CN107009069A - HGA wire-arranging mechanisms - Google Patents
HGA wire-arranging mechanisms Download PDFInfo
- Publication number
- CN107009069A CN107009069A CN201610058760.7A CN201610058760A CN107009069A CN 107009069 A CN107009069 A CN 107009069A CN 201610058760 A CN201610058760 A CN 201610058760A CN 107009069 A CN107009069 A CN 107009069A
- Authority
- CN
- China
- Prior art keywords
- hga
- wire
- bottom plate
- arranging mechanisms
- suction head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
Abstract
A kind of HGA wire-arranging mechanisms, it includes：Pedestal；Install lifting bottom plate on the base with can moving up and down；For the first motor for driving the lifting bottom plate to move up and down；Four groups of horizontal driving units on the lifting bottom plate are installed in, each horizontal driving units include connecting plate and the second motor for driving the connecting plate horizontal linear to act；And four Suction head components of the termination of this four connecting plates are respectively installed in, this four Suction head components constitute two pairs, respectively two HGA can be carried out drawing displacement realizing winding displacement.Winding displacement of the present invention is accurate, applied widely, and can improve bonding wire qualification rate.
Description
Technical field
The present invention relates to magnetic head process equipment, more particularly, to a kind of HGA (Head Gimbal Assembly, head suspension assembly) wire-arranging mechanism.
Background technology
A kind of existing HGA wire-arranging mechanisms, it includes a connecting seat, an eccentric wheel drive unit, a linkage and a dead man, wherein, connecting seat is vertically set, and it includes the first connecting plate being vertically connected and the second connecting plate；Eccentric wheel drive unit includes the eccentric roller for being installed in the first connecting plate；Linkage includes being installed in the second connecting plate and one first moving member, the gangbar that one end is connected with the first moving member and one second moving member being connected with the other end of gangbar above eccentric roller；Dead man is connected with the second moving member, when eccentric roller is rotated, drives the linkage of first, second moving member so that dead man actively can carry out positioning winding displacement to multiple HGA.The operation principle of this wire-arranging mechanism is generally comprised：By detent mechanism, locating piece is moved the position that HGA needs to reach, then with push arm mechanism urges HGA ends, HGA is spread to both sides, be positioned against mechanism, reach accurate position, reuse and push down mechanism and push down HGA tail ends, then welded, wait several seconds for welding and terminate.In other words, bonding wire craft flow includes：Detent mechanism is in place；Push arm mechanism urges HGA；Push down mechanism and push down HGA tail ends；Wire-arranging mechanism carries out bonding wire；And detent mechanism and push arm mechanism are exited.Existing this wire-arranging mechanism is a kind of mechanical winding displacement mode, and it has some shortcomings：If because pad end is not stretched out in the position of promotion, then pushing block just can not effectively promote HGA, therefore can not general all products；And, due to running into during high head portrait, it is impossible to determine that each HGA can accurately in place, therefore bonding wire qualification rate is low during high head portrait.It can be seen that, it is necessary to be improved existing HGA wire-arranging mechanisms in fact.
The content of the invention
The technical problems to be solved by the invention are to overcome the shortcomings of present in above-mentioned prior art, and propose a kind of HGA wire-arranging mechanisms, and winding displacement is accurate, applied widely, and can improve bonding wire qualification rate.
The present invention proposes a kind of HGA wire-arranging mechanisms for above-mentioned technical problem, and it includes：Pedestal；Install lifting bottom plate on the base with can moving up and down；For the first motor for driving the lifting bottom plate to move up and down；Four groups of horizontal driving units on the lifting bottom plate are installed in, each horizontal driving units include connecting plate and the second motor for driving the connecting plate horizontal linear to act；And four Suction head components of the termination of this four connecting plates are respectively installed in, this four Suction head components constitute two pairs, respectively two HGA can be carried out drawing displacement realizing winding displacement.
In certain embodiments, first pair of two Suction head components are alignd respectively with second pair of two Suction head components on horizontal linear.
In certain embodiments, the lifting bottom plate is installed on pedestal by lifting connecting portion；First motor drives the lifting connecting portion to drive the lifting bottom plate to move up and down by belt.
In certain embodiments, the lifting connecting portion includes nut-screw rod component and guide assembly.
In certain embodiments, each second motor drives corresponding connecting plate linearly operating by level connection joint portion.
In certain embodiments, the level connection joint portion includes nut-screw rod component and guide assembly.
In certain embodiments, each horizontal driving units also include position detection part, the horizontal linear position for detecting connecting plate.
In certain embodiments, each test section includes two inductors and the sensing chip being engaged with the two inductors.
In certain embodiments, each Suction head component includes square suction nozzle.
Compared with prior art, the HGA wire-arranging mechanisms of the present invention, by dexterously setting the first motor and lifting bottom plate to coordinate, four Suction head components can be driven to move up and down simultaneously, drive four Suction head component horizontal linears to act respectively by four groups of horizontal driving units being installed on the lifting bottom plate again, two HGA can be carried out draw with displacement to realize winding displacement, winding displacement is accurate, it is applied widely, and bonding wire qualification rate can be improved.
Brief description of the drawings
Fig. 1 is the stereogram of the HGA wire-arranging mechanisms of the present invention.
Fig. 2 is the front view of the HGA wire-arranging mechanisms of the present invention.
Wherein, description of reference numerals is as follows:The test section of 5 51 52 second motor of connecting plate, 53 level connection joint portion of horizontal driving units 6,7,8 Suction head component, 29 belt wheel, 41 nut-screw rod component, 42 guide assembly, 49 belt wheel of the pedestal 2 of the 10 HGA wire-arranging mechanisms 1 lifting bottom plate 3 first lifting connecting portion of motor 4 54.
Embodiment
Below in conjunction with the accompanying drawing of this specification, give presently preferred embodiments of the present invention further elaboration.
Referring to Fig. 1 and Fig. 2, Fig. 1 is the stereogram of the HGA wire-arranging mechanisms of the present invention.Fig. 2 is the front view of the HGA wire-arranging mechanisms of the present invention.The present invention proposes a kind of HGA wire-arranging mechanisms 10, and it is generally comprised：Pedestal 1；It is installed in the lifting bottom plate 2 on the pedestal 1 with can moving up and down；For the first motor 3 for driving the lifting bottom plate 2 to move up and down；Lifting connecting portion 4 for connecting the lifting bottom plate 2 and pedestal 1；It is installed in four groups of horizontal driving units 5 on the lifting bottom plate 2；And driven and four Suction head components 6,7,8 of horizontal rectilinear motion by four groups of horizontal driving units 5 respectively, this four Suction head component 6,7,8 constitutes two pairs, can carry out winding displacement processing to two HGA respectively.
The lifting connecting portion 4 includes nut-screw rod component 41 and guide assembly 42.Installed on the output shaft of first motor 3 and belt wheel 49 is installed on belt wheel 39, the nut-screw rod component 41, so that the first motor 3 can pass through belt（It is not shown）The nut-screw rod component 41 is driven to drive the lifting bottom plate 2 to move up and down.
Each horizontal driving units 5 include the connecting plate 51 for being used to install Suction head component 6,7,8, for the second motor 52 for driving the horizontal linear of connecting plate 51 to act, the level connection joint portion 53 between the output shaft of second motor 52 and connecting plate 51 is connected to, and for the test section 54 for the horizontal linear position for detecting connecting plate 51.In the present embodiment, the level connection joint portion 53 includes nut-screw rod component and guide assembly.The test section 54 includes two inductors and the sensing chip being engaged with the two inductors.
First pair of two Suction head components 6,7 are longitudinally-aligned.Second pair of two Suction head components 8（Not shown in another figure）It is longitudinally-aligned.And, first pair of two Suction head components 6,7 are alignd respectively with second pair of two Suction head components 8 on horizontal linear, that is, Suction head component 8 is alignd with Suction head component 6 on horizontal linear, the Suction head component not shown in figure is alignd with Suction head component 7 on horizontal linear.This structure, can make four arrangements of Suction head component 6,7,8 compact.In the present embodiment, each Suction head component 6,7,8 includes square suction nozzle.This structure, for conventional circular suction nozzle, in same area, can increase adsorption area, improve absorption affinity.
The operation principle of the HGA wire-arranging mechanisms 10 of the present invention is generally comprised：When material is reached below suction nozzle, the in situ of suction nozzle can be higher by several millimeters than material, and the first motor 3 drives four groups of suction nozzles to decline simultaneously by lifting connecting portion 4；Now vacuum is opened, four groups of suction nozzles are while the HGA of absorbing material, carry out winding displacement, winding displacement is to drive four groups of suction nozzles respectively by four the second motors 52 while carrying out the minute movement of horizontal linear, HGA is reached the accurate location of bonding wire needs, then, HGA holding positions are pushed down by other mechanism, first motor 3 drives lifter plate 2 to move up, and four the second motors 52 drive suction nozzle to next group of HGA position, the winding displacement of next group of progress.So move in circles, winding displacement number of times is determined according to material HGA quantity, until winding displacement terminates.
Compared with prior art, the HGA wire-arranging mechanisms 10 of the present invention, by dexterously setting the first motor 3 and lifting bottom plate 2 to coordinate, four Suction head components 6,7,8 can be driven to move up and down simultaneously, drive four horizontal linears of Suction head component 6,7,8 to act respectively by four groups of horizontal driving units 5 being installed on the lifting bottom plate 2 again, two HGA can be carried out draw with displacement to realize winding displacement, winding displacement is accurate, it is applied widely, and bonding wire qualification rate can be improved.
The above is only presently preferred embodiments of the present invention; it is not intended to limit embodiment of the present invention; those of ordinary skill in the art are according to central scope and spirit of the invention; corresponding flexible or modification can be very easily carried out, therefore protection scope of the present invention should be defined by the protection domain required by claims.
Claims (9)
1. a kind of HGA wire-arranging mechanisms, it is characterised in that including：Pedestal；Install lifting bottom plate on the base with can moving up and down；For the first motor for driving the lifting bottom plate to move up and down；Four groups of horizontal driving units on the lifting bottom plate are installed in, each horizontal driving units include connecting plate and the second motor for driving the connecting plate horizontal linear to act；And four Suction head components of the termination of this four connecting plates are respectively installed in, this four Suction head components constitute two pairs, respectively two HGA can be carried out drawing displacement realizing winding displacement.
2. according to the HGA wire-arranging mechanisms described in claim 1, it is characterised in that first pair of two Suction head components are alignd respectively with second pair of two Suction head components on horizontal linear.
3. according to the HGA wire-arranging mechanisms described in claim 1, it is characterised in that the lifting bottom plate is installed on pedestal by lifting connecting portion；First motor drives the lifting connecting portion to drive the lifting bottom plate to move up and down by belt.
4. according to the HGA wire-arranging mechanisms described in claim 3, it is characterised in that the lifting connecting portion includes nut-screw rod component and guide assembly.
5. according to the HGA wire-arranging mechanisms described in claim 1, it is characterised in that each second motor drives corresponding connecting plate linearly operating by level connection joint portion.
6. according to the HGA wire-arranging mechanisms described in claim 5, it is characterised in that the level connection joint portion includes nut-screw rod component and guide assembly.
7. according to the HGA wire-arranging mechanisms described in claim 1, it is characterised in that each horizontal driving units also include position detection part, the horizontal linear position for detecting connecting plate.
8. according to the HGA wire-arranging mechanisms described in claim 7, it is characterised in that each test section includes two inductors and the sensing chip being engaged with the two inductors.
9. according to the HGA wire-arranging mechanisms described in claim 1, it is characterised in that each Suction head component includes square suction nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610058760.7A CN107009069A (en) | 2016-01-28 | 2016-01-28 | HGA wire-arranging mechanisms |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610058760.7A CN107009069A (en) | 2016-01-28 | 2016-01-28 | HGA wire-arranging mechanisms |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107009069A true CN107009069A (en) | 2017-08-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610058760.7A Pending CN107009069A (en) | 2016-01-28 | 2016-01-28 | HGA wire-arranging mechanisms |
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| CN204505275U (en) * | 2015-03-26 | 2015-07-29 | 翊腾电子科技（昆山）有限公司 | A kind of vacuum slot of imitated structure |
| US9105282B1 (en) * | 2013-05-20 | 2015-08-11 | Western Digital Technologies, Inc. | Head gimbal assembly carrier with adjustable protective bar |
| CN105149758A (en) * | 2015-09-30 | 2015-12-16 | 广东华士科技股份有限公司 | Automatic wire arranging welding device |
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| US5832763A (en) * | 1996-05-31 | 1998-11-10 | Hutchinson Technology Incorporated | Gram load adjusting method for magnetic head suspensions |
| JP2001014625A (en) * | 1999-06-28 | 2001-01-19 | Internatl Business Mach Corp <Ibm> | Ultrasonic welding method between slider and lead wire, and welding inspection method |
| US6355122B1 (en) * | 1999-06-28 | 2002-03-12 | International Business Machines Corporation | Method for ultrasonically connecting and inspecting slider-lead joints for disk drive head gimbal assemblies |
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| WO2001071437A2 (en) * | 2000-03-22 | 2001-09-27 | Applied Kinetic, Inc. | Manufacturing apparatus and method |
| US20070143056A1 (en) * | 2004-02-12 | 2007-06-21 | Seagate Technology Llc | Head gimbal assembly loader |
| CN1822108A (en) * | 2005-02-08 | 2006-08-23 | 阿尔卑斯电气株式会社 | Combine method for solder balls of magnetic head assembly |
| CN1892875A (en) * | 2005-05-09 | 2007-01-10 | 日本发条株式会社 | Method of manufacturing head suspension |
| CN1942094A (en) * | 2005-09-29 | 2007-04-04 | 爱普斯有限公司 | Electronic component moving device, surface mounting machine and ic automatically conveying device |
| US8561285B1 (en) * | 2005-11-30 | 2013-10-22 | Western Digital Technologies, Inc. | Methods and devices for picking and placing workpieces into small form factor hard disk drives |
| US20080002302A1 (en) * | 2006-05-15 | 2008-01-03 | Hae-Sung Kwon | Method and apparatus for head gimbal assembly with improved shock performance in hard disk drive |
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| CN201226642Y (en) * | 2008-05-28 | 2009-04-22 | 力浦电子实业股份有限公司 | Free range interval regulation module for automatic part fetching/placing machine |
| CN202034709U (en) * | 2011-04-07 | 2011-11-09 | 黄少平 | Numerical control wiring machine |
| CN103093764A (en) * | 2011-11-02 | 2013-05-08 | 日本发条株式会社 | Wiring structure of head suspension and method of manufacturing the same |
| CN102654390A (en) * | 2011-11-25 | 2012-09-05 | 吴江市博众精工科技有限公司 | UV (ultraviolet) dispensing mechanism adjusting module |
| CN202640359U (en) * | 2012-05-29 | 2013-01-02 | 格兰达技术（深圳）有限公司 | Testing-gripper combined module device of IC (Integrated Circuit) chip testing sorter |
| CN102790143A (en) * | 2012-07-13 | 2012-11-21 | 深圳市因沃客科技有限公司 | Taking mechanism for full-automatic die bonder |
| CN202744099U (en) * | 2012-09-21 | 2013-02-20 | 富通集团有限公司 | Automatic winding displacement device |
| US9105282B1 (en) * | 2013-05-20 | 2015-08-11 | Western Digital Technologies, Inc. | Head gimbal assembly carrier with adjustable protective bar |
| CN104416577A (en) * | 2013-08-22 | 2015-03-18 | 深圳富泰宏精密工业有限公司 | Sucker mechanism |
| CN103538023A (en) * | 2013-10-14 | 2014-01-29 | 吴江市博众精工科技有限公司 | Automatic decimal alignment mounting machine |
| CN104191219A (en) * | 2014-08-29 | 2014-12-10 | 珠海市运泰利自动化设备有限公司 | Fog lamp clamp spring assembling device |
| CN204505275U (en) * | 2015-03-26 | 2015-07-29 | 翊腾电子科技（昆山）有限公司 | A kind of vacuum slot of imitated structure |
| CN105149758A (en) * | 2015-09-30 | 2015-12-16 | 广东华士科技股份有限公司 | Automatic wire arranging welding device |
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Application publication date: 20170804 |
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