CN107170694A - Position adjusting mechanism, resin encapsulation equipment, the manufacture method of resin encapsulation method and resin-encapsulated product - Google Patents
Position adjusting mechanism, resin encapsulation equipment, the manufacture method of resin encapsulation method and resin-encapsulated product Download PDFInfo
- Publication number
- CN107170694A CN107170694A CN201710022620.9A CN201710022620A CN107170694A CN 107170694 A CN107170694 A CN 107170694A CN 201710022620 A CN201710022620 A CN 201710022620A CN 107170694 A CN107170694 A CN 107170694A
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- Prior art keywords
- resin
- encapsulated
- wedge
- shaping mould
- substrate
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- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 205
- 239000011347 resin Substances 0.000 title claims abstract description 205
- 238000005538 encapsulation Methods 0.000 title claims abstract description 125
- 230000007246 mechanism Effects 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 title claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000007493 shaping process Methods 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 230000008569 process Effects 0.000 claims abstract description 37
- 230000008859 change Effects 0.000 claims abstract description 10
- 238000001721 transfer moulding Methods 0.000 claims description 11
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 230000033001 locomotion Effects 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 description 22
- 239000007788 liquid Substances 0.000 description 17
- 238000007667 floating Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- WABPQHHGFIMREM-AHCXROLUSA-N lead-203 Chemical compound [203Pb] WABPQHHGFIMREM-AHCXROLUSA-N 0.000 description 5
- 238000004382 potting Methods 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- -1 chip Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Problem of the present invention can reduce the position adjusting mechanism of the cost of the shaping mould to provide a kind of number of components of shaping mould for reducing resin encapsulation equipment and the process number of assembling and the dismounting that can reduce the shaping mould.Solution is, the position adjusting mechanism (10) of the present invention includes platen (14) and a pair of wedge-shaped members (11), a pair of wedge-shaped members (11) include the 1st wedge-shaped member (11a) and the 2nd wedge-shaped member (11b), and be assembled on platen (14), 1st wedge-shaped member (11a) and the 2nd wedge-shaped member (11b) each have slope, configured in the mode that the mutual slope is relative, and can be by making at least one wedge-shaped member be slided along its slope, and change the length in the substrate thickness direction of a pair of wedge-shaped members (11), position adjusting mechanism (10) is in resin encapsulation equipment (1000), respectively constituted with the resin-encapsulated shaping mould (51) of placement substrate (201) and (61).
Description
Technical field
The present invention relates to a kind of position adjusting mechanism, resin encapsulation equipment, resin encapsulation method and resin-encapsulated product
Manufacture method.
Background technology
For the electronic units such as integrated circuit (IC), semiconductor wafer (below sometimes simply referred to as " chip "), enter
The situation that row resin-encapsulated is molded and used is more.More specifically, resin envelope can be carried out by configuring the chip on substrate
Dress, makes the chip turn into the electronic unit of resin-encapsulated (also referred to as the electronic unit of finished product or assembling (package)
Deng.It is sometimes simply referred to as below " electronic unit ").
There is the deviation with thickness in the substrate for being configured with chip.Recorded in patent document 1 even in this
In the case of, for being set as not make the suitable clamping pressure clamping substrate (absorptive substrate such as cracking on substrate and deformation
The deviation of thickness) substrate clamp system (thickness deviation absorbing mechanism).In the substrate clamp system of patent document 1, in phase
To the inside of a mould (such as descending mould) among the mould (for example, upper mould and lower mould) of setting, it is provided with and has loaded substrate
Platform portion, elastomeric element and rigid element.Among described portion, in the slope of the opposing face as the face for being placed with substrate
Upper abutting has the elastomeric element.The rigid element is by the wedge-shaped part with the slope relative with the slope in described portion
Part is constituted, and the slope is abutted each other by the mobile wedge-shaped member, so as to be supported by the rigid element
Described portion.
Prior art literature：
Patent document
Patent document 1:Japanese Laid-Open 2002-343819 publications
The content of the invention
The invention problem to be solved
Substrate clamp system (thickness deviation absorbing mechanism) described in patent document 1 is built in shaping mould.Therefore, no
Pipe be the substrate clamp system in itself in or in the shaping mould for being combined with it, number of components is more, and structure becomes multiple
It is miscellaneous.Then, the shaping mould for being combined with the substrate clamp system compares with not combining its shaping mould, the work for assembling and dismantling
Ordinal number increase, and compared to general shaping mould, the cost increase of shaping mould in itself.
Here, the object of the invention is to provide a kind of number of components of shaping mould for reducing resin encapsulation equipment and can reduce
The process number of assembling and the dismounting of the shaping mould, and the position adjusting mechanism of the cost of the shaping mould, resin envelope can be reduced
The manufacture method of assembling device, resin encapsulation method and resin-encapsulated product.
The method for solving problem
In order to reach the purpose, position adjusting mechanism of the invention is
In the resin encapsulation equipment for encapsulating base plate resin, the position for adjusting the position of the thickness direction of the substrate is adjusted
Save mechanism, it is characterised in that：
It includes platen and a pair of wedge-shaped members,
The pair of wedge-shaped member includes the 1st wedge-shaped member and the 2nd wedge-shaped member, and is assembled on the platen,
1st wedge-shaped member and the 2nd wedge-shaped member each have slope, and the mutual slope is with relative side
Formula is configured, can be by making at least one wedge-shaped member be slided along its slope, and changes the institute on the substrate thickness direction
The length of a pair of wedge-shaped members is stated,
Resin-encapsulated shaping mould of the position adjusting mechanism in the resin encapsulation equipment with the configuration substrate
Respectively constituted.
The present invention resin encapsulation equipment be
The resin encapsulation equipment that base plate resin is encapsulated, it is characterised in that：
It includes the setting unit for setting the position adjusting mechanism of the invention and resin-encapsulated shaping mould,
Position adjusting mechanism configuration the setting unit over and under at least one on.
The present invention resin encapsulation method be
The resin encapsulation method that base plate resin is encapsulated, it is characterised in that：
The resin encapsulation equipment of the invention of the setting unit is arranged on shaping mould using resin-encapsulated, and is wrapped
Contain：
Position adjustments process：By making at least one wedge-shaped member be slided along its slope, and change the pair of wedge
The length of the thickness direction of shape part and adjust the substrate thickness direction position,
Resin-encapsulated process：The base plate resin is encapsulated.
The manufacture method of the resin-encapsulated product of the present invention is substrate by the manufacturer of the resin-encapsulated product of resin-encapsulated
Method, is characterized as encapsulating the base plate resin by the resin encapsulation method of the invention.
The effect of invention
According to the present invention, the process that the number of components of shaping mould can be reduced and assembling and the dismounting of the shaping mould can be reduced
Number, and the cost of the shaping mould can be reduced.
Brief description of the drawings
Fig. 1 is the schematic diagram of the example for the pair of wedge-shaped member for showing the position adjusting mechanism of the present invention.
Fig. 2 is to show to make the schematic diagram of the state of one of Fig. 1 the pair of wedge-shaped member slip.
Fig. 3 is the schematic diagram of one for showing the position adjusting mechanism of the present invention.
Fig. 4 is the schematic diagram for the resin encapsulation equipment for showing embodiment 1.The resin encapsulation equipment of the figure is to include Fig. 3's
One of the transfer molding resin encapsulation equipment of position adjusting mechanism.
Fig. 5 is the schematic diagram for showing to be configured with the state of shaping mould on Fig. 4 resin encapsulation equipment 1000.
Fig. 6 is the schematic diagram of a process of the resin encapsulation method for the resin encapsulation equipment 1000 for being shown with Fig. 5.
Fig. 7 is the schematic diagram of another process of the resin encapsulation method for the resin encapsulation equipment 1000 for being shown with Fig. 5.
Fig. 8 is the schematic diagram of another process of the resin encapsulation method for the resin encapsulation equipment 1000 for being shown with Fig. 5.
Fig. 9 is the schematic diagram of another process of the resin encapsulation method for the resin encapsulation equipment 1000 for being shown with Fig. 5.
Figure 10 is the signal of another process of the resin encapsulation method for the resin encapsulation equipment 1000 for being shown with Fig. 5
Figure.
Figure 11 is the signal of another process of the resin encapsulation method for the resin encapsulation equipment 1000 for being shown with Fig. 5
Figure.
Figure 12 is the signal of another process of the resin encapsulation method for the resin encapsulation equipment 1000 for being shown with Fig. 5
Figure.
Figure 13 is the schematic diagram for the compression forming resin encapsulation equipment for showing embodiment 2.
Figure 14 is the schematic diagram of a process of the resin encapsulation method for the resin encapsulation equipment 2000 for being shown with Figure 13.
Figure 15 is the signal of another process of the resin encapsulation method for the resin encapsulation equipment 2000 for being shown with Figure 13
Figure.
Figure 16 is the signal of another process of the resin encapsulation method for the resin encapsulation equipment 2000 for being shown with Figure 13
Figure.
Figure 17 is the signal of another process of the resin encapsulation method for the resin encapsulation equipment 2000 for being shown with Figure 13
Figure.
Figure 18 is one of the structure for schematically showing the resin-encapsulated product obtained by flip-chip resin-encapsulated
Sectional view.
Embodiment
Next, just present invention citing illustrates in further detail.But, the invention is not restricted to the following description.
The position adjusting mechanism of the present invention can for example be further equipped with the driving machine for driving the pair of wedge-shaped member
Structure.
The resin encapsulation equipment of the present invention can for example configure the position adjusting mechanism in the lower section of the setting unit.
The present invention resin encapsulation equipment for example,
The position adjustments auxiliary body containing elastomeric element is further included,
Position adjustments auxiliary body configuration the setting unit over and under at least one,
In the state of Temporarily Closed resin-encapsulated shaping mould, by the tensile force of the elastomeric element, even if can be by
The substrate is fixed on the resin-encapsulated shaping mould can also.In addition, in the present invention, " Temporarily Closed " of shaping mould is
Refer to the matched moulds carried out before the matched moulds (formal to close) in resin-encapsulated.Closed more than formal for example, Temporarily Closed can be used
The strength matched moulds of mitigation.In addition, though chatted after concrete condition, but can be by resin-encapsulated shaping mould from the state of Temporarily Closed
Temporarily release matched moulds, and substrate is subjected to resin-encapsulated by resin-encapsulated with shaping mould matched moulds (formal close), or can be with
The state of Temporarily Closed resin-encapsulated shaping mould is kept without releasing matched moulds, and is continued resin-encapsulated shaping mould matched moulds
(formal close) and substrate is subjected to resin-encapsulated.
The present invention resin encapsulation equipment for example,
The position adjustments auxiliary body further includes retainer,
The elastomeric element can also be in the shape being clamped between the retainer and the resin-encapsulated shaping mould
It is scalable under state.
The present invention resin encapsulation equipment for example,
The position adjustments auxiliary body further includes rigid element,
In resin-encapsulated shaping mould matched moulds, and the state that the substrate is clamped by the resin-encapsulated with shaping mould
Under, the resin-encapsulated is with shaping mould to making the movement in direction that the resin-encapsulated is opened and closed with shaping mould can be by the rigid portion
Part stops.In addition, in the present invention, the thickness direction phase of " direction for making resin-encapsulated be opened and closed with shaping mould " for example with substrate
Together, for example, being above-below direction.
For the resin encapsulation equipment of the present invention, for example, the position adjustments auxiliary body is configurable on the setting
The lower section in portion, the position adjusting mechanism also can be further configured thereunder.
For the resin encapsulation equipment of the present invention, for example, the platen and the pair of wedge-shaped member can on
Lower lifting.
The resin encapsulation equipment of the present invention for example can further include the resin-encapsulated shaping for being arranged on the setting unit
Mould.In addition, in the present invention, resin-encapsulated is not limited especially with shaping mould (below sometimes simply referred to as " shaping mould ")
It is fixed, for example, can be metal die, or can be ceramic die etc..
The resin encapsulation equipment of the present invention for example can be the resin encapsulation equipment of transfer molding, or can be used for compression forming
Resin encapsulation equipment.
The resin encapsulation equipment of the present invention for example can be for carrying out resin-encapsulated to the chip of configuration on the substrate
And manufacture the resin encapsulation equipment of electronic unit.
In addition, it is general for " electronic unit ", there is the situation for referring to the chip before resin-encapsulated, and refer to chip resin
The situation of the state of encapsulation, but in the present invention, in the case where only claiming " electronic unit ", if without special instruction, referred to described
Chip is by the electronic unit (being used as the electronic unit of finished product) of resin-encapsulated.In the present invention, " chip " refers to before resin-encapsulated
Chip, specifically, for example, the chip of the semiconductor element of IC, semiconductor chip, Electric control etc. can be enumerated.In addition,
" semiconductor element " for example refers to the circuit element made using semiconductor as raw material.In the present invention, the chip before resin-encapsulated
In order to be distinguished with the electronic unit after resin-encapsulated, it is referred to as " chip " for the sake of convenience.But, " chip " of the invention as long as tree
Chip before fat encapsulation, is not just particularly limited, can not be shaped like chips.
In addition, as by the present invention resin encapsulation equipment or resin encapsulation method and by resin-encapsulated substrate (
Referred to as insert (interposer)) it is not particularly limited, but for example, can be lead frame, wiring substrate, chip, ceramics
Substrate etc..In the present invention, also can be to two-sided carry out resin for example, resin-encapsulated only can be carried out to a face of the substrate
Encapsulation.In addition, the substrate for example can be one face or it is two-sided on the installation base plate of chip is installed.The peace of the chip
Dress method is not particularly limited, but for example, can enumerate wire bonding, flip-over type engagement etc..In the present invention, for example, can
The chip is manufactured by the ministry of electronics industry of resin-encapsulated by a face to the installation base plate or two-sided carry out resin-encapsulated
Part.In addition, be not particularly limited by the purposes of the substrate of resin-encapsulated by the resin encapsulation equipment of the present invention, but example
Such as, high-frequency model substrate, Electric control module substrate, Mechanical course substrate of mobile communication terminal etc. can be enumerated.
In addition, in the present invention, " flip-chip ", which refers to have on the electrode (pad) of IC chip surface element, is referred to as weldering
The IC chip of the projected electrode of the bulge shape of ball (bump), or such chip form.The chip (can for example be faced downwards
Under) it is arranged on the distribution part of printed board etc..The flip-chip for example can be used as the chip or peace of wireless bonding
One kind of dress method.
In addition, in the present invention, as the resin for resin-encapsulated, not being particularly limited, but for example, can be ring
The thermosetting resin such as oxygen tree fat and silicone resin, can also be thermoplastic resin.In addition, the material of resin-encapsulated can contain for part
The composite of thermosetting resin or thermoplastic resin.As the form of the resin of supply resin encapsulation equipment, for example, it can enumerate
Particulate resin, liquid resin, flaky resin, sheet-like resin, powdered resin etc..In the present invention, the liquid resin is
Resin with mobility, is not particularly limited, for example, can enumerate, fluid resin, molten resin etc..In the present invention, institute
State fluid resin and refer to for example be liquid or the resin with mobility at room temperature.In the present invention, the molten resin is
Referring to turns into liquid or the resin with mobility state for example by melting.If the form of the resin can be supplied to shaping mould
Die cavity or groove (pot) etc., then other forms also may be used.
The resin encapsulation equipment of the present invention can for example have the position adjusting mechanism of more than 2.
The resin encapsulation method of the present invention is as described above, using the resin encapsulation equipment of the invention and include institute's rheme
Put regulation process and the resin-encapsulated process.For the resin encapsulation method of the present invention, for example, the resin encapsulation equipment
For the resin encapsulation equipment of transfer molding, in the resin-encapsulated process, resin-encapsulated can be carried out by transfer molding.Separately
Outside, for the resin encapsulation method of the present invention, for example, the resin encapsulation equipment fills for the resin-encapsulated of compression forming
Put, in the resin-encapsulated process, resin-encapsulated is carried out by compression forming and also may be used.
For the resin encapsulation method of the present invention, for example, the position adjustments process can be included：Set described in Temporarily Closed
Fat encapsulation shaping mould, and in the state of the substrate is clamped with shaping mould by the resin-encapsulated, at least one by described in
Individual wedge-shaped member is slided, and makes the length change of the thickness direction of the pair of wedge-shaped member, and by the thickness direction of the substrate
Position adjustments to the position of the correspondence Temporarily Closed state process；Thereafter, opened by the resin-encapsulated with shaping mould
Mould and in the state of relieving the clamping of the substrate, at least one described wedge-shaped member is slided, make the pair of wedge again
The process that the length of the thickness direction of shape part only increases the magnitude of interference of the substrate.
The manufacture method of the resin-encapsulated product of the present invention for example can configure core on one or two face of the substrate
Piece, the resin-encapsulated product can be the chip by the electronic unit of resin-encapsulated.The chip is not particularly limited, no
Cross as described above, can be IC, semiconductor chip, semiconductor element of Electric control etc..That is, electronics produced by the present invention is passed through
Part can be such as semiconductor electronic part.
Hereinafter, the specific embodiment of the present invention will be illustrated based on accompanying drawing.Each accompanying drawing for convenience of description, and passes through
Appropriate omission, exaggeration etc. are schematically described.
[embodiment 1]
In the present embodiment, to position adjusting mechanism of the invention one, the resin-encapsulated dress of the invention using it
Put one and illustrated using one of its resin encapsulation method of the invention.In addition, using this example demonstrates that
Resin encapsulation equipment, is the resin encapsulation equipment of transfer molding as described below.In addition, the resin encapsulation method of the present embodiment
Resin-encapsulated is carried out by transfer molding.
First, the example of the pair of wedge-shaped member of the position adjusting mechanism of the present invention is shown in Fig. 1.Fig. 1 (a) is just
View, Fig. 1 (b) are side view.As illustrated, a pair of wedge-shaped members 11 include the 1st wedge-shaped member 11a and the 2nd wedge-shaped member
11b.In addition, hereinafter, there is a situation where wedge-shaped member 11 being referred to as " pin (cotter) ", and exist the 1st wedge shape respectively
Part 11a is referred to as " the 1st pin ", and the 2nd wedge-shaped member 11b is referred to as to the situation of " the 2nd pin ".As shown in Fig. 1 (b), the 1st pin 11a and
One face of the 2nd pin each comfortable thickness directions (paper above-below direction) of 11b is slope.More specifically, as illustrated, the 1st
Sell 11a upper surface and the 2nd pin 11b lower surface is respectively slope.1st pin 11a and the 2nd pin 11b are with mutual slope
Relative mode is configured.
In addition, pin 11 is connected to drive mechanism 12 such as shown in Fig. 1 (b) by pin power transmission component 16.Then, pass through
Drive mechanism 12 is slided to the slope direction (paper left and right directions) of the slope of pin 11, and the thickness direction of pin 11 can be changed
Length.For example, as shown in Fig. 1 (b), making the 1st pin 11a be slided to its preceding extreme direction (on the left of paper).Thus, the 2nd pin 11b is relative
In the 1st pin 11a and relatively Slideslip to the right.State after slip is shown in Fig. 2.Fig. 2 (a) is front view, and Fig. 2 (b) is side view
Figure.As shown in Fig. 2 the length of the thickness direction (paper above-below direction) of pin 11 becomes big compared with Fig. 1.In addition, for example by by the 1st
Sell 11a to slide to Fig. 1 (b) opposite direction, and the length of the thickness direction (paper above-below direction) of pin 11 can be reduced.
In addition, in Fig. 1 (b) and Fig. 2 (b) example, can be by the 1st wedge-shaped part of the downside of pin 11 by drive mechanism 12
Part (the 1st pin) 11a is slided in level (paper or so) direction.But not limited to this, for example, can both pass through the sliding pin of drive mechanism 12
The 2nd wedge-shaped member (the 2nd pin) 11b of 11 upsides, also slidably the 1st pin 11a and the 2nd sells 11b both sides.Also, it is used as driving machine
Structure 12, is not particularly limited, for example, servomotor, cylinder etc. can be used.
In addition, in Fig. 1 and Fig. 2 and Figure 13~Figure 17 described below, the 1st wedge-shaped member (the 1st pin) 11a and the 2nd
The entirety in wedge-shaped member (a 2nd pin) 11b respective face is slope.But the invention is not restricted to this, as long as at least one can be made
Individual wedge-shaped member is slided along the slope.For example, in the 1st wedge-shaped member (the 1st pin) and the 2nd wedge-shaped member the (the 2nd
Pin) one or both in, can be only one face a part be slope.More specifically, for example, the of diagram
Can be the front in only one face at least one of 1 wedge-shaped member (the 1st pin) 11a and the 2nd wedge-shaped member (the 2nd pin) 11b
(thin side) is slope, and base side (thick side) is horizontal plane.
Next, Fig. 3 shows one of the position adjusting mechanism of the present invention.Fig. 3 (a) is the positive front for showing pin 11
Sectional view.Fig. 3 (b) is side view.As illustrated, for the position adjusting mechanism 10, having pin 11 in mould matrix 13.Mould
Matrix 13 is placed on the upper surface of platen 14 (plane).That is, pin 11 is installed on platen 14 by mould matrix 13.Drive mechanism 12
Connected by fixed component 15 and mould matrix 13.In addition, drive mechanism 12 is connected by pin power transmission component 16 and pin 11, and
Can drive pin 11.In addition, pin 11, drive mechanism 12 and pin power transmission component 16 are identical with Fig. 1 and Fig. 2.In this way, drive mechanism
12 are installed in the way of being fixed relative to platen 14, and pin 11 relative to the moveable mode of platen to install.Thus, it can be used and drive
Position of the adjustment pin 11 of motivation structure 12 relative to platen 14.
In addition, in the present embodiment, wedge-shaped member is installed indirectly to platen using mould matrix.Not limited to this, can also make
Wedge-shaped member is installed indirectly to platen with part with other installations.In addition, can also directly install wedge-shaped member to platen.
Secondly, Fig. 4 shows to include one of the transfer molding resin encapsulation equipment of Fig. 3 position adjusting mechanism.Fig. 4
(a) it is to show the positive front cross-sectional view of pin 11 (11a, 11b).Fig. 4 (b) is only to show pin 11 (11a, 11b), driving machine
Structure 12 and the side view for selling power transmission component 16.
As illustrated, the resin encapsulation equipment 1000 is included and Fig. 3 identicals position adjusting mechanism 10, setting resin-encapsulated
Setting unit 1100 and position adjustments auxiliary body 1200 with shaping mould (shaping mould).For Fig. 4 position adjusting mechanism 10,
As illustrated, being each arranged in parallel with 2 part (pin 11, driving machines in addition on the upper surface (plane) of platen 14
Structure 12, mould matrix 13, fixed component 15 and pin power transmission component 16).In addition, Fig. 4 position adjusting mechanism 10 and Fig. 3
Position adjusting mechanism it is identical.Fig. 42 pins 11 are as described below, each the substrate thickness direction of adjustable relative different substrate
Position.Therefore, it can be said that Fig. 4 resin encapsulation equipment 1000 has 2 position adjusting mechanisms, 2 position adjusting mechanisms are total to
There is 1 platen 14.In addition, as illustrated, position adjustments auxiliary body 1200 contacts and configured in the lower end of setting unit 1100.Position
Governor motion 10 is put to contact and configure in the lower end of position adjustments auxiliary body 1200.In addition, in the resin encapsulation equipment 1000
In, platen 14 is connected to pressurizing extruder, is installed on a pair of pin 11 and mould matrix 13 of platen 14 and can be lifted in vertical direction.
That is, platen 14 is liftable in vertical direction " removable platen ".
Setting unit 1100 includes lower mould periphery retainer 52 and upper die cavity retainer 62.With regard to lower mould periphery retainer 52
Speech, can set following lower mould (lower shaping mould) 51a in it.For upper die cavity retainer 62, it can set following in it
Upper mould (upper shaping mould) 61a.In addition, for upper die cavity retainer 62, stationary platen 71 is fixed in its upper end.Outside with regard to lower mould
For all retainers 52, following heating plates 22 are fixed in its lower end.
Retainer (lower die cavity retainer) 21 is configured in the way of keeping lower mould 51a in lower mould 51a lower section.Retainer 21
Stacked gradually and constituted in the order described above by heating plate 22, thermal insulation board 24 and clamping plate 25 this 3 blocks of plates since upper.Heating plate 22
With heater 23, and the shaping mould being placed in heating plate 22 can be heated.In the through hole being made up of in addition retainer 21
It is configured with plunger 41.Plunger 41 is the extrusion mechanism for being injected into encapsulation with resin in the die cavity of pattern, and can pass through post
The lifting (not shown) of the special power source of plug.
Position adjustments auxiliary body 1200 has floating spring (elastomeric element) 31 and pillar (rigid element) 32.Floating bullet
(insertion) may be present in spring (elastomeric element) 31 and pillar (rigid element) 32 is had in the central part of heating plate 22 and thermal insulation board 24
In standby cavity.Floating spring 31 is spiral helicine elastomeric element, and the central part of spiral is cavity.Floating spring 31 is to be clamped in
State between lower mould (following) and the bottom surface of retainer 21 (clamping plate 25) is scalable.For example, it is as described below, floated during by matched moulds
The bending of spring 31, lower mould can be slided downwards.In addition, as shown in Fig. 4 (c) stereogram, pillar 32 is configured in floating spring
The hollow sectors of the central part of 31 spiral.Pillar 32 can connect the lower end of lower mould, and the hole that can be outputed from clamping plate 25
Turnover.The lower end of pillar 32, as described below, can abut the 2nd pin 11b upper surface in matched moulds.
Further, the lower surface (lower end) of the platen 14 of position adjusting mechanism 10 is connected by extruding power transmission component 83
In drive mechanism 82.In addition, drive mechanism 82 is arranged on base 81.As described below, by being moved up and down with drive mechanism 82
Position adjusting mechanism 10 comprising platen 14, can be arranged on down up and down through position adjustments auxiliary body 1200
Mould.Drive mechanism 82 is not particularly limited, but such as can enumerate servomotor.
Further, on the corner of base 81, platen (removable platen) 14 and stationary platen 71, it is each configured with connection
Bar (columnar part) 91.Specifically, the upper end of four connecting rods 91 is fixed on the corner of stationary platen 71, and lower end is fixed on bottom
The corner of seat 81.Moreover, having opened hole on the corner of platen 14, and each it is through with connecting rod 91.Moreover, platen 14 can be along
Connecting rod 91 is moved up and down.In addition, connecting rod (columnar part) 91 is substituted, for example, can be by retainer frame (hold frame) (note
Volume trade mark) etc. wall segment be arranged between platen (removable platen) 14 and the face relative to each other of stationary platen 71.
Fig. 5 shows to configure the state of shaping mould on Fig. 4 resin encapsulation equipment 1000.Fig. 5 (a) is except in lower mould periphery
Lower mould (lower shaping mould) 51a of configuration in retainer 52, and in upper die cavity retainer 62 in configuration mould (upper shaping mould) 61a it
Outside, and Fig. 4 (a) is identical.Fig. 5 (b) and Fig. 4 (b) is same figure.As illustrated, in the resin encapsulation equipment 1000, lower mould
At least drag chamber part 51 can be set up in parallel 2 in lower mould periphery retainer 52 among 51a.As illustrated, 2 drags
While chamber part 51 is placed in retainer (lower die cavity retainer) 21 top, surrounded by lower mould periphery retainer 52.More specifically
For, drag chamber part 51 is placed on lower mould matrix 51x.In the upper surface of drag chamber part 51, as described below, it can carry
Put substrate.Lower mould matrix 51x lower end is connected to the upper end of pillar 32.Geosynclinal block 42 is arranged at the relative to each other of 2 lower mould 51a
Side (inner side), 2 drag chamber parts 51 have 1 geosynclinal block 42., can be in the groove as its inner space for geosynclinal block 42
Encapsulation resin is accommodated in 44.In addition, upper mould 61a is by 64 groups of the remaining solidfied material block 43 of choosing, upper model cavity part 61 and upper mould matrix
Into.Upper model cavity part 61 is fixed on the lower end (lower surface) of mould matrix 64.Upper model cavity part 61 has edge in its underpart
The die cavity 63 of resin-encapsulated shape formation.The remaining solidfied material block 43 of choosing is with order that encapsulation resin lateral flow and supplying
The block in the space in the die cavity of shaping mould.The remaining solidfied material block 43 of choosing is arranged at relative to each other one of 2 upper model cavity parts 61
Side (inner side), 2 upper model cavity parts 61 have the remaining solidfied material block 43 of 1 choosing.Also, by lower mould (lower shaping mould) 51a and
Upper mould (upper shaping mould) 61a composition transfer molding (resin-encapsulated use) shaping moulds.
Next, just using the resin encapsulation method of Fig. 5 resin encapsulation equipment 1000 using Fig. 6~Figure 12 process chart
Illustrate.In addition, Fig. 6 (a) is and Fig. 4 (a) and Fig. 5 (a) identicals, can show the positive front cross-sectional view of pin 11.Fig. 6
(b) be and Fig. 4 (b) and Fig. 5 (b) identicals, only show pin 11, drive mechanism 12 and sell power transmission component 16 side view.
Also it is identical in Fig. 7~Figure 12.
First, as shown in fig. 6, while 51 upper surface placement substrate (insert) 201 of drag chamber part, to geosynclinal block
42 inside (groove 44) supply liquid resin 101a.As illustrated, substrate 201, in its upper surface (to the upper table of drag cavity block 52
The face of the opposite side of the contact surface in face) on be fixed with chip 202 and lead 203.As illustrated, chip 202 is solid by lead 203
Fixed (wire bonding) is on substrate 201.Liquid resin 101a is thermosetting resin.Liquid resin 101a supply for example may be used
It is carried out as follows.First, before liquid resin 101a supply, for example, heating up (heating) in advance by the heat of heater 23
Geosynclinal block 42, lower mould matrix 51x and drag chamber part 51.Afterwards, the forms such as powder, particle, tabular are supplied inside geosynclinal block 42
Resin (not shown).So, by the heat of geosynclinal block 42, lower mould matrix 51x and drag chamber part 51, the resin quilt
Heat and melt, and as molten resin (liquid resin) 101a of diagram.
Next, as shown in fig. 7, making lower mould 51a and lower mould periphery retainer 52, position adjusting mechanism 10 and position adjustments
Auxiliary body 1200 is risen by drive mechanism 82 to arrow X1 direction together.Then, as illustrated, by the one of substrate 201
End drag chamber part 51 and upper model cavity part 61 are clamped and fixed.Now, as illustrated, floating spring 31 is clamped in
Between lower mould matrix 51x and retainer 21 (clamping plate 25) and shrink, and the tensile force that is extended with floating spring 31 fixes substrate
201.Now, as Temporarily Closed, substrate 201 is only fixed with the power of the mitigation of the tensile force of floating spring 31.Now, such as figure institute
Show, pin 11 does not abut the pillar 32 for being connected to lower mould matrix 51x, and separated.
Next, since Fig. 7 state, such as shown in Fig. 8 (b), making the 1st pin 11a as arrow Y1, forward extreme direction
(on the left of paper) slides (sliding).Thus, as arrow Z1, the 2nd pin 11b rises, the thickness increase of a pair of pin 11.Also,
As shown in Fig. 8 (a), stop sliding when the upper surface of pin 11 (the 2nd pin 11b) abuts the lower end of pillar 32.Detect now
The position (Temporarily Closed position) of pin 11, and record.
Next, as shown in figure 9, by lower mould 51a and lower mould periphery retainer 52, position adjusting mechanism 10 and position adjustments
Auxiliary body 1200 is declined by drive mechanism 82 to arrow X2 direction together, and temporarily mold and release upper mould 61a and under
Clampings of the mould 51a to substrate 201.Its reason is, when due to the 2nd pin 11b risings, the 2nd pin 11b upper surface abuts pillar 32,
The friction produced between 1st pin 11a and the 2nd pin 11b becomes big, so that difficult in the state of pillar 32 is abutted in the 2nd pin 11b upper surfaces
11a is sold to slide the 1st, therefore is temporarily separated pin 11 and pillar 32.If abutting the state of pillar 32 in pin 11 (the 2nd pin 11b)
Under also slidably, then can omit Fig. 9 die sinking process.But, if pin 11 (the 2nd pin 11b) abuts the state of pillar 32
Words, due to the 1st pin 11a and the 2nd pin 11b friction, in order that pin 11, which is slided, needs big power.Therefore, in order that pin 11 is slided
The power of drive mechanism 12 must become big.In contrast, by such as Fig. 9 die sinking process, being temporarily separated pin 11 and pillar 32, then
Usable power less strong device is related to cost degradation as drive mechanism 12.
Next, as shown in Figure 10 (b), from the position (Temporarily Closed position) of Fig. 8 pin 11, such as arrow Y2, entering one
Extreme direction (on the left of paper) slides (sliding) to step forward.Thus, such as arrow Z2, the 2nd pin 11b rises, and makes a pair of pin 11
Thickness increases.In following Figure 11 matched moulds (formal close), during state (Temporarily Closed) of the drag chamber part 51 than Fig. 8
Also to rise the size (magnitude of interference) of the thickness increase of pin 11 from Fig. 8 to Figure 10, thus substrate 201 strongly seized on both sides by the arms (Gu
It is fixed).By the above, the position adjustments process of the position of the thickness direction of the substrate 201 of pin 11 can be adjusted.
Also, since Figure 10 state, as shown in figure 11, by upper die and lower die matched moulds (formal matched moulds).Specifically,
As illustrated, by drive mechanism 82, making lower mould 51a and lower mould periphery retainer 52, position adjusting mechanism 10 and position adjustments
Auxiliary body 1200 rises to arrow X3 direction together.Also, as illustrated, by one end of substrate 201 drag chamber portion
Part 51 and upper model cavity part 61 are clamped and fixed.Now, because the upper surface of pin 11 is connected to the lower end of pillar 32, therefore
Apply upward power by pillar 32 from pin 11 on drag chamber part 51.Substrate 201 is fixed by the upward power.In addition, this
When, as described above, the power more strengthened when substrate 201 is by state (Temporarily Closed) than Fig. 8 is seized on both sides by the arms (fixation), the power is from figure
The amount of the size (magnitude of interference) of the thickness increase of 8 to Figure 10 pin 11.In addition, in the present embodiment, the X1 in Fig. 7 (a) (makes
The direction that lower mould 51a rises), X2 (direction for declining lower mould 51a), Figure 11 (a) X3 in Fig. 9 (a) (make on lower mould 51a
The direction risen) turn into the direction for being opened and closed resin-encapsulated shaping mould.
Also, since Figure 11 state (matched moulds state), as shown in figure 12, above push away plunger 41 and remaining by being formed at choosing
The space (passage) of solidfied material block 43 injects liquid resin 101a in die cavity 63.Afterwards, upper mould 61a and lower mould 51a is passed through
Heat make liquid resin 101a solidify.Thus, the chip 202 being configured on substrate 201 can be manufactured and lead 203 is sealed by resin
The electronic unit (resin-encapsulated electronic part) of dress.Afterwards, by drive mechanism 82, lower mould 51a and lower mould periphery retainer are made
52nd, position adjusting mechanism 10 and position adjustments auxiliary body 1200 decline and molded together, and take out the electronic unit.As above
As, it can enter to be about to the resin-encapsulated process of the resin-encapsulated of substrate 201.
According to the present embodiment, as using Fig. 7 and Fig. 8 explanations, thickness and the combination of substrate 201 are detected by Temporarily Closed
The thickness of its adjustment pin 11.After further, as using Figure 10 and Figure 11 explanations, the thickness of pin 11 is only increased into the magnitude of interference
Matched moulds (formal to close) after amount.Thus, even if the thickness of substrate 201 has deviation, due to can with certain pressure clamping (Gu
It is fixed) substrate, therefore can prevent from or suppress substrate splitting (crackle), deform etc..
In addition, by the way that two stages carry out position adjustments and micro- in interim matched moulds and during formal matched moulds such as the present embodiment
The amount of the magnitude of interference is adjusted, the problem of can preventing or suppress flip-chip bonded when chip of substrate etc. carries out resin-encapsulated.Hereinafter,
Illustrated using Figure 18.Figure 18 is to schematically show the resin-encapsulated production that the chip for engaging flip-over type carries out resin-encapsulated
The sectional view of one of the structure of product.As illustrated, being provided with multiple soldered balls 204 on substrate 201, further loaded thereon
There is 1 chip 202, soldered ball 204 and chip 202 are packed by potting resin 101.Now, as illustrated, due to substrate 201
The narrow space surrounded out with chip 202, it is possible to occur resin being not filled by and resulting space (gas to the space
Bubble) the problems such as.In order to prevent these, the resin for preferably using the mobility high (viscosity is low) for flowing easily into the narrow space enters
Row resin-encapsulated.In addition, now such as the resin being mixed with flour filler can also be used.But, if high using mobility
The resin of (viscosity is low), then during matched moulds, resin is possible to from the micro gap outflow between upper die and lower die.Therefore, by such as
Two stages in interim matched moulds and during formal matched moulds as the present embodiment carry out position adjustments and the amount of the micro-adjustment magnitude of interference
Words, then the gap that will not occur resin outflow between upper die and lower die, and can be split (crackle), deformed with not producing substrate
Deng suitable pressure clamp (fixation) substrate.This prevents or suppress being not filled by of the resin, space, resin from into
The problem of pattern is spilt etc..
In addition, according to the device of the present embodiment, as shown in Fig. 4~Figure 12, shaping mould (lower mould 51a and upper mould 61a) and position
Put governor motion 10 and position adjustments auxiliary body 1200 is respectively constituted.Even if thus, for example changing resin-encapsulated
In the case of object, for example, it can be answered by only changing shaping mould (lower mould 51a and upper mould 61a) or only changing lower mould 51a
It is right.I.e. for change of object of resin-encapsulated etc., and whole resin encapsulation equipment need not be replaced, only pass through shaping mould
Replacing can be tackled, therefore, it is possible to the extremely low cost of correspondence.
[embodiment 2]
Next, just the other embodiment of the present invention is illustrated.In the present embodiment, the resin of compression forming is sealed
Assembling device and the resin encapsulation method carried out by using its compression forming are illustrated.
Figure 13 shows the resin encapsulation equipment of the present embodiment.Figure 13 (a) is the positive front cross-sectional view of display pin 11.Figure
13 (b) is only to show pin 11, drive mechanism 12 and the side view for selling power transmission component 16.In addition, in following Figure 14~figures
It is also identical in 17.
As shown in figure 13, the resin encapsulation equipment 2000 includes position adjusting mechanism 10b, setting resin-encapsulated shaping mould
The setting unit 2100 of (shaping mould), retainer (the lower die cavity retainer) 21b for keeping lower mould 51b and position adjustments auxiliary body
2200.For position adjusting mechanism 10b, substitute platen (removable platen) 14 and there is platen (removable platen) 14b, generation
There is mould matrix 13b for mould matrix 13, in mould matrix 13b in addition to having 2 pins 11 side by side, and (the Fig. 3 of embodiment 1
~Figure 12) position adjusting mechanism 10 it is identical.It is maintained for for frame (lower die cavity retainer) 21b, substitutes heating plate 22, heater
23rd, thermal insulation board 24 and clamping plate 25 and with heating plate 22b, heater 23b, thermal insulation board 24b and clamping plate 25b.Heating plate 22b, plus
Hot device 23b, thermal insulation board 24b and clamping plate 25b structure and configuration heating plate 22 respectively with embodiment 1 (Fig. 4~Figure 12), heating
Device 23, thermal insulation board 24 and clamping plate 25 are identical.In addition, and embodiment 1 (Fig. 4~Figure 12) retainer (lower die cavity retainer)
21 is identical.Position adjustments auxiliary body 2200 and the position adjustments auxiliary body 1200 of embodiment 1 (Fig. 4~Figure 12) are identical.I.e.
Floating spring 31b and the floating spring 31 of embodiment 1 (Fig. 4~Figure 12) are identical, pillar 32b and embodiment 1 (Fig. 4~Figure 12)
Pillar 32 is identical.
Lower mould 51b and upper mould 61b are provided with setting unit 2100.Compression forming is constituted by lower mould 51b and upper mould 61b
With (resin-encapsulated use) shaping mould.Lower mould 51b is placed on retainer (lower die cavity retainer) 21b.In addition, lower mould 51b is under
Model cavity Lower surface portion part 53, drag chamber part 54, floating spring (elastomeric element) 55 and lower mould matrix 51y are formed.Lower mould
Cavity part 54 is configured in the way of the space around and over drag chamber Lower surface portion part 53.By drag chamber
Type is formed with the superjacent air space for the drag chamber Lower surface portion part 53 that Lower surface portion part 53 and drag chamber part 54 are surrounded out
Chamber 56.Lower mould matrix 51y is upper with around drag chamber Lower surface portion part 53 in retainer (lower die cavity retainer) 21b
Mode is configured.Floating spring 55 is held between the lower end of drag chamber part 54 and lower mould matrix 51y upper end, and can be stretched
Contracting.Upper mould 61b is as described below, can fix substrate in its lower surface.
Further, Figure 13 resin encapsulation equipment 2000 is as illustrated, with stationary platen 71b, base 81b, driving machine
Structure 82b, extrudes power transmission component 83b and connecting rod 91b.Figure 13 platen (removable platen) 14b, stationary platen 71b, bottom
Seat 81b, drive mechanism 82b, extrude power transmission component 83b and connecting rod 91b structure and configure respectively with the (Fig. 4 of embodiment 1
~Figure 12) platen (removable platen) 14, stationary platen 71, base 81, drive mechanism 82, extruding power transmission component 83b
And connecting rod 91 is identical.In stationary platen 71b lower surface, as illustrated, being fixed with die cavity retainer 62b.Further, exist
Upper die cavity retainer 62b lower surface is fixed with mould 61b.
Next, just using the resin-encapsulated side of Figure 13 resin encapsulation equipment 2000 using Figure 14~Figure 17 process chart
Method is illustrated.First, by lower mould 51b in advance with heater 23b heat heating (heating) untill the temperature of resin melting.Connect
Get off, as shown in figure 14, while substrate (insert) 201 is fixed on into upper mould 61b lower surface, particulate resin 301a is supplied
To in the die cavity 56 of lower mould.Substrate 201 is fixed on upper mould 61b lower surface such as can be used fixture (not shown).In substrate
201 lower surface (for the face of the opposite side of upper mould 61b contact surface), it is same as Example 1, it is fixed with chip 202 and draws
Line 203.In addition, as illustrated, in this condition, pin 11 does not abut the pillar 32b for being connected to drag chamber Lower surface portion part 53,
But separation.Afterwards, particulate resin 301a is melted by lower mould 51b heat, as molten resin (liquid resin).
Next, as shown in figure 15, making lower mould 51b and position adjusting mechanism 10b, position adjustments by drive mechanism 82b
Auxiliary body 2200 rises to arrow X4 direction together, and drag chamber part 54 is connected to mould 61b and matched moulds.By
This, as illustrated, in molten resin (liquid resin) 301b that particulate resin 301a is melted, chip 202 and lead 203 soak
Stain.Now, as illustrated, being clamped in the floating spring 55 between the lower end of drag chamber part 54 and retainer 21b upper end
Shrink.In addition, in this condition, pin 11 does not abut the pillar 32b for being connected to drag chamber Lower surface portion part 53.Therefore, lower mould
Floating spring 31b of the die cavity Lower surface portion part 53 only by being clamped between drag chamber Lower surface portion part 53 and retainer 21b
The tensile force of stretching and fixed.
Next, as shown in figure 16, making the 1st pin 11a such as arrow Y3, extreme direction (on the left of paper) slides (sliding forward
Move).Thus, such as arrow Z3, the 2nd pin 11b rises and the thickness of a pair of pin 11 increases.Now, branch is above pushed away by a pair of pin 11
Post 32b is simultaneously pressurizeed by pillar 32b and connected drag chamber Lower surface portion part 53 to liquid resin 301b.Now,
By suitably adjust the 1st pin 11a sliding distance and suitably adjust a pair of pin 11 thickness and with its to flowing
Property resin 301b pressurization.In this way, position adjustments process of the pin 11 in the position of the thickness direction of substrate 201 can be adjusted.
Then, as shown in figure 17, liquid resin 301b is made to be cured as potting resin 301.Thus, it can manufacture and be configured at base
Chip 201 and lead 203 on plate 201 are packaged the electronic unit (resin-encapsulated electronic part) of the resin-encapsulated of resin 301.It
Afterwards, as illustrated, by drive mechanism 82b, making lower mould 51b and position adjusting mechanism 10b and position adjustments auxiliary body 2200
Decline together to arrow X5 direction and mold, and potting resin 301 and electronic unit are stripped.In this way, can enter to be about to substrate 201
Carry out the resin-encapsulated process of resin-encapsulated.In addition, in the present embodiment, Figure 15 (a) X4 (sides for making lower mould 51b increase
To), Figure 17 (a) X5 (direction for declining lower mould 51b) turn into the direction that makes resin-encapsulated be opened and closed with shaping mould.
The situation for carrying out resin-encapsulated by compression molding is compared with transfer molding, the easy deviation of resin thickness.Its result
It is when resin-encapsulated, to put on the pressure of substrate and resin also easy deviation.But, according to the present embodiment, such as in figure 16
As illustrated, the thickness and companion of a pair of pin 11 can be suitably adjusted by suitably adjusting the 1st pin 11a sliding distance
With its pressurization to liquid resin 301b.Thus, can also for example adjust the pressure related to substrate 201 be it is certain, because
This can prevent or suppress substrate to split (crackle), deform etc..In addition, the thickness by suitably adjusting a pair of pin 11, equally may be used
Tackle the thickness deviation of substrate 201.
In addition, in the case where carrying out resin-encapsulated by compression forming, in order to solve the easy deviation of the resin thickness
The problem of, for example, there is the method for connecting elastomeric element in the lower end of lower mould.According to this method, the elastomeric element can be passed through
Elasticity absorbs the influence of the deviation of (alleviation) described resin thickness.But, because the power that mould is pushed on the elastomeric element is weaker,
Thus in resin-encapsulated, the pressure for putting on resin dies down, and produce resin be not filled by, space (bubble) the problems such as.In this regard,
According to the position adjusting mechanism of the present invention, pressure can be applied to shaping mould by the wedge-shaped member (pin) as rigid element.By
This, is compared with using the situation of elastomeric element, can apply stronger pressure to resin in resin-encapsulated.Therefore, resin is filled
Property uprise and can prevent or suppress resin be not filled by, space (bubble) the problems such as.
In addition, according to device (Fig. 4~figure of the present embodiment (embodiment 2, Figure 13~Figure 17) device, and embodiment 1
12) equally, shaping mould (lower mould 51b and upper mould 61b) and position adjusting mechanism 10b and position adjustments auxiliary body 2200 are difference
Part.Even if thus, for example change resin-encapsulated object in the case of, also in the same manner as in Example 1, for example can be by only
Replace shaping mould (lower mould 51a and upper mould 61a) or only displace mould 51a to correspond to.I.e. for the object of the resin-encapsulated
Change of thing etc., and whole resin encapsulation equipment need not be replaced, it can only be tackled by the replacement of shaping mould, therefore, it is possible to right
Answer extremely low cost.
According to the present invention, such as illustrated by embodiment 1 and embodiment 2, position adjusting mechanism and shaping mould is not
Same part.Thus, as described above, the number of components of shaping mould can be reduced, and the assembling and dismounting of the shaping mould can be reduced
Process number, and the cost of the shaping mould can be reduced.Thus, for example can promptly manufacture and provide shaping mould at a low price and resin envelope
Assembling device.
In addition, according to the present invention, for example, can also reduce the number of components of position adjusting mechanism itself.Specifically, for example
In patent document 1, substrate clamp system (substrate deviation absorbing mechanism) makes built-in compression spring (elastomeric element) in wedge portion part
And stabilize it removable.In this regard, according to the present invention, such as it is illustrated in embodiment 1 and embodiment 2 as, by with position
Put and elastomeric element is configured in the position adjustments auxiliary body that governor motion is different parts, and separable wedge-shaped member (pin) and bullet
Property part.Thus, the ensuring of slip (sliding) stability of wedge-shaped member (pin), the increasing to the clamping force of substrate for example be can obtain
Greatly, prevent resin from spreading the effect of the bad grade of slip (sliding) of caused wedge-shaped member (pin).
In addition, according to the present invention, for example, can be respectively configured by the position adjusting mechanism and shaping mould, and realizing
The lightweight of shaping mould.
In addition, according to the present invention, for example, because the position adjusting mechanism and shaping mould are configured respectively, even if heating
Shaping mould, the position adjusting mechanism is also difficult to be heated.Thus, the driving machine of the position adjusting mechanism can not for example be cooled down
Structure (such as servomotor) and use.Even if in addition, for example, because the formation material of the position adjusting mechanism is non-resistance to
It is hot also can, therefore further cost degradation is also for may.Particularly, such as embodiment 1 and embodiment 2, in the position
There is the distance of the position adjustments auxiliary body, the then position adjusting mechanism and shaping mould between governor motion and shaping mould
Become farther, therefore the position adjusting mechanism is further difficult to be heated.
In addition, according to the present invention, for example, because the position adjusting mechanism and shaping mould are configured respectively, thus can be by
The position adjusting mechanism is diverted to various resin encapsulation equipments.Specifically, it can for example show in embodiment 1 and embodiment 2
The transfer molding gone out with, compression molding with etc. divert the position adjusting mechanism in various resin encapsulation equipments.Accordingly, for example it is
Just when resin encapsulation equipment is changed, the position adjusting mechanism can also be diverted, and being capable of further cost degradation.In addition,
For example, as illustrated by embodiment 1 and embodiment 2, due to the change of the object for resin-encapsulated, can not replace whole
Resin encapsulation equipment, and can only be tackled by the replacement of shaping mould, therefore, it is possible to the extremely low cost of correspondence.
In addition, the resin encapsulation equipment and resin encapsulation method of embodiment 1 and embodiment 2 are not limited to described above, it can enter
Row various change.For example, the resin encapsulation equipment of embodiment 1 and embodiment 2 is in addition to each component parts, can be suitably
With component parts such as mold closing mechanism, resin feedway, resin conveying device, extraneous gas barrier components.In addition, implementing
In example 1 and embodiment 2, although show the example using position adjustments auxiliary body 1200 or 2200, but in the present invention, position
It is any to put regulation auxiliary body, also may not be used.In addition, in embodiment 1 and embodiment 2, just set resin-encapsulated with into
It is configured with position adjustments auxiliary body below the setting unit of pattern, and is configured with the example of position adjusting mechanism thereunder
Explanation is gone.But, in the present invention, the allocation position of the position adjusting mechanism and the position adjustments auxiliary body is not limited
In this, all may be used respectively in top, the lower section of the setting unit for setting resin-encapsulated shaping mould.For example, the position adjusting mechanism
It is configurable on the top for the setting unit that resin-encapsulated shaping mould is set.In addition, being for example molded relative to setting resin-encapsulated
The setting unit of mould, the position adjusting mechanism is respectively configured in lower section and also may be used in top, the position adjustments auxiliary body.Separately
Outside, for example on the contrary, relative to the setting unit for setting resin-encapsulated shaping mould, the position adjusting mechanism is in lower section, institute's rheme
Regulation auxiliary body is put to be respectively configured and also may be used in top.In addition, for example, the position adjusting mechanism and position adjustments auxiliary
Mechanism both sides are configured in setting the top of the setting unit of resin-encapsulated shaping mould also may be used.In addition, setting the position to adjust
In the case of saving auxiliary body, such as the side above or below the setting unit for wishing to make resin-encapsulated shaping mould is stable
In the case of, relative to the setting unit, the position adjusting mechanism and the position adjustments auxiliary body can be configured in homonymy.
Further, the invention is not restricted to above-described embodiment, in the range of idea of the invention is not departed from, as needed,
Any and appropriate combination can be carried out, changes or selects to use.
The application advocates to enjoy based on Japanese patent application laid filed in 7 days March in 2016 is willing to 2016-043950
Priority, the whole of the disclosure of which is included in this specification.
Description of reference numerals
10th, 10b position adjusting mechanisms
11 pins (a pair of wedge-shaped members)
11a the 1st sells (the 1st wedge-shaped member)
11b the 2nd sells (the 2nd wedge-shaped member)
12 drive mechanisms
13 mould matrixes
14 platens (removable platen)
15 fixed components
16 pin power transmission components
21st, 21b retainers (lower die cavity retainer)
22nd, 22b heating plates
23rd, 23b heaters
24th, 24b thermal insulation boards
25th, 25b clamping plates
31st, 31b floating springs (elastomeric element)
32nd, 32b pillars (rigid element)
41 plungers
42 geosynclinal blocks
The remaining solidfied material block of 43 choosings
51 drag chamber parts
Mould under 51a, 51b
Mould matrix under 51x, 51y
52 times mould periphery retainers
53 drag chamber Lower surface portion parts
54 drag chamber parts
55 floating springs (elastomeric element)
56 die cavities
Model cavity part on 61
The upper mould of 61a, 61b
62nd, the upper die cavity retainers of 62b
71st, 71b stationary platens
81st, 81b bases
82nd, 82b drive mechanisms
83rd, 83b extrudes power transmission component
91st, 91b connecting rods (columnar part)
101st, 301 potting resin
101a, 301b molten resin (liquid resin)
201 substrates
202 chips
203 leads
204 soldered balls
1000th, 2000 resin encapsulation equipment
1100th, 2100 setting unit
1200th, 2200 position adjustments auxiliary body
Claims (18)
1. a kind of position adjusting mechanism, it adjusts the thickness side of the substrate in the resin encapsulation equipment for encapsulating base plate resin
To position, it is characterised in that：
It includes platen and a pair of wedge-shaped members,
The pair of wedge-shaped member
Comprising the 1st wedge-shaped member and the 2nd wedge-shaped member,
And on the platen,
1st wedge-shaped member and the 2nd wedge-shaped member
Each there is slope,
Configured in the mode that the mutual slope is relative,
And can be by making at least one wedge-shaped member be slided along its slope, and change the institute on the substrate thickness direction
The length of a pair of wedge-shaped members is stated,
The position adjusting mechanism is in the resin encapsulation equipment, and the resin-encapsulated shaping mould of the configuration substrate is divided
Do not constitute.
2. the position adjusting mechanism according to claim 1, it is further equipped with being used to drive the pair of wedge-shaped member
Drive mechanism.
3. a kind of resin encapsulation equipment, it encapsulates base plate resin, it is characterised in that include the position described in claim 1 or 2
Put governor motion and the setting unit of resin-encapsulated shaping mould is set；
The position adjusting mechanism be configured at the setting unit over and under at least one party.
4. the resin encapsulation equipment according to claim 3, wherein, the position adjusting mechanism is configured at the setting unit
Lower section.
5. the resin encapsulation equipment according to claim 3 or 4, it further includes the position adjustments containing elastomeric element
Auxiliary body,
The position adjustments auxiliary body be configured at the setting unit over and under at least one party,
, can be by the substrate by the tensile force of the elastomeric element in the state of Temporarily Closed resin-encapsulated shaping mould
It is fixed on the resin-encapsulated shaping mould.
6. the resin encapsulation equipment according to claim 5, wherein, the position adjustments auxiliary body is further comprising guarantor
Hold frame,
The elastomeric element is scalable in the state of being clamped between the retainer and the resin-encapsulated shaping mould.
7. the resin encapsulation equipment according to claim 5, wherein, the position adjustments auxiliary body is further comprising firm
Property part,
In resin-encapsulated shaping mould matched moulds, and in the state of the substrate is clamped by the resin-encapsulated with shaping mould,
The resin-encapsulated is with shaping mould to making the movement in direction that the resin-encapsulated is opened and closed with shaping mould can be by the rigid element
Stop.
8. the resin encapsulation equipment according to claim 4, wherein, the position adjustments auxiliary body configuration is set described
The lower section in portion is put, and below the position adjustments auxiliary body, is configured with the position adjusting mechanism.
9. the resin encapsulation equipment according to claim 3 or 4, wherein, the platen and the pair of wedge-shaped member are equal
Can oscilaltion.
10. the resin encapsulation equipment according to claim 3 or 4, it is further comprising the tree for being arranged on the setting unit
Fat encapsulation shaping mould.
11. the resin encapsulation equipment according to claim 10, wherein, the resin-encapsulated with shaping mould comprising upper mould and
Lower mould.
12. the resin encapsulation equipment according to claim 3 or 4, it is the resin encapsulation equipment of transfer molding.
13. the resin encapsulation equipment according to claim 3 or 4, it is the resin encapsulation equipment of compression forming.
14. the resin encapsulation equipment according to claim 3 or 4, it is used for the chip tree by configuration on the substrate
Fat encapsulates and manufactures electronic unit.
15. the resin encapsulation equipment according to claim 3 or 4, it has the position adjusting mechanism of more than 2.
16. a kind of resin encapsulation method, it encapsulates base plate resin, it is characterised in that：
Resin-encapsulated described in shaping mould being arranged at any one of claim 3 to 15 of the setting unit using resin-encapsulated
Device, and comprising：
Position adjustments process, by making at least one wedge-shaped member be slided along its slope, and changes the pair of wedge-shaped part
The length of the thickness direction of part and adjust the substrate thickness direction position, and
Resin-encapsulated process, the base plate resin is encapsulated.
17. the resin encapsulation method according to claim 16, wherein, the position adjustments process is included：
In resin-encapsulated shaping mould described in Temporarily Closed, and pass through shape of the resin-encapsulated with the shaping mould clamping substrate
Under state, at least one described wedge-shaped member is slided, so that the length change of the thickness direction of the pair of wedge-shaped member, so that
By the process of the position adjustments of the thickness direction of the substrate to the position of the correspondence Temporarily Closed state；And
Thereafter, again will be described in the state of the resin-encapsulated shaping mould is molded and releases the clamping of the substrate
At least one wedge-shaped member is slided, so that the length of the thickness direction of the pair of wedge-shaped member only increases the interference of the substrate
The process of amount.
18. a kind of substrate is by the manufacture method of the resin-encapsulated product of resin-encapsulated, it is characterised in that：By claim 15 to
Resin encapsulation method described in 17 any one encapsulates the base plate resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-043950 | 2016-03-07 | ||
| JP2016043950A JP6236486B2 (en) | 2016-03-07 | 2016-03-07 | A position adjusting mechanism, a resin sealing device, a resin sealing method, and a resin sealing product manufacturing method. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107170694A true CN107170694A (en) | 2017-09-15 |
| CN107170694B CN107170694B (en) | 2021-07-20 |
Family
ID=59848636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710022620.9A Active CN107170694B (en) | 2016-03-07 | 2017-01-12 | Resin packaging device, resin packaging method, and method for manufacturing resin-packaged product |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6236486B2 (en) |
| KR (1) | KR101992005B1 (en) |
| CN (1) | CN107170694B (en) |
| TW (1) | TWI629730B (en) |
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| CN109719898A (en) * | 2017-10-30 | 2019-05-07 | 东和株式会社 | The manufacturing method of resin molding apparatus and synthetic resin |
| CN112048715A (en) * | 2019-06-06 | 2020-12-08 | 北京北方华创微电子装备有限公司 | Leveling mechanism, reaction chamber and semiconductor processing equipment |
| TWI728725B (en) * | 2019-04-25 | 2021-05-21 | 日商Ｔｏｗａ股份有限公司 | Resin molding device and manufacturing method of resin molded product |
| CN112912224A (en) * | 2018-10-22 | 2021-06-04 | 贝斯荷兰有限公司 | Mold half and molding method for transfer molding of electronic components encapsulated for mounting on a carrier comprising dual support surfaces and method of use thereof |
| CN112976475A (en) * | 2019-12-02 | 2021-06-18 | 朝日科技股份有限公司 | Resin sealing device |
| CN113573867A (en) * | 2019-04-25 | 2021-10-29 | 东和株式会社 | Resin molding device and method for manufacturing resin molded product |
| US11518070B2 (en) | 2019-03-27 | 2022-12-06 | Pyxis Cf Pte. Ltd. | Compression molding machine and method of compression molding |
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| JP6541746B2 (en) * | 2017-10-30 | 2019-07-10 | Ｔｏｗａ株式会社 | Resin molding apparatus and method of manufacturing resin molded article |
| JP7092513B2 (en) * | 2018-02-09 | 2022-06-28 | アピックヤマダ株式会社 | Mold base for compression molding dies |
| TWI787417B (en) * | 2018-02-09 | 2022-12-21 | 日商山田尖端科技股份有限公司 | Mold for compression molding and compression molding device |
| KR102446919B1 (en) * | 2021-06-02 | 2022-09-23 | 한화솔루션 주식회사 | Undercover molding apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101992005B1 (en) | 2019-06-21 |
| KR20170104365A (en) | 2017-09-15 |
| JP2017162888A (en) | 2017-09-14 |
| TWI629730B (en) | 2018-07-11 |
| TW201732966A (en) | 2017-09-16 |
| JP6236486B2 (en) | 2017-11-22 |
| CN107170694B (en) | 2021-07-20 |
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