CN107075670B - 单片气体分配歧管及多种建构技术及其使用案例 - Google Patents

单片气体分配歧管及多种建构技术及其使用案例 Download PDF

Info

Publication number
CN107075670B
CN107075670B CN201580056443.5A CN201580056443A CN107075670B CN 107075670 B CN107075670 B CN 107075670B CN 201580056443 A CN201580056443 A CN 201580056443A CN 107075670 B CN107075670 B CN 107075670B
Authority
CN
China
Prior art keywords
gas
substrate
layer
delivery system
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580056443.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN107075670A (zh
Inventor
安德鲁·C·李
迈克尔·C·凯洛格
克里斯多夫·J·佩纳
约翰·E·多尔蒂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/517,192 external-priority patent/US20160111257A1/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN107075670A publication Critical patent/CN107075670A/zh
Application granted granted Critical
Publication of CN107075670B publication Critical patent/CN107075670B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4402—Reduction of impurities in the source gas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4409—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber characterised by sealing means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561—Gas plumbing upstream of the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Engineering & Computer Science (AREA)
CN201580056443.5A 2014-10-17 2015-10-16 单片气体分配歧管及多种建构技术及其使用案例 Active CN107075670B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US14/517,192 2014-10-17
US14/517,192 US20160111257A1 (en) 2014-10-17 2014-10-17 Substrate for mounting gas supply components and methods thereof
US14/884,575 US10557197B2 (en) 2014-10-17 2015-10-15 Monolithic gas distribution manifold and various construction techniques and use cases therefor
US14/884,575 2015-10-15
PCT/US2015/055997 WO2016061493A1 (en) 2014-10-17 2015-10-16 Monolithic gas distribution manifold and various construction techniques and use cases therefor

Publications (2)

Publication Number Publication Date
CN107075670A CN107075670A (zh) 2017-08-18
CN107075670B true CN107075670B (zh) 2019-11-15

Family

ID=55747420

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580056443.5A Active CN107075670B (zh) 2014-10-17 2015-10-16 单片气体分配歧管及多种建构技术及其使用案例

Country Status (7)

Country Link
US (2) US10557197B2 (cg-RX-API-DMAC7.html)
JP (1) JP2017534174A (cg-RX-API-DMAC7.html)
KR (2) KR20240017979A (cg-RX-API-DMAC7.html)
CN (1) CN107075670B (cg-RX-API-DMAC7.html)
SG (1) SG11201703128UA (cg-RX-API-DMAC7.html)
TW (2) TWI682061B (cg-RX-API-DMAC7.html)
WO (1) WO2016061493A1 (cg-RX-API-DMAC7.html)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI693638B (zh) 2014-04-07 2020-05-11 美商蘭姆研究公司 獨立於配置的氣體輸送系統
US10557197B2 (en) 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10118263B2 (en) * 2015-09-02 2018-11-06 Lam Researech Corporation Monolithic manifold mask and substrate concepts
US9879795B2 (en) 2016-01-15 2018-01-30 Lam Research Corporation Additively manufactured gas distribution manifold
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold
US10662527B2 (en) 2016-06-01 2020-05-26 Asm Ip Holding B.V. Manifolds for uniform vapor deposition
US10303189B2 (en) * 2016-06-30 2019-05-28 Reno Technologies, Inc. Flow control system, method, and apparatus
US10838437B2 (en) * 2018-02-22 2020-11-17 Ichor Systems, Inc. Apparatus for splitting flow of process gas and method of operating same
US11144075B2 (en) * 2016-06-30 2021-10-12 Ichor Systems, Inc. Flow control system, method, and apparatus
US10403476B2 (en) * 2016-11-09 2019-09-03 Lam Research Corporation Active showerhead
US20190032211A1 (en) * 2017-07-28 2019-01-31 Lam Research Corporation Monolithic ceramic gas distribution plate
JP6759167B2 (ja) * 2017-09-05 2020-09-23 株式会社日立ハイテク プラズマ処理装置
SG11202005688TA (en) * 2018-01-08 2020-07-29 Lam Res Corp Components and processes for managing plasma process byproduct materials
CN108735580B (zh) * 2018-06-05 2020-12-01 钟祥市创林机电技术有限公司 一种半导体芯片生产用物理气相沉积装置
US10697062B2 (en) * 2018-07-11 2020-06-30 Applied Materials, Inc. Gas flow guide design for uniform flow distribution and efficient purge
KR20200045785A (ko) * 2018-10-23 2020-05-06 안범모 반도체 제조 공정용 또는 디스플레이 제조 공정용 프로세스 유체가 통과하는 접합부품
US12516414B2 (en) 2019-03-19 2026-01-06 Asm Ip Holding B.V. Reactor manifolds
US11492701B2 (en) * 2019-03-19 2022-11-08 Asm Ip Holding B.V. Reactor manifolds
CN113994460B (zh) * 2019-04-15 2025-05-20 朗姆研究公司 用于气体输送的模块部件系统
US11881384B2 (en) 2019-09-27 2024-01-23 Applied Materials, Inc. Monolithic modular microwave source with integrated process gas distribution
KR20210048408A (ko) 2019-10-22 2021-05-03 에이에스엠 아이피 홀딩 비.브이. 반도체 증착 반응기 매니폴드
KR102821917B1 (ko) * 2019-11-08 2025-06-16 어플라이드 머티어리얼스, 인코포레이티드 가스 전달 조절을 위한 챔버 컴포넌트들
US11646183B2 (en) * 2020-03-20 2023-05-09 Applied Materials, Inc. Substrate support assembly with arc resistant coolant conduit
US11624450B2 (en) 2021-04-29 2023-04-11 Applied Materials, Inc. Fluid delivery mounting panel and system
KR102486339B1 (ko) * 2022-07-12 2023-01-09 주식회사 에코넷코리아 스퍼터링 장치에 설치되는 반사형 가스 분사 노즐
US20250372407A1 (en) * 2024-05-31 2025-12-04 Applied Materials, Inc. Ultrasonic bonding for process chamber components

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6168948B1 (en) * 1995-06-29 2001-01-02 Affymetrix, Inc. Miniaturized genetic analysis systems and methods
US6581640B1 (en) * 2000-08-16 2003-06-24 Kelsey-Hayes Company Laminated manifold for microvalve

Family Cites Families (145)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2361150A (en) 1941-01-24 1944-10-24 Mathieson Alkali Works Inc Method and apparatus for admitting chlorine to a liquid stream
US2569857A (en) 1946-03-06 1951-10-02 Klingerit Inc Combined mixing unit and hose rack
US2871887A (en) * 1955-04-26 1959-02-03 Monarch Machine Tool Co Manifolding
US3102004A (en) 1959-08-05 1963-08-27 Grintz Joseph John Mixing and dispensing apparatus
US3026183A (en) 1960-02-05 1962-03-20 Dayco Corp Mixing apparatus
GB1098629A (en) * 1964-08-06 1968-01-10 Applied Controls Ltd Connector unit
US3865133A (en) 1973-10-31 1975-02-11 Minnesota Mining & Mfg Self cleaning check valve
US4134002A (en) 1975-11-21 1979-01-09 Stanford George H Down spouts provided with heating elements
US4099919A (en) 1976-12-22 1978-07-11 The Upjohn Company Stem adjustment seal for reaction injection molding machine
CA1096630A (en) 1978-05-26 1981-03-03 David J. Tookey Static mixer
US4215081A (en) 1979-01-24 1980-07-29 Brooks Kirtland H Liquid aerator
DE3025596A1 (de) * 1980-07-05 1982-02-25 Feldmühle AG, 4000 Düsseldorf Ventilscheibe aus oxidkeramischem werkstoff
US4581521A (en) 1980-08-28 1986-04-08 Grise Frederick Gerard J Electrically heated pipe assembly
US4422471A (en) 1982-05-24 1983-12-27 The United States Of America As Represented By The Secretary Of The Navy Four bar manifold
JPS6063375A (ja) 1983-09-14 1985-04-11 Canon Inc 気相法堆積膜製造装置
US4714091A (en) 1985-06-10 1987-12-22 Emcore, Inc. Modular gas handling apparatus
US4703718A (en) 1985-11-29 1987-11-03 Rca Corporation Vapor deposition apparatus and method of using same
DE3820810A1 (de) 1988-06-20 1989-12-21 Krauss Maffei Ag Vorrichtung zum mischen von wenigstens zwei reaktiven kunststoffkomponenten
US5082633A (en) 1990-06-14 1992-01-21 The Dow Chemical Company Mix head for mixing reactive chemicals
JP3323530B2 (ja) 1991-04-04 2002-09-09 株式会社日立製作所 半導体装置の製造方法
US5251447A (en) 1992-10-01 1993-10-12 General Electric Company Air fuel mixer for gas turbine combustor
US5534328A (en) 1993-12-02 1996-07-09 E. I. Du Pont De Nemours And Company Integrated chemical processing apparatus and processes for the preparation thereof
US5341841A (en) * 1993-10-19 1994-08-30 Acute Ideas, Inc. Fluid distribution device
US5653259A (en) * 1994-10-17 1997-08-05 Applied Biosystems, Inc. Valve block
IT240440Y1 (it) 1996-02-09 2001-04-02 Italtinto Srl Macchina dosatrice per coloranti
IT240441Y1 (it) 1996-02-09 2001-04-02 Italtinto Srl Macchina dosatrice in particolare per coloranti
US5794645A (en) 1996-07-15 1998-08-18 Creative Pathways, Inc. Method for supplying industrial gases using integrated bottle controllers
US6073646A (en) 1996-09-30 2000-06-13 Benkan Corporation Gas controlling device for integration
US6302141B1 (en) 1996-12-03 2001-10-16 Insync Systems, Inc. Building blocks for integrated gas panel
US5836355A (en) 1996-12-03 1998-11-17 Insync Systems, Inc. Building blocks for integrated gas panel
JP3748473B2 (ja) 1996-12-12 2006-02-22 キヤノン株式会社 堆積膜形成装置
US5984519A (en) 1996-12-26 1999-11-16 Genus Corporation Fine particle producing devices
US6159442A (en) 1997-08-05 2000-12-12 Mfic Corporation Use of multiple stream high pressure mixer/reactor
US6352594B2 (en) 1997-08-11 2002-03-05 Torrex Method and apparatus for improved chemical vapor deposition processes using tunable temperature controlled gas injectors
US6068016A (en) 1997-09-25 2000-05-30 Applied Materials, Inc Modular fluid flow system with integrated pump-purge
US5887977A (en) 1997-09-30 1999-03-30 Uniflows Co., Ltd. Stationary in-line mixer
CN1289851C (zh) 1998-03-05 2006-12-13 斯瓦戈洛克公司 歧管系统
US6260581B1 (en) 1998-06-12 2001-07-17 J. Gregory Hollingshead Apparatus for assembling modular chemical distribution substrate blocks
US6289928B1 (en) * 1998-12-04 2001-09-18 Basf Corporation Apparatus and method for direct injection of additives into a polymer melt stream
JP4454725B2 (ja) 1998-12-28 2010-04-21 株式会社オムニ研究所 ガス混合装置およびガス混合ブロック
WO2000042233A1 (en) 1999-01-13 2000-07-20 Cornell Research Foundation, Inc. Monolithic fabrication of fluidic structures
JP4463896B2 (ja) 1999-04-13 2010-05-19 株式会社オムニ研究所 ガス供給装置
US6620289B1 (en) 1999-04-27 2003-09-16 Applied Materials, Inc Method and apparatus for asymmetric gas distribution in a semiconductor wafer processing system
US6186177B1 (en) 1999-06-23 2001-02-13 Mks Instruments, Inc. Integrated gas delivery system
US7144616B1 (en) 1999-06-28 2006-12-05 California Institute Of Technology Microfabricated elastomeric valve and pump systems
IT246858Y1 (it) 1999-07-16 2002-04-10 Italtinto Srl Macchina erogatrice-dosatrice per coloranti vernici o simili con gruppo di erogazione centrale simultanea dei coloranti e sistema di pulitur
US6125887A (en) 1999-09-20 2000-10-03 Pinto; James V. Welded interconnection modules for high purity fluid flow control applications
US6283155B1 (en) 1999-12-06 2001-09-04 Insync Systems, Inc. System of modular substrates for enabling the distribution of process fluids through removable components
US6640835B1 (en) 2000-03-03 2003-11-04 Creative Pathways, Inc. Micromount™ system
US6546960B1 (en) 2000-03-03 2003-04-15 Creative Pathways, Inc. Self-aligning SmartStrate™
DE10015165B4 (de) * 2000-03-27 2004-01-29 Koenig & Bauer Ag Vorrichtung zur Zuführung von Druckmittel
US6283143B1 (en) 2000-03-31 2001-09-04 Lam Research Corporation System and method for providing an integrated gas stick
DE10032269A1 (de) 2000-07-03 2002-01-31 Basf Ag Verfahren und Vorrichtung zur Verringerung von Nebenprodukten bei der Vermischung von Eduktströmen
JP4156184B2 (ja) 2000-08-01 2008-09-24 株式会社キッツエスシーティー 集積化ガス制御装置
JP2002089798A (ja) 2000-09-11 2002-03-27 Ulvac Japan Ltd 流体制御装置およびこれを用いたガス処理装置
WO2002023964A1 (en) * 2000-09-13 2002-03-21 Applied Materials, Inc. Processing chamber with multi-layer brazed lid
US6464129B2 (en) 2000-12-22 2002-10-15 Triumph Group, Inc. Method of diffusion bonding superalloy components
DE10123093A1 (de) 2001-05-07 2002-11-21 Inst Mikrotechnik Mainz Gmbh Verfahren und statischer Mikrovermischer zum Mischen mindestens zweier Fluide
US6655829B1 (en) 2001-05-07 2003-12-02 Uop Llc Static mixer and process for mixing at least two fluids
US7293910B2 (en) 2001-05-24 2007-11-13 Masco Corporation Surge suppressor for a mixer head assembly
US7150475B2 (en) 2001-07-13 2006-12-19 Talon Innovations, Inc. Shear-resistant modular fluidic blocks
FR2829707B1 (fr) 2001-09-19 2003-12-12 Air Liquide Procede et dispositif de melange de deux gaz reactifs
JP2003334479A (ja) 2001-10-02 2003-11-25 Ngk Insulators Ltd 液体噴射装置
US20030124842A1 (en) 2001-12-27 2003-07-03 Applied Materials, Inc. Dual-gas delivery system for chemical vapor deposition processes
US7261812B1 (en) 2002-02-13 2007-08-28 Nanostream, Inc. Multi-column separation devices and methods
US6924235B2 (en) 2002-08-16 2005-08-02 Unaxis Usa Inc. Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method
TWI305664B (en) * 2002-08-16 2009-01-21 Unaxis Usa Inc Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method
AU2003262953A1 (en) 2002-08-27 2004-03-19 Celerity Group, Inc. Modular substrate gas panel having manifold connections in a common plane
US7510392B2 (en) 2002-11-06 2009-03-31 Mold-Masters (2007) Limited Injection nozzle with a removable heater device having one or more heating elements
JP4502590B2 (ja) 2002-11-15 2010-07-14 株式会社ルネサステクノロジ 半導体製造装置
US6718817B1 (en) 2002-11-22 2004-04-13 Chung-Shan Institute Of Science And Technology Sample injection device for gas chromatography
AU2003303439A1 (en) * 2002-12-20 2004-07-22 Applied Materials, Inc. Micromachined intergrated fluid delivery system
CA2772050C (en) 2002-12-26 2016-09-06 Meso Scale Technologies, Llc. Assay cartridges and methods of using the same
US6907904B2 (en) 2003-03-03 2005-06-21 Redwood Microsystems, Inc. Fluid delivery system and mounting panel therefor
US7140558B2 (en) 2003-03-24 2006-11-28 Irene Base, legal representative Mixing arrangement for atomizing nozzle in multi-phase flow
US20050005981A1 (en) 2003-03-26 2005-01-13 Paul Eidsmore Modular fluid components and assembly
DE10333921B4 (de) 2003-07-25 2005-10-20 Wella Ag Extraktionsverfahren unter Verwendung eines statischen Mikromischers
DE10333922B4 (de) 2003-07-25 2005-11-17 Wella Ag Bauteile für statische Mikromischer, daraus aufgebaute Mikromischer und deren Verwendung zum Mischen, zum Dispergieren oder zur Durchführung chemischer Reaktionen
US7178556B2 (en) 2003-08-07 2007-02-20 Parker-Hannifin Corporation Modular component connector substrate assembly system
US7234222B1 (en) 2003-09-26 2007-06-26 Lam Research Corporation Methods and apparatus for optimizing the delivery of a set of gases in a plasma processing system
CN1887029A (zh) 2003-11-07 2006-12-27 迅捷公司 表面安装的加热器
US7892357B2 (en) 2004-01-12 2011-02-22 Axcelis Technologies, Inc. Gas distribution plate assembly for plasma reactors
ITTO20040012A1 (it) 2004-01-13 2004-04-13 Nordimpianti Technologies S R Tintometro
DE502005005027D1 (de) 2004-02-17 2008-09-25 Ehrfeld Mikrotechnik Bts Gmbh Mikromischer
US7572337B2 (en) * 2004-05-26 2009-08-11 Applied Materials, Inc. Blocker plate bypass to distribute gases in a chemical vapor deposition system
US20070140042A1 (en) 2004-06-04 2007-06-21 Gerhard Schanz Multicomponent packaging with static micromixer
JP2006009969A (ja) 2004-06-25 2006-01-12 Kitz Sct:Kk 集積化ガス制御装置用流路ブロックとその製造方法並びに集積化ガス制御装置
US20060028908A1 (en) 2004-08-03 2006-02-09 Suriadi Arief B Micro-mixer
US7320339B2 (en) 2005-06-02 2008-01-22 Ultra Clean Holdings, Inc. Gas-panel assembly
US7299825B2 (en) * 2005-06-02 2007-11-27 Ultra Clean Holdings, Inc. Gas-panel assembly
US7410519B1 (en) 2005-08-16 2008-08-12 Ewald Dieter H Sandwich filter block
JP4718274B2 (ja) 2005-08-25 2011-07-06 東京エレクトロン株式会社 半導体製造装置，半導体製造装置の流量補正方法，プログラム
US7976795B2 (en) 2006-01-19 2011-07-12 Rheonix, Inc. Microfluidic systems
US8196480B1 (en) 2006-04-03 2012-06-12 A+ Manufacturing, Llc Modular sample conditioning system
US7566165B2 (en) 2006-04-17 2009-07-28 Milliken & Company Valved manifold and system suitable for introducing one or more additives into a fluid stream
US20070289652A1 (en) * 2006-06-16 2007-12-20 Matheson Tri-Gas High flow surface mount components
CN101506561B (zh) 2006-08-23 2012-04-18 株式会社堀场Stec 组合式气体分配盘装置
US20080066859A1 (en) 2006-08-30 2008-03-20 Michiaki Kobayashi Plasma processing apparatus capable of adjusting pressure within processing chamber
US8807164B2 (en) * 2006-08-30 2014-08-19 Semba Biosciences, Inc. Valve module and methods for simulated moving bed chromatography
NL1032816C2 (nl) 2006-11-06 2008-05-08 Micronit Microfluidics Bv Micromengkamer, micromenger omvattende meerdere van dergelijke micromengkamers, werkwijzen voor het vervaardigen daarvan, en werkwijzen voor mengen.
US7789107B2 (en) 2006-11-16 2010-09-07 Talon Innovations Fluid transport in monolithic structures
US7822570B2 (en) 2006-11-17 2010-10-26 Lam Research Corporation Methods for performing actual flow verification
JP5004614B2 (ja) 2007-02-20 2012-08-22 株式会社日立ハイテクノロジーズ 真空処理装置
JP5427344B2 (ja) * 2007-05-23 2014-02-26 株式会社渡辺商行 気化装置、及び、気化装置を備えた成膜装置
US7798388B2 (en) 2007-05-31 2010-09-21 Applied Materials, Inc. Method of diffusion bonding a fluid flow apparatus
US7806143B2 (en) 2007-06-11 2010-10-05 Lam Research Corporation Flexible manifold for integrated gas system gas panels
FR2919510B1 (fr) 2007-08-03 2010-10-22 Daher Aerospace Melangeur de fluide gazeux
US8322380B2 (en) 2007-10-12 2012-12-04 Lam Research Corporation Universal fluid flow adaptor
US20090120364A1 (en) 2007-11-09 2009-05-14 Applied Materials, Inc. Gas mixing swirl insert assembly
WO2009085866A2 (en) 2007-12-27 2009-07-09 Lam Research Corporation Gas transport delay resolution for short etch recipes
DE102008022355A1 (de) 2008-05-06 2009-11-19 Axel Wittek Rotor-Stator-System zum Herstellen von Dispersionen
KR101012421B1 (ko) 2008-06-02 2011-02-08 성균관대학교산학협력단 에어로졸 분사장치 및 그것을 이용한 필름형성방법
US9656223B2 (en) 2008-06-16 2017-05-23 Isel Co., Ltd. Mixing unit and device, fluid mixing method and fluid
US7699935B2 (en) 2008-06-19 2010-04-20 Applied Materials, Inc. Method and system for supplying a cleaning gas into a process chamber
US8340827B2 (en) 2008-06-20 2012-12-25 Lam Research Corporation Methods for controlling time scale of gas delivery into a processing chamber
US8397752B2 (en) 2008-10-22 2013-03-19 Globe Union Industrial Corp. Process for fabricating integral plastic faucet member and finished product thereof
US20140020779A1 (en) 2009-06-10 2014-01-23 Vistadeltek, Llc Extreme flow rate and/or high temperature fluid delivery substrates
KR101366019B1 (ko) 2010-02-22 2014-02-21 가부시키가이샤 후지킨 혼합 가스 공급 장치
KR101814096B1 (ko) 2010-02-23 2018-01-02 아사히 유키자이 가부시키가이샤 인라인형 유체 혼합 장치
US8852685B2 (en) 2010-04-23 2014-10-07 Lam Research Corporation Coating method for gas delivery system
US9156050B2 (en) 2010-06-24 2015-10-13 Graco Minnesota Inc. Fluid circulation valve assembly for fluid proportioner
US10350556B2 (en) 2011-01-07 2019-07-16 Microfluidics International Corporation Low holdup volume mixing chamber
US9129778B2 (en) 2011-03-18 2015-09-08 Lam Research Corporation Fluid distribution members and/or assemblies
US9079140B2 (en) 2011-04-13 2015-07-14 Microfluidics International Corporation Compact interaction chamber with multiple cross micro impinging jets
US8746284B2 (en) 2011-05-11 2014-06-10 Intermolecular, Inc. Apparatus and method for multiple symmetrical divisional gas distribution
EP2820915B1 (en) 2012-02-27 2017-01-04 Watlow Electric Manufacturing Company Temperature detection and control system for layered heaters
US9091397B2 (en) 2012-03-27 2015-07-28 Lam Research Corporation Shared gas panels in plasma processing chambers employing multi-zone gas feeds
US10002747B2 (en) 2012-03-27 2018-06-19 Lam Research Corporation Methods and apparatus for supplying process gas in a plasma processing system
US8851113B2 (en) 2012-03-27 2014-10-07 Lam Research Coporation Shared gas panels in plasma processing systems
JP6123208B2 (ja) 2012-09-28 2017-05-10 東京エレクトロン株式会社 成膜装置
US20140137961A1 (en) 2012-11-19 2014-05-22 Applied Materials, Inc. Modular chemical delivery system
US9090972B2 (en) 2012-12-31 2015-07-28 Lam Research Corporation Gas supply systems for substrate processing chambers and methods therefor
US20140202577A1 (en) 2013-01-21 2014-07-24 William Gardiner WEBSTER, III Duct fitting apparatus with reduced flow pressure loss and method of formation thereof
GB201310452D0 (en) 2013-06-12 2013-07-24 Blagdon Actuation Res Ltd Fluid Manifolds
US10090211B2 (en) * 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
TWI693638B (zh) 2014-04-07 2020-05-11 美商蘭姆研究公司 獨立於配置的氣體輸送系統
WO2015191960A1 (en) 2014-06-13 2015-12-17 Vistadeltek, Llc High conductance valve for fluids and vapors
CN112549529B (zh) 2014-07-13 2022-11-29 斯特拉塔西斯公司 用于三维打印的系统及制造三维物体的方法
US10557197B2 (en) 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US20160111257A1 (en) 2014-10-17 2016-04-21 Lam Research Corporation Substrate for mounting gas supply components and methods thereof
MX369370B (es) 2015-04-08 2019-11-06 Decatur Diamond Llc Fresa con conductos lubricacion.
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10118263B2 (en) 2015-09-02 2018-11-06 Lam Researech Corporation Monolithic manifold mask and substrate concepts
US9879795B2 (en) 2016-01-15 2018-01-30 Lam Research Corporation Additively manufactured gas distribution manifold
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6168948B1 (en) * 1995-06-29 2001-01-02 Affymetrix, Inc. Miniaturized genetic analysis systems and methods
US6581640B1 (en) * 2000-08-16 2003-06-24 Kelsey-Hayes Company Laminated manifold for microvalve

Also Published As

Publication number Publication date
KR20240017979A (ko) 2024-02-08
US10914003B2 (en) 2021-02-09
JP2017534174A (ja) 2017-11-16
WO2016061493A1 (en) 2016-04-21
CN107075670A (zh) 2017-08-18
TW201634735A (zh) 2016-10-01
US20200141002A1 (en) 2020-05-07
KR20170071552A (ko) 2017-06-23
TWI668322B (zh) 2019-08-11
SG11201703128UA (en) 2017-05-30
US10557197B2 (en) 2020-02-11
TWI682061B (zh) 2020-01-11
TW201934799A (zh) 2019-09-01
US20160108523A1 (en) 2016-04-21

Similar Documents

Publication Publication Date Title
CN107075670B (zh) 单片气体分配歧管及多种建构技术及其使用案例
KR102376011B1 (ko) 가스 전달 시스템의 모놀리식 세라믹 컴포넌트 및 이의 제작 방법 및 이용
KR102626481B1 (ko) 임베딩된 전극을 갖는 세라믹 가스 분배 플레이트
US20160111257A1 (en) Substrate for mounting gas supply components and methods thereof
TWI835740B (zh) 單片陶瓷氣體分配板
US10794519B2 (en) Additively manufactured gas distribution manifold
US9879795B2 (en) Additively manufactured gas distribution manifold
KR102055040B1 (ko) 배플 플레이트 및 샤워헤드 어셈블리들 및 대응하는 제작 방법
JP2017534174A5 (cg-RX-API-DMAC7.html)
CN110998818A (zh) 等离子体蚀刻工艺中使用涂布部件的工艺裕度扩充
CN113508191A (zh) 具有高长宽比孔洞及高孔洞密度的气体分布板
CN103993293A (zh) 带温度控制的多室喷头
KR20240093865A (ko) 라디칼 종 전달을 위한 구멍 크기를 갖는 샤워헤드
KR102855716B1 (ko) 유지 장치
KR102662822B1 (ko) MEMS-기반 코리올리 (coriolis) 질량 유량 제어기
TWI911754B (zh) 基板支撐件
CN120981878A (zh) 半导体处理腔室盖及涂层
US20260049399A1 (en) Hybrid semiconductor gas flow components with smooth internal walls
TWI915728B (zh) 體現在機器可讀媒體中的結構、電漿處理系統及製造一體式氣體中樞及分配噴嘴之方法
CN101495669A (zh) 经结合的多层射频窗
TW202424251A (zh) 多通道加熱氣體輸送系統

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant