TWI698305B - 使用傾向引導流體於噴灑主體下方且前往入口埠之流體出口的拋光墊清理系統及其方法 - Google Patents

使用傾向引導流體於噴灑主體下方且前往入口埠之流體出口的拋光墊清理系統及其方法 Download PDF

Info

Publication number
TWI698305B
TWI698305B TW104126604A TW104126604A TWI698305B TW I698305 B TWI698305 B TW I698305B TW 104126604 A TW104126604 A TW 104126604A TW 104126604 A TW104126604 A TW 104126604A TW I698305 B TWI698305 B TW I698305B
Authority
TW
Taiwan
Prior art keywords
fluid
inlet port
spray
polishing pad
bottom side
Prior art date
Application number
TW104126604A
Other languages
English (en)
Chinese (zh)
Other versions
TW201617171A (zh
Inventor
巴特菲爾德保羅Ｄ
張壽松
金泛稙
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201617171A publication Critical patent/TW201617171A/zh
Application granted granted Critical
Publication of TWI698305B publication Critical patent/TWI698305B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW104126604A 2014-10-24 2015-08-14 使用傾向引導流體於噴灑主體下方且前往入口埠之流體出口的拋光墊清理系統及其方法 TWI698305B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/523,482 US9687960B2 (en) 2014-10-24 2014-10-24 Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods
US14/523,482 2014-10-24

Publications (2)

Publication Number Publication Date
TW201617171A TW201617171A (zh) 2016-05-16
TWI698305B true TWI698305B (zh) 2020-07-11

Family

ID=55761295

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104126604A TWI698305B (zh) 2014-10-24 2015-08-14 使用傾向引導流體於噴灑主體下方且前往入口埠之流體出口的拋光墊清理系統及其方法

Country Status (6)

Country Link
US (1) US9687960B2 (enExample)
JP (1) JP6640848B2 (enExample)
KR (1) KR102399846B1 (enExample)
CN (1) CN107078045B (enExample)
TW (1) TWI698305B (enExample)
WO (1) WO2016064467A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107107304A (zh) * 2014-12-12 2017-08-29 应用材料公司 用于cmp期间的原位副产物移除及台板冷却的系统及工艺
KR102401388B1 (ko) * 2016-06-24 2022-05-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스
JP7083722B2 (ja) * 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7162465B2 (ja) * 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7492854B2 (ja) * 2020-05-11 2024-05-30 株式会社荏原製作所 研磨装置及び研磨方法
US12240078B2 (en) * 2020-06-24 2025-03-04 Applied Materials, Inc. Cleaning system for polishing liquid delivery arm
US11577358B2 (en) * 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US11724355B2 (en) 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
KR20220073192A (ko) * 2020-11-26 2022-06-03 에스케이실트론 주식회사 연마 패드 세정 장치 및 연마 장치
JP7592362B2 (ja) * 2021-02-02 2024-12-02 株式会社ディスコ 研削方法
CN113977458B (zh) * 2021-11-25 2022-12-02 中国计量科学研究院 抛光液注入装置及抛光系统
CN114888722B (zh) * 2022-05-17 2024-11-22 华海清科股份有限公司 一种化学机械抛光方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5779522A (en) * 1995-12-19 1998-07-14 Micron Technology, Inc. Directional spray pad scrubber
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US20100197204A1 (en) * 2003-02-11 2010-08-05 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3511442B2 (ja) * 1996-12-18 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、省液型の液体供給ノズル装置及びウエット処理装置
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
JPH11291155A (ja) * 1998-04-10 1999-10-26 Hitachi Cable Ltd 脆性材料研磨用定盤の掃除方法及びその装置並びに研磨装置
JP2001277095A (ja) * 2000-03-31 2001-10-09 Mitsubishi Materials Corp パッドコンディショニング装置及びパッドコンディショニング方法
JP2001237204A (ja) * 2000-02-22 2001-08-31 Hitachi Ltd 半導体装置の製造方法
US6669538B2 (en) * 2000-02-24 2003-12-30 Applied Materials Inc Pad cleaning for a CMP system
US6824448B1 (en) 2001-05-31 2004-11-30 Koninklijke Philips Electronics N.V. CMP polisher substrate removal control mechanism and method
KR100500517B1 (ko) 2002-10-22 2005-07-12 삼성전자주식회사 반도체 웨이퍼용 ｃｍｐ 설비
JP2004228301A (ja) * 2003-01-22 2004-08-12 Sharp Corp 基板処理装置および基板処理方法
US7004820B1 (en) 2005-05-26 2006-02-28 United Microelectronics Corp. CMP method and device capable of avoiding slurry residues
KR20070121146A (ko) * 2006-06-21 2007-12-27 삼성전자주식회사 화학적 기계적 연마설비의 슬러리 공급장치
KR20100034618A (ko) 2008-09-24 2010-04-01 주식회사 하이닉스반도체 연마 패드의 세정방법
KR101130888B1 (ko) 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 세정 유닛 및 이를 이용한 이동식 화학 기계적 연마 시스템
CN102553849B (zh) * 2010-12-29 2015-04-29 中芯国际集成电路制造(上海)有限公司 一种固定研磨粒抛光垫清洗装置及清洗方法
US20140148822A1 (en) * 2012-11-26 2014-05-29 Nahayan Ameen Abdulla Ibrahim Al Mahza Method and apparatus for polishing human skin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5779522A (en) * 1995-12-19 1998-07-14 Micron Technology, Inc. Directional spray pad scrubber
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US20100197204A1 (en) * 2003-02-11 2010-08-05 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces

Also Published As

Publication number Publication date
KR102399846B1 (ko) 2022-05-20
JP6640848B2 (ja) 2020-02-05
CN107078045B (zh) 2020-11-20
JP2017532790A (ja) 2017-11-02
TW201617171A (zh) 2016-05-16
US9687960B2 (en) 2017-06-27
CN107078045A (zh) 2017-08-18
US20160114459A1 (en) 2016-04-28
KR20170073689A (ko) 2017-06-28
WO2016064467A1 (en) 2016-04-28

Similar Documents

Publication Publication Date Title
TWI698305B (zh) 使用傾向引導流體於噴灑主體下方且前往入口埠之流體出口的拋光墊清理系統及其方法
TWI691367B (zh) 用於研磨墊清洗的方法及系統
CN105390417B (zh) 抛光组件及基板处理装置
US7240679B2 (en) System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
JP4641540B2 (ja) 研磨装置および研磨方法
CN101826449B (zh) 液体处理装置及液体处理方法
US20050139318A1 (en) Proximity meniscus manifold
KR101893439B1 (ko) 판 형상 부재의 가공 장치 및 그 가공 방법
KR101420900B1 (ko) 슬러리의 수동적 제거를 제공하는 연마 어셈블리들을 구비한 ｃｍｐ 장치들
TWI810342B (zh) 研磨裝置及研磨方法
JP7083722B2 (ja) 研磨装置、及び、研磨方法
US10661411B2 (en) Apparatus for cleaning a polishing surface, polishing apparatus, and method of manufacturing an apparatus for cleaning a polishing surface
US20190039203A1 (en) Substrate processing apparatus
TWI829280B (zh) 用於拋光液體傳輸臂的清潔裝置、工具及方法，及其拋光組件
KR101615426B1 (ko) 슬러리 분사노즐 및 이를 이용한 기판 처리장치
WO2001012384A2 (en) Apparatus for moving a workpiece
KR200471622Y1 (ko) 화학적 기계적 연마 장치의 연마헤드 세정장치
JP2025126581A (ja) Ｃｍｐ装置、及び、ｃｍｐ方法
CN120134203A (zh) 化学机械研磨设备