CN107102512B - 防尘薄膜组件收纳容器 - Google Patents

防尘薄膜组件收纳容器 Download PDF

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Publication number
CN107102512B
CN107102512B CN201710083586.6A CN201710083586A CN107102512B CN 107102512 B CN107102512 B CN 107102512B CN 201710083586 A CN201710083586 A CN 201710083586A CN 107102512 B CN107102512 B CN 107102512B
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CN
China
Prior art keywords
thin film
frame
film assembly
dustproof
dustproof thin
Prior art date
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Active
Application number
CN201710083586.6A
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English (en)
Chinese (zh)
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CN107102512A (zh
Inventor
关原一敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Publication of CN107102512A publication Critical patent/CN107102512A/zh
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Publication of CN107102512B publication Critical patent/CN107102512B/zh
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Packaging Frangible Articles (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201710083586.6A 2016-02-22 2017-02-16 防尘薄膜组件收纳容器 Active CN107102512B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-030677 2016-02-22
JP2016030677A JP6604651B2 (ja) 2016-02-22 2016-02-22 ペリクル収納容器

Publications (2)

Publication Number Publication Date
CN107102512A CN107102512A (zh) 2017-08-29
CN107102512B true CN107102512B (zh) 2020-12-18

Family

ID=59674680

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710083586.6A Active CN107102512B (zh) 2016-02-22 2017-02-16 防尘薄膜组件收纳容器

Country Status (4)

Country Link
JP (1) JP6604651B2 (ja)
KR (1) KR20170098700A (ja)
CN (1) CN107102512B (ja)
TW (1) TWI624718B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
JP7442291B2 (ja) * 2019-10-09 2024-03-04 信越化学工業株式会社 ペリクルとその専用ペリクルケースからなるアセンブリ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036915Y2 (ja) * 1986-03-07 1991-02-21
US5305878A (en) * 1993-04-01 1994-04-26 Yen Yung Tsai Packaged optical pellicle
JP3023612U (ja) * 1995-10-06 1996-04-23 信越化学工業株式会社 ペリクルのペリクル収納容器への固定構造
JP3938224B2 (ja) * 1997-08-04 2007-06-27 旭化成エレクトロニクス株式会社 ペリクルの収納構造
JP2005326634A (ja) * 2004-05-14 2005-11-24 Mitsui Chemicals Inc ペリクルの収納方法
JP4581681B2 (ja) * 2004-12-27 2010-11-17 株式会社ニコン レチクル保護装置および露光装置
JP4391435B2 (ja) * 2005-03-22 2009-12-24 信越化学工業株式会社 ペリクル収納容器
JP5052106B2 (ja) * 2006-11-22 2012-10-17 旭化成イーマテリアルズ株式会社 ペリクルの収納方法
CN101689018B (zh) * 2007-07-06 2013-03-20 旭化成电子材料株式会社 大型表膜构件的框体及该框体的把持方法
JP5051840B2 (ja) * 2007-11-22 2012-10-17 信越化学工業株式会社 ペリクル収納容器内にペリクルを保管する方法
JP2011034020A (ja) * 2009-08-06 2011-02-17 Shin-Etsu Chemical Co Ltd ペリクル収納容器
KR200469200Y1 (ko) * 2010-05-10 2013-09-26 아사히 가세이 이-매터리얼즈 가부시키가이샤 펠리클 수납 용기
JP5864399B2 (ja) * 2012-10-22 2016-02-17 信越化学工業株式会社 ペリクル収納容器
JP2014190998A (ja) * 2013-03-26 2014-10-06 Dainippon Printing Co Ltd 基板収納ケース

Also Published As

Publication number Publication date
KR20170098700A (ko) 2017-08-30
JP6604651B2 (ja) 2019-11-13
TWI624718B (zh) 2018-05-21
JP2017151130A (ja) 2017-08-31
TW201730667A (zh) 2017-09-01
CN107102512A (zh) 2017-08-29

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