-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680003407.7A Active CN107432081B (en) | 2016-01-26 | 2016-10-13 | Flexible printed circuit board and method for manufacturing flexible printed circuit board |
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| Country | Link |
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| JP (1) | JP6710053B2 (en) |
| CN (1) | CN107432081B (en) |
| WO (1) | WO2017130473A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110351998A (en) * | 2019-09-06 | 2019-10-18 | 深圳科诺桥科技股份有限公司 | The production method and electromagnetic shielding film of millimeter wave electromagnetic shielding film |
| CN112638142A (en) * | 2019-09-24 | 2021-04-09 | 信越聚合物株式会社 | Cover film with electromagnetic wave shield and method for manufacturing the same, and flexible printed wiring board with electromagnetic wave shield and method for manufacturing the same |
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| KR20200055752A (en) * | 2017-09-15 | 2020-05-21 | 루미리즈 홀딩 비.브이. | Flexible lighting strips |
| JP7232006B2 (en) * | 2018-09-21 | 2023-03-02 | 日本航空電子工業株式会社 | CONNECTOR, DEVICE INCLUDING CONNECTOR, AND CONNECTOR MANUFACTURING METHOD |
| WO2021020919A1 (en) * | 2019-07-30 | 2021-02-04 | 삼성전자 주식회사 | Rigid flexible printed circuit board and electronic device comprising same |
| TWI697549B (en) * | 2019-12-23 | 2020-07-01 | 長春人造樹脂廠股份有限公司 | Liquid crystal polymer film and laminate comprising the same |
| TWI740515B (en) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | Liquid crystal polymer film and laminate comprising the same |
| WO2021193385A1 (en) * | 2020-03-26 | 2021-09-30 | 株式会社クラレ | Method for producing multilayer circuit board |
| KR102348525B1 (en) * | 2020-07-17 | 2022-01-07 | 88테크 주식회사 | Conductive paste and manufacturing method thereof, and simultaneous process to form reinforcement layers and electromagnetic shielding layers using the conductive paste |
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| CN102215630A (en) * | 2010-04-07 | 2011-10-12 | 株式会社藤仓 | Flexible printed board and method of manufacturing same |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107432081B (en) | 2020-02-21 |
| WO2017130473A1 (en) | 2017-08-03 |
| JP6710053B2 (en) | 2020-06-17 |
| JP2017135216A (en) | 2017-08-03 |
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