CN107250313B - 有机硅类压敏粘接剂和具有有机硅类压敏粘接层的叠层体 - Google Patents

有机硅类压敏粘接剂和具有有机硅类压敏粘接层的叠层体 Download PDF

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Publication number
CN107250313B
CN107250313B CN201680012561.0A CN201680012561A CN107250313B CN 107250313 B CN107250313 B CN 107250313B CN 201680012561 A CN201680012561 A CN 201680012561A CN 107250313 B CN107250313 B CN 107250313B
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China
Prior art keywords
sensitive adhesive
mass
component
pressure
parts
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CN201680012561.0A
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Chinese (zh)
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CN107250313A (zh
Inventor
日野贤一
田中尚子
中村昭宏
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
CN201680012561.0A 2015-03-05 2016-03-03 有机硅类压敏粘接剂和具有有机硅类压敏粘接层的叠层体 Active CN107250313B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015043149 2015-03-05
JP2015-043149 2015-03-05
PCT/JP2016/001181 WO2016139956A1 (ja) 2015-03-05 2016-03-03 シリコーン系感圧接着剤、およびシリコーン系感圧接着層を有する積層体

Publications (2)

Publication Number Publication Date
CN107250313A CN107250313A (zh) 2017-10-13
CN107250313B true CN107250313B (zh) 2020-12-01

Family

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CN201680012561.0A Active CN107250313B (zh) 2015-03-05 2016-03-03 有机硅类压敏粘接剂和具有有机硅类压敏粘接层的叠层体

Country Status (5)

Country Link
JP (1) JP6663418B2 (ja)
KR (1) KR20170126874A (ja)
CN (1) CN107250313B (ja)
TW (1) TWI688629B (ja)
WO (1) WO2016139956A1 (ja)

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* Cited by examiner, † Cited by third party
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KR102538886B1 (ko) * 2017-05-24 2023-06-01 닛산 가가쿠 가부시키가이샤 에폭시변성 폴리실록산을 함유하는 가접착제
US11549039B2 (en) 2017-10-19 2023-01-10 Dow Silicones Corporation Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications
EP3757186A4 (en) * 2018-02-19 2021-11-24 Dow Toray Co., Ltd. PRESSURE SENSITIVE SILICONE ADHESIVE COMPOSITION AND LAYER PRODUCT
US11987731B2 (en) 2018-08-10 2024-05-21 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
KR102525733B1 (ko) * 2018-08-10 2023-04-27 다우 도레이 캄파니 리미티드 감압 접착층 형성성 오가노폴리실록산 조성물 및 이의 사용
EP3896137A4 (en) * 2018-12-13 2022-10-12 Dow Toray Co., Ltd. ADHESIVE COMPOSITION BASED ON SILICONES AND THEIR USE
CN113728068B (zh) * 2019-04-25 2023-05-30 三星Sdi株式会社 聚硅氧系黏着保护膜及包括其的光学元件
US20220162482A1 (en) * 2019-06-13 2022-05-26 Dow Silicones Corporation Silicone pressure sensitive adhesive composition and preparation and use thereof in protective films for ultrasonic fingerprint sensors
KR20230125248A (ko) * 2020-12-25 2023-08-29 다우 도레이 캄파니 리미티드 실리콘 점착제 조성물 및 그의 용도

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104144781A (zh) * 2012-02-23 2014-11-12 台湾道康宁股份有限公司 压敏粘合剂片及其制备方法

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JP2001079992A (ja) * 1999-09-14 2001-03-27 Tokuyama Corp 積層体の製造方法
JP5019725B2 (ja) * 2004-07-12 2012-09-05 リンテック株式会社 シリコーンゴム粘着シート
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP5478827B2 (ja) * 2004-10-28 2014-04-23 ダウ・コーニング・コーポレイション 硬化可能な伝導組成物
US7528209B2 (en) * 2004-10-29 2009-05-05 Shin-Etsu Chemical Co., Ltd. Curable silicone release composition and sheet having a releasability using the same
JP2007045102A (ja) * 2005-08-12 2007-02-22 Lintec Corp 自己密着性カバーフィルム、及びその自己密着性カバーフィルムを貼着してなる保護積層体
GB0520145D0 (en) * 2005-10-04 2005-11-09 Dow Corning Taiwan A liquid silicone rubber composition for textile coating
JP5014774B2 (ja) * 2006-12-26 2012-08-29 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応硬化型シリコーン組成物および半導体装置
TWI440682B (zh) * 2007-03-30 2014-06-11 Shinetsu Chemical Co 無溶劑型聚矽氧感壓接著劑組成物
JP5115300B2 (ja) * 2008-04-21 2013-01-09 信越化学工業株式会社 基材密着性良好なシリコーン粘着剤組成物およびシリコーン粘着テープ
JP5634053B2 (ja) * 2008-11-26 2014-12-03 東レ・ダウコーニング株式会社 無溶剤型剥離性硬化皮膜形成性オルガノポリシロキサン組成物および剥離性硬化皮膜を有するシート状基材
JP5683848B2 (ja) * 2009-07-01 2015-03-11 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、該組成物からなる硬化層を備えたシート状物品およびその製造方法
JP5922463B2 (ja) * 2012-03-30 2016-05-24 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
KR102120623B1 (ko) * 2013-02-22 2020-06-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 디바이스
JP5811117B2 (ja) * 2013-03-05 2015-11-11 信越化学工業株式会社 硬化性シリコーン組成物の硬化方法
TWI663236B (zh) * 2014-10-16 2019-06-21 Dow Silicones Corporation 聚矽氧組合物及具有由該組合物製得之壓敏性黏著層的壓敏性黏著膜

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN104144781A (zh) * 2012-02-23 2014-11-12 台湾道康宁股份有限公司 压敏粘合剂片及其制备方法

Also Published As

Publication number Publication date
TW201641656A (zh) 2016-12-01
JP6663418B2 (ja) 2020-03-11
JPWO2016139956A1 (ja) 2017-12-21
WO2016139956A1 (ja) 2016-09-09
TWI688629B (zh) 2020-03-21
CN107250313A (zh) 2017-10-13
KR20170126874A (ko) 2017-11-20

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