CN107078045B - 使用定向成在喷洒主体下方且向入口端口引导流体的流体出口的抛光垫清洗系统及相关方法 - Google Patents

使用定向成在喷洒主体下方且向入口端口引导流体的流体出口的抛光垫清洗系统及相关方法 Download PDF

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Publication number
CN107078045B
CN107078045B CN201580057701.1A CN201580057701A CN107078045B CN 107078045 B CN107078045 B CN 107078045B CN 201580057701 A CN201580057701 A CN 201580057701A CN 107078045 B CN107078045 B CN 107078045B
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China
Prior art keywords
fluid
inlet port
polishing pad
spray
spray body
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CN201580057701.1A
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Chinese (zh)
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CN107078045A (zh
Inventor
P·D·巴特菲尔德
张寿松
B·J·金
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN201580057701.1A 2014-10-24 2015-08-13 使用定向成在喷洒主体下方且向入口端口引导流体的流体出口的抛光垫清洗系统及相关方法 Active CN107078045B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/523,482 US9687960B2 (en) 2014-10-24 2014-10-24 Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods
US14/523,482 2014-10-24
PCT/US2015/044970 WO2016064467A1 (en) 2014-10-24 2015-08-13 Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods

Publications (2)

Publication Number Publication Date
CN107078045A CN107078045A (zh) 2017-08-18
CN107078045B true CN107078045B (zh) 2020-11-20

Family

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Family Applications (1)

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CN201580057701.1A Active CN107078045B (zh) 2014-10-24 2015-08-13 使用定向成在喷洒主体下方且向入口端口引导流体的流体出口的抛光垫清洗系统及相关方法

Country Status (6)

Country Link
US (1) US9687960B2 (enExample)
JP (1) JP6640848B2 (enExample)
KR (1) KR102399846B1 (enExample)
CN (1) CN107078045B (enExample)
TW (1) TWI698305B (enExample)
WO (1) WO2016064467A1 (enExample)

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* Cited by examiner, † Cited by third party
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CN107107304A (zh) * 2014-12-12 2017-08-29 应用材料公司 用于cmp期间的原位副产物移除及台板冷却的系统及工艺
KR102401388B1 (ko) * 2016-06-24 2022-05-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스
JP7083722B2 (ja) * 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7162465B2 (ja) * 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7492854B2 (ja) * 2020-05-11 2024-05-30 株式会社荏原製作所 研磨装置及び研磨方法
US12240078B2 (en) * 2020-06-24 2025-03-04 Applied Materials, Inc. Cleaning system for polishing liquid delivery arm
US11577358B2 (en) * 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US11724355B2 (en) 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
KR20220073192A (ko) * 2020-11-26 2022-06-03 에스케이실트론 주식회사 연마 패드 세정 장치 및 연마 장치
JP7592362B2 (ja) * 2021-02-02 2024-12-02 株式会社ディスコ 研削方法
CN113977458B (zh) * 2021-11-25 2022-12-02 中国计量科学研究院 抛光液注入装置及抛光系统
CN114888722B (zh) * 2022-05-17 2024-11-22 华海清科股份有限公司 一种化学机械抛光方法

Citations (3)

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JP2001237204A (ja) * 2000-02-22 2001-08-31 Hitachi Ltd 半導体装置の製造方法
US20020090896A1 (en) * 2000-02-24 2002-07-11 Li,Et Al Pad Cleaning for a CMP system
CN102553849A (zh) * 2010-12-29 2012-07-11 中芯国际集成电路制造(上海)有限公司 一种固定研磨粒抛光垫清洗装置及清洗方法

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US5616069A (en) * 1995-12-19 1997-04-01 Micron Technology, Inc. Directional spray pad scrubber
JP3511442B2 (ja) * 1996-12-18 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、省液型の液体供給ノズル装置及びウエット処理装置
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
JPH11291155A (ja) * 1998-04-10 1999-10-26 Hitachi Cable Ltd 脆性材料研磨用定盤の掃除方法及びその装置並びに研磨装置
JP2001277095A (ja) * 2000-03-31 2001-10-09 Mitsubishi Materials Corp パッドコンディショニング装置及びパッドコンディショニング方法
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6824448B1 (en) 2001-05-31 2004-11-30 Koninklijke Philips Electronics N.V. CMP polisher substrate removal control mechanism and method
KR100500517B1 (ko) 2002-10-22 2005-07-12 삼성전자주식회사 반도체 웨이퍼용 ｃｍｐ 설비
JP2004228301A (ja) * 2003-01-22 2004-08-12 Sharp Corp 基板処理装置および基板処理方法
US6884152B2 (en) * 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US7004820B1 (en) 2005-05-26 2006-02-28 United Microelectronics Corp. CMP method and device capable of avoiding slurry residues
KR20070121146A (ko) * 2006-06-21 2007-12-27 삼성전자주식회사 화학적 기계적 연마설비의 슬러리 공급장치
KR20100034618A (ko) 2008-09-24 2010-04-01 주식회사 하이닉스반도체 연마 패드의 세정방법
KR101130888B1 (ko) 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 세정 유닛 및 이를 이용한 이동식 화학 기계적 연마 시스템
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JP2001237204A (ja) * 2000-02-22 2001-08-31 Hitachi Ltd 半導体装置の製造方法
US20020090896A1 (en) * 2000-02-24 2002-07-11 Li,Et Al Pad Cleaning for a CMP system
CN102553849A (zh) * 2010-12-29 2012-07-11 中芯国际集成电路制造(上海)有限公司 一种固定研磨粒抛光垫清洗装置及清洗方法

Also Published As

Publication number Publication date
KR102399846B1 (ko) 2022-05-20
JP6640848B2 (ja) 2020-02-05
JP2017532790A (ja) 2017-11-02
TW201617171A (zh) 2016-05-16
TWI698305B (zh) 2020-07-11
US9687960B2 (en) 2017-06-27
CN107078045A (zh) 2017-08-18
US20160114459A1 (en) 2016-04-28
KR20170073689A (ko) 2017-06-28
WO2016064467A1 (en) 2016-04-28

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