CN107068664A - A kind of LED COB light sources and preparation method thereof - Google Patents
A kind of LED COB light sources and preparation method thereof Download PDFInfo
- Publication number
- CN107068664A CN107068664A CN201611238609.8A CN201611238609A CN107068664A CN 107068664 A CN107068664 A CN 107068664A CN 201611238609 A CN201611238609 A CN 201611238609A CN 107068664 A CN107068664 A CN 107068664A
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- Prior art keywords
- heat conduction
- copper
- led
- light sources
- disjunctor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED COB light sources, including heat conduction plastic matrix support, the LED COB light sources are sequentially arranged with plastics box dam, fluorescent powder colloid, flip LED chips, copper foil circuit layer, ceramic matrix insulating barrier, heat conduction plastic matrix support, copper-based disjunctor radiating piece from bottom to up.The copper-based disjunctor radiating piece is integrally formed by bottom with some thermal columns.There is a pedestal to load for copper-based disjunctor radiating piece 7 in the middle of above the heat conduction plastic matrix support, there are some post holes to be inserted for thermal column in the pedestal.The heat conduction plastic matrix support surrounding arm of angle has screw hole.The invention discloses also LED COB light source preparation methods.Good heat dissipation effect of the present invention, rational in infrastructure, technique is simple, easy for installation.
Description
Technical field
The present invention relates to a kind of LED/light source, specifically a kind of LED-COB light sources and preparation method thereof.
Background technology
LED-COB light sources are directly against the integrated area source technology of specular removal on metallic substrates in LED chip.Its is electrical
Stable, circuit design, optical design, heat dissipation design are scientific and reasonable；Height develops the color, lighted uniformly, without hot spot, health environment-friendly.It is existing
In technology, the installation of LED-COB light sources is inconvenient, radiator structure is undesirable, and technique is more complicated, and cost is high.
The content of the invention
The present invention is in view of the shortcomings of the prior art, simple there is provided a kind of good heat dissipation effect, scientific and reasonable for structure, technique
LED-COB light sources and preparation method thereof.
Technical scheme：A kind of LED-COB light sources, including heat conduction plastic matrix support, the LED-COB light sources are from bottom to up
It is sequentially arranged with plastics box dam, fluorescent powder colloid, flip LED chips, copper foil circuit layer, ceramic matrix insulating barrier, heat conduction plastic cement base
Body support frame, copper-based disjunctor radiating piece.
The copper-based disjunctor radiating piece is integrally formed by bottom with some thermal columns.
There is a pedestal to load for copper-based disjunctor radiating piece 7 in the middle of above the heat conduction plastic matrix support, in the pedestal
There are some post holes to be inserted for thermal column.
The heat conduction plastic matrix support surrounding arm of angle has screw hole.
A kind of LED-COB light sources preparation method includes as follows：
(1) fix copper-based disjunctor radiating piece with tool to be fitted into the pedestal of heat conduction plastic matrix support, thermal column insertion post
Hole, impact forging compacting makes heat conduction plastic matrix support be integrally formed with copper-based disjunctor radiating piece；
(2) with sinter molding and it is polished to the ceramic matrix insulating barrier of minute surface and sticks at heat conduction plastic matrix cradle bottom surface, copper
Paper tinsel line layer is laid on ceramic matrix surface of insulating layer, and LED chip is packaged on copper foil circuit layer in upside-down mounting mode, flip LED core
Piece both positive and negative polarity electrical connection corresponding with the both positive and negative polarity on copper foil circuit layer, glue is dried；
(3) ceramic matrix insulating barrier periphery is adhered to plastics box dam, and surrounds flip LED chips, pour into fluorescent material with
The fluorescent powder colloid of colloid mixing, horizontal is put into baking box drying.
Beneficial effect：The present invention using copper-based disjunctor radiating piece as LED chip by adopting the above-described technical solution, radiated
Medium, can efficiently export the heat produced during LED chip work, reduce junction temperature.Meanwhile, the ceramic matrix for being polished to minute surface is exhausted
Edge layer thermal conductivity factor is high, further improves radiating effect and improves light output.Using flip LED chips, gold thread connection, section are not required to
About cost, dependable performance.Using plastics box dam, subsequent terminal can directly be put using diaphragm such as mounted lens, reflector,
It is not required to additionally mounted support.The heat conduction plastic matrix support surrounding arm of angle have screw hole be conveniently installed on lamp radiator it is time saving simultaneously
Cost-saving.Install simple and convenient.
Brief description of the drawings
Fig. 1 is main structure diagram of the present invention.
Fig. 2 is backsight structural representation of the present invention.
Fig. 3 is Fig. 1 structure decomposition figures.
Fig. 4 is Fig. 2 structure decomposition figures.
Fig. 5 is heat conduction plastic matrix supporting structure schematic diagram of the present invention.
Fig. 6 is copper-based disjunctor heat spreader structure schematic diagram of the invention.
Label is represented in figure：1 plastics box dam, 2 fluorescent powder colloids, 3 flip LED chips, 4 copper foil circuits layer, 5 ceramic matrixs
Insulating barrier, 6 heat conduction plastic matrix supports, 7 copper-based disjunctor radiating pieces, 8 thermal columns, 9 screw holes, 10 bottoms, 11 pedestals, 12 posts
Hole.
Embodiment
For the ease of understanding the present invention, the present invention will be described more fully below.The present invention gives preferable reality
Apply mode.But, the present invention can be realized in many different forms, however it is not limited to embodiments described herein.Phase
Instead there is provided the purpose of these embodiments made to the more thorough comprehensive of the disclosure understanding.
It should be noted that when element is referred to as " connecting " another element, it can be directly to another yuan
Part may be simultaneously present centering elements.Unless otherwise defined, all of technologies and scientific terms used here by the article and category
The implication being generally understood that in the those skilled in the art of the present invention is identical.Used in the description of the invention herein
Term be intended merely to describe specific embodiment purpose, it is not intended that in limitation the present invention.Term as used herein
" and/or " include the arbitrary and all combination of one or more related Listed Items.
See Fig. 1-6, a kind of LED-COB light sources, including heat conduction plastic matrix support 6, the LED-COB light sources are from bottom to up
It is sequentially arranged with plastics box dam 1, fluorescent powder colloid 2, flip LED chips 3, copper foil circuit layer 4, ceramic matrix insulating barrier 5, heat conduction modeling
Matrix body support frame 6, copper-based disjunctor radiating piece 7.
The copper-based disjunctor radiating piece 7 is integrally formed by bottom 10 with some thermal columns 8.
The heat conduction plastic matrix support 6 has a pedestal 11 to load for copper-based disjunctor radiating piece 7 in the middle of above, the pedestal
There are some post holes 12 to be inserted for some thermal columns 8 in 11.Thermal column can be diameter 3MM, height 3MM, the thickness of bottom 10 of disjunctor
1MM, whole heat conduction plastic matrix support height 3MM.
The surrounding arm of angle of heat conduction plastic matrix support 6 has screw hole 9, is installed for lamp radiator.
A kind of LED-COB light sources preparation method includes as follows：
(1) fix copper-based disjunctor radiating piece 7 with tool to be fitted into the pedestal 11 of heat conduction plastic matrix support 6, thermal column 8 is inserted
Enter post holes 12, impact forging compacting makes heat conduction plastic matrix support 6 be integrally formed with copper-based disjunctor radiating piece 7.
(2) with HTHP sinter molding and it is polished to the ceramic matrix insulating barrier 5 of minute surface and sticks at heat conduction plastic matrix branch
The bottom surface of frame 6, copper foil circuit layer 4 is laid on the surface of ceramic matrix insulating barrier 5, and LED chip is packaged in copper foil circuit layer 4 in upside-down mounting mode
On, flip LED chips both positive and negative polarity is corresponding with the both positive and negative polarity on copper foil circuit layer 4 to be electrically connected, flip LED chips and copper foil circuit layer
On polarity connection can be with elargol, glue is dried after insulating cement encapsulation.
(3) periphery of ceramic matrix insulating barrier 5 is adhered to plastics box dam 1, and surrounds flip LED chips 3, pour into fluorescent material
The fluorescent powder colloid 2 mixed with colloid, horizontal be put into baking box drying light source assembly.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to the present invention's
Protection domain.
Claims (5)
1. a kind of LED-COB light sources, including heat conduction plastic matrix support, it is characterised in that：The LED-COB light sources are from bottom to up
It is sequentially arranged with plastics box dam, fluorescent powder colloid, flip LED chips, copper foil circuit layer, ceramic matrix insulating barrier, heat conduction plastic cement base
Body support frame, copper-based disjunctor radiating piece.
2. a kind of LED-COB light sources according to claim 1, it is characterised in that：The copper-based disjunctor radiating piece is by bottom
It is integrally formed with some thermal columns.
3. a kind of LED-COB light sources according to claim 1 or 2, it is characterised in that：On the heat conduction plastic matrix support
There is a pedestal to load for copper-based disjunctor radiating piece in the middle of face, there are some post holes to be inserted for thermal column in the pedestal.
4. a kind of LED-COB light sources according to claim 1, it is characterised in that：The heat conduction plastic matrix support surrounding
The arm of angle has screw hole.
5. a kind of LED-COB light sources preparation method described in a kind of claim 1, it is characterised in that its method includes as follows：
(1) fix copper-based disjunctor radiating piece with tool to be fitted into the pedestal of heat conduction plastic matrix support, thermal column insertion post holes, punching
Forging and stamping system makes heat conduction plastic matrix support be integrally formed with copper-based disjunctor radiating piece；
(2) with sinter molding and it is polished to the ceramic matrix insulating barrier of minute surface and sticks at heat conduction plastic matrix cradle bottom surface, copper foil line
Road floor is laid on ceramic matrix surface of insulating layer, and LED chip is packaged on copper foil circuit layer in upside-down mounting mode, and flip LED chips are just
Negative pole electrical connection corresponding with the both positive and negative polarity on copper foil circuit layer, glue is dried；
(3) ceramic matrix insulating barrier periphery is adhered to plastics box dam, and surrounds flip LED chips, pour into fluorescent material and colloid
The fluorescent powder colloid of mixing, horizontal is put into baking box drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611238609.8A CN107068664A (en) | 2016-12-28 | 2016-12-28 | A kind of LED COB light sources and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611238609.8A CN107068664A (en) | 2016-12-28 | 2016-12-28 | A kind of LED COB light sources and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107068664A true CN107068664A (en) | 2017-08-18 |
Family
ID=59623604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611238609.8A Pending CN107068664A (en) | 2016-12-28 | 2016-12-28 | A kind of LED COB light sources and preparation method thereof |
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| Country | Link |
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| CN (1) | CN107068664A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007311510A (en) * | 2006-05-18 | 2007-11-29 | Ngk Spark Plug Co Ltd | Wiring board |
| CN204905297U (en) * | 2015-08-06 | 2015-12-23 | 永林电子有限公司 | Heat dissipation type COB light source |
| CN105428512A (en) * | 2015-11-16 | 2016-03-23 | 江西华柏节能照明科技协同创新有限公司 | Optical engine module based on low-heat-resistance heat dissipation technology |
-
2016
- 2016-12-28 CN CN201611238609.8A patent/CN107068664A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007311510A (en) * | 2006-05-18 | 2007-11-29 | Ngk Spark Plug Co Ltd | Wiring board |
| CN204905297U (en) * | 2015-08-06 | 2015-12-23 | 永林电子有限公司 | Heat dissipation type COB light source |
| CN105428512A (en) * | 2015-11-16 | 2016-03-23 | 江西华柏节能照明科技协同创新有限公司 | Optical engine module based on low-heat-resistance heat dissipation technology |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170818 |
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| RJ01 | Rejection of invention patent application after publication |