CN107004664B - 可简单制造的电子元器件和制造电子元器件的方法 - Google Patents

可简单制造的电子元器件和制造电子元器件的方法 Download PDF

Info

Publication number
CN107004664B
CN107004664B CN201580063060.0A CN201580063060A CN107004664B CN 107004664 B CN107004664 B CN 107004664B CN 201580063060 A CN201580063060 A CN 201580063060A CN 107004664 B CN107004664 B CN 107004664B
Authority
CN
China
Prior art keywords
chip
carrier substrate
electronic component
tso
vss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580063060.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN107004664A (zh
Inventor
克里斯蒂安·鲍尔
汉斯·克吕格尔
于尔根·波特曼
阿洛伊斯·斯特尔兹利
沃尔夫冈·帕尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of CN107004664A publication Critical patent/CN107004664A/zh
Application granted granted Critical
Publication of CN107004664B publication Critical patent/CN107004664B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/222—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only  for microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H04R23/02—Transducers using more than one principle simultaneously
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H04R3/007—Protection circuits for transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0523—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Otolaryngology (AREA)
  • Health & Medical Sciences (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
  • Manufacture Of Switches (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201580063060.0A 2014-12-09 2015-10-19 可简单制造的电子元器件和制造电子元器件的方法 Active CN107004664B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014118214.6A DE102014118214B4 (de) 2014-12-09 2014-12-09 Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements
DE102014118214.6 2014-12-09
PCT/EP2015/074148 WO2016091438A1 (de) 2014-12-09 2015-10-19 Einfach herstellbares elektrisches bauelement und verfahren zur herstellung eines elektrischen bauelements

Publications (2)

Publication Number Publication Date
CN107004664A CN107004664A (zh) 2017-08-01
CN107004664B true CN107004664B (zh) 2021-02-05

Family

ID=54330770

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580063060.0A Active CN107004664B (zh) 2014-12-09 2015-10-19 可简单制造的电子元器件和制造电子元器件的方法

Country Status (10)

Country Link
US (1) US11245977B2 (enExample)
EP (1) EP3231010B1 (enExample)
JP (1) JP6672301B2 (enExample)
KR (1) KR102561741B1 (enExample)
CN (1) CN107004664B (enExample)
BR (1) BR112017012118A2 (enExample)
DE (1) DE102014118214B4 (enExample)
ES (1) ES2873364T3 (enExample)
MX (1) MX380533B (enExample)
WO (1) WO2016091438A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11067768B2 (en) * 2017-11-16 2021-07-20 Tdk Taiwan Corp. Optical member driving mechanism
CN111003682A (zh) * 2018-10-08 2020-04-14 凤凰先驱股份有限公司 电子封装件及其制法
CN111821567A (zh) * 2019-03-30 2020-10-27 深圳硅基仿生科技有限公司 电子封装体及植入式器件
CN111422821A (zh) * 2020-03-13 2020-07-17 清华大学 微系统封装方法
DE102024211816A1 (de) * 2024-12-11 2026-06-11 Robert Bosch Gesellschaft mit beschränkter Haftung Mikroelektromechanisches System mit mindestens einer Kontaktsäule, Verfahren zur Herstellung des mikroelektromechanischen Systems sowie Verwendung des mikroelektromechanischen Systems

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1611002A (zh) * 2001-12-28 2005-04-27 埃普科斯股份有限公司 结构高度低的封装元器件及制造方法
DE102012112058A1 (de) * 2012-12-11 2014-06-12 Epcos Ag MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6781231B2 (en) 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
JP4484544B2 (ja) * 2004-02-25 2010-06-16 京セラ株式会社 高周波モジュールの製造方法
US7323675B2 (en) * 2005-09-21 2008-01-29 Sigurd Microelectronics Corp. Packaging structure of a light-sensing device with a spacer wall
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
JP2008091639A (ja) * 2006-10-02 2008-04-17 Nec Electronics Corp 電子装置およびその製造方法
JP4903540B2 (ja) * 2006-11-29 2012-03-28 京セラ株式会社 微小電子機械部品封止用基板及び複数個取り形態の微小電子機械部品封止用基板、並びに微小電子機械装置及び微小電子機械装置の製造方法
KR100826394B1 (ko) * 2007-05-17 2008-05-02 삼성전기주식회사 반도체 패키지 제조방법
CN101325823B (zh) * 2007-06-11 2011-08-17 美律实业股份有限公司 硅晶麦克风的封装构造
TWI348872B (en) 2007-10-17 2011-09-11 Ind Tech Res Inst Electro-acoustic sensing device
US8900931B2 (en) * 2007-12-26 2014-12-02 Skyworks Solutions, Inc. In-situ cavity integrated circuit package
DE102009019446B4 (de) 2009-04-29 2014-11-13 Epcos Ag MEMS Mikrofon
US8227904B2 (en) 2009-06-24 2012-07-24 Intel Corporation Multi-chip package and method of providing die-to-die interconnects in same
US8428286B2 (en) * 2009-11-30 2013-04-23 Infineon Technologies Ag MEMS microphone packaging and MEMS microphone module
TWI451538B (zh) 2010-01-19 2014-09-01 通用微機電系統公司 微機電系統（ｍｅｍｓ）麥克風封裝體及其製造方法
DE102010006132B4 (de) 2010-01-29 2013-05-08 Epcos Ag Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
EP2420470B1 (en) * 2010-08-18 2015-10-14 Nxp B.V. MEMS Microphone
US9239386B2 (en) * 2011-10-05 2016-01-19 Infineon Technologies Ag Sonic sensors and packages
US9210516B2 (en) * 2012-04-23 2015-12-08 Infineon Technologies Ag Packaged MEMS device and method of calibrating a packaged MEMS device
JP5565544B2 (ja) * 2012-08-01 2014-08-06 株式会社村田製作所 電子部品及び電子部品モジュール
CN102917303B (zh) 2012-10-30 2015-03-18 无锡芯奥微传感技术有限公司 塑料壳封装麦克风
US9040349B2 (en) * 2012-11-15 2015-05-26 Amkor Technology, Inc. Method and system for a semiconductor device package with a die to interposer wafer first bond
CN103491490B (zh) * 2013-08-16 2019-03-19 上海集成电路研发中心有限公司 一种mems麦克风结构及其制造方法
CN103888879A (zh) * 2014-03-31 2014-06-25 山东共达电声股份有限公司 一种指向性mems麦克风
US9666514B2 (en) * 2015-04-14 2017-05-30 Invensas Corporation High performance compliant substrate
JP6450416B2 (ja) * 2016-04-29 2019-01-09 キヤノン株式会社 超音波トランスデューサ及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1611002A (zh) * 2001-12-28 2005-04-27 埃普科斯股份有限公司 结构高度低的封装元器件及制造方法
DE102012112058A1 (de) * 2012-12-11 2014-06-12 Epcos Ag MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen

Also Published As

Publication number Publication date
MX380533B (es) 2025-03-12
KR102561741B1 (ko) 2023-07-28
US11245977B2 (en) 2022-02-08
MX2017007254A (es) 2017-10-16
ES2873364T3 (es) 2021-11-03
BR112017012118A2 (pt) 2018-01-02
KR20170094143A (ko) 2017-08-17
US20170272855A1 (en) 2017-09-21
CN107004664A (zh) 2017-08-01
WO2016091438A1 (de) 2016-06-16
EP3231010B1 (de) 2021-03-03
DE102014118214B4 (de) 2024-02-22
JP2018506171A (ja) 2018-03-01
JP6672301B2 (ja) 2020-03-25
DE102014118214A1 (de) 2016-06-09
EP3231010A1 (de) 2017-10-18

Similar Documents

Publication Publication Date Title
JP5193898B2 (ja) 半導体装置及び電子装置
US8017452B2 (en) Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method
US7676912B2 (en) Method of manufacturing electronic component package
US20170288123A1 (en) Piezoelectric device and method for manufacturing the same
CN107342747B (zh) 声表面波器件晶圆级薄型封装结构及其制造方法
KR102561741B1 (ko) 용이하게 제조가능한 전기 컴포넌트 및 전기 컴포넌트를 제조하기 위한 방법
US11492250B2 (en) Electronic device and method for manufacturing an electronic device
CN111477617B (zh) 光学封装结构及其制造方法
CN114695145A (zh) 板级系统级封装方法及封装结构
US8415793B2 (en) Wafer and substructure for use in manufacturing electronic component packages
JP2011210818A (ja) 半導体構成体及び半導体構成体の製造方法
CN107978575B (zh) 封装结构及其制作方法
KR101176350B1 (ko) 반도체 패키지 제조용 기판 및 이를 이용한 반도체 패키지
JP2007227596A (ja) 半導体モジュール及びその製造方法
JP2007035779A (ja) リードレス中空パッケージ及びその製造方法
US7816176B2 (en) Method of manufacturing electronic component package
CN114823387A (zh) 板级系统级封装方法及封装结构
JP2013539253A (ja) モジュール及びその製造方法
JP2018107394A (ja) 配線基板及び電子部品装置とそれらの製造方法
JP4910953B2 (ja) 電子部品パッケージ構造
JP2012191054A (ja) 多数個取り配線基板および配線基板
JP2005093927A (ja) 半導体装置及び半導体装置の製造方法
JP2016143783A (ja) 電子装置
KR101374147B1 (ko) 멤스 디바이스 및 이의 제조 방법
JP5315642B2 (ja) 電子部品パッケージ

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant