CN106939417A - 印制线路板的化学镀锡配方 - Google Patents
印制线路板的化学镀锡配方 Download PDFInfo
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- CN106939417A CN106939417A CN201710297420.4A CN201710297420A CN106939417A CN 106939417 A CN106939417 A CN 106939417A CN 201710297420 A CN201710297420 A CN 201710297420A CN 106939417 A CN106939417 A CN 106939417A
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- tin
- solution
- chemical plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710297420.4A CN106939417B (zh) | 2017-04-28 | 2017-04-28 | 印制线路板的化学镀锡溶液 |
Applications Claiming Priority (1)
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CN201710297420.4A CN106939417B (zh) | 2017-04-28 | 2017-04-28 | 印制线路板的化学镀锡溶液 |
Publications (2)
Publication Number | Publication Date |
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CN106939417A true CN106939417A (zh) | 2017-07-11 |
CN106939417B CN106939417B (zh) | 2018-01-09 |
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CN201710297420.4A Active CN106939417B (zh) | 2017-04-28 | 2017-04-28 | 印制线路板的化学镀锡溶液 |
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CN (1) | CN106939417B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108754466A (zh) * | 2017-12-26 | 2018-11-06 | 深圳市德瑞勤科技有限公司 | 一种铜基表面的防鼠咬沉锡液、其化学沉锡方法及其防鼠咬铜基板 |
CN110093598A (zh) * | 2019-05-18 | 2019-08-06 | 深圳市创智成功科技有限公司 | 用于保护化学锡镀层的锡面保护剂 |
CN110158066A (zh) * | 2019-05-18 | 2019-08-23 | 深圳市创智成功科技有限公司 | 环保型可抑制四价锡生成速率的溶液 |
CN114561633A (zh) * | 2022-02-23 | 2022-05-31 | 吉安宏达秋科技有限公司 | 镀锡液及其制备方法和用于印制线路板的镀锡方法 |
CN114574840A (zh) * | 2022-01-10 | 2022-06-03 | 深圳市虹喜科技发展有限公司 | 铜制电子材料镀锡镀液以及制备方法、应用方法 |
CN114808051A (zh) * | 2021-10-20 | 2022-07-29 | 中山市一鸣电子材料有限公司 | 一种用于磁芯电感电镀的镀锡液及其制备方法 |
CN115087225A (zh) * | 2022-07-20 | 2022-09-20 | 深圳市板明科技股份有限公司 | 一种耐氯离子的印制线路板闪蚀添加剂和闪蚀方法 |
CN115404471A (zh) * | 2022-08-30 | 2022-11-29 | 江西住井新材料有限公司 | 一种无电解镀锡溶液及应用 |
CN115418643A (zh) * | 2022-10-13 | 2022-12-02 | 深圳市板明科技股份有限公司 | 一种含有护锡添加剂的无机退膜液及其使用方法 |
Citations (3)
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---|---|---|---|---|
US20040219375A1 (en) * | 2003-04-30 | 2004-11-04 | Mec Company Ltd. | Bonding layer for bonding resin on copper surface |
CN1569382A (zh) * | 2003-07-15 | 2005-01-26 | 天津英诺泰克科技发展有限公司 | 软性印刷电路板用化学锡溶液 |
CN1590596A (zh) * | 2003-08-08 | 2005-03-09 | 罗姆和哈斯电子材料有限责任公司 | 复合基底的电镀 |
-
2017
- 2017-04-28 CN CN201710297420.4A patent/CN106939417B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040219375A1 (en) * | 2003-04-30 | 2004-11-04 | Mec Company Ltd. | Bonding layer for bonding resin on copper surface |
CN1569382A (zh) * | 2003-07-15 | 2005-01-26 | 天津英诺泰克科技发展有限公司 | 软性印刷电路板用化学锡溶液 |
CN1590596A (zh) * | 2003-08-08 | 2005-03-09 | 罗姆和哈斯电子材料有限责任公司 | 复合基底的电镀 |
Non-Patent Citations (5)
Title |
---|
方景礼: "《电镀配合物--理论与应用》", 31 January 2008, 化学工业出版社 * |
河南省电力公司: "《火电工程调试技术手册(化学卷)》", 30 April 2004, 中国电力出版社 * |
王志登等: ""镀锡导针线材的保色处理"", 《2013年海峡两岸(上海)电子电镀及表面处理学术交流会论文集》 * |
祁鲁梁等: "《水处理药剂及材料实用手册(第二版)》", 28 February 2006, 中国石化出版社 * |
贡长生等: "《绿色精细化工导论》", 31 July 2005, 化学工业出版社 * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108754466A (zh) * | 2017-12-26 | 2018-11-06 | 深圳市德瑞勤科技有限公司 | 一种铜基表面的防鼠咬沉锡液、其化学沉锡方法及其防鼠咬铜基板 |
CN108754466B (zh) * | 2017-12-26 | 2023-01-17 | 深圳市德瑞勤科技有限公司 | 一种铜基表面的防鼠咬沉锡液、其化学沉锡方法及其防鼠咬铜基板 |
CN110093598A (zh) * | 2019-05-18 | 2019-08-06 | 深圳市创智成功科技有限公司 | 用于保护化学锡镀层的锡面保护剂 |
CN110158066A (zh) * | 2019-05-18 | 2019-08-23 | 深圳市创智成功科技有限公司 | 环保型可抑制四价锡生成速率的溶液 |
CN110158066B (zh) * | 2019-05-18 | 2020-02-14 | 深圳市创智成功科技有限公司 | 环保型可抑制四价锡生成速率的溶液 |
CN114808051A (zh) * | 2021-10-20 | 2022-07-29 | 中山市一鸣电子材料有限公司 | 一种用于磁芯电感电镀的镀锡液及其制备方法 |
CN114574840A (zh) * | 2022-01-10 | 2022-06-03 | 深圳市虹喜科技发展有限公司 | 铜制电子材料镀锡镀液以及制备方法、应用方法 |
CN114561633A (zh) * | 2022-02-23 | 2022-05-31 | 吉安宏达秋科技有限公司 | 镀锡液及其制备方法和用于印制线路板的镀锡方法 |
CN114561633B (zh) * | 2022-02-23 | 2023-11-14 | 吉安宏达秋科技有限公司 | 镀锡液及其制备方法和用于印制线路板的镀锡方法 |
CN115087225A (zh) * | 2022-07-20 | 2022-09-20 | 深圳市板明科技股份有限公司 | 一种耐氯离子的印制线路板闪蚀添加剂和闪蚀方法 |
CN115087225B (zh) * | 2022-07-20 | 2022-11-08 | 深圳市板明科技股份有限公司 | 一种耐氯离子的印制线路板闪蚀添加剂和闪蚀方法 |
CN115404471A (zh) * | 2022-08-30 | 2022-11-29 | 江西住井新材料有限公司 | 一种无电解镀锡溶液及应用 |
CN115418643A (zh) * | 2022-10-13 | 2022-12-02 | 深圳市板明科技股份有限公司 | 一种含有护锡添加剂的无机退膜液及其使用方法 |
CN115418643B (zh) * | 2022-10-13 | 2023-10-31 | 深圳市板明科技股份有限公司 | 一种含有护锡添加剂的无机退膜液及其使用方法 |
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CN106939417B (zh) | 2018-01-09 |
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Inventor after: Wang Jiangfeng Inventor after: Shen Wenbao Inventor after: Zhu Linjuan Inventor before: Wang Jiangfeng Inventor before: Shen Wenbao |
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Address after: 518100 Zhongliang Business Park, No. 2 Liuxian Road, Xin'an Street, Baoan District, Shenzhen City, Guangdong Province, 1403A, 14th floor Patentee after: Shenzhen Chuangzhi Xinlian Technology Co.,Ltd. Address before: 518100 Zhongliang Business Park, No. 2 Liuxian Road, Xin'an Street, Baoan District, Shenzhen City, Guangdong Province, 1403A, 14th floor Patentee before: Shenzhen Chuangzhi Success Technology Co.,Ltd. |
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