CN107020708A - 制备可流动非晶态聚α‑烯烃粘合剂粒料的方法 - Google Patents

制备可流动非晶态聚α‑烯烃粘合剂粒料的方法 Download PDF

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CN107020708A
CN107020708A CN201611063046.3A CN201611063046A CN107020708A CN 107020708 A CN107020708 A CN 107020708A CN 201611063046 A CN201611063046 A CN 201611063046A CN 107020708 A CN107020708 A CN 107020708A
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pellet
adhesive
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cooling fluid
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D·德赛
胡宇红
K·加斯帕尔
E·汉特威尔克
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Henkel AG and Co KGaA
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Abstract

本发明涉及一种制备自由流动的抗团聚非晶态聚α‑烯烃基粘合剂粒料的方法。该方法包括(a)通过浸在冷却流体中的模板的孔口挤出粘合剂；(b)将所述粘合剂在所述冷却流体中切割成多个粒料；(c)在约25℃‑约40℃的温度范围下，将所述粒料凝固至少30分钟；并且(d)将所述粒料与所述重结晶流体分离并且干燥所述粒料。所述粒料的硬化速度比常规形成的粒料快至少3倍。

Description

制备可流动非晶态聚α-烯烃粘合剂粒料的方法
本申请是2013年5月23日提交的国际申请号为WO2013/177382，中国国家申请号为201380027096.4，发明名称为“制备可流动非晶态聚α-烯烃粘合剂粒料的方法”的发明专利申请的分案申请。
技术领域
本发明涉及一种制备自由流动的抗团聚非晶态聚α-烯烃基粘合剂粒料的方法以及采用该方法制造的粘合剂粒料。
背景技术
通常将热熔粘合剂成型并包装成固体块，例如粒料(pellets)、chubs、枕头状(pillows)和块状(blocks)。相较于粉末，优选固体块，因为在装载和卸载过程中固体块与吸入相关的风险较小，并且在存贮和运送时具有便利性。还希望将所述粘合剂提供为可以存储并且随后可以自动运输并供给到应用位置处的应用装置中的形式。希望得到自由流动的抗团聚粒料，以减少最终使用操作的中断。
如美国专利号5041251中所述的软质粘性塑料材料的常规制粒技术包括在冷却流体中对材料进行挤出和切割，并且将粒料在所述冷却流体中保留至少几小时至几天。将粒料和冷却流体分离，并喷撒蜡粉以赋予非粘性。所述蜡通常具有高结晶度，因此有助于自由流动。
非晶态聚α-烯烃(APAO)基粘合剂具有低结晶度，本质上是柔软的和粘性的，并且在升高的温度下易于团聚(结块)成巨大的块。因为团聚的块必需用力进行再分散，所以团聚的粘合剂中断了最终使用操作。为防止这种团聚，APAO基粘合剂通常包装在圆桶(drum)内或作为带有保护性包装的各chubs、块状和枕头状进行包装；或者在冷却、隔热的轨道车中进行运输。由于上述限制，粒料粘合剂通常由例如乙烯乙酸乙烯酯和高结晶度烯烃基粘合剂等高结晶度粘合剂形成，而不是由APAO基粘合剂形成。
在本领域中，需要以较快的产出量生产非晶态聚α-烯烃基抗团聚粘合剂粒料。本发明满足了该需求。
发明内容
本发明提供了由非晶态聚α-烯烃聚合物组成的抗团聚粘合剂粒料的制备方法。该方法包括(a)通过浸在冷却流体中的模板的孔口挤出所述粘合剂，所述冷却流体的温度T1低于约45°F(7.2℃)；(b)将所述粘合剂在所述冷却流体中切割成多个粒料；(c)在重结晶流体中将所述粒料凝固至少30分钟，所述重结晶流体的温度T2比T1至少高30°F；以及(d)将粒料和重结晶流体分离并且干燥粒料。
所得粒料可以自由流动并且不结块(non-blocking)，可以在低于120°F的温度下长时间存储和运输，而不会团聚在一起。
申请人已经发现在约25-40℃(77-104°F)的温度范围内对粒料进行重结晶，可以将粘合剂重结晶的速度从几天提高到几个小时。申请人还发现所得的粒料的硬度特性比常规方法形成的粒料的硬度特性高至少3倍。
附图说明
图1A和1B为粘合剂的DSC扫描图。
图2为在各种温度下重结晶的粘合剂粒料的动态时间扫描测试图。
图3显示了在各种温度下重结晶的粘合剂粒料的变形百分比。
发明详述
下面对制备抗团聚粒料颗粒的方法以及采用该方法制备的粒料颗粒进行说明。该方法得到甚至在升高的存储和运输温度即高达120°F下仍然抗团聚的粒料颗粒。此外，该方法得到耐压缩的粒料颗粒，压缩可以导致结成巨大团块。
在升高的存储和运输温度例如120°F下，某些粘合剂组合物易于团聚。这种粘合剂组合物包括各种组分，并且大部分基于聚合物，例如聚烯烃或苯乙烯系嵌段共聚物，如SBS、SIS、SIBS，或它们的共混物等。本文中所用的聚合物表示均聚物、共聚物、三元共聚物或互聚物。
任何具有冷结晶温度的粘合剂，无论是晶体结构还是非晶形结构，都可以用在所述粘合剂中。优选地，所述粘合剂包括约30重量％-约90重量％的α-烯烃聚合物。在一个实施方案中，大于50％、优选60％的所述聚合物是非晶形态。非晶形态的聚合物具有较低的结构有序度，并且这种无组织的结果是没有可见结晶度。在另一个实施方案中，大于30％、优选50％的所述聚合物是半结晶形态。具有半结晶形态的聚合物由晶畴和非晶畴两者组成。优选地，所述半结晶形态聚合物具有小于30％的结晶度。
聚烯烃聚合物包括C2-C12的共聚物。在一个实施方案中，聚烯烃共聚单体由乙烯、丙烯、丁烯、己烷(hexane)、4-甲基-1-戊烯和/或1-辛烯组成。示例性α-烯烃选自乙烯、丁烯、戊烯-1,2-甲基戊烯-1,3甲基丁烯-1(pentene-1,2-methylpentene-1,3methylbutene-1)、己烯-1,3-甲基戊烯-1,4-甲基戊烯-1,3,3-二甲基丁烯-1(hexene-1,3-methylpentene-1,4-methylpentene-1,3,3-dimethylbutene-1)、庚烯-1、己烯-1、甲基己烯-1、二甲基戊烯-1、三甲基丁烯-1、乙基戊烯-1、辛烯-1、甲基戊烯-1、二甲基己烯-1、三甲基戊烯-1、乙基己烯-1、甲基乙基戊烯-1、二乙基丁烯-1、丙基戊烯-1(propylpentane-1)、癸烯-1、甲基壬烯-1、壬烯-1、二甲基辛烯-1、三甲基庚烯-1、乙基辛烯-1、甲基乙基丁烯-1、二乙基己烯-1、十二碳烯-1和1-十六碳烯-1。
聚烯烃还包括高密度聚乙烯、低密度聚乙烯、超低密度聚乙烯、线性低密度聚乙烯或乙烯高级α-烯烃共聚物；聚丙烯，其包括软质聚丙烯、无规共聚物、抗冲共聚物或多相聚丙烯和热塑性硫化聚丙烯或TPV基聚丙烯；聚丁烯，其包括聚1-丁烯均聚物和共聚物或聚异丁烯；辛烯、乙烯-丙烯单体或EPM、乙烯-丙烯-二烯单体或EPDM及它们的混合物。
示例性二烯共聚单体单元包括二乙烯基苯、1,4-己二烯、5-1,6-辛二烯(5-1,6-octadiene)、5-甲基-1,4-己二烯、3,7-二甲基-1,6-辛二烯、1,3-环戊二烯、1,4-环己二烯和二环戊二烯。
在优选实施方案中，聚烯烃是乙烯、丙烯和丁烯的共聚单体。
所述粘合剂进一步包括附加组分，例如增粘剂。在一个实施方案中，基于所述粘合剂的总重量，所述粘合剂包括约10重量％-50重量％的增粘剂。示例性增粘剂包括天然树脂和改性树脂、聚萜烯树脂、酚改性烃树脂、脂族烃和芳族烃树脂、氢化烃、氢化树脂、氢化树脂的酯和松香。松香及其衍生物的实例包括木松香、妥尔油、松脂(colophonium)、脂松香、木松香、松香酯树脂(包括其酯、氢化或脱氢形式)；萜烯树脂包括例如天然萜烯和合成萜烯、多萜烯和萜烯酯；芳族或脂族-芳族混合型增粘树脂，如来源于环戊二烯、二环戊二烯的聚合物；苯乙烯树脂，如来源于苯乙烯、α-甲基苯乙烯、乙烯基甲苯、甲氧基苯乙烯、叔丁基苯乙烯、氯苯乙烯的共聚物；来源于单体1,3-丁二烯、顺式-1,3-戊二烯、反式-1,3-戊二烯、2-甲基-1,3-丁二烯、2-甲基-2-丁烯和其他共聚合性单体或脂族石油烃树脂的脂族树脂。
优选地，增粘剂的软化点为约80℃-150℃(环球法(ring and ball method)，通过ASTM E28-58测得)。
任选地，可以向所述粘合剂添加量为0重量％-约10重量％的蜡。该蜡可以来源于天然蜡或合成蜡。适宜的天然蜡为植物蜡、动物蜡、矿物蜡或石化蜡。适宜的化学改性蜡为硬蜡，如褐煤酯蜡、沙索蜡(sarsol wax)等。适宜的合成蜡为聚亚烷基蜡和聚乙二醇蜡。优选的蜡为石化蜡，例如矿脂、微晶蜡(microwax)和合成蜡，特别是聚乙烯(PE)蜡、聚丙烯(PP)蜡、任选的PE或PP共聚物、Fischer-Tropsch树脂、石蜡或微晶蜡(microcrystallinewax)。
此外，可以向所述粘合剂添加不超过约10重量％的增塑剂。适宜的增塑剂为药用白油、环烷基矿物油、邻苯二甲酸酯、己二酸酯、聚丙烯、聚丁烯、聚异戊二烯低聚物、氢化聚异戊二烯和/或聚丁二烯低聚物、苯甲酸酯、植物油或动物油以及它们的衍生物。
所述粘合剂进一步可以包括例如以下组分：填料、抗氧剂、助剂、粘合促进剂、天然蜡、合成蜡、油类、低分子量聚合物、嵌段物、抗结块剂、颜料、加工助剂、UV稳定剂、中和剂、润滑剂、表面活性剂、成核剂(surfactants nucleating agents)、氧化聚烯烃、酸改性聚烯烃和/或酸酐改性聚烯烃。添加剂可以和作为单独组分、母料或组合形式的其他粘合剂组分进行结合。该选择和性质是本领域技术人员所熟知的。通常将它们以不超过约3重量％并且优选约0.1重量％-约2重量％的量添加到所述粘合剂中。
优选地，所述粘合剂是一种软质半压敏粘合剂，其针入度数(i)在25℃下调理1小时后为8-50dmm，(ii)在25℃下调理4小时后为10-45英寸/毫米(10or to 45inch/mm),(iii)在25℃下调理24小时后为10-40dmm。更优选地，所述粘合剂的针入度数(i)在25℃下调理1小时后为15-40dmm，(ii)在25℃下调理4小时后为15-40dmm(10or to 45dmm),(iii)在25℃下调理24小时后为10-30dmm。
与高结晶度的粘合剂不同，高含量APAO粘合剂在冷却时不具有重结晶温度。这种APAO基粘合剂具有冷结晶温度，并且可以在所述方法中利用任何具有冷结晶温度的粘合剂以形成不结块、自由流动的粒料。尽管本领域已知有多种确定冷结晶温度(Tc)的方法，本文中所报告的Tc值是通过差示扫描量热仪(DSC)确定的。首先将所述粘合剂加热到其熔点温度以上，以除去任何先前加热历史，然后冷却到其玻璃化转变温度(Tg)以下。APAO基粘合剂的缓慢结晶速率在冷却DSC扫描期间将所述粘合剂保持在非晶态。由于在第二加热DSC扫描中将该非晶态粘合剂缓慢加热到其玻璃化转变温度以上，所述粘合剂的非晶区域具有足够的动能和运动自由度，以将它们本身排列为晶体形式。将第二次加热扫描中观察到的放热峰确定为冷结晶温度。尽管没有受任何特定理论约束，据信，冷结晶提高了所述粘合剂的结晶度，并因此提高了所述粘合剂的硬度和强度。
在优选的实施方案中，所述粘合剂的冷结晶温度范围为约82°F-约104°F(约28℃-约40℃)。
制备抗团聚颗粒的方法包括：在升高的温度下熔化非晶态粘合剂，然后或者在冷却流体中或者立即浸入冷却流体中将粘合剂切割成多个粒料。可以将设备进行装配，使得模板浸入冷却流体中或刚好在冷却流体上方。在一个实施方案中，通过在冷却流体中的模板的孔口直接挤出所述粘合剂。
冷却流体的第一温度T1低于约45°F(7.2℃)。该温度的下限取决于流体，例如，对于水来说，冷却流体的下限为约33°F(0.5℃)，并且必须在冷却流体的凝固点以上。冷却流体包括水、二醇、液氮、压缩二氧化碳等。冷却流体可以进一步包括抗结块(antiblock)组合物，其以足够量至少部分地涂覆在颗粒表面上时抑制了颗粒结块(blocking)，即结饼(caking)、团聚(agglomerating)、聚集(aggregating)和/或粘接(sticking)。抗结块组合物包括粉末、硅酮、表面活性剂、蜡、聚合物以及它们的组合物。
抗结块组合物包括有机化合物或无机化合物，例如选自滑石、云母、碳酸钙、细碎二氧化硅或气相二氧化硅、有机酸、金属有机酯、纤维素衍生物、三水合氧化铝、大理石粉、水泥粉、粘土、长石、氧化铝、氧化镁、氢氧化镁、氧化锑、氧化锌、硫酸钡、硅酸铝、硅酸钙、二氧化钛、钛酸盐、白垩，聚合物如聚乙烯、聚丙烯、聚苯乙烯，以及它们的组合。抗结块(antiblocking)组合物可以以任意形式使用；但是，通常优选粉末。
通常，一旦切割粒料，就将它们从孔口运走以防止干扰连续挤出/制粒过程。可以通过本领域已知的各种方法将粒料从孔口运走，例如重力进料、工艺水流等。如本领域技术人员所知，工艺水流在约35gpm-350gpm间变化，取决于制粒机的尺寸和速度。
然后将粒料粘合剂在具有第二温度T2的重结晶流体中重结晶/凝固。重结晶流体温度依粘合剂而变化。在一个实施方案中，重结晶流体的T2的范围为约77°F-约105°F(约25℃-约41℃)。在优选实施方案中，重结晶流体的T2的范围为约82°F-约104°F(约28℃-约40℃)。
相较于改变(shock)或降低粒料整体温度以强制重结晶的常规技术，本发明方法将粒料暴露于高重结晶温度下以加速凝固过程。在优选方法中，将粒料在具有规定的温度T2的重结晶流体中保留最少约30分钟，优选地至少100分钟。
粒料在重结晶流体中硬化和重结晶的速度是常规方法的速度的至少3倍，并且，在重结晶流体中保留约40分钟、优选120分钟后，粒料具有足够的硬度或足够低的变形。
重结晶流体包括水、二醇、液氮、压缩二氧化碳等。重结晶流体还可以包括抗结块组合物。
然后将重结晶的粒料与重结晶流体分离，并干燥。干燥后，任选地，将重结晶的粒料喷撒(dusted)并涂敷干燥的抗结块组合物。
粒料形状可以根据制造方法而不同。它们可以具有小枕头形状，优选类似球的球形，或者在另一个优选实施方案中，它们形成圆柱形。在这种情况下，每个方向上的尺寸都不同，例如一个方向上为25mm，直径为2-10mm。不要求粒料的形状是规则的，例如，可以对球形压缩或拉伸，杆可以对称或具有不规则形状，只要颗粒尺寸不太大。形状会受制造方法的影响，例如将粒料挤压、切割和分离以得到部分圆形的形状。可以但不优选将不同形状和尺寸的粒料进行混合。本发明的另一个方面涉及粒料的尺寸。在一个实施方案中，每颗粒料的重量大于约5mg，并且小于约200mg，优选小于约100mg，最优选小于约80mg。小的颗粒尺寸增加了材料的流动性。
通常，以常规方式生产的包括主要为非晶或半晶形态的聚合物通常得到软质粒料。软质粒料在长期存储或升高温度时易于团聚。根据本发明的粒料在温度高达120°F时仍显示出自由流动特性。这种自由流动特性在升高的温度下存储后还保持稳定。
常规方法将粒料保留在冷却流体中以强制重结晶，而本发明方法在高于冷却流体至少30°F的温度下将粒料凝固。出乎意料的是，本发明方法将粘合剂凝固速度增大了至少2倍。此外，由本发明方法制成的粘合剂粒料的百分比变形值比常规方法制成的粒料至少低三分之二，甚至仅在重结晶约120分钟后。
提供以下实施例进一步描述本发明。这些实施例阐述了当前设想的用于实施本发明的优选方式，这些实施例是为了说明本发明而非限制本发明。
实施例
实施例1：粘合剂针入度
在25℃下在不同时间段内调理粘合剂样品，然后使用针入度仪根据ASTM D1321测量针入度值。结果如表1所示。
表1针入度
*1dmm＝0.1mm
与对比样品D和E相比，样品A、B和C的针入度值较高，表明样品A、B和C比坚硬的对比样品D和E软。由于对比样品D和E的针入度值低，对比样品D和E可以容易制粒。在本领域中通常认为较软或半压敏粘合剂更难制备非块状的粒料。
实施例2：峰值重结晶温度确定
通过差示扫描量热仪(DSC)确定粘合剂的冷结晶温度，并将这些温度在表2中进行概述。每种粘合剂以10℃/min升温到180℃进行熔化，然后以10℃/min冷却到-50℃并且在-50℃保温10分钟。然后以3℃/min将粘合剂再加热到180℃。使用DSC通用V4.5A TA仪器软件(DSC Universal V4.5A TA Instrument software)，确定冷结晶峰值(Tc)为第二次DSC加热的峰值放热温度。
表2冷结晶峰值温度
粘合剂 冷结晶温度(℃)
样品A 38
样品B 25
样品C 35
对比样品D 无
对比样品E 无
图1A和1B分别示出对于样品A和样品E冷却和第二次加热得出的曲线。样品A、B和C在冷却期间不具有重结晶温度(Tr)。只在第二次加热时，样品A、B和C才显示出冷结晶温度。与样品A、B和C不同，对比样品D和E在冷却时很容易重结晶。
实施例3
粘合剂粒料是采用试验造粒机(pilot pelletizer)通过以下方法制备的：
1、将APAO基粘合剂(具有>50％聚丙烯-聚丁烯共聚物的APAO粘合剂)装载到搅拌加热混合罐中并且在175℃下熔化。
2、将熔化的粘合剂强制通过孔口(尺寸：2.8mm)并且在冷却水流中切割。冷却水流含有T1(4℃)的水，流速为约55gpm-约65gpm以使粒料顺着水流移动。冷却罐还包含1.0％的抗结块剂。粒料流入搅拌重结晶/凝固罐中。
3、搅拌重结晶/凝固罐包括水和1.0％的抗结块剂。将重结晶/凝固罐的温度设为T2 35℃。
4、将粒料在重结晶/凝固罐中保留约120分钟。
实施例4：动态时间扫描测试
对多个在T2温度下重结晶/凝固得到的粒料的时间扫描曲线进行测试。对每个粒料样品运行ARES M中的动态时间扫描程序。在两个平行板之间在应用温度(150℃)下加热粒料样品，并且迅速冷却到指定的重结晶/凝固温度(40°F、80°F、85°F、90°F、100°F或105°F)并保持24小时。施加10rad/sec的频率，以及1.0％的恒定应变，并且随时间记录模量。图2所示为随时间变化的Tanδ值(Tan delta value)。Tanδ＝1时的温度表示粘合剂从液体变为固体的转变温度点(Tanδ大于1时，表示液体状粘合剂，以及Tanδ小于1时，表示固体状粘合剂)。
如图2所示，在常规重结晶温度(40°F)下对粒料重结晶，要求相当长的时间以横跨Tanδ＝1时的值，然而在90°F下凝固粒料使凝固速度增大了至少2倍。此外，当粒料在90°F下重结晶时，粒料的凝固显著快于常规方法。
实施例5：时间温度扫描测试中达到Tanδ＝1时的停留时间
基于时间温度扫描测试，达到Tanδ＝1时花费的停留时间显示在表3中。
表3停留时间
如表3所示，在80°F或以上的温度凝固样品A，将达到Tanδ＝1时的保持时间减少了至少20％。而且，将T2增加到85°F以上并低于105°F，最大限度地增大了凝固过程的速度。
实施例6：变形/硬度
通过测量在不同T2流体温度下凝固的粒料的百分比变形，检查样品A的粒料硬度。通过使用改进的千分尺(带磁铁和钢)测量初始直径(d0)，检查粒料变形。将70g重量放在粒料上1分钟，然后测量新的直径(d1)。计算至少12个粒料样品的百分比差，(d0-d1)/d0×100％，并且在图3中显示随重结晶流体温度变化的百分比变形。
图3显示了当粒料在T2(85°F和90°F)凝固时，平均变形最小。在90°F下凝固的粒料，甚至仅在约40分钟后，达到了小于约30％的变形。事实上，在90°F下重结晶时，仅在约40分钟后，大部分粒料达到了小于约20％的变形。相比之下，甚至在重结晶超过60分钟时，在48°F-76°F温度下凝固的粒料的变形范围为约60％-约80％。
此外，如图3所示，与在较低温度范围凝固相比，在85°F和90°F凝固的粒料凝固得显著更快，并且具有较低变形。
实施例7：结块性(blocking)
通过将约950g重量均匀分布在由不同温度下凝固的样品A制成的约200g的粒料的顶部，测量结块性。然后将整个组合(set-up)转移到120°F炉中，保持24小时。然后取出该组合并冷却到室温(约20℃)。然后人工目测所述粒料。如果粘合剂结块，给予“不合格”评级，对于完全没有结块的粘合剂，给予“合格”评级。
表4不同工艺条件下样品A的结块结果
对本领域技术人员显而易见的是，在不背离本发明精神和范围的前提下，可以对本发明做出多种修改和变化。给出本发明描述的具体实施方案仅用于示例，并且本发明仅由所附权利要求书以及这些权利要求的等同形式的全部范围所限制。

Claims (6)

1.多个粘合剂粒料，其通过包括以下步骤的方法制造：
a)通过浸在冷却流体中的模板的孔口挤出粘合剂，所述冷却流体的温度为T1；
b)将所述粘合剂在所述冷却流体中切割成多个粒料；
c)在温度为T2的重结晶流体中将所述粒料凝固至少30分钟且至多24小时；
d)将所述粒料与所述重结晶流体分离并且干燥所述粒料，
其中T1低于约45°F，并且T2比T1高至少30°F，
其中所述粘合剂包含具有冷结晶温度的非晶态聚α-烯烃聚合物；
其中所述熔粘合剂的针入度数(i)在77°F下调理1小时后为8-50dmm，(ii)在77°F下调理4小时后为10-45dmm,(iii)在77°F下调理24小时后为10-40dmm；并且
其中所述粒料的平均百分比变形(d0-d1)/d0×100％小于40％，其中d0为初始直径，d1为施加70g重量1分钟后测得的直径。
2.根据权利要求1所述的粘合剂粒料，其中所述粒料是热熔粘合剂粒料。
3.根据权利要求1所述的粘合剂粒料，其中所述非晶态聚α-烯烃聚合物包括乙烯、丙烯、丁烯、戊烯、己烷、庚烯、辛烷、壬烯、癸烯、十一碳烯、十二碳烯及它们的混合物的共聚单体。
4.根据权利要求3所述的粘合剂粒料，其中所述非晶态α-烯烃聚合物包括丙烯和丁烯的共聚单体。
5.根据权利要求1所述的粘合剂粒料，其中所述热熔粘合剂的冷结晶温度为约77°F-约105°F。
6.根据权利要求5所述的粘合剂粒料，其中所述热熔粘合剂的冷结晶温度为约82°F-约104°F。
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