CN107030952B - 树脂材料供给装置及方法、以及压缩成形装置 - Google Patents

树脂材料供给装置及方法、以及压缩成形装置 Download PDF

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Publication number
CN107030952B
CN107030952B CN201611174792.XA CN201611174792A CN107030952B CN 107030952 B CN107030952 B CN 107030952B CN 201611174792 A CN201611174792 A CN 201611174792A CN 107030952 B CN107030952 B CN 107030952B
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CN
China
Prior art keywords
resin material
redirecting
flexible sheet
compression molding
horizontal portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CN201611174792.XA
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English (en)
Chinese (zh)
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CN107030952A (zh
Inventor
竹内慎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
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Towa Corp
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Publication of CN107030952A publication Critical patent/CN107030952A/zh
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00Making preforms
    • B29B11/02Making preforms by dividing preformed material, e.g. sheets, rods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/01Manufacture or treatment
    • H10W74/016Manufacture or treatment using moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • B29C2043/3405Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3416Feeding the material to the mould or the compression means using carrying means conveyor belts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • B29C2043/3405Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3427Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/0198Manufacture or treatment batch processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
CN201611174792.XA 2015-12-22 2016-12-19 树脂材料供给装置及方法、以及压缩成形装置 Active CN107030952B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-250316 2015-12-22
JP2015250316A JP6654887B2 (ja) 2015-12-22 2015-12-22 樹脂材料供給装置及び方法並びに圧縮成形装置

Publications (2)

Publication Number Publication Date
CN107030952A CN107030952A (zh) 2017-08-11
CN107030952B true CN107030952B (zh) 2019-12-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611174792.XA Active CN107030952B (zh) 2015-12-22 2016-12-19 树脂材料供给装置及方法、以及压缩成形装置

Country Status (4)

Country Link
JP (1) JP6654887B2 (https=)
KR (1) KR101891894B1 (https=)
CN (1) CN107030952B (https=)
TW (1) TWI597147B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
JP6725945B2 (ja) * 2019-06-20 2020-07-22 株式会社オリンピア 遊技機
JP6725944B2 (ja) * 2019-06-20 2020-07-22 株式会社オリンピア 遊技機
JP6725946B2 (ja) * 2019-06-25 2020-07-22 株式会社オリンピア 遊技機
CN114589852B (zh) * 2022-03-17 2024-11-29 黄高维 一种工业生产用树脂井盖上料装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6096379A (en) * 1998-03-20 2000-08-01 Eckhoff; Paul S. Radiation processing apparatus and method
JP2003171009A (ja) * 2001-12-04 2003-06-17 Sainekkusu:Kk 半導体封止用粉状樹脂供給装置
CN103846432A (zh) * 2012-12-05 2014-06-11 兴化市东旭机械有限公司 一种钨粉装填装置
CN104221164A (zh) * 2012-04-09 2014-12-17 乐金华奥斯有限公司 太阳能电池密封材料用eva薄片制备装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815153Y2 (ja) * 1973-06-16 1983-03-26 株式会社クボタ プレスセイケイソウチ ニ オケル カナガタ ヘノ ザイリヨウキヨウキユウケンセイケイヒンハンシユツソウチ
JPS5981123A (ja) * 1982-11-01 1984-05-10 Toyota Motor Corp 圧縮成形用金型に可塑化樹脂材料を供給する方法および装置
JPS6389311A (ja) * 1986-10-03 1988-04-20 Mikuni Seisakusho:Kk スタンピング成形型の加熱成形用基材の供給方法
JPH0449127U (https=) * 1990-08-30 1992-04-24
JP2000326328A (ja) * 1999-05-24 2000-11-28 Meiwa Ind Co Ltd 加熱軟化樹脂シートの搬送方法
JP4791851B2 (ja) * 2006-02-24 2011-10-12 Towa株式会社 電子部品の樹脂封止成形装置
JP2008114512A (ja) * 2006-11-07 2008-05-22 Trinc:Kk 除電機能を持つ樹脂成型機および樹脂成型用除電方法
JP5693931B2 (ja) * 2010-11-25 2015-04-01 アピックヤマダ株式会社 樹脂モールド装置
JP5793806B2 (ja) * 2011-08-17 2015-10-14 アピックヤマダ株式会社 樹脂モールド装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6096379A (en) * 1998-03-20 2000-08-01 Eckhoff; Paul S. Radiation processing apparatus and method
JP2003171009A (ja) * 2001-12-04 2003-06-17 Sainekkusu:Kk 半導体封止用粉状樹脂供給装置
CN104221164A (zh) * 2012-04-09 2014-12-17 乐金华奥斯有限公司 太阳能电池密封材料用eva薄片制备装置
CN103846432A (zh) * 2012-12-05 2014-06-11 兴化市东旭机械有限公司 一种钨粉装填装置

Also Published As

Publication number Publication date
KR20170074749A (ko) 2017-06-30
TWI597147B (zh) 2017-09-01
KR101891894B1 (ko) 2018-08-24
JP6654887B2 (ja) 2020-02-26
TW201722670A (zh) 2017-07-01
CN107030952A (zh) 2017-08-11
JP2017113941A (ja) 2017-06-29

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