CN107075309B - 浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法 - Google Patents

浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法 Download PDF

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Publication number
CN107075309B
CN107075309B CN201580047704.7A CN201580047704A CN107075309B CN 107075309 B CN107075309 B CN 107075309B CN 201580047704 A CN201580047704 A CN 201580047704A CN 107075309 B CN107075309 B CN 107075309B
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China
Prior art keywords
water
polyvinyl alcohol
composition
polishing
slurry composition
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CN201580047704.7A
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English (en)
Chinese (zh)
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CN107075309A (zh
Inventor
增田刚
北村启
松村义之
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CMC Materials LLC
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Nihon Cabot Microelectronics KK
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Publication of CN107075309A publication Critical patent/CN107075309A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3753—Polyvinylalcohol; Ethers or esters thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Materials Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN201580047704.7A 2014-09-05 2015-09-04 浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法 Active CN107075309B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-181015 2014-09-05
JP2014181015A JP6559936B2 (ja) 2014-09-05 2014-09-05 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法
PCT/JP2015/004504 WO2016035346A1 (en) 2014-09-05 2015-09-04 Slurry composition, rinse composition, substrate polishing method and rinsing method

Publications (2)

Publication Number Publication Date
CN107075309A CN107075309A (zh) 2017-08-18
CN107075309B true CN107075309B (zh) 2020-09-01

Family

ID=54197031

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CN201580047704.7A Active CN107075309B (zh) 2014-09-05 2015-09-04 浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法

Country Status (5)

Country Link
JP (1) JP6559936B2 (enExample)
KR (1) KR102524838B1 (enExample)
CN (1) CN107075309B (enExample)
TW (1) TWI633178B (enExample)
WO (1) WO2016035346A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6801964B2 (ja) * 2016-01-19 2020-12-16 株式会社フジミインコーポレーテッド 研磨用組成物及びシリコン基板の研磨方法
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
JP7050684B2 (ja) * 2016-08-31 2022-04-08 株式会社フジミインコーポレーテッド 研磨用組成物および研磨用組成物セット
JP6495230B2 (ja) 2016-12-22 2019-04-03 花王株式会社 シリコンウェーハ用リンス剤組成物
KR102508181B1 (ko) * 2016-12-28 2023-03-09 니타 듀퐁 가부시키가이샤 연마용 조성물 및 연마 방법
KR102825101B1 (ko) * 2016-12-28 2025-06-26 니타 듀퐁 가부시키가이샤 연마용 조성물
WO2019187969A1 (ja) * 2018-03-30 2019-10-03 株式会社フジミインコーポレーテッド 研磨用組成物
JP7361467B2 (ja) * 2018-12-25 2023-10-16 ニッタ・デュポン株式会社 研磨用組成物
JP2020203980A (ja) * 2019-06-17 2020-12-24 日本キャボット・マイクロエレクトロニクス株式会社 化学機械研磨組成物、リンス組成物、化学機械研磨方法及びリンス方法
CN112457930A (zh) * 2019-09-06 2021-03-09 福吉米株式会社 表面处理组合物、表面处理组合物的制造方法、表面处理方法和半导体基板的制造方法
JP7495283B2 (ja) * 2019-09-06 2024-06-04 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の製造方法、表面処理方法、および半導体基板の製造方法
JP7477964B2 (ja) * 2019-12-13 2024-05-02 インテグリス・インコーポレーテッド 化学機械研磨組成物及びそれを用いた化学機械研磨方法
JP7495317B2 (ja) * 2020-09-25 2024-06-04 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の製造方法、表面処理方法、および半導体基板の製造方法
JP7645682B2 (ja) * 2021-03-31 2025-03-14 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の製造方法、表面処理方法、及び半導体基板の製造方法
KR102728251B1 (ko) * 2021-12-31 2024-11-11 주식회사 케이씨텍 컨택 공정용 금속막 슬러리 조성물
KR20230106938A (ko) * 2022-01-07 2023-07-14 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
CN115873508A (zh) * 2022-12-26 2023-03-31 博力思(天津)电子科技有限公司 去除速率高且表面粗糙度低的SiC衬底抛光液及抛光工艺

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140427A (ja) * 1997-11-13 1999-05-25 Kobe Steel Ltd 研磨液および研磨方法
CN1384860A (zh) * 1999-11-04 2002-12-11 先进微装置公司 含有机添加剂的钽障壁浆液
CN1613941A (zh) * 2003-09-05 2005-05-11 福吉米株式会社 抛光组合物
CN1721515A (zh) * 2004-06-18 2006-01-18 福吉米株式会社 清洗组合物及清洗和制造硅片的方法
TW201350563A (zh) * 2012-03-14 2013-12-16 Fujimi Inc 研磨用組成物及半導體基板之製造方法
TW201412960A (zh) * 2012-05-25 2014-04-01 Nissan Chemical Ind Ltd 晶圓用研磨液組成物
TW201527506A (zh) * 2013-10-25 2015-07-16 Kao Corp 矽晶圓用研磨液組合物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011158718A1 (ja) * 2010-06-18 2011-12-22 日立化成工業株式会社 半導体基板用研磨液及び半導体ウエハの製造方法
JP2014038906A (ja) * 2012-08-13 2014-02-27 Fujimi Inc 研磨用組成物、当該研磨用組成物の製造方法、及び当該研磨用組成物を用いた半導体基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140427A (ja) * 1997-11-13 1999-05-25 Kobe Steel Ltd 研磨液および研磨方法
CN1384860A (zh) * 1999-11-04 2002-12-11 先进微装置公司 含有机添加剂的钽障壁浆液
CN1613941A (zh) * 2003-09-05 2005-05-11 福吉米株式会社 抛光组合物
CN1721515A (zh) * 2004-06-18 2006-01-18 福吉米株式会社 清洗组合物及清洗和制造硅片的方法
TW201350563A (zh) * 2012-03-14 2013-12-16 Fujimi Inc 研磨用組成物及半導體基板之製造方法
TW201412960A (zh) * 2012-05-25 2014-04-01 Nissan Chemical Ind Ltd 晶圓用研磨液組成物
TW201527506A (zh) * 2013-10-25 2015-07-16 Kao Corp 矽晶圓用研磨液組合物

Also Published As

Publication number Publication date
KR20170048513A (ko) 2017-05-08
WO2016035346A1 (en) 2016-03-10
CN107075309A (zh) 2017-08-18
JP2016056220A (ja) 2016-04-21
TW201615797A (zh) 2016-05-01
KR102524838B1 (ko) 2023-04-24
TWI633178B (zh) 2018-08-21
JP6559936B2 (ja) 2019-08-14

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Address after: Mie, Japan

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Patentee before: NIHON CABOT MICROELECTRONICS Kabushiki Kaisha

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