CN107159995B - 一种定量水滴式焊接机构 - Google Patents
一种定量水滴式焊接机构 Download PDFInfo
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- CN107159995B CN107159995B CN201710351773.8A CN201710351773A CN107159995B CN 107159995 B CN107159995 B CN 107159995B CN 201710351773 A CN201710351773 A CN 201710351773A CN 107159995 B CN107159995 B CN 107159995B
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- welding
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- cutout
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Processing (AREA)
- Resistance Welding (AREA)
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CN201710351773.8A CN107159995B (zh) | 2017-05-18 | 2017-05-18 | 一种定量水滴式焊接机构 |
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CN201710351773.8A CN107159995B (zh) | 2017-05-18 | 2017-05-18 | 一种定量水滴式焊接机构 |
Publications (2)
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CN107159995A CN107159995A (zh) | 2017-09-15 |
CN107159995B true CN107159995B (zh) | 2022-10-14 |
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CN201710351773.8A Active CN107159995B (zh) | 2017-05-18 | 2017-05-18 | 一种定量水滴式焊接机构 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111531241B (zh) * | 2020-05-08 | 2021-11-16 | 佛山市道磁电子有限公司 | 一种片状电感焊锡设备 |
CN114083098B (zh) * | 2022-01-24 | 2022-05-17 | 快克智能装备股份有限公司 | 开合式焊接装置及其安装调试和焊接方法 |
CN114083191B (zh) * | 2022-01-24 | 2022-04-19 | 快克智能装备股份有限公司 | 焊接装置及其焊接方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5297718A (en) * | 1992-06-08 | 1994-03-29 | Eishu Nagata | Soldering method and soldering apparatus |
US5605276A (en) * | 1994-07-07 | 1997-02-25 | Nagata; Eishu | Soldering method and soldering apparatus |
US6006639A (en) * | 1998-02-04 | 1999-12-28 | Litton Systems, Inc. | Solder placement apparatus and method |
JP2004298951A (ja) * | 2003-04-01 | 2004-10-28 | Tokai Rika Co Ltd | ろう材の供給装置 |
CN203091618U (zh) * | 2013-01-18 | 2013-07-31 | 常州快克锡焊股份有限公司 | 锡量可控的锡丝切断机 |
CN104227169A (zh) * | 2014-07-17 | 2014-12-24 | 常州快克锡焊股份有限公司 | 熔滴焊组件及熔滴焊工艺 |
CN206981941U (zh) * | 2017-05-18 | 2018-02-09 | 惠州市日进科技有限公司 | 一种定量水滴式焊接机构 |
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2017
- 2017-05-18 CN CN201710351773.8A patent/CN107159995B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5297718A (en) * | 1992-06-08 | 1994-03-29 | Eishu Nagata | Soldering method and soldering apparatus |
US5605276A (en) * | 1994-07-07 | 1997-02-25 | Nagata; Eishu | Soldering method and soldering apparatus |
US6006639A (en) * | 1998-02-04 | 1999-12-28 | Litton Systems, Inc. | Solder placement apparatus and method |
JP2004298951A (ja) * | 2003-04-01 | 2004-10-28 | Tokai Rika Co Ltd | ろう材の供給装置 |
CN203091618U (zh) * | 2013-01-18 | 2013-07-31 | 常州快克锡焊股份有限公司 | 锡量可控的锡丝切断机 |
CN104227169A (zh) * | 2014-07-17 | 2014-12-24 | 常州快克锡焊股份有限公司 | 熔滴焊组件及熔滴焊工艺 |
CN206981941U (zh) * | 2017-05-18 | 2018-02-09 | 惠州市日进科技有限公司 | 一种定量水滴式焊接机构 |
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CN107159995A (zh) | 2017-09-15 |
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Address after: Room 605, Chenjiang Venture Building, Yuanhui Road, Chenjiang Street, Zhongkai High tech Zone, Huizhou, Guangdong 516259 Patentee after: Huizhou Rijin Technology Co.,Ltd. Patentee after: Zhu Kai Address before: Room 3003, Unit 1, Huayuju, No. 263 Zhongkai Avenue, Huizhou, Guangdong, 516006 Patentee before: HUIZHOU RIJIN TECHNOLOGY CO.,LTD. Patentee before: Zhu Kai |
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Effective date of registration: 20230718 Address after: No. 304-314, No. 16 (Plant B), Huifeng East Second Road, Zhongkai High tech Zone, Huizhou, Guangdong Province 516006 Patentee after: HUIZHOU WEIMILI TECHNOLOGY Co.,Ltd. Address before: Room 605, Chenjiang Venture Building, Yuanhui Road, Chenjiang Street, Zhongkai High tech Zone, Huizhou, Guangdong 516259 Patentee before: Huizhou Rijin Technology Co.,Ltd. Patentee before: Zhu Kai |